CN110349865A - The packaging method of chip - Google Patents
The packaging method of chip Download PDFInfo
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- CN110349865A CN110349865A CN201810299486.1A CN201810299486A CN110349865A CN 110349865 A CN110349865 A CN 110349865A CN 201810299486 A CN201810299486 A CN 201810299486A CN 110349865 A CN110349865 A CN 110349865A
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- 238000000034 method Methods 0.000 title claims abstract description 92
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 46
- 239000012530 fluid Substances 0.000 claims abstract description 89
- 238000012536 packaging technology Methods 0.000 claims abstract description 79
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 238000003780 insertion Methods 0.000 claims abstract description 41
- 230000037431 insertion Effects 0.000 claims abstract description 41
- 230000000295 complement effect Effects 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241001062009 Indigofera Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/951—Supplying the plurality of semiconductor or solid-state bodies
- H01L2224/95101—Supplying the plurality of semiconductor or solid-state bodies in a liquid medium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
Abstract
A kind of packaging method of chip, comprising: substrate is provided, there is several the first openings in the substrate；Several the first chips are provided, the shape of first chip is complementary with the shape of the first opening；It will all the first chip be embedded in the first opening using first fluid at least once from packaging technology；Will all the first chips insertion first opening in after, formed in the substrate several second opening；Several the second chips are provided, the shape of second chip is complementary with the shape of the second opening, and the size of second chip is different from the size of the first chip；It will all the second chip be embedded in the second opening using second fluid at least once from packaging technology.The packaging method can be improved the Embedding efficiency of the first chip and the second chip.
Description
Technical field
The present invention relates to encapsulation field more particularly to the packaging methods of chip.
Background technique
Micro- light emitting diode (Micro LED) has the characteristics that energy conservation, simple structure, small in size and slim, also, micro- hair
Optical diode also have the characteristics that it is self luminous so that micro- light emitting diode is not necessarily to backlight, and high resolution, micro- light emitting diode
The next generation display technology being considered as after OLED.The luminous efficiency of micro- light emitting diode is better than OLED, and the two difference can
Up to 2~3 times, therefore, for the display screen for same brightness, the battery life of micro- light emitting diode (LED) display screen is higher than OLED
2~3 times of battery life, advantageously account for the power problems of display screen.
Micro- light emitting diode generally includes the chip of three kinds of colors, specifically, the chip of three kinds of colors includes: in work shape
It glows respectively when state, the chip of green light and blue light.
However, the size of three kinds of color chips is different, so that being embedded in different size cores using existing packaging method
The efficiency of piece is lower.
Summary of the invention
The technical problem to be solved by the present invention is to provide a kind of packaging methods of chip, to improve the packaging efficiency of chip.
In order to solve the above technical problems, the present invention provides a kind of packaging method of chip, comprising: provide substrate, the base
There is several the first openings in bottom；Several the first chips, the shape of the shape of first chip and the first opening are provided
It is complementary；It will all the first chip be embedded in the first opening using first fluid at least once from packaging technology；It will whole first cores
After in the first opening of piece insertion, several the second openings are formed in the substrate；Several the second chips are provided, described
The shape of two chips is complementary with the shape of the second opening, and the size of second chip is different from the size of the first chip；It adopts
It will all the second chip be embedded in the second opening with second fluid at least once from packaging technology.
Optionally, the color that first chip and the second chip shine in working condition is different；It is described luminous
Color includes: red, green and blue.
Optionally, packaging system is provided；The first fluid is from packaging technology and second fluid from packaging technology described
It is carried out in packaging system.
Optionally, the packaging system includes: solution chamber, and for containing solution, the solution is for submerging substrate；Fortune
Dynamic control device, for controlling the direction of motion of substrate.
Optionally, the solution includes: deionized water, organic solution or inorganic solution.
Optionally, the first fluid from the method for packaging technology include: that substrate is immersed in solution；Substrate is submerged
After in solution, first chip is put into solution chamber, first chip is suspended in solution；Opening movement control
Device processed makes basement movement, during the motion, in first opening of the first chip insertion.
Optionally, the second fluid from the method for packaging technology include: that substrate is immersed in solution；Substrate is submerged
After in solution, the second chip is put into solution chamber, second chip is immersed in solution；Opening movement control dress
It sets, makes basement movement, in the process of movement, in second opening of the second chip insertion.
