CN110366089A - MEMS device and preparation method thereof - Google Patents
MEMS device and preparation method thereof Download PDFInfo
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- CN110366089A CN110366089A CN201810322121.6A CN201810322121A CN110366089A CN 110366089 A CN110366089 A CN 110366089A CN 201810322121 A CN201810322121 A CN 201810322121A CN 110366089 A CN110366089 A CN 110366089A
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- vibrating membrane
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- support portion
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
- H04R2231/001—Moulding aspects of diaphragm or surround
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Abstract
The present invention provides a kind of MEMS device and preparation method thereof, vibrating membrane is formed in the front of substrate, support portion is formed between the vibrating membrane and the substrate, the vibrating membrane is symmetrical relative to projection centre of the support portion on the vibrating membrane, back chamber is formed at the back side of the substrate, the back chamber exposes the vibrating membrane and backwards to the gap, and retain support substrate of the substrate as the support portion in the back chamber with the support portion with positive area, the vibrating membrane is in vibration, middle position between the margin and center of the vibrating membrane vibrates, compared with prior art, increase effective vibration area, which thereby enhance sensitivity and the signal-to-noise ratio of MEMS device, the amplitude of vibration is reduced simultaneously, reduce the fluctuation range of sensitivity and signal-to-noise ratio；The power being applied on vibrating membrane in Mechanical Reliability test is reduced simultaneously, to increase the reliability of MEMS device.
Description
Technical field
The present invention relates to technical field of semiconductors, and in particular to a kind of MEMS device and preparation method thereof.
Background technique
MEMS (Micro-Electro-Mechanical System, MEMS) technology refers to that one kind can will be mechanical
Component, driving part, optical system, electric-control system are integrated into the microsystem of an entirety, it with microelectric technique and it is micro- plus
The manufacturing process that work technology (such as silicon bulk micromachining, silicon face micro Process, bonding chip) combines, it is excellent to produce various performances
It is different, cheap, micromation sensor (such as inertial sensor, pressure sensor, acceleration transducer etc.), actuator,
Driver and micro-system.
Existing MEMS device generally comprises substrate, and the substrate has front and the back side, and the substrate has and runs through
The back chamber in front and the back side, is formed with vibrating membrane on the front of substrate, and vibrating membrane covering back chamber is formed with absolutely on vibrating membrane
Edge support portion and the pole plate on insulative support parts that lies across, have gap, if being formed on pole plate between pole plate and vibrating membrane
Do through-hole spaced apart from each other.In MEMS device work, sound enters gap from through-hole, causes to vibrate vibration of membrane, the vibration
Dynamic film is opposite with pole plate and constitutes a capacitor.
But moved since vibrating membrane is equivalent to a film, ratio can be generated in smaller effective vibration area
Biggish amplitude, and the fluctuation range for the larger sensitivity that will lead to device of amplitude and signal-to-noise ratio vibrated increases, and one
Bigger power, such as air pressure test or mechanical force impact examination can be applied when a little mechanical reliability tests to vibrating membrane
It tests, be easy to cause the loss or damage of vibrating membrane.
Summary of the invention
The purpose of the present invention is to provide a kind of MEMS device and preparation method thereof, and branch is formed between vibrating membrane and substrate
Support part forms back chamber at the back side of substrate, and retains the substrate in the back chamber with the support portion with positive area, with this
Increase effective vibration area, improves sensitivity and the signal-to-noise ratio of MEMS device.
To achieve the above object, the present invention provides a kind of preparation method of MEMS device, comprising the following steps:
A substrate is provided, the substrate has front and the back side；
The first insulating layer is formed in the front of the substrate, is patterned that form one first recessed to first insulating layer
Slot, first groove expose the part substrate；
Support portion is formed in first groove, forms vibrating membrane on the support portion and first insulating layer
And pole plate, the pole plate are located on the vibrating membrane and are dielectrically separated from the vibrating membrane, the pole plate and the vibrating membrane it
Between be formed with gap, the through-hole for being connected to the gap is formed in the pole plate, and the vibrating membrane is relative to the branch
Projection centre of the support part on the vibrating membrane is symmetrical；
Back chamber is formed at the back side of the substrate, the back chamber exposes the vibrating membrane and backwards to the gap, and
The substrate that there is positive area with the support portion is remained in the back chamber.
