CN110350051A - 一种含氮化合物晶硅叠瓦双面太阳电池及其制备方法 - Google Patents
一种含氮化合物晶硅叠瓦双面太阳电池及其制备方法 Download PDFInfo
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 59
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 69
- 238000002161 passivation Methods 0.000 claims abstract description 38
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- 229910052796 boron Inorganic materials 0.000 claims description 30
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Abstract
本发明公开了一种含氮化合物晶硅叠瓦双面太阳电池及其制备方法,属于晶硅太阳能技术领域,其包括从上到下设置的第一氮化硅减反射层、p型掺杂层、n型硅衬底层、氮化钽背钝化层、第二氮化硅减反射层,第一氮化硅减反射层上表面和第二氮化硅减反射层下表面还设置有金属栅线电极层。本发明太阳电池背面采用氮化钽背钝化层和第二氮化硅减反射层,降低了太阳电池的背面复合速率和背面入射光的反射率,提高了背面电池的效率和背面电池的短路电流,及太阳电池的双面率。氮化钽背钝化层不仅有选择电子传输的能力,还能降低背面电极印刷的接触电阻。上述设置增加了设备利用率,工艺简单,制造出双面叠瓦太阳组件,增加了发电量,降低了生产制造成本。
Description
技术领域
本发明属于晶硅太阳能技术领域,具体涉及一种含氮化合物晶硅叠瓦双面太阳电池及其制备方法。
背景技术
随着环境污染的问题受到人们的高度重视后,传统的化石能源逐渐被新能源替代,新能源领域中太阳能成了人们关注的焦点。太阳能有着清洁,使用安全,转化利用比较容易的特点。在太阳能电池类型中晶硅太阳电池占85%以上的市场,是目前太阳能电池的主要产品,太阳能的开发利用加速了太阳电池技术的发展,市场陆续出现了双面叠瓦晶硅太阳电池,双面叠瓦太阳电池增加了发电量,降低了衬底硅片的浪费,充分利用了太阳光,在光伏建筑一体化方面应用有比较大的潜力,现如今成了世界上科研院所和光伏企业的研究热点。
发明内容
本发明的目的在于:提供一种含氮化合物晶硅叠瓦双面太阳电池,太阳电池背面采用氮化钽背钝化层和第二氮化硅减反射层,降低了太阳电池的背面复合速率和背面入射光的反射率,提高了背面电池的效率和背面电池的短路电流,及太阳电池的双面率。选用氮化钽背钝化层不仅有选择电子传输的能力,还能降低背面电极印刷的接触电阻。氮化硅减反射层和氮化钽背钝化层增加了设备利用率,工艺简单,制造出双面叠瓦太阳组件,增加了发电量,降低了生产制造成本。
本发明采用的技术方案如下:
一种含氮化合物晶硅叠瓦双面太阳电池,包括从上到下依次设置的第一氮化硅减反射层104、p型掺杂层101、n型硅衬底层100、氮化钽背钝化层102、第二氮化硅减反射层103,第一氮化硅减反射层上表面和第二氮化硅减反射层下表面还设置有金属栅线电极层105。
进一步地,所述氮化钽背钝化层102的钽源的前驱体是戊酰亚胺基-三二甲基氨基钽,所述氮化钽背钝化层102的氮源前驱体气体为纯氨气或者氮气和氢气的组合气体,所述氮化钽背钝化层102的厚度为50-120nm。。
进一步地,所述第一氮化硅减反射层104和第二氮化硅减反射层103的硅源来自SiH4气体,氮源来自氨气、一氧化氮、氮气的至少之一,第一氮化硅减反射层的厚度为80-120nm,第二氮化硅减反射层的厚度为20-80nm。
进一步地,p型掺杂层101为硼源掺杂层,硼源掺杂层的掺杂浓度1016~1020/cm3,硼源掺杂层的厚度为200~500nm。
进一步地,所述n型硅衬底层100为单晶硅或多晶硅,所述n型硅衬底层100的衬底厚度为160~180um。