Optionally, the packaging system further include: feed inlet at the top of the solution chamber is located at the solution cavity
The discharge port and circulator of room bottom；When first fluid is from the number of packaging technology or second fluid from packaging technology
Number when being greater than 1 time, the circulator is used to carry out the of first fluid next time from packaging technology or next time
The self-styled dress technique of two fluids；The circulator includes circulation pipe and the circulating pump that is connected to circulation pipe, the circulation pipe both ends
It is connected to respectively with discharge port and feed inlet, and further includes dispensing port at the top of the circulation pipe.
Optionally, when first fluid is greater than one time from the number of packaging technology, next time the is carried out using circulator
The method of the self-styled dress technique of one fluid includes: to open discharge port and circulating pump to make first be not embedded under the action of circulating pump
Chip is again introduced into solution chamber by feed inlet along circulation pipe with solution, to encapsulate work certainly into first fluid next time
Skill.
Optionally, when second fluid is greater than one time from the number of packaging technology, next time the is carried out using circulator
The method of the self-styled dress technique of two fluids includes: to open discharge port and circulating pump to make second be not embedded under the action of circulating pump
Chip is again introduced into solution chamber by feed inlet along circulation pipe with solution, to encapsulate work certainly into second fluid next time
Skill.
It optionally, further include third chip, the size of the third chip and the size of the first chip and the second chip are equal
It is different；The packaging method further include: will all the second chip be embedded in after the second opening, and form several in the substrate
The shape of third opening, the third opening is complementary with the shape of third chip；Work is encapsulated using third fluid at least once certainly
Skill will be in whole third chips insertion third opening；The third fluid also carries out in the packaging system from packaging technology.
Optionally, the third fluid from the method for packaging technology include: that substrate is immersed in solution；Substrate is submerged
After in solution, third chip is put into solution chamber, the third chip is suspended in solution；Open the movement control
Device processed makes basement movement, the third chip insertion third opening.
Compared with prior art, the technical solution of the embodiment of the present invention has the advantages that
In the packaging method for the chip that technical solution of the present invention provides, the first chip and the second chip need to be carried out at insertion
Reason.Wherein, the insertion technique of the first chip is first fluid from packaging technology.When the timing of number one of first chip, by
Yu Yici first fluid can complete the insertion of several the first chips from packaging technology, therefore, will all the first chip insertions
Required technique number is less in first opening, it may be assumed that will all the first chip insertions first from packaging technology using first fluid
The efficiency of opening is higher.After whole the first openings of the first chip insertion, using second fluid from packaging technology by second
The second opening of chip insertion.When the timing of number one of the second chip, if since a second fluid can be embedded in from packaging technology
Dry the second chip, it is therefore, technique number required in all the second openings of the second chip insertion is less, it may be assumed that use second
Fluid is also higher by the efficiency of all the second openings of the second chip insertion from packaging technology.To sum up, the method is embedded in the first core
The Embedding efficiency of piece and the second chip is higher.
Further, the packaging method further includes being embedded in third chip in third opening, and the third chip is embedding
Entering technique is third fluid from packaging technology.When the number of third chip is a timing, since third fluid is from encapsulating work
Artistic skill enough completes the insertion of several third chips, therefore, whole third chips is embedded into technique required in third opening
Number is less, it may be assumed that from packaging technology that the efficiency of whole third chips insertion third opening is higher using third fluid.To sum up,
The method is higher to the Embedding efficiency of the first chip, the second chip and third chip.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of different scale chips encapsulating structures.
Fig. 2 to Fig. 9 is the structural schematic diagram of each step of one embodiment of packaging method of chip of the present invention.
Specific embodiment
As described in background, the efficiency for being embedded in micro- light emitting diode using existing packaging method is lower.
Fig. 1 is a kind of structural schematic diagram of different scale chips encapsulating structures.
Referring to FIG. 1, the substrate 100 is provided, with several the first opening (figures being separated from each other in the substrate 100
In be not shown), second opening (not shown) and third opening (not shown)；Using manipulator (not shown),
It is embedded in red chip 101a in the first opening, is embedded in Green Chip 101b in the second opening, is embedded in indigo plant in third opening
Color chip 101c, and the size of the red chip 101a, Green Chip 101b and blue chip 101c are different.
