CN110364417A - Adhesive tape stripping means and adhesive tape stripping off device - Google Patents
Adhesive tape stripping means and adhesive tape stripping off device Download PDFInfo
- Publication number
- CN110364417A CN110364417A CN201910285578.9A CN201910285578A CN110364417A CN 110364417 A CN110364417 A CN 110364417A CN 201910285578 A CN201910285578 A CN 201910285578A CN 110364417 A CN110364417 A CN 110364417A
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- China
- Prior art keywords
- adhesive tape
- adhesive
- protection band
- stripping
- bond roll
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
Abstract
The present invention provides a kind of adhesive tape stripping means and adhesive tape stripping off device that adhesive tape can precisely be removed to removal under the premise of without using release band from wafer.Stripping unit (23) has bond roll (27).Bond roll (27) has the adhesive surface with adhesiveness at least part of outer peripheral surface.Bond roll (27) is mobile to band peeling direction (P) relative to wafer (W) in the state of making protection band (PT) be adhered to the adhesive surface, so that protection band (PT) be removed from wafer (W).Protection band (PT) is removed using the bonding force of bond roll (27), therefore, precisely can remove protection band (PT) from wafer (W) under the premise of without using auxiliary parts such as release band.
Description
Technical field
The present invention relates to a kind of for that will paste the adhesive tape removing of semiconductor crystal wafer (hereinafter, being properly termed as " wafer ")
, adhesive tape stripping means and adhesive tape stripping off device.
Background technique
After the surface to wafer has carried out circuit pattern formation processing, implementation integrally carries out uniformly the back side of wafer
The back mill that ground is ground and is thinned it is handled.It is viscous on the surface of wafer in order to protect circuit before carrying out back mill processing
The adhesive tape (protection band) of protection is pasted.After being thinned wafer, in order to carry out, cutting action etc. is respectively handled and is removed
Protection band.
As the previous method for removing protection band from wafer, following method is used: after being overleaf ground, will remove
Adhesive tape (release band) is pasted on the surface of protection band and removes the release band, thus using release band and protection band as one
Body removes (for example, referring to patent document 1).
In addition, as the other methods for removing protection band from wafer, propose using adsorption roller and hold component this two
The method of person.That is, adsorbing protection band using adsorption roller by one side, move horizontally protection band on one side, thus the end of protection band
The small part in portion is removed from wafer, forms removing starting end.Then, it is formed on one side using adsorption roller and holding component holding
Removing starting end on one side by protection band from wafer remove (for example, referring to patent document 2).
Patent document 1: Japanese Unexamined Patent Publication 2012-89647 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2016-39301 bulletin
Summary of the invention
Problems to be solved by the invention
However, there are problems that as follows in above-mentioned previous device.
That is, in stripping means previous involved in the patent document 1, per it is secondary protection band is removed when, require to shell
From band.In addition, by release band to the band-guided structure of protection and using release band and protection band as integrally from wafer removing
Structure is complicated, therefore, worries the problem of operating cost of stripping off device rises.
In addition, in recent years, there are the tendencies that the stronger material of bonding force is used as the jointing material of band.Therefore, especially
Using the scheme of patent document 2, it is difficult to reliably remove the adhesive tapes such as protection band from wafer.
Here, illustrating an original more difficult using previous scheme removing adhesive tape using the structure of patent document 2
Cause.That is, the protection band of the end vicinity of wafer and the bond area of wafer are smaller than the bond area at the center portion of wafer.
That is, the bonding force between wafer and protection band is lower near removing starting end, therefore, using adsorption roller and component can be held
Protection band is removed from wafer and forms removing starting end.
However, the bond area of wafer and protection band becomes larger, between wafer and protection band with going towards center portion
Bonding force increases.Therefore, create the problem that the bonding force between wafer and protection band is more than adsorption roller and holds component to guarantor
The retentivity of protecting band, protection band is from adsorption roller and holds component and falls off and fall to wafer and be again attached to wafer.
In addition, after foring removing starting end using adsorption roller, making handle in the method involved in patent document 2
Component is held to advance along horizontal direction, it will be between removing starting end and wafer that component insertion protection band be held.At this point, peeling away
Gap between beginning and wafer is relatively narrow, accordingly, it is difficult to precisely be inserted into the gap for component is held.Especially holding
In the lower situation of the position precision of component, following problem is also worried: holding component and contact with the side of wafer, wafer is damaged
Wound.
The present invention is made into view of such situation, and main purpose is can be before without using release band
Put the adhesive tape stripping means and adhesive tape stripping off device that adhesive tape is precisely removed to removal from wafer.
The solution to the problem
The present invention takes scheme as following to reach such purpose.
That is, adhesive tape stripping means of the invention is the adhesive tape that will be pasted the adhesive tape of workpiece and remove from the workpiece
Stripping means, which is characterized in that
The adhesive tape stripping means has:
Adhesion process makes the surface bonding of adhesive member Yu the adhesive tape, the adhesive member in the adhesion process
Has the adhesive surface with adhesiveness at least part of outer peripheral surface；
Stripping process makes the adhesive member for being bonded with the adhesive tape relative to the work in the stripping process
Part is mobile to scheduled band peeling direction, removes the adhesive tape from the workpiece；And
Removal process removes the adhesive tape stripped down from the adhesive member in the removal process.
(function and effect) in adhesion process, make to have to have at least part of outer peripheral surface to glue according to the program
The adhesive member of the adhesive surface of conjunction property and the surface bonding of adhesive tape.Then, in stripping process, make to be bonded with the viscous of adhesive tape
It is mobile to scheduled band peeling direction relative to workpiece to close component, removes the adhesive tape from workpiece.
It in this case, being capable of the auxiliary as the holding component of release band, holding adhesive tape without using removing
Under the premise of component, adhesive tape is removed from workpiece using the bonding force of adhesive member.Thus, it is possible to reduce the removing of adhesive tape
Required cost.
In addition, in above-mentioned invention, it is preferred that the adhesive member is bond roll,
In the stripping process, the bond roll for being bonded with the adhesive tape is rolled, the adhesive tape and institute are made
Adhesive surface bonding is stated, while batching the adhesive tape, so that the adhesive tape be made to remove from the workpiece.
(function and effect) use bond roll as adhesive member according to the program.Also, in stripping process, make to glue
Closing has the bond roll of adhesive tape to roll, and bonds adhesive tape and adhesive surface, while batching the adhesive tape, to make adhesive tape from work
Part removing.In this case, be stripped the adhesive surface bonding of the adhesive tape and bond roll that get off, therefore, the adhesive tape with it is viscous
The mode that the outer peripheral surface of conjunction roller is adjacent to is taken up.That is, the state that the adhesive tape stripped down can be made compact, is performed simultaneously stripping
From process.Thus, it is possible to which adhesive tape and the component of surrounding is reliably avoided to bond and the situation of peeling-off mistake.
In addition, in above-mentioned invention, it is preferred that in the adhesion process, make that the adhesive surface is provided with suction
The adhesive member in attached hole is abutted with the adhesive tape, bonds the adhesive tape and the adhesive surface, while by the suction
Adsorb the adhesive tape in attached hole.
(function and effect) have adsorption hole according to the program, adhesive member.Also, in stripping process, make adhesive tape
It is bonded with adhesive surface, while also carrying out the absorption to adhesive tape.Thus, the bonding force collaboration of the adsorption capacity and adhesive surface of adsorption hole
Effect, therefore, can be improved adhesive member to the retentivity of adhesive tape.
In addition, in above-mentioned invention, it is preferred that have bonding force recovery process, in the bonding force recovery process,
The adhesive surface of the adhesive member after being removed to the adhesive tape is cleaned and is restored the bonding of the adhesive surface
Power.
(function and effect) clean adhesive surface after adhesive tape is removed and restore the adhesive surface according to the program
Bonding force.Therefore, it even if Reusability adhesive member, also can more reliably avoid occurring as caused by the reduction of bonding force
Bond the situation of mistake.