Optionally, the step of forming the support portion include:
A vibration film layer is formed, the vibration film layer fills up first groove and covers first insulating layer, is located at
The vibration film layer in first groove forms support portion；
The step of forming the vibrating membrane include:
It is formed after the vibration film layer, the vibration film layer is patterned, formed and cover the support portion and institute
State the vibrating membrane of the first insulating layer.
Optionally, after being patterned to the vibration film layer, the edge of first insulating layer is exposed.
Optionally, the step of forming the pole plate include:
A second insulating layer is formed, the second insulating layer covers the vibrating membrane and first insulating layer；
The second insulating layer and first insulating layer are patterned, expose the edge of the substrate, and
Multiple second grooves are formed in the second insulating layer, the depth of second groove is less than the thickness of the second insulating layer；
Form a plate material layer, the plate material layer fill up second groove and cover the second insulating layer with
The substrate；
The plate material layer is patterned, the edge of the second insulating layer is exposed, forms pole plate.
Optionally, the step of forming the through-hole include:
A third insulating layer is formed, the third insulating layer covers the pole plate, the second insulating layer and the base
Bottom；
The third insulating layer is patterned with the pole plate, forms the multiple logical of the exposure second insulating layer
Hole.
Optionally, the step of formation back chamber includes:
The back side of the substrate is patterned, forms a third groove of exposure first insulating layer, described the
Three grooves retain the substrate in the third groove with the support portion with positive area backwards to the gap；
It is performed etching by the third groove the first insulating layer described part, exposes the vibrating membrane, form institute
State back chamber.
Optionally, the step of forming the gap include:
The part second insulating layer is performed etching by the through-hole, the vibrating membrane is exposed, in the vibration
Gap is formed between film and the pole plate.
Optionally, perform etching the step of forming the back chamber to the first insulating layer carves with to the second insulating layer
The step of erosion forms the gap carries out in same processing step.
Optionally, before forming the third groove, the preparation method of the MEMS device further include: form one the 4th
Insulating layer, the 4th insulating layer cover the front of the substrate；
During forming the gap, the 4th insulating layer is removed.
Correspondingly, the present invention also provides a kind of MEMS device, comprising:
One substrate has front and the back side；
Positioned at the positive vibrating membrane of the substrate, support portion between the vibrating membrane and the substrate is described
Vibrating membrane is symmetrical relative to projection centre of the support portion on the vibrating membrane；
Pole plate above the vibrating membrane, the pole plate are dielectrically separated from the vibrating membrane and are formed therebetween
There is gap, the through-hole for being connected to the gap is formed in the pole plate；
Back chamber positioned at the back side of the substrate, the back chamber expose the vibrating membrane and backwards to the gaps, and
In the intracavitary support substrate being provided with the support portion with positive area of the back, the support substrate is connected to the back
In the substrate around chamber.
Optionally, the MEMS device further include: one first insulating layer, first insulating layer are located at the side of the substrate
Edge, the vibrating membrane are located on first insulating layer；
One second insulating layer, the second insulating layer are located on the edge and first insulating layer of the vibrating membrane；With
And
One third insulating layer, the third insulating layer surround the pole plate, the second insulating layer and the substrate；And
And the through-hole is located in the third insulating layer and the connection gap.
Optionally, the support portion is in cylindrical shape, round table-like or rectangular-shape.
Optionally, the support substrate is in cuboid, and the back chamber is divided into two son back chambers by the support substrate.
Optionally, the support substrate is the structure of a plurality of cuboid intersection, and multiple cuboid crosspoints are located at the branch
The lower section of support part, the back chamber are divided into multiple sub- back chambers by the support substrate.
In MEMS device provided by the invention and preparation method thereof, vibrating membrane is formed in the front of substrate, in the vibration
Support portion, projection centre of the vibrating membrane relative to the support portion on the vibrating membrane are formed between film and the substrate
Symmetrically, back chamber is formed at the back side of the substrate, the back chamber exposes the vibrating membrane and backwards to the gap, and retains institute
State has support substrate of the substrate of positive area as the support portion with the support portion in back chamber, the vibrating membrane is shaking
When dynamic, the middle position between the margin and center of the vibrating membrane vibrates, and compared with prior art, increases effectively
Vibration area which thereby enhances sensitivity and the signal-to-noise ratio of MEMS device, while reducing the amplitude of vibration, reduces sensitivity
And the fluctuation range of signal-to-noise ratio；The power being applied on vibrating membrane in Mechanical Reliability test is reduced simultaneously, to increase
The reliability of MEMS device.