In the above method, in order to realize the insertion to red chip 101a, Green Chip 101b and blue chip 101c, benefit
With manipulator by red chip 101a, Green Chip 101b and blue chip 101c be respectively embedded into the first opening, second opening and
In third opening.
However, the manipulator can only once be embedded in a red chip 101a, a Green Chip 101b and one simultaneously
A blue chip 101c, and the quantity of the red chip 101a, Green Chip 101b and blue chip 101c are more, in order to
Whole red chip 101a, Green Chip 101b and blue chip 101c are respectively embedded into the first opening, the second opening and the
In three openings, so that manipulator needs the number of work more, therefore, whole red chip 101a, green are embedded in using manipulator
The efficiency of chip 101b and blue chip 101c are lower.
To solve the technical problem, the present invention provides a kind of packaging methods of at least two scale chips, comprising: adopts
It will all the first chip be embedded in the first opening with first fluid at least once from packaging technology；It will all the first chips insertions the
After in one opening, the second opening is formed in the substrate；It will all the from packaging technology using second fluid at least once
In the second opening of two chips insertion.The method is higher to the Embedding efficiency of the first chip and the second chip.
It is understandable to enable above-mentioned purpose of the invention, feature and beneficial effect to become apparent, with reference to the accompanying drawing to this
The specific embodiment of invention is described in detail.
Fig. 2 to Fig. 9 is the structural schematic diagram of each step of one embodiment of packaging method of chip of the present invention.
Fig. 2 and Fig. 3 are please referred to, Fig. 3 is diagrammatic cross-section of the Fig. 2 along A-A1 line, and Fig. 2 is the top view of Fig. 3, provides substrate
200；The part substrate 200 is removed, forms several the first openings 201 in the substrate 200.
The material of the substrate 200 includes graphite or glass.
In the present embodiment, the forming method of first opening 201 includes: to form first on 200 surface of substrate
Mask layer (not shown), first mask layer is interior to have the first mask open (not shown), first exposure mask
Opening exposes the top surface of part of substrate 200；Using first mask layer as exposure mask, the substrate 200 is etched, described
The first opening 201 is formed in substrate 200.
The material of first mask layer includes silicon nitride, titanium nitride or photoresist.First mask layer is for making
For the exposure mask for forming the first opening 201.
First mask open is determined by the shape of subsequent first chip.In the present embodiment, first core
The size top dimension of piece is greater than bottom size, and therefore, the top dimension of first mask open is greater than bottom size, accordingly
, the top dimension of the first opening 201 is greater than bottom size.In other embodiments, ruler at the top of the size of first chip
Very little to be greater than bottom size, therefore, the shape of first mask open includes cuboid or square, correspondingly, first opens
The shape of mouth includes cuboid or square.
In other embodiments, the forming method of first opening includes: Sheet Metal Forming Technology or laser drilling process.
First opening 201 is used for the first chip of subsequent receiving.In the present embodiment, in first opening 201
The technique for being embedded in the first chip includes first fluid from packaging technology, specifically please refers to Fig. 4.
Referring to FIG. 4, several the first chips 202 are provided, the shape of first chip 202 and the first opening 201
Shape is complementary；Using first fluid at least once all the first chip 202 insertion first 201 will be open (see figure from packaging technology
2) in.
When first opening 201 is embedded in the first chip 202, the meaning of not formed subsequent second opening is: having
Conducive to preventing the first chip of part 202 to be embedded in the second opening, to improve the accuracy of 202 embedded location of the first chip.
The forming method of first chip 202 includes: to provide the first initial substrate (not shown), at the beginning of described first
Beginning substrate surface has third mask layer (not shown), and the third mask layer exposes the top of the first initial substrate of part
Portion surface；Using the third mask layer as exposure mask, first initial substrate is etched, forms the first substrate (figure being separated from each other
In be not shown) and the first chip 202.
In the present embodiment, the material of first initial substrate is silicon, correspondingly, the first substrate and the first chip 202
Material be silicon.In other embodiments, the material of first substrate includes germanium or SiGe, correspondingly, the first substrate and
The material of first chip includes germanium or SiGe.
The material of the third mask layer includes silicon nitride, titanium nitride or photoresist, and the third mask layer is used for shape
At the exposure mask of the first chip 202.