In addition, in above-mentioned invention, it is preferred that the adhesion process has the bonding of the adhesive member
The cooling cooling procedure in face.
(function and effect) have the cooling procedure that adhesive surface is cooling according to the program.In this case, though for
The bonding force between adhesive tape and workpiece is reduced in the case where being heated to adhesive tape, can also prevented
The situation that the bonding force as caused by high temperature reduces in the adhesive surface of adhesive member.Thus, it is possible to make between adhesive tape and workpiece
Bonding force reduces, while can be improved the bonding force between adhesive tape and adhesive member.
The present invention can also take scheme as following to reach such purpose.
That is, adhesive tape stripping off device of the invention is the adhesive tape that will be pasted the adhesive tape of workpiece and remove from the workpiece
Stripping off device, which is characterized in that
The adhesive tape stripping off device has:
Holding station is used to load and keep to be pasted with the workpiece of the adhesive tape；
Adhesive member has the adhesive surface with adhesiveness at least part of outer peripheral surface；
Control mechanism is bonded, the surface bonding of the adhesive member Yu the adhesive tape is made；
Mechanism for stripping shells the adhesive member for being bonded with the adhesive tape to scheduled band relative to the workpiece
It is mobile from direction, remove the adhesive tape from the workpiece；And
Removal mechanism removes the adhesive tape stripped down from the adhesive member.
(function and effect) according to the program, bonding control mechanism makes to have to have at least part of outer peripheral surface to bond
The adhesive member of the adhesive surface of property and the surface bonding of adhesive tape.Then, mechanism for stripping makes the adhesive member for being bonded with adhesive tape
It is mobile to scheduled band peeling direction relative to the workpiece, remove the adhesive tape from workpiece.
It in this case, being capable of the auxiliary as the holding component of release band, holding adhesive tape without using removing
Under the premise of component, adhesive tape is removed from workpiece using the bonding force of adhesive member.Thus, it is possible to be appropriately carried out above-mentioned side
Method.
In addition, in above-mentioned invention, it is preferred that the adhesive member is bond roll, and the mechanism for stripping makes to bond
There is the bond roll of the adhesive tape to roll, bond the adhesive tape and the adhesive surface, while batching the adhesive tape,
To make the adhesive tape remove from the workpiece.
(function and effect) roll the bond roll for being bonded with adhesive tape according to the program, keep adhesive tape and adhesive surface viscous
It closes, while batching the adhesive tape, so that adhesive tape be made to remove from workpiece.In this case, it is stripped the adhesive tape to get off and glues
The adhesive surface bonding of roller is closed, therefore, which is taken up in such a way that the outer peripheral surface with bond roll is adjacent to.Thus, it is possible to can
Adhesive tape and the component of surrounding is avoided to bond and the situation of peeling-off mistake by ground.
In addition, in above-mentioned invention, it is preferred that the adhesive member is provided in the adhesive surface for adsorbing
The adsorption hole of adhesive tape is stated, the bonding control mechanism abuts the adhesive member with the adhesive tape, makes the adhesive tape
It is bonded with the adhesive surface, while the adhesive tape is adsorbed by the adsorption hole.
(function and effect) have adsorption hole according to the program, adhesive member.Also, bond adhesive tape and adhesive surface simultaneously
And adhesive tape is adsorbed using adhesive member.Thus, the adsorption capacity of adsorption hole and the bonding force synergistic effect of adhesive surface, therefore, energy
Adhesive member is enough improved to the retentivity of adhesive tape.
In addition, in above-mentioned invention, it is preferred that have bonding force recovery mechanism, the bonding force recovery mechanism is to institute
The adhesive surface for stating the adhesive member after adhesive tape is removed is cleaned and is restored the bonding force of the adhesive surface.
(function and effect) clean adhesive surface after adhesive tape is removed and restore the adhesive surface according to the program
Bonding force.Therefore, it even if Reusability adhesive member, also can more reliably avoid occurring as caused by the reduction of bonding force
Bond the situation of mistake.
In addition, in above-mentioned invention, it is preferred that have the cooling that the adhesive surface of the adhesive member is cooling
Mechanism.
(function and effect) have the cooling body that adhesive surface is cooling according to the program.In this case, though for
The bonding force between adhesive tape and workpiece is reduced in the case where being heated to adhesive tape, can also prevented
The situation that the bonding force as caused by high temperature reduces in the adhesive surface of adhesive member.Thus, it is possible to make between adhesive tape and workpiece
Bonding force reduces, while can be improved the bonding force between adhesive tape and adhesive member.
The effect of invention
Adhesive tape stripping means and adhesive tape stripping off device according to the present invention, the adhesive member for making to have adhesive surface with
In the state of adhesive tape bonding, move workpiece and adhesive member relatively, so that adhesive tape be made to remove from workpiece.Therefore, energy
It is enough to remove adhesive tape from workpiece under the premise of without using auxiliary part as release band, holding component.
Detailed description of the invention
Fig. 1 is the main view for indicating the basic structure of adhesive tape stripping off device of embodiment 1.
Fig. 2 is the top view for indicating the basic structure of adhesive tape stripping off device of embodiment 1.
Fig. 3 is the right view for indicating the basic structure of adhesive tape stripping off device of embodiment 1.
Fig. 4 is the flow chart of a series of movement in the adhesive tape stripping off device for indicate embodiment 1.
Fig. 5 is the figure of the movement in the step S2 for indicate the adhesive tape stripping off device of embodiment 1.
Fig. 6 is the figure of the movement in the step S3 for indicate the adhesive tape stripping off device of embodiment 1.(a) of Fig. 6 is to indicate just
In the main view to the mobile stripping unit in removing starting position, (b) of Fig. 6 is to indicate that bond roll is bonded with the state of protection band
Main view, (c) of Fig. 6 be indicate bond roll and protection band bonding range top view, (d) of Fig. 6 is to indicate using
It holds in the previous scheme of component, hold the top view that component holds the range of protection band.
Fig. 7 is the figure of the movement in the step S4 for indicate the adhesive tape stripping off device of embodiment 1.(a) of Fig. 7 is to indicate just
In the main view for the state for removing protection band from wafer, (b) of Fig. 7 is the master for indicating the state after the completion of the removing of protection band
View.
Fig. 8 is the figure of the movement in the step S5 for indicate the adhesive tape stripping off device of embodiment 1.(a) of Fig. 8 be indicate by
For holding unit the main view for the state that hold protection band, (b) of Fig. 8 is to indicate to separate protection band from bond roll to remove
State main view.
Fig. 9 is the figure of the movement in the step S6 for indicate the adhesive tape stripping off device of embodiment 1.
Figure 10 is the perspective view of the bond roll of embodiment 2.
Figure 11 is the figure of the movement in the step S3 for indicate the adhesive tape stripping off device of embodiment 2.(a) of Figure 11 is to indicate
To the main view of the mobile stripping unit in removing starting position, (b) of Figure 11 indicates that bond roll is bonded with protection band
The main view of state, (c) of Figure 11 are to illustrate that the position between the adhesive surface, adsorption hole, protection band of bond roll when overlooking is closed
The figure of system.
Figure 12 is the figure for indicating the movement of adhesive tape stripping off device of embodiment 2.(a) of Figure 12 is indicated in step S4
The figure of movement, (b) of Figure 12 are the figures for indicating the movement in step S5.
Figure 13 is the figure for indicating the movement of adhesive tape stripping off device of embodiment 3.(a) of Figure 13 is to indicate in step s 4
The figure of bond roll rolled from removing starting end to center portion, (b) of Figure 13 are to indicate in step s 4 therefrom
The figure for the bond roll that centre part is rolled to removing end, (c) of Figure 13 are to illustrate that bond roll when looking down and protection band bond
Range figure.