Detailed description of the invention
Fig. 1 is the schematic diagram of the section structure of a MEMS device.
Fig. 2 is the flow chart of the preparation method of MEMS device provided by one embodiment of the invention.
Fig. 3~Fig. 9 is that each step cross-section structure of the preparation method of MEMS device provided by one embodiment of the invention shows
It is intended to.
Figure 10 a~10b is the schematic diagram of effective vibration area in MEMS device.
Figure 11 a~11b is the cross-sectional view for carrying on the back chamber.
Specific embodiment
Fig. 1 is the structural schematic diagram of a MEMS device, as shown in Figure 1, the MEMS device includes: substrate 10, the base
Bottom 10 has front S1 and back side S2, vibrating membrane 11 and pole plate 12 is formed in the front of the substrate 10, in the substrate 10
Edge on be formed with support portion 13 and be used to support the vibrating membrane 11, and the support portion 13 surrounds the vibrating membrane 11
Edge, the pole plate 12 are dielectrically separated from by the support portion 13 with the vibrating membrane 11 and are formed with gap therebetween
15, it is formed with insulating layer 14 on the substrate 10, the support portion 13 and the pole plate 12, in the insulating layer 14 and institute
State the through-hole (not identifying) for being formed in pole plate 12 and being connected to the gap 15；It is formed with back chamber 16 at the back side of the substrate 10,
The back chamber 16 runs through the substrate 10, exposes the vibrating membrane 11 and backwards to the gap 15.
A capacitor is formed between the vibrating membrane 11 and the pole plate 12, sound etc. enters the gap by the through-hole
15, cause the vibration of the vibrating membrane 11, i.e., it is mobile relative to the pole plate 12, the opposite movement cause the pole plate 12 with
The capacitance for the capacitor that vibrating membrane 11 is formed changes.By measure the capacitance it is static relative to device when capacitor reference value
Variation, so as to measure movement of the vibrating membrane 11 relative to pole plate 12.
Figure 10 a is the schematic diagram of effective vibration area of the MEMS device, is please referred to shown in Fig. 1 and Figure 10 a, described
Effective vibration area of MEMS device is located at the central area of the back chamber 15, i.e., in the O region in figure.Its effective vibration area
It is smaller, and vibrating membrane 11 can generate bigger amplitude in smaller effective coverage, the Amplitude Comparison conference of vibration is led
The fluctuation range of the sensitivity and signal-to-noise ratio that cause the MEMS device increases, also, is applied in mechanical reliability test
The power of the vibrating membrane 11 is bigger, will lead to the loss or damage of the vibrating membrane 11 when serious, and then influence the MEMS
The reliability of device.
In view of the above-mentioned problems, present inventor proposes a kind of preparation method of MEMS device, comprising: provide a base
Bottom, the substrate have front and the back side；The first insulating layer is formed in the front of the substrate, first insulating layer is carried out
Graphical to form one first groove, first groove exposes the part substrate；Support is formed in first groove
Portion forms vibrating membrane on the support portion and first insulating layer and pole plate, the pole plate is located on the vibrating membrane
And be dielectrically separated from the vibrating membrane, it is formed with gap between the pole plate and the vibrating membrane, is formed in the pole plate
It is connected to the through-hole in the gap, and projection centre pair of the vibrating membrane relative to the support portion on the vibrating membrane
Claim；Back chamber is formed at the back side of the substrate, the back chamber exposes the vibrating membrane and the gap, and the back backwards
The substrate that there is positive area with the support portion is remained in chamber.
In the preparation method of MEMS device provided by the invention, vibrating membrane is formed in the front of substrate, in the vibrating membrane
Support portion, projection centre pair of the vibrating membrane relative to the support portion on the vibrating membrane are formed between the substrate
Claim, the back chamber exposes the vibrating membrane and backwards to the gap, and retains in the back chamber with the support portion with just
Support substrate to the substrate of area as the support portion, the vibrating membrane in vibration, the vibrating membrane edge with
Middle position between center vibrates, and compared with prior art, increases effective vibration area, which thereby enhances MEMS device
The sensitivity of part and signal-to-noise ratio, and reduce the fluctuation range of sensitivity and signal-to-noise ratio；It reduces and is tried in Mechanical Reliability simultaneously
The power being applied on vibrating membrane is tested, to increase the reliability of MEMS device.