Using the third mask layer as exposure mask, etch first initial substrate technique include: dry etch process and
One of wet-etching technology or two kinds of combinations.
The shape of first chip 202 is complementary with the shape of the first opening 201, and it is embedding to be conducive to subsequent first chip 202
Enter in the first opening 201.
Packaging system is provided；The first fluid is from packaging technology and subsequent second fluid from packaging technology and third
Fluid carries out in the packaging system from packaging technology.
The packaging system includes: solution chamber 203 (see Fig. 3), and the solution chamber 203 is for containing solution 204, institute
Solution 204 is stated for submerging substrate 200；Motion control device (not shown), for controlling the direction of motion of substrate 200.
The method that first chip 202 is embedded in (see Fig. 2) in first opening 201 from packaging technology using first fluid
It include: that substrate 200 is immersed in solution 204；The substrate 200 is immersed in solution 204, the first chip 202 is put into
In solution chamber 203, first chip 202 is suspended in solution 204；First chip is suspended in after solution 204, is opened
Motion control device is opened, substrate 200 is moved, in the process of movement, in the first opening 201 of the first chip 202 insertion.
The solution chamber 203 is first fluid from packaging technology and subsequent second fluid from packaging technology and third stream
Body provides working environment from packaging technology, and free from the influence of the external environment in the solution chamber 203, therefore, is conducive to mention
The controllability of high first chip 202 and subsequent second chip and third chip insertion situation.
First chip 202 is suspended in solution 204, and the solution 204 is conducive to for transmitting the first chip 202
First chip 202 is embedded into the first opening 201.
The solution 204 includes: deionized water, organic solution or inorganic solution.
It is embedded in (see Fig. 2) meaning of the first chip 202 in first opening 201 from packaging technology using first fluid
It is: since several the first chips 202 can be embedded into the first opening 201 by a first fluid from packaging technology, because
This, it is technique number required in all the first openings 201 of the first chip 202 insertion is less, it may be assumed that be encapsulated certainly using first fluid
Technique is higher by the efficiency in all the first openings 201 of the first chip 202 insertion.
In the present embodiment, the first fluid is greater than 1 time from the number of packaging technology, and the packaging system further includes following
Loop device 205, the circulator 205 for carry out next time first fluid from packaging technology.
In other embodiments, the first fluid is 1 time from the number of packaging technology, and the packaging system can not wrap
Include circulator.
The first chip 202 that the circulator 205 is used to for being not embedded into the first opening 201 last time is thrown to molten again
Sap cavity room 203 is repeatedly recycled, and being conducive to will be in whole the first opening 201 of the first chip 202 insertion.
In the present embodiment, 203 top of solution chamber also has feed inlet, and 203 bottom of solution chamber also has
There is discharge port；The circulatory system 205 further includes circulation pipe 208 and the circulating pump being connected to circulation pipe 208 206, the circulation
208 both ends of pipe are connected to discharge port and feed inlet respectively, and further include dispensing port 207 at the top of the circulation pipe 208.
The first chip 202 that the feed inlet is used to be not embedded into the first opening 201 is thrown to solution chamber 203 again
It is interior；The discharge port is for discharging the first chip 202 being not embedded into the first opening 201；The circulation pipe 208 is molten for conveying
Liquid 204；The circulating pump 206 is used to provide power for solution 204, is conducive to the first core that will be not embedded into the first opening 201
Piece 202 is delivered to again in solution chamber 203；The dispensing port 207 is for delivering the first chip 202.
First fluid next time is carried out using circulator 205 to include: opening discharge port from the method for packaging technology and follow
Ring pump 206, under the action of circulating pump 206, makes the first chip 202 being not embedded into pass through charging along circulation pipe 208 with solution 204
Mouthful it is again introduced into solution chamber 203, to enter first fluid next time from packaging technology.
In the present embodiment, first chip 202 glows at work.
In other embodiments, first chip green light or blue light at work.
Referring to FIG. 5, will all the first chip 202 insertion first be open after 201, if being formed in the substrate 200
Dry the second opening 208.
It will all the first chip 202 insertion first be open after 201, be formed before second opening 208, the formation
Method includes: to take out substrate 200 out of solution chamber 203；After substrate 200 is taken out out of solution chamber 203, the is carried out
The processing of one press mold.
