CN110345801B - Enhanced heat dissipation module, heat dissipation fin structure and stamping method thereof - Google Patents
Enhanced heat dissipation module, heat dissipation fin structure and stamping method thereof Download PDFInfo
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- CN110345801B CN110345801B CN201810304032.9A CN201810304032A CN110345801B CN 110345801 B CN110345801 B CN 110345801B CN 201810304032 A CN201810304032 A CN 201810304032A CN 110345801 B CN110345801 B CN 110345801B
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- tunnel
- heat dissipation
- tapering
- heat sink
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
- B21D53/022—Making the fins
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/08—Fins with openings, e.g. louvers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to an enhanced heat radiation module, a heat radiation fin structure and a stamping method thereof, wherein the enhanced heat radiation module comprises a first heat radiation fin and a second heat radiation fin, and the first heat radiation fin is provided with a first gradually reducing tunnel which protrudes outwards; the second heat dissipation fin is provided with a second gradually-reduced tunnel which protrudes outwards, wherein the first gradually-reduced tunnel and the second gradually-reduced tunnel jointly enclose a flow guide channel. Therefore, the natural heat convection is improved by utilizing the air pressure difference generated by hot air passing through the convergent tunnel, and the heat dissipation efficiency of the heat dissipation fins is further improved. By using the enhanced heat dissipation module, the surface area of the tapered tunnel is about 10 percent of the surface area of the heat dissipation fins, so that the heat dissipation fin structure has more surfaces for heat dissipation, and the heat dissipation efficiency of heat radiation can be improved without using additional coating on the surfaces of the heat dissipation fins.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to a heat dissipation structure, and more particularly, to an enhanced heat dissipation module, a heat dissipation fin structure and a stamping method thereof.
[ background of the invention ]
Heat dissipation is heat exchange by heat transfer, and the heat transfer mode has three types: conduction, convection and vertical deflection, wherein the radiating fins of the pen-shaped electric appliance mainly radiate heat by utilizing heat radiation and then radiate the heat by forced convection through a fan.
However, in order to maximize the radiation heat dissipation efficiency, the surface of the heat dissipation fins is often covered with highly polymeric nano-material carbon and graphite, but the improvement of the heat dissipation efficiency by the above method is limited, so how to improve the structure of the heat dissipation fins to improve the heat dissipation efficiency is one of the key points of research and development of the manufacturers.
In view of the above, the present inventors have made extensive studies and studies to solve the above problems in combination with the application of the above prior art, and as a result, the present inventors have developed the present invention.
[ summary of the invention ]
The invention provides an enhanced heat dissipation module, a heat dissipation fin structure and a stamping method thereof, which utilize the air pressure difference generated by hot air passing through a gradually-reduced tunnel to improve the natural heat convection, thereby improving the heat dissipation efficiency of heat dissipation fins.
In an embodiment of the present invention, the present invention provides a heat dissipation fin structure, including: a heat dissipation fin having at least one tapering tunnel protruding outwards.
In an embodiment of the present invention, the present invention provides an enhanced heat dissipation module, including: a first heat dissipation fin having at least one first gradually shrinking tunnel protruding outwards; and a second heat dissipation fin having at least one second tapering tunnel protruding outwards, wherein the first tapering tunnel and the second tapering tunnel together enclose a flow guide channel.
In an embodiment of the present invention, the present invention provides a method for stamping a heat dissipation fin structure, including: utilizing a slit cutting operation or a stamping indentation operation to cut two slits which are substantially parallel to each other on a heat dissipation fin; and providing a stamping mechanism, wherein the stamping mechanism stamps the area between the two slits until the area between the two slits is deformed to form a tapered tunnel, and the two slits are deformed to form two front and rear openings of the tapered tunnel.
Based on the above, the surface area of the tapered tunnel is about 10% of the surface area of the heat dissipation fin, so that the heat dissipation fin structure has more surfaces for heat dissipation, and the heat dissipation efficiency of heat dissipation can be improved without using additional paint on the surfaces of the heat dissipation fins.