To keep the contents of the present invention more clear and easy to understand, below in conjunction with Figure of description, the contents of the present invention are done into one
Walk explanation.Certainly the invention is not limited to the specific embodiment, and general replacement well known to those skilled in the art is also contained
Lid is within the scope of the present invention.
Secondly, the present invention has carried out detailed statement using schematic diagram, in detail that example of the present invention, for the ease of saying
Bright, schematic diagram is not partially enlarged in proportion to the general scale, should not be to this as restriction of the invention.
The present invention provides a kind of preparation method of MEMS device, as shown in Figure 2, comprising the following steps:
Step S100: providing a substrate, and the substrate has front and the back side；
Step S200: the first insulating layer is formed in the front of the substrate, shape is patterned to first insulating layer
At one first groove, first groove exposes the part substrate；
Step S300: forming support portion in first groove, on the support portion and first insulating layer
It forms vibrating membrane and pole plate, the pole plate is located on the vibrating membrane and is dielectrically separated from the vibrating membrane, the pole plate and institute
It states and is formed with gap between vibrating membrane, the through-hole for being connected to the gap, and the vibrating membrane phase are formed in the pole plate
It is symmetrical for projection centre of the support portion on the vibrating membrane；
Step S400: back chamber is formed at the back side of the substrate, the back chamber exposes the vibrating membrane and backwards to described
Gap, and the substrate that there is positive area with the support portion is remained in the back chamber.
Fig. 3~Fig. 9 is the structural representation of each step of the preparation method of MEMS device provided by one embodiment of the invention
Figure, please refers to shown in Fig. 2, and combines Fig. 3~Fig. 9, the preparation method for the MEMS device that the present invention will be described in detail proposes:
As shown in figure 3, in the step s 100, providing a substrate 100, the substrate 100 has front S1 and back side S2.Institute
The material for stating substrate 100 can be silicon base, be also possible to germanium, germanium silicon, GaAs substrate or silicon-on-insulator substrate.This field
Technical staff can according to need selection substrate, therefore the type of substrate should not limit the scope of the invention.The present embodiment
In substrate 100 be preferably silicon base.The positive S1 and back side S2 of the substrate 100 are located at the opposite sides of the substrate 100.
Please continue to refer to shown in Fig. 3, in step s 200, the first insulating layer is formed in the positive S1 of the substrate 100
110, first insulating layer 110 is patterned to form one first groove 111, first groove 11 exposes part institute
State substrate 100.
Specifically, the first insulating layer 110 is deposited on the positive S1 of the substrate 100, on first insulating layer 110
It is formed photoresist layer (not shown), the photoresist layer is exposed and is developed, patterned photoresist layer is formed, exposes
The position for making a reservation for be formed the first groove on first insulating layer 110, is exposure mask to described using the patterned photoresist layer
First insulating layer 110 performs etching, until exposing the substrate 100, it is recessed to form described first in first insulating layer 110
Slot 111.Optionally, the material of first insulating layer 110 is the lamination of silica, silicon nitride or silica and silicon nitride, or
Other materials well known by persons skilled in the art.
In step S300, support portion 121 is formed in first groove 111, in the support portion 121 and described
Form vibrating membrane 120 and pole plate 140 on first insulating layer 110, the pole plate 140 be located on the vibrating membrane 120 and with it is described
Vibrating membrane 120 is dielectrically separated from, and is formed with gap 160 between the pole plate 140 and the vibrating membrane 120, in the pole plate 140
Be formed with the through-hole 151 for being connected to the gap 160, and the vibrating membrane 120 relative to the support portion 121 in the vibration
Projection centre on film 120 is symmetrical, please refers to shown in Fig. 4~Fig. 9.
In step S400, back chamber 170 is formed in the back side S2 of the substrate 100, the back chamber 170 exposes the vibration
Dynamic film 120 and the backwards gap 160, and remain with the support portion 121 in the back chamber 170 with positive area
Substrate please refers to shown in Fig. 8 and Fig. 9.