进一步地,第一氮化硅减反射层上表面和第二氮化硅减反射层下表面,使用丝网印刷工艺和叠瓦双面太阳电池网版制备金属栅线电极层,金属栅线电极层105是Cu或Cu与Mo、W、Ti、Ni、Al、Mg、Ta、Sn、Ag至少之一所形成的合金,或者,金属栅线电极层105是Ag或Ag的合金。
一种含氮化合物晶硅叠瓦双面太阳电池的制备方法,包括以下步骤:
(1)选用n型硅衬底,进行清洗制绒步骤,形成表面织构化结构金字塔形状,n型硅衬底的厚度160~180um;
(2)在n型硅衬底层的上表面,使用硼源扩散设备,制备p型掺杂层101,硼源掺杂浓度1016~1020/cm3,硼源掺杂层的厚度为200~500nm;
(3)在硼源掺杂层的上表面,使用原子层沉积(ALD)设备制备第一氮化硅减反射层104,硅源前驱体气体来自SiH4,氮源前驱体为氨气,第一氮化硅减反射层的厚度为80~120nm;
(4)在n型硅衬底层的下表面,使用原子层沉积(ALD)设备制备氮化钽背钝化层,钽源的前驱体是戊酰亚胺基-三(二甲基氨基)钽,氮源前驱体气体为氮气和氢气的组合气体,含量比例10:1,氮化钽背钝化层的厚度为50~120nm;
(5)在氮化钽背钝化层下表面,使用原子层沉积(ALD)设备制备第二氮化硅减反射层103,硅源前驱体气体来自SiH4,氮源前驱体为氮气,第二氮化硅减反射层的厚度为20~80nm;
(6)在第一氮化硅减反射层上表面和第二氮化硅减反射层下表面,使用丝网印刷工艺和叠瓦双面太阳电池网版制备金属栅线电极层,金属栅线电极层为Cu或Cu与Mo、W、Ti、Ni、Al、Mg、Ta、Sn、Ag至少之一所形成的合金,或者,金属栅线电极层为Ag或Ag的合金,金属栅线电极层的厚度为30um~80um。
综上所述,由于采用了上述技术方案,本发明的有益效果是:
1、本发明中,太阳电池背面采用氮化钽背钝化层和第二氮化硅减反射层叠层组合,降低了太阳电池的背面复合速率和背面入射光的反射率,提高了背面电池的效率和背面电池的短路电流,及太阳电池的双面率。
2、本发明中,选用氮化钽背钝化层不仅有选择电子传输的能力,还能降低背面电极印刷的接触电阻。氮化硅减反射层和氮化钽背钝化层的氮源的来源相同,设置不同的腔体,可以在同一台设备制备,增加设备的利用率高,工艺简单,制造出双面叠瓦太阳组件,增加了发电量,降低了生产制造成本。
附图说明
图1为本发明实施例1的结构示意图;
图2为本发明实施例2的结构示意图;
图3为本发明网版示意图;
图中标记:100-n型硅衬底层、101-硼源掺杂层、102-氮化钽背钝化层、102a-二氧化硅层、103-第二氮化硅减反射层、104-第一氮化硅减反射层、105-金属栅线电极层。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅用以解释本发明,并不用于限定本发明。
一种含氮化合物晶硅叠瓦双面太阳电池,包括从上到下依次设置的第一氮化硅减反射层104、p型掺杂层101、n型硅衬底层100、氮化钽背钝化层102、第二氮化硅减反射层103,第一氮化硅减反射层上表面和第二氮化硅减反射层下表面还设置有金属栅线电极层105。
进一步地,所述氮化钽背钝化层102的钽源的前驱体是戊酰亚胺基-三二甲基氨基钽,所述氮化钽背钝化层102的氮源前驱体气体为纯氨气或者氮气和氢气的组合气体,所述氮化钽背钝化层102的厚度为50-120nm。。
进一步地,所述第一氮化硅减反射层104和第二氮化硅减反射层103的硅源来自SiH4气体,氮源来自氨气、一氧化氮、氮气的至少之一,第一氮化硅减反射层的厚度为80-120nm,第二氮化硅减反射层的厚度为20-80nm。
进一步地,p型掺杂层101为硼源掺杂层,硼源掺杂层的掺杂浓度1016~1020/cm3,硼源掺杂层的厚度为200~500nm。
进一步地,所述n型硅衬底层100为单晶硅或多晶硅,所述n型硅衬底层100的衬底厚度为160~180um。
进一步地,第一氮化硅减反射层上表面和第二氮化硅减反射层下表面,使用丝网印刷工艺和叠瓦双面太阳电池网版制备金属栅线电极层,金属栅线电极层105是Cu或Cu与Mo、W、Ti、Ni、Al、Mg、Ta、Sn、Ag至少之一所形成的合金,或者,金属栅线电极层105是Ag或Ag的合金。