[ description of the drawings ]
Fig. 1 is a schematic perspective view of a heat sink fin structure according to a first embodiment of the present invention.
Fig. 2 is a front view of a first embodiment of a heat sink fin structure according to the present invention.
Fig. 3 is a cross-sectional view of a first embodiment of a heat sink fin structure according to the present invention.
Fig. 4 is a front view of a second embodiment of a heat sink fin structure according to the present invention.
Fig. 5 is a schematic perspective view of a heat sink fin structure according to a third embodiment of the present invention.
Fig. 6 is a flowchart illustrating steps of a method for stamping a heat sink structure according to the present invention.
FIG. 7 is a schematic diagram of the present invention using a slit-cutting operation to cut two slits on a heat sink fin.
FIG. 8 is a schematic diagram of the present invention using a slit-cutting operation to cut two slits on a heat sink fin.
FIG. 9 is a schematic view of the punching mechanism of the present invention punching the area between two slits.
FIG. 10 is a schematic view of the area between two slits deformed to form a tapered tunnel and two slits deformed to form two ports according to the present invention.
Fig. 11 is a perspective view of an enhanced heat dissipation module according to a first embodiment of the invention.
Fig. 12 is a schematic cross-sectional view illustrating an enhanced heat dissipation module according to a first embodiment of the invention.
Fig. 13 is a partially enlarged cross-sectional view of an enhanced heat dissipation module according to a first embodiment of the invention.
Fig. 14 is a schematic cross-sectional view illustrating an enhanced heat dissipation module according to a second embodiment of the invention.
Fig. 15 is a schematic cross-sectional view illustrating an enhanced heat dissipation module according to a third embodiment of the invention.
Fig. 16 is a perspective view of a heat sink fin structure according to a fourth embodiment of the present invention.
Fig. 17 is a schematic cross-sectional view of a fifth embodiment of a heat sink fin structure according to the present invention.
Fig. 18 is a perspective view of a sixth embodiment of a heat sink fin structure according to the present invention.
Fig. 19 is a cross-sectional view of a seventh embodiment of a heat fin structure of the present invention.
[ detailed description ] embodiments
The following detailed description and technical contents of the present invention will be described with reference to the drawings, which are provided for illustrative purposes only and are not intended to limit the present invention.
Referring to fig. 1 to 3, the present invention provides a first embodiment of a heat sink fin structure, and the heat sink fin structure 10 mainly includes a heat sink fin 1.
As shown in fig. 1, the lower side of the heat sink 1 is in thermal contact with a heat source 100, the heat sink 1 has one or several tapered tunnels 11 protruding outwards, the front and back of the tapered tunnels 11 have two openings 12, the tapered tunnels 11 are opened in a tapered manner in a direction away from the heat source 100, so that the opening size of one opening 12 is larger than that of the other opening 12.
As shown in fig. 1 to 3, the tapering tunnel 11 has two sidewalls 111 and a top wall 112, the top wall 112 integrally extends and crosses the two sidewalls 111, so that the section of the tapering tunnel 11 is n-shaped, wherein the two sidewalls 111 taper towards the direction away from the heat source 100, so that the tapering tunnel 11 is a trapezoid tunnel.
In addition, the heat sink fin 1 is provided with one or more windows 13, the window 13 has two opposite sides 131, two sidewalls 111 of the tapered tunnel 11 are integrally formed by extending outwards from the two sides 131 of the window 13, and the top wall 112 corresponds to the window 13 cover.
As shown in fig. 1, the heat sink fin structure 10 of the present invention is used by thermally contacting a heat source 100 to the lower portion of the heat sink fin 1, wherein the heat sink fin 1 has a tapered tunnel 11 protruding outward, and the tapered tunnel 11 is opened in a tapered manner in a direction away from the heat source 100, such that the opening size of the through opening 12 disposed below is larger than the opening size of the through opening 12 disposed above. Therefore, when the hot air passes through the tapered tunnel 11 from bottom to top, the pressure increases due to the decrease of the fluid flow rate, otherwise, the pressure decreases due to the increase of the fluid flow rate, so that the opening size of the lower through opening 12 is larger than the opening size of the upper through opening 12, which causes the lower air pressure to be larger than the upper air pressure to generate an air pressure difference like "air pump", and the high temperature is squeezed to the low temperature to improve the natural heat convection, thereby achieving the purpose of improving the heat dissipation efficiency of the heat dissipation fin structure 10.