Figure 14 is the figure of the movement in the step S5 for indicate the adhesive tape stripping off device of embodiment 3.(a) of Figure 14 is to indicate
Due to bond roll rotation and formed hold protection band when part used state figure, (b) of Figure 14 be indicate to hold from
The figure of the state for the protection band that bond roll drop down, (c) of Figure 14 are to illustrate bond roll for the bond roll for being bonded with protection band
With the perspective view of the range of protection band bonding.
Figure 15 is the figure for indicating the movement of adhesive tape stripping off device of embodiment 4.(a) of Figure 15 is to indicate in step s 4
The figure of bond roll rolled from removing starting end to center portion, (b) of Figure 15 are to indicate in step s 4 therefrom
The figure for the bond roll that centre part is rolled to removing end, (c) of Figure 15 are to indicate to remove from bond roll in step s 5 to protect
The figure of the state of band.
Figure 16 is the figure for indicating the adhesive tape stripping off device of variation.(a) of Figure 16 is bonding block (Japanese: adhesion ス
タ Application プ) face upwarding stereogram, (b) of Figure 16 is to indicate in the step S3 of variation mobile to removing starting position
The main view of block is bonded, (c) of Figure 16 is to indicate to bond the state that block is bonded with protection band in the step S3 of variation
Main view, (d) of Figure 16 is the main view for indicating the state for removing protection band from wafer in the step S4 of variation
Figure.
Figure 17 is the figure for illustrating the adhesive tape stripping off device of variation.(a) of Figure 17 is the perspective view of bond roll, Figure 17's
(b) it is when illustrating to overlook, the figure of positional relationship between the adhesive surface of bond roll, adsorption hole, protection band.
Description of symbols
1, adhesive tape stripping off device；3, holding station；5, band mechanism for stripping；7, band recoverer；19, movable part；23, removing is single
Member；25, motor；27, bond roll；37, cooling nozzles (cooling body)；39, component is held；41, recycling bins；43, washer jet
(bonding force recovery mechanism)；W, semiconductor crystal wafer；PT, protection band.
Specific embodiment
[embodiment 1]
Hereinafter, the embodiment of the present invention 1 is described with reference to the drawings.Fig. 1 is the master of the adhesive tape stripping off device 1 of embodiment 1
View, Fig. 2 are the top views of adhesive tape stripping off device 1, and Fig. 3 is the right view of adhesive tape stripping off device 1.In embodiment 1, with
From the knot for semiconductor crystal wafer W (hereinafter, being referred to simply as " wafer W ") the removing protection band PT for having protection band PT in surface mount in advance
It is illustrated for structure.That is, in embodiment 1, illustration uses wafer W as the adhesive tape being pasted with by taking protection band PT as an example
The case where object (workpiece).
The integrally-built explanation of < >
The adhesive tape stripping off device 1 has holding station 3, band mechanism for stripping 5 and with recoverer 7 etc., and holding station 3 loads
And the wafer W for keeping not shown transfer robot conveying.
Holding station 3 is metal chuck table, as shown in Fig. 2, being provided with multiple adsorption holes 9 on surface.Adsorption hole 9
Respectively connection is connected to external vacuum plant 11 via flow path 10 like that as shown in fig. 5 or the like.That is, by using vacuum plant 11
It is sucked by vacuum, so that holding station 3 is adsorbed and keeps placed wafer W.Holding station 3 is equipped with more fulcrum posts 13, and
And it is built-in with the heater 14 heated to wafer W and protection band PT.
Holding station 3 is not limited to made of metal, and the structure etc. formed by the porous material of ceramics also may be appropriately used
To replace.In addition, adsorption hole 9 and vacuum plant 11 it is not necessary to structure, as long as the knot of wafer W can be stably kept
Structure, holding station 3 can not adsorb the structure of wafer W.
Fulcrum post 13, which separates, to be equally spaced provided on the scheduled circumference of holding station 3.That is, fulcrum post 13 is configured to
It retreats and goes up and down relative to the retaining surface of holding station 3 under the action of cylinder 15.
As depicted in figs. 1 and 2, band mechanism for stripping 5 is equipped with stripping unit 23 by lifting shaft 21, and lifting shaft 21 is from can edge
The movable table 19 that horizontally moves back and forth in the x direction of track 17 extend downward.
Movable table 19, which is configured to utilize, hangs up between the driving pulley in rotation idler pulley and the drive shaft for being assemblied in motor
Endless belt and move horizontally.Stripping unit 23 can moving horizontally and move back and forth in the x direction with movable table 19.Lifting
Axis 21 is configured to make the integral elevating of stripping unit 23 using the positive and negative rotation driving of motor 25.Movable table 19 is equivalent in the present invention
Driving mechanism.
As shown in Fig. 1 and Fig. 4 etc., stripping unit 23 is provided with the bond roll 27 for removing protection band PT from wafer W.Bonding
Roller 27 is configured to available and hangs up in the belt wheel 31 for being assemblied in hollow rotary shaft 29 and be assemblied in the drive shaft of motor 33
Endless belt 36 and rotation between driving pulley 35.
In addition, stripping unit 23 has cooling nozzles 37.Cooling nozzles 37 are connect with gas supply part (not shown), are constituted
It is by blowing gas to the outer peripheral surface of bond roll 27 that bond roll 27 is cooling.Cooling nozzles 37 are equivalent to cold in the present invention
But mechanism.
At least part that bond roll 27 is configured to outer peripheral surface becomes the adhesive surface with adhesiveness.In the present embodiment,
The entirety that bond roll 27 is configured to outer peripheral surface becomes adhesive surface.As the outer peripheral surface for constituting bond roll 27, have adhesiveness
The example of material can enumerate rubber, elastomer or gelatinous high molecular material etc..
In addition, the material as the outer peripheral surface for constituting bond roll 27, particularly preferably by using the cleaning of the progress such as water
And restore the material of bonding force.As an example of preferred material, polyurethane series resin (Japanese: ウ レ タ can be enumerated
Application system resin), silicon system resin, acrylic resin etc..Bond roll 27 is bonded by adhesive surface and protection band PT, so as to incite somebody to action
Protection band PT is removed from wafer W, and is able to maintain the protection band PT stripped down from wafer W.
As shown in Fig. 1 etc., the position than holding station 3 on the front is set on peeling direction P with recoverer 7, is had
Holding unit 39 and recycling bins 41.Holding unit 39, which is held, to be removed from wafer W and is bonded the protection band that remain by bond roll 27
The end of PT.
By making bond roll 27 suitably mobile in the state of hold protection band PT for holding unit 39, thus from bond roll
27 removal protection band PT.The protection band PT that recycling bins 41 are got rid of in internal storage from bond roll 27.In embodiment 1,
Hold the removal mechanism that unit 39 is equivalent in the present invention.
Adhesive tape stripping off device 1 is also equipped with washer jet 43.Washer jet 43 and cleaning solution supplying device (not shown) connect
It is logical, it is configured to the adhesive surface jet cleaning liquid to bond roll 27.In the present embodiment, water is used as cleaning solution.It is clear by spraying
Washing lotion restores bond roll 27 so that dust, the jointing material for constituting protection band PT etc. be removed from the adhesive surface of bond roll 27
The bonding force of adhesive surface.Washer jet 43 is equivalent to the bonding force recovery mechanism in the present invention.
The explanation of < movement >
Then, a series of to using the adhesive tape stripping off device 1 of embodiment 1 to remove protection band PT from wafer W
Movement is illustrated.In addition, as protection band PT, the one-side band that can be reduced by heating using bonding force.
Step S1 (input of condition setting)
Firstly, being operated to operation portion (not shown) and inputting various conditions and set.One as the setting of various conditions
A example can enumerate heating temperature and the heating time, information related with the height of the retaining surface of holding station 3 of heater 14
Deng.The heating temperature of heater 14, heating time are set to the adhesive layer of protection band PT due to heating and foaming and intumescing and cause
The degree that bonding force disappears.