实施例1
如图1所示,本发明的一种含氮化合物晶硅叠瓦双面太阳电池,包括从上到下依次设置的第一氮化硅减反射层(104)、硼源掺杂层(101)、n型硅衬底层(100)、氮化钽背钝化层(102)、第二氮化硅减反射层(103)、在第一氮化硅减反射层上表面和第二氮化硅减反射层下表面设置金属栅线电极层(105)。
本实施例通过以下步骤制备而成:
(1)选用n型单晶硅或多晶硅衬底,进行清洗制绒步骤,形成表面织构化结构金字塔形状,n型单晶硅或多晶硅衬底的厚度160~180um。
(2)在晶硅衬底100的上表面,使用硼源扩散设备,制备p型硼源掺杂层101,硼掺杂浓度1016~1020/cm3,硼源掺杂层的厚度为200~500nm。
(3)在硼源掺杂层101上表面,使用原子层沉积(ALD)设备制备第一氮化硅减反射层104,硅源前驱体气体来自SiH4,氮源前驱体为氨气,制备的氮化硅减反射层含有H原子,饱和硅片表面的悬挂键,降低了界面态密度,第一氮化硅减反射层的厚度为80~120nm。
(4)在晶硅衬底100的下表面,使用原子层沉积(ALD)设备制备氮化钽背钝化层102,钽源的前驱体是戊酰亚胺基-三(二甲基氨基)钽,氮源前驱体气体为氮气和氢气的组合气体,含量比例10:1,
氮化钽背钝化层制备时含有H原子,饱和硅片表面的悬挂键,降低了界面复合速率,氮化钽具有电子选择性接触特性,阻挡的空穴少数载流子通过,降低了背面电池的复合中心,提高了背面电池的效率和背面电池的短路电流,及太阳电池的双面率,氮化钽背钝化层的厚度为50~120nm。
(5)在氮化钽背钝化层102下表面,使用原子层沉积(ALD)设备制备第二氮化硅减反射层103,硅源前驱体气体来自SiH4,氮源前驱体为氮气,降低电池背面的反射率,第二氮化硅减反射层的厚度为20~80nm。
(6)在第一氮化硅减反射层104上表面和第二氮化硅减反射层103下表面,使用丝网印刷工艺和叠瓦双面太阳电池网版制备金属栅线电极层105,金属栅线电极层为Cu或Cu与Mo、W、Ti、Ni、Al、Mg、Ta、Sn、Ag至少之一所形成的合金,或者,金属栅线电极层Ag或Ag的合金,金属栅线电极层105的厚度为30um~80um。
实施例2
如图2所示,本发明的一种含氮化合物晶硅叠瓦双面太阳电池,包括从上到下依次设置的包括从上到下依次设置的第一氮化硅减反射层(104)、硼源掺杂层(101)、n型硅衬底层(100)、二氧化硅层(102a)、氮化钽背钝化层(102)、第二氮化硅减反射层(103)、在第一氮化硅减反射层上表面和第二氮化硅减反射层下表面设置金属栅线电极层(105)
本实施例通过以下步骤制备而成:
(1)选用n型单晶硅或多晶硅衬底,进行清洗制绒步骤,形成表面织构化结构金字塔形状,n型单晶硅或多晶硅衬底的厚度160~180um。
(2)在晶硅衬底100的上表面,使用硼源扩散设备,制备p型硼源掺杂层101,硼掺杂浓度1016~1020/cm3,硼源掺杂层的厚度为200~500nm。
(3)在硼源掺杂层101上表面,使用原子层沉积(ALD)设备制备第一氮化硅减反射层104,硅源前驱体气体来自SiH4,氮源前驱体为氨气,制备的氮化硅减反射层含有H原子,饱和硅片表面的悬挂键,降低了界面态密度,第一氮化硅减反射层的厚度为80~120nm。
(4)在晶硅衬底100的下表面,先使用HF和添加剂对晶硅电池的背面进行抛光,然后用低温臭氧氧化设备,氧化时间60~90s,形成一层致密的二氧化硅层102a,进行硅片下表面的化学钝化,二氧化硅层的厚度为3~10nm。
(5)在二氧化硅层102a的下表面,使用原子层沉积(ALD)设备制备氮化钽背钝化层102,钽源的前驱体是戊酰亚胺基-三(二甲基氨基)钽,氮源前驱体气体为氮气的组合气体,纯度为99.9%,制备的氮化钽背钝化层具有电子选择性接触特性,阻挡的空穴少数载流子通过,降低了背面电池的复合中心,提高了背面电池的效率和背面电池的短路电流,及太阳电池的双面率,氮化钽背钝化层的厚度为50~120nm。