In addition, the surface area of the tapered tunnel 11 is about 10% of the surface area of the heat sink fin 1, so that the heat sink fin structure 10 has more heat dissipating surfaces, and the heat dissipating efficiency of the heat sink fin 1 can be improved without using additional paint on the surface.
Referring to fig. 4 to 5, a second and a third embodiments of the heat sink fin structure 10 of the present invention are shown, and the second and the third embodiments are substantially the same as the first embodiment, and the second and the third embodiments are different from the first embodiment in the shape of the tapered tunnel 11.
As further explained below, as shown in fig. 4, the two sidewalls 111 of the second embodiment are tapered toward the direction away from the heat source 100, so that the tapered tunnel 11 is a semi-elliptical tunnel; as shown in fig. 5, the tapered tunnel 11 of the third embodiment has two sidewalls 111 and a top wall 112, and the top wall 112 extends integrally and bridges the two sidewalls 111, so that the cross section of the tapered tunnel 11 is U-shaped. Wherein, no matter the convergent tunnel 11 is a trapezoid tunnel or a semi-elliptic tunnel, the section of the convergent tunnel 11 is n-shaped or U-shaped, and the effect of the convergent tunnel 11 is the same.
Referring to fig. 6 and 7 to 10, steps of a Stamping method of the heat sink fin structure 10 according to the present invention are shown. First, as shown in step a of fig. 6 and fig. 7, a slit cutting operation is used to cut two substantially parallel slits 14 on a heat sink fin 1, wherein the slit cutting operation is to provide a cutter to cut the slits 14 on the heat sink fin 1; alternatively, as shown in step a of fig. 6 and fig. 8, two slits 14 substantially parallel to each other are cut on a heat sink fin 1 by using a stamping and indenting operation, wherein the stamping and indenting operation is to provide a stamping machine to press the slits 14 under the heat sink fin 1.
Furthermore, as shown in step b of fig. 6 and fig. 9 to 10, a stamping mechanism 200 is provided, the stamping mechanism 200 stamps the region between the two slits 14 until the region between the two slits 14 is deformed to form a tapered tunnel 11, and the two slits 14 are deformed to form two front and rear openings 12 of the tapered tunnel 11, thereby forming the heat sink fin structure 10 of fig. 1 to 6.
Referring to fig. 11 to 13, the present invention provides a first embodiment of an enhanced heat dissipation module, in which the enhanced heat dissipation module 20 mainly includes a first heat dissipation fin 2 and a second heat dissipation fin 3.
As shown in fig. 11 to 12, the first heat sink fin 2 has one or more first tapering tunnels 21 protruding outwards, the first tapering tunnels 21 have two sidewalls 211 and a top wall 212, the top wall 212 extends integrally and crosses over the two sidewalls 211, the cross section of the first tapering tunnels 21 is n-shaped, a right angle θ 1 is formed between each sidewall 211 and the top wall 212, the first heat sink fin 2 has one or more windows 22, the windows 22 have opposite two sides 221, and the two sidewalls 211 of each first tapering tunnel 21 extend integrally outwards from the two sides 221 of each first heat sink fin 2.
As shown in fig. 11 to 12, the second heat sink fin 3 has one or more second tapering tunnels 31 protruding outward, the second tapering tunnels 31 have two sidewalls 311 and a top wall 312, the top wall 212 extends integrally and crosses over the two sidewalls 211, the cross section of the second tapering tunnels 31 is in a reversed-u shape, a right angle θ 1 is formed between each sidewall 311 and the top wall 312, the second heat sink fin 3 has one or more windows 32, each window 32 has two opposite sides 321, the two sidewalls 311 of each second tapering tunnel 31 extend outward integrally from the two sides 321 of each second heat sink fin 3, wherein the first tapering tunnel 21 and the second tapering tunnel 31 together enclose a flow guide channel s1, and the first tapering tunnel 21 and the second tapering tunnel 31 extend toward the same side.