Step S2 (conveying and holding of wafer)
When various settings are completed, adhesive tape stripping off device 1 is made to work.Since work starts, it is pasted with protection band in advance
The wafer W of PT rear is conveyed by mechanical arm (not shown) align using alignment tool in holding station 3.At this point, start by
The heating that heater 14 carries out, holding station 3 are heated by heater 14.
As shown in figure 5, the back side is placed in by the wafer W that mechanical arm adsorbs from the more fulcrum posts outstanding of holding station 3
13.Later, fulcrum post 13 declines, and the entire back side of wafer W is placed in the upper table of holding station 3 with scheduled posture and position
Face.Moreover, the positioning mechanism that wafer W is equipped in the periphery of holding station 3 holds from periphery and realizes contraposition.
Later, vacuum plant 11 works and starts to be sucked by vacuum, so that wafer W, which is adsorbed, is held in holding station 3.It is adsorbed
The protection band PT on wafer W that remain is heated by heater 14, thus the adhesive layer hair of the heating fissility in protection band PT
Bubble expansion, the bonding force between protection band PT and wafer W reduce.
Step S3 (bonding of bond roll)
When completing the heating of predetermined time, heater 14 is made to stop working, and band mechanism for stripping 5 is made to work.According to
Work the instruction started, and control unit (not shown) controls movable table 19 and motor 25, makes the removing list with mechanism for stripping 5
Member 23 is suitably moved along horizontal direction and up and down direction.By the control, the bond roll 27 of stripping unit 23 is set to from first
Beginning position is mobile to removing starting position.In addition, removing starting position is configured to as protection band PT's as shown in (a) of Fig. 6
One end (removing starting end).
When bond roll 27 is moved to removing starting position, as shown in (b) of Fig. 6, make stripping unit 23 using motor 25
Decline.Since stripping unit 23 declines, so that bond roll 27 presses protection band PT, in the adhesive surface that the periphery of bond roll 27 is arranged
It is bonded with protection band PT.At this point, by it is in the adhesive surface of bond roll 27, be in contact with the x/y plane including protection band PT
Range is set as abutting range V.
As shown in (c) of Fig. 6, bond roll 27 is configured to, also with the comparable width for abutting range V of the width of bond roll 27
Width B2 wide of the B1 than the range H bonded with bond roll 27 in protection band PT.That is, bond roll 27 becomes the adhesive surface of wide cut
Protection band PT is pressed on to bond with protection band PT.
Thus, so that power is uniformly acted on the range in the width direction of protection band PT and bond and keep protection band PT, together
When can by protection band PT from wafer W remove.In addition, the width of particularly preferably bond roll 27 is greater than the diameter of protection band PT.?
In this case, reliably making to abut range V compared with range H as wide cut, therefore, it can more reliably make uniform power effect
Range in the width direction of protection band PT.
When making bond roll 27 and protection band PT is bonded, cooling nozzles 37 blow gas R to bond roll 27, by bond roll
27 is cooling.By the cooling, even if in the case where making protection band PT become high temperature due to heater 14, it also can be more reliable
Ground prevents 27 temperature of bond roll excessively high and reduces the bonding force of the adhesive surface of bond roll 27 by such situation.Preferably by cooling
The temperature of abutting range V in bond roll 27 is maintained 40 DEG C hereinafter, particularly preferably maintaining 10 DEG C or more and 30 by nozzle 37
DEG C or less.
Step S4 (removing of band)
After the adhesive surface bonding of the one end and bond roll 27 that make protection band PT, with arrow D such as in (a) of Fig. 7
It is shown such, move stripping unit 23 to the front with peeling direction P towards tiltedly upper.That is, driving stripping unit 23 makes its edge
The band peeling direction P parallel with the face of protection band PT it is mobile, also, stripping unit 23 is driven to make it also to far from wafer W
Direction is mobile, so that stripping unit is mobile to direction D obliquely.
As stripping unit 23 is driven to, the front with peeling direction P is mobile, and bond roll 27 is shelled relative to wafer W to band
It is mobile from direction P.By the opposite movement, protection band PT is peeled away from wafer W.
In addition it is also possible to be, the interference between stripping unit 23 and wafer W in order to prevent makes stripping unit 23 slightly
Ground rises to after the height degree higher than the surface of wafer W of the bottom surface of stripping unit 23, makes stripping unit 23 forwards
Oblique upper, that is, direction D is mobile.Alternatively, it is also possible to remove stripping unit 23 to band
Direction P is moved horizontally.
It is moved to obliquely upward in stripping unit 23 after certain position, makes stripping unit 23 to peeling direction P's
Front horizontal is mobile.It as shown in (b) of Fig. 7, is moved horizontally by this, keeps stripping unit 23 mobile to removing end side, protect
Protecting band PT is removed from wafer W completely.Stripping unit 23 is in the state of making the another side of protection band PT hang down further to band
The top of recoverer 7 is mobile.
Step S5 (recycling of band)
After making stripping unit 23 be moved to band recoverer 7, the position of suitable control bond roll 27, such as (a) institute of Fig. 8
Show the other end part for holding protection band PT using holding unit 39 like that.After holding unit 39 holds on protection band PT,
It is mobile to the rear with peeling direction P to make stripping unit 23 as shown in (b) of Fig. 8, while making bond roll 27 to Xiang Fanfang
To rotation.By the movement of stripping unit 23 and the reversion of bond roll 27, make to bond the protection band PT that remain by bond roll 27
It separates and is removed with bond roll 27.The protection band PT got rid of from bond roll 27 falls to recycling bins 41 and is recovered.
Step S6 (cleaning of bond roll)
Protection band PT is being removed and after having recycled from bond roll 27, is making bond roll 27 to moving near washer jet 43
It is dynamic.As shown in figure 9, washer jet 43 sprays cleaning solution S to the adhesive surface of bond roll 27, the adhesive surface of bond roll 27 is cleaned.
By the cleaning, dust, fragment of protection band PT etc. are removed from the adhesive surface of bond roll 27, therefore, the bonding of bond roll 27
The bonding force in face restores.Bond roll 27 after replying bonding force by cleaning returns to initial position.
Cleaning with bond roll 27 synchronously makes fulcrum post 13 rise and protrude from holding station 3, and wafer W is made to leave holding station
3.The top of mechanical arm enters between wafer W and holding station 3, adsorbs from the back side and keeps wafer W and by wafer W towards subsequent processing
It sends out.As previously discussed, the movement of a circulation terminates, and repeats identical movement later.
The effect of the structure of < embodiment 1 >
According to the adhesive tape stripping off device of embodiment 1, has the adhesive surface with adhesiveness by using in outer peripheral surface
Bond roll 27 removes protection band PT from wafer W.In this case, when removing protection band PT from wafer W, adhesive tape stripping
From device without structure needed for having the operation of release band, the release band, holding component etc..Thus, it is possible to reduce adhesive tape
The operating cost of stripping off device.
In addition, in previous structure, in the case where the holding component using claw-like, pin-shaped etc. is to remove protection band, also
Worry following problem: the power for removing concentrates on the relatively narrow region of the part in protection band, and protection band occurs damaged.Specifically
For, as shown in (d) of Fig. 6, using component V1 holding protection band PT is held, it is however generally that, hold component V1
Width B3 than hold component V1 tip portion J at protection band PT width B4 it is narrow.
Therefore, it is in protection band PT, by being acted between the part held holding component V1 and the part that is not held
Power generate biggish difference.As a result, worrying following problem: will protected while holding protection band PT by holding component V1
When band PT is removed from wafer W, especially in the peripheral portion for holding the part that component V1 is held, protection band PT occurs broken
Damage.
On the other hand, in the present embodiment, as shown in (c) of Fig. 6, bond the bond roll 27 of wide cut and protection band PT.
Therefore, power is made to uniformly act on the range in the width direction of protection band PT and remove protection band PT from wafer W.Thus,
It can be avoided excessive power when stripping process to act on a part of protection band PT and cause as protection band PT breakage
Situation.
