CN110366084A - A kind of semiconductor devices and preparation method thereof and electronic device - Google Patents
A kind of semiconductor devices and preparation method thereof and electronic device Download PDFInfo
- Publication number
- CN110366084A CN110366084A CN201910489891.4A CN201910489891A CN110366084A CN 110366084 A CN110366084 A CN 110366084A CN 201910489891 A CN201910489891 A CN 201910489891A CN 110366084 A CN110366084 A CN 110366084A
- Authority
- CN
- China
- Prior art keywords
- vibrating diaphragm
- anchor point
- semiconductor devices
- insulating layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 239000000463 material Substances 0.000 claims description 25
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 238000005530 etching Methods 0.000 description 12
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 229920005591 polysilicon Polymers 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
- H04R2231/001—Moulding aspects of diaphragm or surround
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910489891.4A CN110366084A (en) | 2019-06-06 | 2019-06-06 | A kind of semiconductor devices and preparation method thereof and electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910489891.4A CN110366084A (en) | 2019-06-06 | 2019-06-06 | A kind of semiconductor devices and preparation method thereof and electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110366084A true CN110366084A (en) | 2019-10-22 |
Family
ID=68215625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910489891.4A Pending CN110366084A (en) | 2019-06-06 | 2019-06-06 | A kind of semiconductor devices and preparation method thereof and electronic device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110366084A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114520947A (en) * | 2022-04-20 | 2022-05-20 | 苏州敏芯微电子技术股份有限公司 | Microphone assembly and electronic equipment |
WO2022135004A1 (en) * | 2020-12-25 | 2022-06-30 | 歌尔微电子股份有限公司 | Capacitive sensor chip, sensor, and electronic device |
CN115714954A (en) * | 2022-12-28 | 2023-02-24 | 绍兴中芯集成电路制造股份有限公司 | MEMS device and manufacturing method thereof |
WO2023206642A1 (en) * | 2022-04-28 | 2023-11-02 | 瑞声声学科技(深圳)有限公司 | Diaphragm and mems sensor |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110115337A1 (en) * | 2009-11-16 | 2011-05-19 | Seiko Epson Corporation | Ultrasonic transducer, ultrasonic sensor, method of manufacturing ultrasonic transducer, and method of manufacturing ultrasonic sensor |
CN202425038U (en) * | 2012-02-06 | 2012-09-05 | 苏州敏芯微电子技术有限公司 | Monolithic integration chip with integrated circuit and capacitance-type micro-silicon microphone |
US20150041930A1 (en) * | 2013-08-09 | 2015-02-12 | Samsung Electro-Mechanics Co., Ltd. | Acoustic transducer |
CN108616799A (en) * | 2018-04-26 | 2018-10-02 | 七色堇电子科技(上海)有限公司 | A kind of semiconductor devices and preparation method thereof and electronic device |
CN108996466A (en) * | 2017-06-07 | 2018-12-14 | 中芯国际集成电路制造(天津)有限公司 | MEMS device and forming method thereof |
CN109052309A (en) * | 2018-07-25 | 2018-12-21 | 七色堇电子科技(上海)有限公司 | A kind of semiconductor devices and preparation method thereof and electronic device comprising it |
-
2019
- 2019-06-06 CN CN201910489891.4A patent/CN110366084A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110115337A1 (en) * | 2009-11-16 | 2011-05-19 | Seiko Epson Corporation | Ultrasonic transducer, ultrasonic sensor, method of manufacturing ultrasonic transducer, and method of manufacturing ultrasonic sensor |
CN202425038U (en) * | 2012-02-06 | 2012-09-05 | 苏州敏芯微电子技术有限公司 | Monolithic integration chip with integrated circuit and capacitance-type micro-silicon microphone |
US20150041930A1 (en) * | 2013-08-09 | 2015-02-12 | Samsung Electro-Mechanics Co., Ltd. | Acoustic transducer |
CN108996466A (en) * | 2017-06-07 | 2018-12-14 | 中芯国际集成电路制造(天津)有限公司 | MEMS device and forming method thereof |
CN108616799A (en) * | 2018-04-26 | 2018-10-02 | 七色堇电子科技(上海)有限公司 | A kind of semiconductor devices and preparation method thereof and electronic device |
CN109052309A (en) * | 2018-07-25 | 2018-12-21 | 七色堇电子科技(上海)有限公司 | A kind of semiconductor devices and preparation method thereof and electronic device comprising it |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022135004A1 (en) * | 2020-12-25 | 2022-06-30 | 歌尔微电子股份有限公司 | Capacitive sensor chip, sensor, and electronic device |
CN114520947A (en) * | 2022-04-20 | 2022-05-20 | 苏州敏芯微电子技术股份有限公司 | Microphone assembly and electronic equipment |
CN114520947B (en) * | 2022-04-20 | 2022-07-08 | 苏州敏芯微电子技术股份有限公司 | Microphone assembly and electronic equipment |
WO2023206642A1 (en) * | 2022-04-28 | 2023-11-02 | 瑞声声学科技(深圳)有限公司 | Diaphragm and mems sensor |
CN115714954A (en) * | 2022-12-28 | 2023-02-24 | 绍兴中芯集成电路制造股份有限公司 | MEMS device and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200103 Address after: 201208 Room 303, No. 4, Lane 1139, Shuangqiao Road, Pudong New Area, Shanghai Applicant after: Li Weigang Address before: 201400 room 1410, 5 / F, 111 Fengpu Road, Fengpu Industrial Zone, Fengxian District, Shanghai. Applicant before: Seven color electronic technology (Shanghai) Co., Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200415 Address after: 201203 Shanghai City, Pudong New Area China (Shanghai) free trade zone fanchun Road No. 400 Building 1 layer 3 Applicant after: Yaoxin microelectronics technology (Shanghai) Co., Ltd Address before: 201208 Room 303, No. 4, Lane 1139, Shuangqiao Road, Pudong New Area, Shanghai Applicant before: Li Weigang |
|
TA01 | Transfer of patent application right | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191022 |
|
WD01 | Invention patent application deemed withdrawn after publication |