The first press mold processing is for protecting fixed have been inserted into the first chip 202 in the first opening 201.
The forming method of second opening 208 includes: to form second in the substrate 200 and 202 surface of the first chip
Mask layer (not shown), second mask layer is interior to have the second mask open (not shown), second exposure mask
Opening exposes the top surface of part of substrate 200；Using second mask layer as exposure mask, the substrate 200 is etched, described
The second opening 208 is formed in substrate 200.
The material of second mask layer includes silicon nitride, titanium nitride or photoresist.Second mask layer is for making
For the exposure mask for forming the second opening 208.
Second mask open is determined by the shape of subsequent second chip.In the present embodiment, second core
The size top dimension of piece is greater than bottom size, and therefore, the top dimension of second mask open is greater than bottom size, accordingly
, the top dimension of the second opening 208 is greater than bottom size.In other embodiments, ruler at the top of the size of second chip
Very little to be greater than bottom size, therefore, the shape of second mask open includes cuboid or square, correspondingly, second opens
The shape of mouth includes cuboid or square.
Using second mask layer as exposure mask, the technique for etching the substrate 200 includes: that dry etch process and wet process are carved
One of etching technique or two kinds of combinations.
Second opening 208 is used for the second chip of subsequent receiving.In the present embodiment, in second opening 208
The technique for being embedded in the second chip includes second fluid from packaging technology, specifically please refers to Fig. 6.
Referring to FIG. 6, several the second chips 209 are provided, the shape of second chip 209 and the second opening 208
Shape is complementary, and the size of second chip 209 is different from the size of the first chip 202；Using second fluid at least once
It will all the second chip 209 insertion second be open in 208 (see Fig. 5) from packaging technology.
The forming method of second chip 209 is identical as the forming method of the first chip 202, and this will not be repeated here.
The second fluid includes: that substrate 200 is immersed in solution 204 from the method for packaging technology；Substrate 200 is soaked
Not after in solution 204, second chip 209 is put into solution chamber 203, second chip 209 is suspended in molten
In liquid 204；After second chip 209 is suspended in solution 204, opening movement control device moves substrate 200,
During movement, in second opening 208 of the insertion of the second chip 209.
Existed from packaging technology in the meaning that the second opening 208 is embedded in (see Fig. 5) the second chip 209 using second fluid
In: since several the second chips 209 can be embedded into the second opening 208 by a second fluid from packaging technology,
It is less that the second whole chips 209 is embedded into technique number required in the second opening 208, it may be assumed that self-styled using second fluid
Fill technique the efficiency in all the second openings 208 of the second chip 209 insertion is higher.
In the present embodiment, second chip 209 green light at work.In other embodiments, second core
Piece glows at work or blue light.
In the present embodiment, the packaging method further include: at least two thirds opening is formed in the substrate 200,
The third opening is used for subsequent receiving third chip.
In the present embodiment, when second opening 208 is embedded in the second chip 209, the meaning of not formed third opening
Justice is: being beneficial to prevent the second chip 209 and is embedded into third opening, to improve the standard of 209 embedded location of the second chip
True property.
In the present embodiment, the second fluid is greater than 1 time from the number of packaging technology, the second fluid after first time
It is realized from packaging technology by circulator 205.Using circulator 205 carry out next time second fluid from packaging technology
Method includes: to open discharge port and circulating pump 206 to make the second chip 209 being not embedded into molten under the action of circulating pump 206
Liquid 204 is again introduced into solution chamber 203 by feed inlet along circulation pipe 208, to encapsulate work certainly into second fluid next time
Skill.
In other embodiments, the second fluid from the number of packaging technology be 1 time.
Referring to FIG. 7, being formed in the substrate 200 after all the second chips 209 are embedded in the second opening 208
Several thirds opening 210.
After in all the second openings 208 of the second chips 209 insertion, forms the third and be open before 210, the shape
It include: to take out substrate 200 out of solution chamber 203 at method；After substrate 200 is taken out out of solution chamber 203, carry out
The processing of second press mold.
The second press mold processing is for protecting fixed have been inserted into the second chip 209 in the second opening 208.
The forming method of the third opening 210 is identical as the forming method of the second opening 208, and this will not be repeated here.