Moreover, in the present invention, removed protection band PT using the bonding force at the outer peripheral surface of bond roll 27, therefore, energy
It is enough easily to restore bonding force by cleaning the outer peripheral surface.By carrying out such cleaning process, bonding can be recycled
Therefore the adhesive surface of roller 27 can reduce the replacement frequency of bond roll 27.Thus, it is possible to reduce the fortune of adhesive tape stripping off device
Row cost.
[embodiment 2]
Then, illustrate the embodiment of the present invention 2.In addition, for structure common in embodiment 1 and embodiment 2, mark
Identical appended drawing reference uses attached drawing to saying in embodiment 2 as the bond roll 27A of the structure different from embodiment 1
It is bright.
As shown in Figure 10, the bond roll 27A of embodiment 2 has flat surface 45 in a part of outer peripheral surface.In flat surface 45
It is provided with adsorption hole 47.Adsorption hole 47 is respectively connected to connection with suction unit (not shown), and being configured to bond roll 27A can be by
The absorption of adsorption hole 47 keeps protection band PT.
In addition, being configured to, by making the inside of bond roll 27A become positive pressure from negative pressure, can be discharged via adsorption hole 47
Gas.It is configured to, the position for being provided with adsorption hole 47 in flat surface 45 is the position corresponding to the range H abutted with protection band PT
It sets.
In addition, a part as outer peripheral surface becomes an example of the structure of the adhesive surface with adhesiveness, implementing
In example 2, the range H indicated with oblique line being configured in the outer peripheral surface of bond roll 27A becomes adhesive surface.Structure shown in Fig. 10 is
An example of bond roll 27A, the position that adhesive surface and adsorption hole 47 are arranged can suitably change.For example, both can be with reality
The entirety for applying the similarly outer peripheral surface of example 1 becomes adhesive surface, and being also possible to flat surface 45 in outer peripheral surface becomes the structure of adhesive surface.
The part as curved surface other than flat surface 45 in outer peripheral surface is provided with adsorption hole 47.
Using the part different from embodiment 1 as emphasis come it is to embodiment 2, for from wafer W remove protection band PT one
The movement of series is illustrated.In addition, the step of step S1 and step S2 is with embodiment 1 is identical, therefore, omit the description.
Step S3 (bonding of bond roll)
When completing the heating to protection band PT, band mechanism for stripping 5 is made to work and make stripping unit 23 to removing start bit
Set movement.When bond roll 27A is moved to removing starting position, as shown in (a) of Figure 11, makes bond roll 27A certainly then adjust
Downward at adsorption hole 47.In addition, for ease of description, the structure of stripping unit 23 is omitted in each figure after Figure 11
A part.
When completing to adjust the position of bond roll 27A at removing starting position, utilized as shown in (b) of Figure 11
Motor 25 declines stripping unit 23.At this point, cooling nozzles 37 blow gas R and cool down the adhesive surface of bond roll 27A.Pass through
Stripping unit 23 declines, so that bond roll 27A moderately presses protection band PT.Also, by the bonding for being set to flat surface 45
Face bonds bond roll 27A and protection band PT.
So that suction unit is worked while bond roll 27A and protection band PT bonding, adsorbs protection band by adsorption hole 47
PT.At this point, flat surface 45, adsorption hole 47, the positional relationship being provided between the range H of adhesive surface and protection band PT when overlooking
As shown in (c) of Figure 11.
That is, be set to bond roll 27A adhesive surface and adsorption hole 47 synergistic effect and keep protection band PT.By adsorption hole
47 generate adsorption capacities and by be set to range H adhesive surface generate bonding force act on respectively, so that bond roll 27A can
More stably keep protection band PT.
In addition, adhesive surface and adsorption hole 47 are respectively arranged at flat surface 45, carry out by flat surface 45 to flat protection
Bonding with PT is kept and absorption is kept, so that bond roll 27A can keep protection band PT in bigger range.Thus,
Bond roll 27A can be further increased to the retentivity of protection band PT.
When being bonded using bond roll 27A and adsorbing the one end of protection band PT, as shown in (a) of Figure 12, in flat surface
45 downward in the state of, make bond roll 27A to the front with peeling direction P towards tiltedly upper movement.By the movement, make bond roll
27A is mobile to band peeling direction P relative to wafer W, and protection band PT is removed (step S4) from wafer W.
Then, bond roll 27A is mobile to the top of recycling bins 41 in the state of remain protection band PT.It is being moved to back
After the top for receiving case 41, positive pressure is switched to from negative pressure as shown in (b) of Figure 12 and gas N is discharged from adsorption hole 47.
By the way that gas N is discharged from adsorption hole 47, so that protection band PT is separated with bond roll 27A and is removed.The protection being removed
Band PT falls to recycling bins 41 and is recovered (step S5).
After protection band PT is removed, the adhesive surface of bond roll 27A is cleaned using washer jet 43, restores bonding
Power, also, the wafer W after protection band PT is stripped sends out (step S6).
In embodiment 1, holding protection band is bonded using the bonding force for the adhesive surface being arranged in the periphery of bond roll 27
PT.On the other hand, the bond roll 27A of embodiment 2 is also equipped with adsorption hole 47, bonds in the bonding force using bond roll 27A
While keeping protection band, is adsorbed by adsorption hole and keep protection band PT.It therefore, can be further in the structure of embodiment 2
Therefore the protection band when removing protection band PT can be more reliably prevented to the retentivity of protection band PT by improving bond roll 27A
The situation that PT is fallen from bond roll 27A.
In addition, in example 2, by the way that gas N is discharged from adsorption hole 47, by bond roll 27A to the guarantor of protection band PT
Hold releasing.In this case, when bond roll 27A adsorbs protection band PT, even if a part in protection band PT is pulled into
In the case where the inside of adsorption hole 47, also reliably protection band PT can be discharged from adsorption hole 47.Thus, it is possible to reliably keep away
The situation of mistake occurs for the movement for exempting to remove protection band PT from bond roll 27A.
[embodiment 3]
Then, illustrate the embodiment of the present invention 3.The structure of the adhesive tape stripping off device 1 of embodiment 3 and the knot of embodiment 1
Structure is identical, therefore, for apparatus structure, omits the description.But embodiment 3 uses bond roll 27 to bond as with protection band PT
Structure.In addition, the stripping process of embodiment 3 is while on one side the rolling of bond roll 27 for making to be bonded with protection band PT by protection band
PT from wafer W remove this put it is different from the stripping process of step S4 of embodiment 1.Therefore, below to the step S4 of embodiment 3 with
Movement afterwards is illustrated.
Step S4 (removing of band)
When coming into effect the process of example 3, firstly, carrying out step S1~step S3 process similarly to Example 1.It is logical
The process for completing step S3 is crossed, so that bond roll 27 moderately presses the one end of protection band PT, the one end of protection band PT
((b) of Fig. 6) is bonded with the adhesive surface being arranged in the periphery of bond roll 27.
In the process of the step S4 of embodiment 1, by making to glue in the state of bonding protection band PT with bond roll 27
It is mobile to diagonally forward to close roller 27, so that protection band PT is removed ((a) of Fig. 7) from wafer W.On the other hand, in the step of embodiment 3
In the process of rapid S4, as shown in (a) of Figure 13, in the state of making protection band PT and bond roll 27 bonds, make bond roll 27 1
Side rolls mobile to the front with peeling direction P on one side.
In embodiment 3, by rolling bond roll 27, thus what protection band PT was arranged with the outer peripheral surface in bond roll 27
Adhesive surface is glued together and removes from wafer W.That is, by rolling the bond roll for being provided with adhesive surface in outer peripheral surface,
Protection band PT to strip down from wafer W is taken up in such a way that the outer peripheral surface with bond roll 27 is adjacent to.