It describes in detail below to step S300 and step S400:
Step S301 is executed, support portion 121 and vibrating membrane 120 are formed.Support portion is formed in first groove 111
121；Vibrating membrane 120 is formed on the support portion 121 and first insulating layer 110.It please refers to shown in Fig. 4, specifically,
A vibration film layer is formed on first insulating layer 110, the vibration film layer is filled up described in first groove 111 and covering
First insulating layer 110 is patterned the vibration film layer, exposes the edge of first insulating layer 110, and formation is located at
The vibration of support portion 121 and covering first support portion 121 and first insulating layer 110 in first groove 111
Dynamic film 120.
The subsequent vibrating membrane as MEMS device of vibrating membrane 120, the material of the vibrating membrane 120 can choose polycrystalline
Silicon, germanium silicon, germanium or other flexible metals or semiconductor material, it is ensured that effect of the vibrating membrane by sound or inertia force etc.
Power and can also be restored after vibration deformation, and ensure vibrating membrane have good electric conductivity.
The vibrating membrane 120 is symmetrical relative to projection centre of the support construction 121 on the vibrating membrane 120, i.e.,
The vibrating membrane 120 is center symmetric figure, and symmetrical centre is throwing of the support construction 121 on the vibrating membrane 120
Shadow, that is, the support construction 121 is located at the lower section of the center of the vibrating membrane 120.
In the present embodiment, it is preferred that the support construction 121 is in cylindrical shape, round table-like or rectangular-shape or ability
Other structures known to field technique personnel.In other embodiments, the quantity of the support construction may be two, three or
More.The present invention is to the structure and quantity of the support construction 121 and without limitation.
Step S302 is executed, pole plate 140 is formed, i.e., forms pole plate 140 on the vibrating membrane 120, as shown in Figure 6.Tool
Body, firstly, forming second insulating layer 130 on the vibrating membrane 120, it should be noted that the second insulating layer 130 with
The material of first insulating layer 110 can be identical, therefore, uses identical filling mode in the accompanying drawings, and in Fig. 5
And not to the boundary line for clearly indicating the second insulating layer 130 and second insulating layer 110 in later attached drawing, certainly,
The second insulating layer 130 can also use the material different from first insulating layer 110, and the present invention does not limit this
It is fixed.
The second insulating layer 130 covers the vibrating membrane 120 and first insulating layer 110.Then, to described
Two insulating layers 130 are patterned with first insulating layer 110, specifically, forming figure in the second insulating layer 130
The photoresist layer of change, using the patterned photoresist layer as exposure mask, to the second insulating layer 130 and first insulating layer
110 perform etching, and expose the edge of the substrate 100, and multiple second grooves are formed in the second insulating layer 130
131, as shown in Figure 5.The depth of second groove 131 is less than the thickness of the second insulating layer 130, i.e., described second groove
131 do not expose the vibrating membrane 120.Optionally, second groove 131 is uniformly distributed in the second insulating layer 130
On, and second groove 131 is corresponding with the vibrating membrane 120.
Then, a plate material layer (not shown) is formed, the plate material layer fills up second groove 131 and covers
The second insulating layer 130 and the substrate 100.Finally, being patterned to the plate material layer, i.e., in the pole plate
Patterned photoresist layer is formed in material layer, using the patterned photoresist layer as exposure mask, to the plate material layer into
Row etching, exposes the edge of the second insulating layer 130, forms pole plate 140, as shown in Figure 6.The material of the pole plate 140
Polysilicon, germanium silicon or germanium may be selected, can also be other metals such as aluminium or other materials well known by persons skilled in the art.
Step S303 is executed, through-hole is formed, i.e., forms through-hole 151 on the pole plate 140, as shown in Figure 7.Specifically,
Firstly, formed a third insulating layer 150, the third insulating layer 150 cover the pole plate 140, the second insulating layer 130 with
And the substrate 100；Then, the third insulating layer 150 and the pole plate 140 are patterned, formation exposes described
Multiple through-holes 151 of second insulating layer 130.Such as it can be by forming patterned photoetching on the third insulating layer 150
Glue-line exposes position of the through-hole of predetermined formation on the third insulating layer, is then to cover with patterned photoresist layer
Film performs etching the third insulating layer 150 and the pole plate 140, until the second insulating layer 130 is exposed,
Multiple through-holes 151 are formed in the third insulating layer 150 and the pole plate 140.