The third opening 210 is used for subsequent receiving third chip, the technique of the third chip insertion third opening 210
Including third fluid from packaging technology, Fig. 8 is specifically please referred to.
Fig. 8 and Fig. 9 are please referred to, several third chips 211 are provided, the shape and third of the third chip 211 are open
210 shape is complementary, and the mutual not phase of the size of the third chip 211 and the size of the first chip 202 and the second chip 209
Together；It will be in whole third chips 211 insertion third opening 210 from packaging technology using third fluid at least once.
It should be noted that Fig. 8 is consistent with the profile direction of Fig. 3, Fig. 9 is consistent with the profile direction of Fig. 2.
The forming method of the third chip 211 is identical as the forming method of the first chip 202, and therefore not to repeat here.
The third fluid includes: that substrate 200 is immersed in solution 204 from the method for packaging technology；Substrate 200 is soaked
Not after in solution 204, the third chip 211 is put into solution chamber 203, the third chip 211 is suspended in molten
In liquid 204；After the third chip 211 is suspended in solution 204, opening movement control device moves substrate 200,
During movement, the third chip 211 is embedded in third opening 210.
It is embedded in the meaning of third chip 211 (see Fig. 5) in third opening 210 from packaging technology using third fluid
It is: since several third chips 211 can be embedded into third opening 210 by a third fluid from packaging technology, because
This, it is less to be embedded into technique number required in third opening 210 for whole third chips 211, it may be assumed that certainly using third fluid
Packaging technology by whole third chips 211 be embedded into third opening 210 in efficiency it is higher.
In the present embodiment, the third fluid is greater than 1 time from the number of packaging technology, and the encapsulating structure further includes following
Loop device 205, the circulator 205 for carry out next time third fluid from packaging technology.It is carried out using circulator 205
Third fluid includes: to open discharge port and circulating pump 206 from the method for packaging technology next time, under the action of circulating pump 206,
The third chip 211 being not embedded into is set to be again introduced into solution chamber 203 by feed inlet along circulation pipe 208 with solution 204, to enter
Third fluid next time is from packaging technology.
In other embodiments, the third fluid from the number of packaging technology be 1 time.
In the present embodiment, the third chip 2011 blue light-emitting in working condition.In other embodiments, described
Three chips 211 green light or feux rouges in working condition.
By whole third chips 211 insertion third opening 210 in after, the packaging method further include: by substrate 200 from
It is taken out in solution chamber 203；After substrate 200 is taken out out of solution chamber 203, the processing of third press mold is carried out.
The third press mold processing is for protecting the fixed third chip 211 having been inserted into third opening 210.
In other embodiments, insertion technique to third chip is not included.
Although present disclosure is as above, present invention is not limited to this.Anyone skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (12)
1. a kind of packaging method of chip characterized by comprising
Substrate is provided, there is several the first openings in the substrate；
Several the first chips are provided, the shape of first chip is complementary with the shape of the first opening；
It will all the first chip be embedded in the first opening using first fluid at least once from packaging technology；
Will all the first chips insertion first opening in after, formed in the substrate several second opening；
Several the second chips are provided, the shape of second chip is complementary with the shape of the second opening, and second chip
Size it is different from the size of the first chip；
It will all the second chip be embedded in the second opening using second fluid at least once from packaging technology.
2. the packaging method of chip as described in claim 1, which is characterized in that first chip and the second chip are working
The color to shine when state is different；The luminous color includes: red, green and blue.
3. the packaging method of chip as described in claim 1, which is characterized in that provide packaging system；The first fluid is certainly
Packaging technology and second fluid carry out in the same packaging system from packaging technology.
4. the packaging method of chip as claimed in claim 3, which is characterized in that the packaging system includes: solution chamber, institute
Solution chamber is stated for containing solution, the solution is for submerging substrate；Motion control device, for controlling the movement side of substrate
To.
5. the packaging method of chip as claimed in claim 4, which is characterized in that the solution includes: deionized water, You Jirong
Liquid or inorganic solution.
6. the packaging method of chip as claimed in claim 4, which is characterized in that method of the first fluid from packaging technology
It include: that substrate is immersed in solution；After substrate is immersed in solution, first chip is put into solution chamber,
First chip is suspended in solution；After first chip is suspended in solution, opening movement control device makes basement movement,
During movement, in first opening of the first chip insertion.