Therefore, the removing end of protection band PT is rollably reached by bond roll 27, thus protection band PT it is whole from
Wafer W removing, is taken up in a manner of being adjacent to bond roll 27.That is, being not necessarily to remove the whole of protection band PT from wafer W
And bond roll 27 is made largely to leave holding station 3.
Step S5 (removal of band)
After stripping down protection band PT from wafer W, the protection band PT of bond roll 27 will be wound to from bond roll
27 removals.Make the direction rotation that bond roll 27 is opposite to the direction of rotation rolled in step s 4 on one side, makes bond roll on one side
27 is mobile to the top with recoverer 7.
The bonding force of protection band PT is lowered, therefore, by making the rotation round about of bond roll 27, thus protection band PT
The other end separated with bond roll 27 and hang down ((a) of Figure 14).Then, as shown in (b) of Figure 14, holding unit 39 are utilized
Hold the other end part that the slave bond roll 27 of protection band PT hangs down.Make bond roll 27 further anti-in the state of maintaining the holding
Turn, while keeping it mobile to the rear with peeling direction P, so that protection band PT is separated with the adhesive surface of bond roll 27 and is removed
(referring to (b) of Fig. 8).
Step S6 (cleaning of bond roll)
After getting rid of protection band PT from bond roll 27, in the same manner as other embodiments, sprayed using from washer jet 43
The adhesive surface of cleaning solution cleaning bond roll 27 out.Then, protection band PT is stripped to the wafer W to get off to send out.By above
Movement, complete embodiment 3 a series of process.
In embodiment 3, using the bond roll 27 for having the adhesive surface with adhesiveness, the bonding force of bond roll 27 is utilized
Protection band PT is removed from wafer W.That is, in the same manner as other embodiments, it can be without using auxiliary such as holding component, release band
The removing to protection band PT is carried out under the premise of component, therefore, can obtain the effect for reducing the operating cost of device.
In addition, in embodiment 3, on one side rolling the bond roll 27 that there is adhesive surface in periphery and making protection band PT and glue
The bonding of conjunction face on one side removes protection band PT from wafer W.Therefore, the protection band PT stripped down from wafer W with bond roll 27
The mode that is adjacent to of outer peripheral surface be taken up, therefore, the protection band PT stripped down becomes compact centered on bond roll 27
The shape ((b) of Figure 13) that ground is entwined.That is, (b) that can be avoided Fig. 7 in embodiment 3 is such, the guarantor that strips down
The another side of protecting band PT significantly hangs down such situation from bond roll 27.
In the case where protection band PT significantly hangs down from bond roll 27, the knot of protection band PT and device droping down are worried
Structure contacts and bonds and occur the situation of the conveying mistake of protection band PT.In order to avoid the situation, need keeping, conveying removing
Ensure broader space around the bond roll 27 of the protection band PT to get off.As a result, being difficult to avoid that the enlargement of device.
On the other hand, in embodiment 3, the another side of the protection band PT stripped down is taken up in bond roll 27, not
It is separated with bond roll 27.Thus, even if not ensuring broader space, it also can be avoided the knot of protection band PT and wafer W, device
Structure bonds and occurs the risk of conveying mistake.
In addition, in embodiment 1, will be bonded with the bond roll 27 of protection band PT forwards or top pulls and by protection band
PT removing.In such a configuration, in order to remove the entirety of protection band PT, need to make bond roll 27 to be moved to forwards or top
The position of the other end (the removing end of protection band PT) far from holding station 3.
On the other hand, in embodiment 3, bond roll 27 is made to roll and batch the protection in a manner of being adjacent to protection band PT
Band PT simultaneously removes protection band PT, therefore, at the time of bond roll 27 is moved to the removing end of protection band PT, protection band
PT is all stripped.Thus, even if not ensuring broader space around holding station 3, bonding that it is also possible to reliably perform
Removing of the roller 27 to protection band PT.
Moreover, in embodiment 3, bond roll 27 bonds protection band PT while rolling on protection band PT, thus
By protection band PT from wafer W remove, therefore, can be avoided occur protection band PT removing mistake situation, protection band PT or
Damaged situation occurs for wafer W.Illustrate the effect using attached drawing.
In step S4 when just starting, with the comparable position T1 of the one end of protection band PT at, bond roll 27 and protect
Protecting band PT bonds ((a) of Figure 13).The range M1 that protection band PT is abutted and bonded with bond roll 27 at the T1 of position is narrow, because
This, bond roll 27 is smaller to the bonding force of protection band PT ((c) of (c) of Figure 13, Figure 14).
But, range M1 also corresponds to the range of the protection band PT and wafer W bonding at the T1 of position.That is, at the T1 of position
Bonding force between protection band PT and wafer W is also smaller.Thus, even if bond roll 27 is smaller to the bonding force of protection band PT,
Protection band PT can be removed from wafer W using the bonding force.
Then, bond roll 27 is rolled to band peeling direction P, to move to the comparable position T2 of the central portion of protection band PT
It is dynamic.At this point, the range M2 wider that protection band PT is bonded with wafer W at the T2 of position, therefore, in the position T2 as central portion
The bonding force located between protection band PT and wafer W is bigger.
But, range M2 also corresponds to the range that protection band PT is abutted and bonded with bond roll 27 at the T2 of position.That is,
Bond roll 27 also becomes larger the bonding force of protection band PT at the T2 of position.Thus, even the bonding between protection band PT and wafer W
The biggish central portion T2 of power can also be removed protection band PT from wafer W using the bigger bonding force.
In this way, in embodiment 3, can also make the bonding force between bond roll 27 and protection band PT according to bond roll
It 27 goes and occurs towards central portion from the end of protection band PT, the variation of bonding force between protection band PT and wafer W, suitably
Ground variation.Therefore, it is being difficult to remove the center portion of protection band PT, also can reliably remove protection band PT from wafer W.
Moreover, in embodiment 3, being particular enable to avoid protection band PT, wafer W when the end of removing protection band PT broken
The situation of damage.That is, the bonding force between protection band PT and wafer W is relatively low in the end of protection band PT.Therefore, when making
When big power acts on the end and removes protection band PT, crystal stock circle W can be lifted together with protection band PT.As a result,
Worry wafer W deformation, damaged situation.In addition, also worrying protection band PT breakage since excessive power acts on protection band PT
Situation.
The case where protection band is kept using absorption or holding as in the past, simultaneously removes protection band from wafer
Under, the retentivity of protection band no matter the end of protection band or in central portion it is all constant.Therefore, in previous stripping means
In, the case where acting on the end of protection band there are excessive power and lead to protection band, wafer breakage.In addition, there is also as follows
Situation: in the central portion of protection band, the bonding force between protection band and wafer is lower than to the retentivity of protection band, protection band occurs
Removing mistake.
In contrast, in embodiment 3, make that the bond roll with adhesive surface 27 is .ed while rolling on protection band PT
Protection band PT is bonded, while batching protection band PT and removing protection band PT.It in this case, can be protection band PT's
The bonding force that end reduces bond roll 27 is the power for removing protection band PT, while increasing the bonding force of bond roll 27 in central portion.
Thus, in embodiment 3, can be avoided following situation: in the end of protection band PT, the power removed it is excessive and
Make the breakages such as wafer W.And following situation can also be avoided: insufficient by the power of removing protection band PT in the central portion of protection band PT
Lead to the removing mistake that protection band PT occurs.
[embodiment 4]
Then, illustrate the embodiment of the present invention 4.The structure of embodiment 4 is to be applied to implement by the stripping process of embodiment 3
Made of the structure of example 2.That is, in example 4, as the structure for keeping protection band PT, using Figure 10 similarly to Example 2
Shown such bond roll 27A.That is, using by bond roll 27A outer peripheral surface setting adsorption hole 47 carry out absorption and
By the bonding similarly carried out in the adhesive surface of outer peripheral surface setting, to keep protection band PT, and protection band PT is removed.