Then, optionally, the 4th insulating layer (not shown) is formed on the positive S1 of the substrate 100, the described 4th absolutely
Edge layer fills the through-hole 151, and covers the third insulating layer 150 and the substrate 100, that is, the 4th insulating layer
Cover the positive S1 of the substrate 100.Avoid the subsequent back side to the substrate 100 when operating to the substrate 100
Positive structure impacts.The material of 4th insulating layer is preferably that silica, silicon nitride or silica/silicon nitride are folded
Layer structure or other materials well known by persons skilled in the art.
Then step S401 is executed, third groove is formed, i.e., forms third groove on the back side S2 of the substrate 100
101, as shown in Figure 8.Specifically, being patterned to the back side S2 of the substrate 100, exposure first insulating layer is formed
110 third groove 101, the third groove 101 backwards to the predetermined gap formed, and retain in the third groove 101 with
The support portion 121 has the substrate of positive area as support substrate 102.The support portion 121 is located at the third groove
In the support substrate 102 in 101.
Then it is performed simultaneously step S304 and step S402, forms gap and back chamber, i.e., in the pole plate 140 and the vibration
Gap 160 is formed between dynamic film 120, back chamber 170 is formed in the third groove 101, forms structure as shown in Figure 9.
Specifically, will be formed in previous step using BOE (Buffered Oxide Etch, buffered oxide etch) method
Structure be placed in oxide etching liquid, etching liquid by third groove 101 to first insulating layer 110 perform etching to
The vibrating membrane 120 is exposed, forms back chamber 170 at the back side of the substrate 100.In etching liquid to first insulating layer
During 110 perform etching, the etching liquid simultaneously performs etching the 4th insulating layer, removes the 4th insulating layer
Later, the second insulating layer 130 is performed etching by the through-hole 151, removes the part second insulating layer 130, shape
At the gap 160 between the vibrating membrane 120 and pole plate 140.That is, the removal of the 4th insulating layer, described
The formation of the formation in gap 160 and the back chamber 170 is carried out in same processing step (i.e. BOE).
Certainly, in other embodiments, the removal of the 4th insulating layer, the formation in the gap 160 and the back chamber
170 formation can not carry out in same step, and the present invention is to this and without limitation.
In the preparation method of MEMS device provided by the invention, vibrating membrane 120 is formed in the positive S1 of substrate 100, in institute
Formation support portion 121, the vibrating membrane 120 between vibrating membrane 120 and the substrate 100 is stated to exist relative to the support portion 121
Projection centre on the vibrating membrane 120 is symmetrical, forms back chamber 170 in the back side S2 of the substrate 100, the back chamber 170 is sudden and violent
Expose the vibrating membrane 120 and the backwards gap 160, and retains in the back chamber 170 with the support portion 121 with face
Support substrate 102 of the substrate of area as the support portion 121.With Fig. 1 compared with Figure 10 a, former back 15 center of chamber will be located at
The biggish region of amplitude ratio shifted to surrounding, please refer to shown in Figure 10 a and 10b, the biggish region of amplitude ratio turned from O region
It moves on in the region AB, increases effective vibration area, while reducing the amplitude of vibration.Certainly, in the region AB or in O region
Amplitude it is not identical, the region marked in Figure 10 a and 10b only represents the vibration that the amplitude in the region is greater than other regions
Width.
In the preparation method of MEMS device provided by the invention, by support portion 121 and it is located at 121 bottom of support portion
The support substrate 102 in portion, increases effective vibration area, which thereby enhances sensitivity and the signal-to-noise ratio of MEMS device, subtracts simultaneously
The amplitude of small vibration, reduces the fluctuation range of sensitivity and signal-to-noise ratio；It reduces and is applied in Mechanical Reliability test simultaneously
The power being added on vibrating membrane 120, to increase the reliability of MEMS device.