As described in detail below, the top wall 212 of the first tapering tunnel 21 of the present embodiment overlaps the window 32 of the second heat sink 3 corresponding to the second tapering tunnel 31 to jointly enclose the flow guiding channel s 1.
As shown in fig. 13, a rounded corner (filler) or a Chamfer (Chamfer) is disposed at a joint of the sidewall 211 and the top wall 212 of the first tapering tunnel 21 in the present embodiment, so that the top wall 212 of the first tapering tunnel 21 is embedded in the window 32 of the second heat sink fin 3 corresponding to the second tapering tunnel 31.
As shown in fig. 11 to 13, in the usage of the enhanced heat dissipation module 20 of the present invention, the first tapering tunnel 21 and the second tapering tunnel 31 jointly define a flow guiding channel s1, when the hot air passes through the flow guiding channel s1 from bottom to top, the openings of the first tapering tunnel 21 and the second tapering tunnel 31 are tapered, so that the lower air pressure is greater than the upper air pressure to generate an air pressure difference, and the high temperature is squeezed to the low temperature to increase the natural heat convection, thereby increasing the heat dissipation efficiency of the enhanced heat dissipation module 20.
In addition, the surface area of the first tapered tunnel 21 is about 10% of the surface area of the first heat sink fin 2, and the surface area of the second tapered tunnel 31 is about 10% of the surface area of the second heat sink fin 3, so that the enhanced heat sink module 20 has more surfaces for heat dissipation, and the surfaces of the first heat sink fin 2 and the second heat sink fin 3 can improve the heat dissipation efficiency without using additional paint.
Referring to fig. 14, a second embodiment of an enhanced heat dissipation module 20 according to the present invention is substantially the same as the first embodiment, and the difference between the second embodiment and the first embodiment is that the cross sections of the first tapered tunnel 21 and the second tapered tunnel 31 are in a ladder shape.
As described further below, an obtuse angle θ 2 is formed between each side wall 211 and the top wall 212 of the first tapering tunnel 21, and an obtuse angle θ 2 is formed between each side wall 311 and the top wall 312 of the second tapering tunnel 31, so that the top wall 212 of the first tapering tunnel 21 is embedded into the second tapering tunnel 31, and the top wall 212 of the first tapering tunnel 21 is overlapped between the side walls 311 of the second tapering tunnel 31 to jointly enclose the flow guiding channel s 1. Thereby, the same functions and effects as those of the first embodiment of the enhanced heat dissipation module 20 are achieved.
Referring to fig. 15, a third embodiment of an enhanced heat dissipation module 20 according to the present invention is substantially the same as the first embodiment, and the third embodiment is different from the first embodiment in that the first tapered tunnel 21 and the second tapered tunnel 31 are formed to extend toward opposite sides.
As described in detail below, the first tapered tunnel 21 and the second tapered tunnel 31 are formed to extend toward opposite sides, and the window 22 of the first radiator fin 2 and the window 32 of the second radiator fin 3 are disposed opposite to each other, so that the first tapered tunnel 21 and the second tapered tunnel 31 together enclose a flow guide passage s 1. Thereby, the same functions and effects as those of the first embodiment of the enhanced heat dissipation module 20 are achieved.
In addition, the first tapering tunnel 21 and the second tapering tunnel 31 of the present embodiment are trapezoidal tunnels, and the cross sections of the first tapering tunnel 21 and the second tapering tunnel 31 are U-shaped, but not limited thereto. The first tapering tunnel 21 and the second tapering tunnel 31 may be trapezoidal tunnels or semi-elliptical tunnels, and the cross-sections of the first tapering tunnel 21 and the second tapering tunnel 31 may be U-shaped or U-shaped.