(6)在氮化钽背钝化层102下表面,使用原子层沉积(ALD)设备制备第二氮化硅减反射层103,硅源前驱体气体来自SiH4,氮源前驱体为氮气,降低电池背面的反射率,第二氮化硅减反射层的厚度为20~80nm。
(7)在第一氮化硅减反射层104上表面和第二氮化硅减反射层103下表面,使用丝网印刷工艺和叠瓦双面太阳电池网版制备金属栅线电极层105,金属栅线电极层为Cu或Cu与Mo、W、Ti、Ni、Al、Mg、Ta、Sn、Ag至少之一所形成的合金,或者,金属栅线电极层Ag或Ag的合金,金属栅线电极层105的厚度为30um~80um。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。
Claims (7)
1.一种含氮化合物晶硅叠瓦双面太阳电池,其特征在于,包括从上到下依次设置的第一氮化硅减反射层(104)、p型掺杂层(101)、n型硅衬底层(100)、氮化钽背钝化层(102)、第二氮化硅减反射层(103),第一氮化硅减反射层上表面和第二氮化硅减反射层下表面还设置有金属栅线电极层(105)。
2.按照权利要求1所述的一种含氮化合物晶硅叠瓦双面太阳电池,其特征在于,所述氮化钽背钝化层(102)的钽源的前驱体是戊酰亚胺基-三(二甲基氨基)钽,所述氮化钽背钝化层(102)的氮源前驱体气体为纯氨气或者氮气和氢气的组合气体,所述氮化钽背钝化层(102)的厚度为50-120nm。。
3.按照权利要求1所述的一种含氮化合物晶硅叠瓦双面太阳电池,其特征在于,所述第一氮化硅减反射层(104)和第二氮化硅减反射层(103)的硅源来自SiH4气体,氮源来自氨气、一氧化氮、氮气的至少之一,第一氮化硅减反射层的厚度为80-120nm,第二氮化硅减反射层的厚度为20-80nm。
4.按照权利要求1所述的一种含氮化合物晶硅叠瓦双面太阳电池,其特征在于,p型掺杂层(101)为硼源掺杂层,硼源掺杂层的掺杂浓度1016~1020/cm3,硼源掺杂层的厚度为200~500nm。
5.按照权利要求1所述的一种含氮化合物晶硅叠瓦双面太阳电池,其特征在于,所述n型硅衬底层(100)为单晶硅或多晶硅,所述n型硅衬底层(100)的衬底厚度为160~180um。
6.按照权利要求1所述的一种含氮化合物晶硅叠瓦双面太阳电池,其特征在于,金属栅线电极层(105)是Cu或Cu与Mo、W、Ti、Ni、Al、Mg、Ta、Sn、Ag至少之一所形成的合金,或者,金属栅线电极层(105)是Ag或Ag的合金。
7.一种含氮化合物晶硅叠瓦双面太阳电池的制备方法,其特征在于,包括以下步骤:
(1)选用n型硅衬底,进行清洗制绒步骤,形成表面织构化结构金字塔形状,n型硅衬底的厚度160~180um;
(2)在n型硅衬底层的上表面,使用硼源扩散设备,制备p型掺杂层101,硼源掺杂浓度1016~1020/cm3,硼源掺杂层的厚度为200~500nm;
(3)在硼源掺杂层的上表面,使用原子层沉积(ALD)设备制备第一氮化硅减反射层104,硅源前驱体气体来自SiH4,氮源前驱体为氨气,第一氮化硅减反射层的厚度为80~120nm;
(4)在n型硅衬底层的下表面,使用原子层沉积(ALD)设备制备氮化钽背钝化层,钽源的前驱体是戊酰亚胺基-三(二甲基氨基)钽,氮源前驱体气体为氮气和氢气的组合气体,含量比例10:1,氮化钽背钝化层的厚度为50~120nm;
(5)在氮化钽背钝化层下表面,使用原子层沉积(ALD)设备制备第二氮化硅减反射层103,硅源前驱体气体来自SiH4,氮源前驱体为氮气,第二氮化硅减反射层的厚度为20~80nm;
(6)在第一氮化硅减反射层上表面和第二氮化硅减反射层下表面,使用丝网印刷工艺和叠瓦双面太阳电池网版制备金属栅线电极层,金属栅线电极层为Cu或Cu与Mo、W、Ti、Ni、Al、Mg、Ta、Sn、Ag至少之一所形成的合金,或者,金属栅线电极层为Ag或Ag的合金,金属栅线电极层的厚度为30um~80um。
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