7. the packaging method of chip as claimed in claim 4, which is characterized in that method of the second fluid from packaging technology
It include: that substrate is immersed in solution；After substrate is immersed in solution, second chip is put into solution chamber,
Second chip is suspended in solution；After second chip is suspended in solution, opening movement control device makes substrate
Movement, in the process of movement, in second opening of the second chip insertion.
8. the packaging method of chip as claimed in claim 4, which is characterized in that the packaging system further include: be located at described
Feed inlet at the top of solution chamber, discharge port and circulator positioned at the solution chamber bottom；When first fluid is self-styled
When the number or second fluid for filling technique are greater than 1 time from the number of packaging technology, the circulator is for carrying out next time
First fluid second fluid from packaging technology or next time from packaging technology；The circulator include circulation pipe and
The circulating pump being connected to circulation pipe, the circulation pipe both ends are connected to discharge port and feed inlet respectively, and at the top of the circulation pipe
It further include dispensing port.
9. the packaging method of chip as claimed in claim 8, which is characterized in that when the number of first fluid from packaging technology is big
When Yu Yici, carrying out first fluid next time using circulator from the method for packaging technology includes: to open discharge port and circulation
Pump, under the action of circulating pump, makes the first chip being not embedded into be again introduced into solution cavity by feed inlet along circulation pipe with solution
Room, to enter first fluid next time from packaging technology.
10. the packaging method of chip as claimed in claim 8, which is characterized in that when second fluid is from the number of packaging technology
For more than once when, using circulator carry out next time second fluid from the method for packaging technology include: open discharge port and
Circulating pump is again introduced into the second chip being not embedded into along circulation pipe by feed inlet with solution molten under the action of circulating pump
Sap cavity room, to enter second fluid next time from packaging technology.
11. the packaging method of chip as claimed in claim 4, which is characterized in that it further include third chip, the third chip
Size and the size of the first chip and the second chip be all different；The packaging method further include: all the second chips are embedding
After entering the second opening, several thirds opening, the shape and third chip of the third opening are formed in the substrate
Shape is complementary；It will be in whole third chips insertion third opening from packaging technology using third fluid at least once；The third
Fluid also carries out in the packaging system from packaging technology.
12. the packaging method of chip as claimed in claim 11, which is characterized in that the third fluid is from the side of packaging technology
Method includes: that substrate is immersed in solution；After substrate is immersed in solution, the third chip is put into through dispensing port molten
Chamber, third chip are suspended in solution；The motion control device is opened, basement movement is made, in the process of movement,
In the third chip insertion third opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810299486.1A CN110349865A (en) | 2018-04-04 | 2018-04-04 | The packaging method of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810299486.1A CN110349865A (en) | 2018-04-04 | 2018-04-04 | The packaging method of chip |
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| Publication Number | Publication Date |
|---|---|
| CN110349865A true CN110349865A (en) | 2019-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810299486.1A Pending CN110349865A (en) | 2018-04-04 | 2018-04-04 | The packaging method of chip |
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| CN (1) | CN110349865A (en) |
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| CN1137329A (en) * | 1993-12-17 | 1996-12-04 | 加利福尼亚大学董事会 | Method for fabricating self-assembling microstructures |
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| CN105789389A (en) * | 2016-05-03 | 2016-07-20 | 上海集成电路研发中心有限公司 | LED chip modularized packaging method |
| CN105826247A (en) * | 2016-05-05 | 2016-08-03 | 上海集成电路研发中心有限公司 | Chip interconnection wiring method based on fluidic self assembly technology |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1137329A (en) * | 1993-12-17 | 1996-12-04 | 加利福尼亚大学董事会 | Method for fabricating self-assembling microstructures |
| CN1147153A (en) * | 1995-06-07 | 1997-04-09 | 加利福尼亚大学董事会 | Method and apparatus for fabricating self-assembling microstructures |
| CN1485884A (en) * | 2002-09-27 | 2004-03-31 | ���µ�����ҵ��ʽ���� | Method for fabricating semiconductor device |
| CN105789389A (en) * | 2016-05-03 | 2016-07-20 | 上海集成电路研发中心有限公司 | LED chip modularized packaging method |
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