Referring to fig. 16, a fourth embodiment of a heat sink fin structure 10 of the present invention is shown, and the fourth embodiment is substantially the same as the first embodiment, and the fourth embodiment is different from the first embodiment in that two sidewalls 111' of a tapered tunnel 11 are connected to a heat sink fin 1.
As described below, the two sidewalls 111 'of the tapered tunnel 11 of the present embodiment are welded on the heat sink fin 1, but not limited thereto, and the two sidewalls 111' of the tapered tunnel 11 may also be integrally formed by extending outward from the heat sink fin 1.
In addition, the heat sink fin 1 has a closed bottom wall 15 formed below the top wall 112 ', and the top wall 112 ', the two side walls 111 ' and the closed bottom wall 15 together define a flow guiding channel s 2. Therefore, when the hot air passes through the flow guiding channel s2 from bottom to top, the opening of the tapered tunnel 11 is tapered, so that the lower air pressure is greater than the upper air pressure to generate an air pressure difference, and the high temperature is extruded to the low temperature to improve the natural heat convection, thereby achieving the same functions and effects as those of the first embodiment of the heat dissipating fin structure 10.
Referring to fig. 17 to 18, a fifth embodiment and a sixth embodiment of a heat sink fin structure 10 according to the present invention are shown, and the fifth embodiment and the sixth embodiment are substantially the same as the fourth embodiment, and the fifth embodiment and the sixth embodiment are different from the fourth embodiment in that the number of the heat sink fins 1 is several.
As shown in fig. 17, a plurality of heat dissipation fins 1 are stacked and arranged in parallel, and each tapered tunnel 11 is formed by extending toward the same side; as shown in fig. 18, a plurality of heat dissipation fins 1 are stacked and arranged side by side, and each tapered tunnel 11 is formed to extend toward the opposite side. Therefore, when the hot air passes through each tapered tunnel 11 from bottom to top, the air pressure difference can be generated, so as to achieve the same function and efficacy as those of the fourth embodiment of the heat dissipation fin structure 10.
Referring to fig. 19, a seventh embodiment of a heat sink fin structure 10 according to the present invention is shown, and the seventh embodiment is substantially the same as the fourth embodiment, and the seventh embodiment is different from the fourth embodiment in that the tapered tunnels 11 have different shapes.
As described further below, the tapered tunnel 11 of the present embodiment has a U-shaped cross section, but is not limited thereto. The convergent tunnel 11 may be a trapezoidal tunnel or a semi-elliptical tunnel, and the section of the convergent tunnel 11 may be n-shaped or U-shaped.
In summary, the enhanced heat dissipation module, the heat dissipation fin structure and the stamping method thereof of the present invention are not found in the similar products and the use thereof, have industrial applicability, novelty and progress, and completely meet the requirements of patent application.
Claims (7)
1. An enhanced heat dissipation module, comprising:
a first heat dissipation fin having at least one first gradually shrinking tunnel protruding outwards; and
a second heat sink fin having at least a second tapering tunnel protruding outwards, wherein the first tapering tunnel and the second tapering tunnel together enclose a flow guiding channel, the first tapering tunnel and the second tapering tunnel respectively have two side walls and a top wall, each top wall extends integrally and cross-connects with each side wall, the first heat sink fin and the second heat sink fin respectively have at least one window, each window has two opposite sides, the two side walls of the first tapering tunnel extend integrally from the two sides of the first heat sink fin outwards, the two side walls of the second tapering tunnel extend integrally and form from the two sides of the second heat sink fin outwards, a right angle is formed between each side wall and the top wall, the top wall of the first tapering tunnel is lapped on the second heat sink fin corresponding to the window arranged on the second tapering tunnel to enclose the flow guiding channel together,
the first gradually-reduced tunnel and the second gradually-reduced tunnel are gradually reduced and opened towards the direction far away from the heat source, so that the opening size of one opening is larger than that of the other opening.
2. The enhanced heat dissipation module of claim 1, wherein the first and second fins have a cross-section of a reverse U-shape or a U-shape, wherein the two sidewalls are tapered away from the heat source.