Also, in example 4, in step s 4, roll bond roll 27A on protection band PT
It is dynamic, so that protection band PT and adhesive surface is bonded and is batched protection band PT, so that protection band PT be removed from wafer W.Therefore, exist
In the bond roll 27A of embodiment 4, the adhesive surface with adhesiveness is set to the entire outer peripheral surface of bond roll 27A.
In embodiment 3 and embodiment 4, from can more properly execute so that protection band PT is bonded and is closely attached on bond roll
It is preferably viscous with the entire outer peripheral surface of bond roll from the aspect of the mode of the periphery of 27A is batched as the process of protection band PT
The structure in conjunction face.In addition, in the adhesive tape stripping off device 1 of embodiment 4, the structure other than adhesive surface of bond roll 27A
It is same as Example 2.
The a series of process of embodiment 4 is illustrated below.Step S1~step S3 process and 2 phase of embodiment
Together.That is, being operated and being set (step S1) such as the heating conditions of heater 14 to operation portion.Then, make adhesive tape removing dress
1 work is set, the wafer W for being pasted with protection band PT is conveyed to holding station 3 and the absorption of holding station 3 is made to keep wafer W, and is made
Heater 14 works and heats to protection band PT, reduces the bonding force of protection band PT by (step S2).
When completing the heating to protection band PT, band mechanism for stripping 5 is made to work and make stripping unit 23 to removing start bit
Movement is set, so that cooling nozzles 37 is worked and is cooled down the adhesive surface of bond roll 27A, while bond roll 27A being made to press on protection band
PT ((b) of Figure 11).Then, it bonds protection band PT with the adhesive surface for being set to flat surface 45, also, suction unit is made to work
And protection band PT is adsorbed in the flat surface 45 (step S3) of bond roll 27A by adsorption hole 47.It is generated by adsorption hole 47
Adsorption capacity and by adhesive surface generate bonding force act on respectively, so that bond roll 27A stably keeps protection band PT.
Step S4 (removing of band)
In the step S4 of embodiment 2, make bond roll 27A in the state of remain protection band PT to band peeling direction P
Front towards tiltedly upper movement, so that protection band PT is removed ((a) of Figure 12) from wafer W.On the other hand, when embodiment 4
When step S4 starts, make using the bond roll 27A for adsorbing and bonding in the state of remain protection band PT on protection band PT
((a) of Figure 15) is rolled to peeling direction P.
As bond roll 27A is rolled, protection band PT and the adhesive surface of the outer peripheral surface setting in bond roll 27A are glued together.
As a result, protection band PT is taken up in such a way that the periphery with bond roll 27A is adjacent to, protection band PT is peeled away from wafer W.
As bond roll 27A is gone from the one end T1 of protection band PT towards center portion T2, bond roll 27A and protection band PT
Between bonding force also increase.Therefore, even if the stronger center portion T2 of bonding force between protection band PT and wafer W
In, bond roll 27A reliably can also be removed protection band PT from wafer W using the bonding force.
In addition, as bond roll 27A is gone towards the other end from the center portion T2 of protection band PT, bond roll 27A and protect
Bonding force between protecting band PT reduces together with bonding force between wafer W with protection band PT.Therefore, in the end of protection band PT
In, it can be avoided the situation that the power for removing protection band PT exceedingly acted on and caused protection band PT, wafer W breakage.Pass through
Bond roll 27A is rolled to the other end of protection band PT, so that the whole of protection band PT is removed from wafer W, with bond roll 27A
The mode being adjacent to is batched in bond roll 27A ((b) of Figure 15).
Step S5 (removal of band)
After stripping down protection band PT from wafer W, make bond roll 27A on one side to the rotation rolled in step s 4
Turn contrary direction rotation, makes bond roll 27A mobile to the top with recoverer 7 on one side.By making bond roll 27A to phase
Opposite direction rotation, so that the other end of protection band PT separates with bond roll 27A and hangs down (4 (a) referring to Fig.1).
Also, the other end part (referring to Fig.1 4 hung down using the slave bond roll 27A that holding unit 39 holds protection band PT
(b)).It inverts bond roll 27A further, while making it to after with peeling direction P
Fang Yidong.In addition, synchronously switching to positive pressure from negative pressure with the movement and gas N being discharged from adsorption hole 47.Pass through gas N's
Discharge and the rotation and movement of bond roll 27A, separate protection band PT with the adhesive surface of bond roll 27A and are removed (Figure 15
(c)).The protection band PT got rid of falls to recycling bins 41 and is recovered.
Step S6 (cleaning of bond roll)
After getting rid of protection band PT from bond roll 27A, in the same manner as other embodiments, sprayed using from washer jet 43
The adhesive surface of cleaning solution cleaning bond roll 27A out.Then, protection band PT is stripped to the wafer W to get off to send out.By above
Movement, complete embodiment 4 a series of process.
Present invention is not limited to the embodiments described above, being capable of the deformation implementation as so following.
(1) in above-described embodiment 1 and embodiment 2, protection band PT is removed from wafer W as being bonded with protection band PT
Adhesive member, used bond roll 27, but it is not limited to this.One example of the structure as substitution bond roll 27, can lift
Such block-like bonding block 61 shown in (a) of Figure 16 out.In this variation, bonding block 61 is equivalent to viscous in the present invention
Close component.
Bond block 61 in outer peripheral surface, at least one side have flat surface 63.Bond in block 61, at least flat surface
63 become the adhesive surface with adhesiveness.The flat surface 63 of bonding block 61 is made of the material with adhesiveness, bonds block
61 bond by flat surface 63 and protection band PT.Additionally, it is preferred that being configured to the guarantor in the width B5 ratio bonding range V of flat surface 63
The width of protecting band PT is wide, and the width B5 for being particularly preferably configured to flat surface 63 is wider than the diameter of protection band PT.In addition, in embodiment
In the case where using bonding block 61 in 2, adsorption hole 47 is suitably arranged in flat surface 63.
Using bonding block 61 to remove protection band PT in the case where, the process of step S3 and step S4 for example it is following this
Sample.That is, starting step S3 after completing step S1 and step S2 in the same manner as each embodiment, make to bond block 61 to protection
The top of removing starting end with PT is mobile ((b) of Figure 16).At this point, the flat surface 63 for being adjusted to bonding block 61 (walks downward
Rapid S3).
Later, make to bond the decline of block 61 as shown in (c) of Figure 16, the flat surface 63 for becoming adhesive surface is pressed on
Protection band PT.By the pressing, bond protection band PT and flat surface 63.Make protection band PT and bonds the shape of the bonding of block 61
Under state, make to bond block 61 to the front direction with peeling direction P tiltedly upper mobile ((d) of Figure 16).Bond block 61 relative to
Wafer W is mobile to band peeling direction P, so that protection band PT removes (step S4) from wafer W.
After protection band PT is stripped down by bonding block 61, protected using holding unit 39 is equal from the bonding removal of block 61
Protecting band PT (step S5).Then, the flat surface 63 for bonding block 61 using 43 pairs of washer jet cleans, and wafer W is sent out
(step S6).
Bonding block 61 is bulk, therefore, is easy the adhesive surface bonded with protection band PT being set as wider and more flat
Face.Therefore, it can be improved the bonding force between protection band PT, therefore, can more stably keep protection band PT, also, energy
It is enough reliably to remove protection band PT from wafer W.
(2) in the various embodiments described above and variation, instantiating as the protection band PT of removing object is round situation,
But it is not limited to this.As another example, the solution of the present invention can be also applied to rectangular shape, polygonal shape etc.
Protection band PT be removing object the case where.In this case, it is set to the configuration of the adhesive surface of bond roll 27, is set to bonding
The configuration of the adsorption hole 47 of roller 27A can be suitably changed according to the shape of protection band PT.