Correspondingly, being prepared the present invention also provides a kind of MEMS device using the preparation method of MEMS device as described above
It forms.As shown in figure 9, MEMS device provided by the invention, comprising:
One substrate 100 has front S1 and back side S2；
Positioned at the vibrating membrane 120 of the positive S1 of the substrate 100, between the vibrating membrane 120 and the substrate 100
Support portion 121, the vibrating membrane 120 is symmetrical relative to projection centre of the support portion 121 on the vibrating membrane 120；
Pole plate 140 above the vibrating membrane 120, the pole plate 140 be dielectrically separated from the vibrating membrane 120 and
It is formed with gap 160 between the two, the through-hole 151 for being connected to the gap 160 is formed in the pole plate 140；
Positioned at the back chamber 170 of the back side S2 of the substrate 100, the back chamber 170 exposes the vibrating membrane 120 and backwards
The gap 160, and the support substrate that there is positive area with the support portion 121 is provided in the back chamber 170
102, the support substrate 102 is connected in the substrate 100 around the back chamber 170.
Optionally, the MEMS device further include:
One first insulating layer 110, first insulating layer 110 are located at the edge of the substrate 100, the vibrating membrane 120
On first insulating layer 110；
One second insulating layer 130, the second insulating layer 130 are located at the vibrating membrane 120 and first insulating layer 110
On；And
One third insulating layer 150, the third insulating layer 150 surround the pole plate 140, the second insulating layer 130 with
And the substrate 100；Also, the through-hole 151 is located in the third insulating layer 150 and the connection gap 160.
Optionally, in the present embodiment, the support portion 121 is in cylindrical shape, round table-like or rectangular-shape or this field
Other shapes known to technical staff.The back chamber 170 is in cylindrical shape, and the support substrate 102 is located at the back chamber 170
Interior, as shown in fig. 11a, the support substrate 102 is in cuboid, i.e., the cross section of the described support substrate 102 is rectangle, described
Back chamber 170 is divided into two son back chambers by the support substrate 102, i.e., the described support substrate 102 is single substrate, certainly,
The support substrate 102 is also possible to remaining shape in addition to cuboid.As shown in figure 11b, the support substrate 102 is more
The structure of cuboid intersection, multiple cuboid crosspoints are located at the lower section of the support portion, and the back chamber 170 is by the support
Substrate 102 is divided into multiple sub- back chambers, and the position of the substrate 100 is had also shown in Figure 11 b, in order to determine substrate
100 with the positional relationship of support substrate 102, but the substrate 100 is not limited to the square of diagram.The present invention is to the branch
The shape and quantity of support part 121 and the support substrate 102 are without limitation.
In conclusion vibrating membrane is formed in the front of substrate in MEMS device provided by the invention and preparation method thereof,
Support portion is formed between the vibrating membrane and the substrate, the vibrating membrane is relative to the support portion on the vibrating membrane
Projection centre is symmetrical, forms back chamber at the back side of the substrate, and the back chamber exposes the vibrating membrane and the backwards gap,
And retain support substrate of the substrate as the support portion in the back chamber with the support portion with positive area, the vibration
In vibration, the middle position between the margin and center of the vibrating membrane vibrates dynamic film, compared with prior art, increases
Big effective vibration area, which thereby enhances sensitivity and the signal-to-noise ratio of MEMS device, while reducing the amplitude of vibration, reduces
The fluctuation range of sensitivity and signal-to-noise ratio；The power being applied on vibrating membrane in Mechanical Reliability test is reduced simultaneously, from
And increase the reliability of MEMS device.
Foregoing description is only the description to present pre-ferred embodiments, not to any restriction of the scope of the invention, this hair
Any change, the modification that the those of ordinary skill in bright field does according to the disclosure above content, belong to the protection of claims
Range.
Claims (14)
1. a kind of preparation method of MEMS device, which comprises the following steps:
A substrate is provided, the substrate has front and the back side；
The first insulating layer is formed in the front of the substrate, first insulating layer is patterned to form one first groove,
First groove exposes the part substrate；
Support portion is formed in first groove, forms vibrating membrane and pole on the support portion and first insulating layer
Plate, the pole plate are located on the vibrating membrane and are dielectrically separated from the vibrating membrane, shape between the pole plate and the vibrating membrane
At there is gap, the through-hole for being connected to the gap is formed in the pole plate, and the vibrating membrane is relative to the support portion
Projection centre on the vibrating membrane is symmetrical；
Back chamber is formed at the back side of the substrate, the back chamber exposes the vibrating membrane and the backwards gap, and described
The substrate that there is positive area with the support portion is remained in back chamber.