3. The enhanced heat dissipation module of claim 1, wherein the top wall corresponds to the window cover.
4. The enhanced heat dissipation module of claim 1, wherein the first tapered tunnel and the second tapered tunnel are formed extending toward the same side.
5. An enhanced heat dissipation module, comprising:
a first heat dissipation fin having at least one first gradually shrinking tunnel protruding outwards; and
a second heat sink fin having at least a second tapering tunnel protruding outwards, wherein the first tapering tunnel and the second tapering tunnel together enclose a flow guiding channel, the first tapering tunnel and the second tapering tunnel respectively have two side walls and a top wall, each top wall extends integrally and cross-connects with each side wall, the first heat sink fin and the second heat sink fin respectively have at least one window, each window has two opposite sides, the two side walls of the first tapering tunnel extend integrally from the two sides of the first heat sink fin outwards, the two side walls of the second tapering tunnel extend integrally and form from the two sides of the second heat sink fin outwards, an obtuse angle is formed between each side wall and the top wall, the top wall of the first tapering tunnel overlaps between the two side walls of the second tapering tunnel to enclose the flow guiding channel together,
the first gradually-reduced tunnel and the second gradually-reduced tunnel are gradually reduced and opened towards the direction far away from the heat source, so that the opening size of one opening is larger than that of the other opening.
6. The enhanced heat dissipation module of claim 5, wherein the first tapered tunnel and the second tapered tunnel are formed extending toward the same side.
7. A method of stamping a heat sink fin structure for making an enhanced heat sink module as recited in claim 1 or 6, comprising:
utilizing a slit cutting operation or a stamping indentation operation to cut two slits which are substantially parallel to each other on a heat dissipation fin; and
providing a stamping mechanism, wherein the stamping mechanism stamps the area between the two slits until the area between the two slits is deformed to form a tapered tunnel, the two slits are deformed to form two front and rear openings of the tapered tunnel, the tapered tunnel is provided with two side walls and a top wall, each top wall integrally extends and is bridged on each side wall, the radiating fins are provided with at least one window, each window is provided with two opposite side edges, the two side walls of the tapered tunnel outwards and integrally extend and form from the two side edges of the radiating fins, and a right angle or an obtuse angle is formed between each side wall and the top wall.
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| CN201810304032.9A CN110345801B (en) | 2018-04-08 | 2018-04-08 | Enhanced heat dissipation module, heat dissipation fin structure and stamping method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810304032.9A CN110345801B (en) | 2018-04-08 | 2018-04-08 | Enhanced heat dissipation module, heat dissipation fin structure and stamping method thereof |
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| CN110345801A CN110345801A (en) | 2019-10-18 |
| CN110345801B true CN110345801B (en) | 2021-06-15 |
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Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4709753A (en) * | 1986-09-08 | 1987-12-01 | Nordyne, Inc. | Uni-directional fin-and-tube heat exchanger |
| JP2001194084A (en) * | 1999-12-15 | 2001-07-17 | Lg Electronics Inc | Fin tube type heat exchanger |
| JP2001296097A (en) * | 2000-04-12 | 2001-10-26 | Kaoru Torii | Fin structure for promoting heat transfer |
| KR100347894B1 (en) * | 2000-07-06 | 2002-08-09 | 엘지전자주식회사 | Heat exchanger |
| KR100550222B1 (en) * | 2004-04-29 | 2006-02-08 | 위니아만도 주식회사 | heat transfer pin of heat exchanger |
| CN1329708C (en) * | 2005-04-22 | 2007-08-01 | 北京工业大学 | Synergic type reinforced heat exchange surface |
| JP2008116102A (en) * | 2006-11-02 | 2008-05-22 | Denso Corp | Heat exchanger for cooling |
| DE102011076172A1 (en) * | 2011-05-20 | 2012-11-22 | J. Eberspächer GmbH & Co. KG | Finned heat exchangers |
| CN204214115U (en) * | 2014-09-16 | 2015-03-18 | 台湾樱花股份有限公司 | Gas heater and compound type heat exchanger thereof |
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