In the case where for example being removed the protection band PT of rectangular shape using the bond roll 27A of embodiment 2, such as Figure 17
(a) shown in, the adsorption hole 47 for being preferably disposed on bond roll 27A is arranged to two-dimensional-matrix-like.In this case, exist in step s3
The positional relationship between adsorption hole 47 and protection band PT when bonding using bond roll 27A and adsorb protection band PT becomes Figure 17
(b) shown in like that.That is, the protection band PT of rectangular shape and the configuration of adsorption hole 47 are properly corresponding, therefore, it is set to bonding
The adhesive surface and adsorption hole 47 of roller 27A acts synergistically, so as to more stably keep protection band PT.
(3) it in the various embodiments described above and each variation, instantiates as an example using the protection band PT of heating fissility
And the scheme for reducing the bonding force of protection band PT by heating, but it is not limited to this.That is, ultraviolet curing both can be used
Property protection band PT and by ultraviolet light irradiation reduce bonding force, can also do not make protection band PT bonding force reduce before
It puts the end for holding protection band PT and removes protection band PT from wafer W.
(4) in the mounting device of the various embodiments described above and each variation, as one as the adhesive tape for removing object
A example is illustrated by taking the protection band PT of circuit protection as an example, but the adhesive tape for becoming removing object is not limited to protect
The adhesive tape that cutting belt etc. is used for other purposes can be also set as removing object by protecting band.
(5) in the various embodiments described above and variation, instantiating moves bond roll 27 to band peeling direction P
The scheme moved and remove protection band PT from wafer W.But, as long as making bond roll 27 relative to wafer W to peeling direction P
The scheme for moving and removing protection band PT from wafer W, is not limited to the program.That is, being also possible to by making to remain crystalline substance
The holding station 3 of circle W is mobile, to keep bond roll 27 mobile to band peeling direction P relative to wafer W.Alternatively, it is also possible to make to bond
Roller 27 and holding station 3 synchronously move.
(6) in the scheme of the various embodiments described above and each variation, instantiate wafer W as being pasted with is with protection band PT
Object, that is, workpiece of the adhesive tape of example, but it is not limited to this.As structure used in workpiece, in addition to the compound by gallium, arsenic
Or except the wafer W of a variety of materials such as silicon formation, additionally it is possible to enumerate by taking ring frame, glass substrate, ceramic substrate, FPC as an example
The various articles such as the metal material of organic material substrate, precision parts etc..In addition, the solution of the present invention is applied to prop up
It pastes in the case where the device of fabrication and installation frame to the adhesive tape transannular frame held and wafer, ring frame and wafer are equivalent to work
Part.
Claims (10)
1. a kind of adhesive tape stripping means is the adhesive tape removing side that will be pasted the adhesive tape of workpiece and remove from the workpiece
Method, which is characterized in that
The adhesive tape stripping means has:
Adhesion process makes the surface bonding of adhesive member Yu the adhesive tape, the adhesive member is outside in the adhesion process
At least part of circumferential surface has the adhesive surface with adhesiveness；
Stripping process, in the stripping process, make to be bonded with the adhesive member of the adhesive tape relative to the workpiece to
Scheduled band peeling direction is mobile, removes the adhesive tape from the workpiece；And
Removal process removes the adhesive tape stripped down from the adhesive member in the removal process.
2. adhesive tape stripping means according to claim 1, which is characterized in that
The adhesive member is bond roll,
In the stripping process, the bond roll for being bonded with the adhesive tape is rolled, glues the adhesive tape with described
The bonding of conjunction face, while the adhesive tape is batched, so that the adhesive tape be made to remove from the workpiece.
3. adhesive tape stripping means according to claim 1 or 2, which is characterized in that
In the adhesion process,
It abuts the adhesive member for being provided with adsorption hole in the adhesive surface with the adhesive tape, makes the adhesive tape and institute
Adhesive surface bonding is stated, while the adhesive tape is adsorbed by the adsorption hole.
4. adhesive tape stripping means according to claim 1 or 2, which is characterized in that
The adhesive tape stripping means has bonding force recovery process, in the bonding force recovery process, is gone to the adhesive tape
The adhesive surface of the adhesive member after removing is cleaned and is restored the bonding force of the adhesive surface.
5. adhesive tape stripping means according to claim 1 or 2, which is characterized in that
The adhesion process has the cooling procedure that the adhesive surface of the adhesive member is cooling.
6. a kind of adhesive tape stripping off device is the adhesive tape removing dress that will be pasted the adhesive tape of workpiece and remove from the workpiece
It sets, which is characterized in that
The adhesive tape stripping off device has:
Holding station is used to load and keep to be pasted with the workpiece of the adhesive tape；
Adhesive member has the adhesive surface with adhesiveness at least part of outer peripheral surface；
Control mechanism is bonded, the surface bonding of the adhesive member Yu the adhesive tape is made；
Mechanism for stripping makes to be bonded with the adhesive member of the adhesive tape relative to the workpiece to scheduled band removing side
To movement, remove the adhesive tape from the workpiece；And
Removal mechanism removes the adhesive tape stripped down from the adhesive member.
7. adhesive tape stripping off device according to claim 6, which is characterized in that
The adhesive member is bond roll,
The mechanism for stripping rolls the bond roll for being bonded with the adhesive tape, keeps the adhesive tape and the adhesive surface viscous
It closes, while batching the adhesive tape, so that the adhesive tape be made to remove from the workpiece.
8. adhesive tape stripping off device according to claim 6 or 7, which is characterized in that
The adhesive member is provided with the adsorption hole for adsorbing the adhesive tape in the adhesive surface,
The bonding control mechanism abuts the adhesive member with the adhesive tape, keeps the adhesive tape and the adhesive surface viscous
It closes, while the adhesive tape is adsorbed by the adsorption hole.
9. adhesive tape stripping off device according to claim 6 or 7, which is characterized in that
The adhesive tape stripping off device has bonding force recovery mechanism, after which is removed the adhesive tape
The adhesive surface of the adhesive member is cleaned and is restored the bonding force of the adhesive surface.
10. adhesive tape stripping off device according to claim 6 or 7, which is characterized in that
The adhesive tape stripping off device has the cooling body that the adhesive surface of the adhesive member is cooling.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018076036A JP2019186399A (en) | 2018-04-11 | 2018-04-11 | Adhesive tape peeling method and adhesive tape peeling device |
| JP2018-076036 | 2018-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110364417A true CN110364417A (en) | 2019-10-22 |
Family
ID=68214873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910285578.9A Pending CN110364417A (en) | 2018-04-11 | 2019-04-10 | Adhesive tape stripping means and adhesive tape stripping off device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2019186399A (en) |
| KR (1) | KR20190118967A (en) |
| CN (1) | CN110364417A (en) |
| TW (1) | TW201943812A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114683673A (en) * | 2020-12-28 | 2022-07-01 | 日机装株式会社 | Peeling mechanism and laminating apparatus using the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI803340B (en) * | 2022-06-07 | 2023-05-21 | 精材科技股份有限公司 | De-taping apparatus and operating method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5635363B2 (en) | 2010-10-19 | 2014-12-03 | 日東電工株式会社 | Protective tape peeling method and protective tape peeling apparatus |
| JP2016039301A (en) | 2014-08-08 | 2016-03-22 | 日東電工株式会社 | Adhesive tape peeling method and adhesive tape peeling device |
-
2018
- 2018-04-11 JP JP2018076036A patent/JP2019186399A/en active Pending
-
2019
- 2019-03-04 TW TW108107001A patent/TW201943812A/en unknown
- 2019-04-08 KR KR1020190040702A patent/KR20190118967A/en unknown
- 2019-04-10 CN CN201910285578.9A patent/CN110364417A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114683673A (en) * | 2020-12-28 | 2022-07-01 | 日机装株式会社 | Peeling mechanism and laminating apparatus using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201943812A (en) | 2019-11-16 |
| KR20190118967A (en) | 2019-10-21 |
| JP2019186399A (en) | 2019-10-24 |
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Application publication date: 20191022 |