2. the preparation method of MEMS device as described in claim 1, which is characterized in that the step of forming support portion packet
It includes:
A vibration film layer is formed, the vibration film layer fills up first groove and covers first insulating layer, is located at described
The vibration film layer in first groove forms support portion；
The step of forming the vibrating membrane include:
It is formed after the vibration film layer, the vibration film layer is patterned, formed and cover the support portion and described the
The vibrating membrane of one insulating layer.
3. the preparation method of MEMS device as claimed in claim 2, which is characterized in that be patterned to the vibration film layer
Later, the edge of first insulating layer is exposed.
4. the preparation method of MEMS device as claimed in claim 3, which is characterized in that the step of forming the pole plate include:
A second insulating layer is formed, the second insulating layer covers the vibrating membrane and first insulating layer；
The second insulating layer and first insulating layer are patterned, expose the edge of the substrate, and described
Multiple second grooves are formed in second insulating layer, the depth of second groove is less than the thickness of the second insulating layer；
Form a plate material layer, the plate material layer fill up second groove and cover the second insulating layer with it is described
Substrate；
The plate material layer is patterned, the edge of the second insulating layer is exposed, forms pole plate.
5. the preparation method of MEMS device as claimed in claim 4, which is characterized in that the step of forming the through-hole include:
A third insulating layer is formed, the third insulating layer covers the pole plate, the second insulating layer and the substrate；
The third insulating layer is patterned with the pole plate, forms multiple through-holes of the exposure second insulating layer.
6. the preparation method of MEMS device as claimed in claim 5, which is characterized in that formed the back chamber the step of include:
The back side of the substrate is patterned, a third groove of exposure first insulating layer is formed, the third is recessed
Slot retains the substrate in the third groove with the support portion with positive area backwards to the gap；
It is performed etching by the third groove the first insulating layer described part, exposes the vibrating membrane, form the back
Chamber.
7. the preparation method of MEMS device as claimed in claim 6, which is characterized in that the step of forming the gap include:
The part second insulating layer is performed etching by the through-hole, exposes the vibrating membrane, the vibrating membrane with
Gap is formed between the pole plate.
8. the preparation method of MEMS device as claimed in claim 7, which is characterized in that perform etching to be formed to the first insulating layer
The step of back chamber with to the second insulating layer perform etching the step of forming the gap in same processing step into
Row.
9. the preparation method of MEMS device as claimed in claim 6, which is characterized in that before forming the third groove,
The preparation method of the MEMS device further include: form one the 4th insulating layer, the 4th insulating layer is covering the substrate just
Face；
During forming the gap, the 4th insulating layer is removed.
10. a kind of MEMS device characterized by comprising
One substrate has front and the back side；
Positioned at the positive vibrating membrane of the substrate, support portion between the vibrating membrane and the substrate, the vibration
Film is symmetrical relative to projection centre of the support portion on the vibrating membrane；
Between pole plate above the vibrating membrane, the pole plate and the vibrating membrane are dielectrically separated from and are formed with therebetween
Gap is formed with the through-hole for being connected to the gap in the pole plate；
Back chamber positioned at the back side of the substrate, the back chamber expose the vibrating membrane and backwards to the gaps, and in institute
It states and carries on the back the intracavitary support substrate for being provided with and there is positive area with the support portion, the support substrate is connected to the back chamber week
In the substrate enclosed.
11. MEMS device as claimed in claim 10, which is characterized in that the MEMS device further include: one first insulating layer,
First insulating layer is located at the edge of the substrate, and the vibrating membrane is located on first insulating layer；
One second insulating layer, the second insulating layer are located on the edge and first insulating layer of the vibrating membrane；And
One third insulating layer, the third insulating layer surround the pole plate, the second insulating layer and the substrate；Also,
The through-hole is located in the third insulating layer and the connection gap.
12. MEMS device as claimed in claim 10, which is characterized in that the support portion is in cylindrical shape, round table-like or length
Cube shape.
13. MEMS device as claimed in claim 10, which is characterized in that the support substrate is in cuboid, the back chamber quilt
The support substrate is divided into two son back chambers.
14. MEMS device as claimed in claim 10, which is characterized in that the support substrate is the knot of a plurality of cuboid intersection
Structure, multiple cuboid crosspoints are located at the lower section of the support portion, and the back chamber is divided into multiple sub- back by the support substrate
Chamber.
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