CN110337194A - The connection method and connection structure of double metal-oxide-semiconductors and PCBA board in parallel - Google Patents
The connection method and connection structure of double metal-oxide-semiconductors and PCBA board in parallel Download PDFInfo
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- CN110337194A CN110337194A CN201910676627.1A CN201910676627A CN110337194A CN 110337194 A CN110337194 A CN 110337194A CN 201910676627 A CN201910676627 A CN 201910676627A CN 110337194 A CN110337194 A CN 110337194A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 114
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 30
- 238000003466 welding Methods 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 description 5
- 206010037660 Pyrexia Diseases 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
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- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The present invention relates to the connection methods and connection structure of a kind of double metal-oxide-semiconductors and PCBA board in parallel, and wherein method includes that the conductor is connected in PCBA board again after connecting the identical pin of two metal-oxide-semiconductors less than the conductor of metal-oxide-semiconductor pin using resistance value；Connection structure includes the PCBA board that two metal-oxide-semiconductors and one are used to install metal-oxide-semiconductor, there are two G pin via holes for setting in PCBA board, one D pin via hole, a S pin via hole, the respective G pin of two metal-oxide-semiconductors are corresponded in two G pin via holes that the ground is plugged in PCBA board and are welded to connect；The respective D pin of two metal-oxide-semiconductors is welded to connect after being connected with each other by the D terminal connecting plate that a resistance value is less than D pin with D pin via hole, and the respective S pin of two metal-oxide-semiconductors is welded to connect after being connected with each other by the S terminal connecting plate that a resistance value is less than S pin with S pin via hole.Present invention reduces the resistance that metal-oxide-semiconductor pin is connect with PCBA board, to reduce the calorific value of pin when metal-oxide-semiconductor works.
Description
Technical field:
The present invention relates to the connection methods and connection structure of a kind of double metal-oxide-semiconductors and PCBA board in parallel.
Background technique:
Metal-oxide-semiconductor is commonly used for controlling the on-off of high current, and the pin D and S of metal-oxide-semiconductor are respectively used to the input of power supply and defeated
Out, pin G output driving current, therefore be usually used in switching circuit.
In order to reduce the calorific value of switching circuit, it will usually by two metal-oxide-semiconductor parallel connections, flow through each metal-oxide-semiconductor to reduce
Size of current to reduce the whole calorific value of switching circuit, while can effectively improve switching circuit and can bear current limit,
Improve the service performance of switch.
Two metal-oxide-semiconductors are set in the same switch, it is common practice to which two metal-oxide-semiconductors are connected to PCBA board
On, the parallel connection of two metal-oxide-semiconductors is then realized by preinstalled circuit in PCBA board, but since metal-oxide-semiconductor pin is relatively elongated, connection
It will form biggish resistance in PCBA board, although having reduced the electric current of single metal-oxide-semiconductor after two metal-oxide-semiconductors are in parallel, draw
The biggish resistance value of foot still will lead to more serious fever.
Summary of the invention:
Present invention technical problems to be solved first are: the connection method of a kind of double metal-oxide-semiconductors and PCBA board in parallel is provided, it should
Metal-oxide-semiconductor pin heating problem can be effectively relieved in method.
In order to solve the above technical problems, the technical solution adopted by the present invention is that: the connection side of double metal-oxide-semiconductors and PCBA board in parallel
The conductor is connected to PCBA again after connecting the identical pin of two metal-oxide-semiconductors using the conductor that resistance value is less than metal-oxide-semiconductor pin by method
On plate.
As a preferred embodiment, conductor is connected to the root of metal-oxide-semiconductor pin.
As a preferred embodiment, by the way of plug welding by the pin of metal-oxide-semiconductor and connect the pin conductor it is preparatory
It is welded on lesser pcb board, forms a fixed module.
As a preferred embodiment, two metal-oxide-semiconductors are oppositely arranged, keep the D pin of two metal-oxide-semiconductors close to each other, by two
A D pin is integral with the conductor plug welding for connecting D pin.
The beneficial effects of the present invention are: then being connected with PCBA board using the conductor paralleling MOS pipe that resistance value is less than metal-oxide-semiconductor pin
It connects, effectively reduces the resistance value that metal-oxide-semiconductor is connect with PCBA board, sent out so that pin when metal-oxide-semiconductor is connect with PCBA board be effectively relieved
The technical problem of heat.
The present invention further shortens electric current and flows through metal-oxide-semiconductor pin further by the way that conductor is connected to metal-oxide-semiconductor pin root
Length, further decrease the resistance value that metal-oxide-semiconductor pin is connect with PCBA board, further decrease pin fever.
The pin of metal-oxide-semiconductor is further pre-welded to lesser PCB with corresponding conductor by the way of plug welding by the present invention
On plate, it is capable of forming the module of double metal-oxide-semiconductors in parallel in this way, convenient for the installation and welding in rear road and PCBA board, meanwhile, using plug welding
The connection that can more ensure metal-oxide-semiconductor pin and conductor, reduces the resistance value of connecting node.It can also effectively avoid welding using plug welding
Liquid stream, which is dropped down, leads to the phenomenon that overlapping with other pins, improves the quality of connection of pin and conductor.
Further the pin of two metal-oxide-semiconductors is vis-a-vis arranged by the present invention, can make in this way the D pin of two metal-oxide-semiconductors with
Corresponding conductor is welded into an entirety jointly, further increases the electric conductivity of welding node, reduces the resistance of welding node, reduces
The fever of D pin.
The further technical problems to be solved of the present invention are: the connection structure of a kind of double metal-oxide-semiconductors and PCBA board in parallel is provided,
Metal-oxide-semiconductor pin heating problem can be effectively relieved in the structure.
In order to solve the above technical problems, the technical solution adopted by the present invention is that: the connection knot of double metal-oxide-semiconductors and PCBA board in parallel
Structure, including two metal-oxide-semiconductors and one for installing the PCBA board of metal-oxide-semiconductor, G pin via hole there are two settings in the PCBA board,
Respectively correspond the G pin of two metal-oxide-semiconductors, a D pin via hole, a S pin via hole is preset with two G of connection in PCBA board
The pin of the circuit of pin via hole, two metal-oxide-semiconductors is oppositely arranged, and the respective G pin of two metal-oxide-semiconductors is plugged on correspondingly
In two G pin via holes in PCBA board and it is welded to connect；
The respective D pin of two metal-oxide-semiconductors is connected with each other by a D terminal connecting plate, is additionally provided on D terminal connecting plate
It is inserted into the D pin of D pin via hole, D pin and D pin via hole are welded to connect, and the resistance of D terminal connecting plate is less than the electricity of D pin
Resistance；
The respective S pin of two metal-oxide-semiconductors is connected with each other by a S terminal connecting plate, is additionally provided on S terminal connecting plate
It is inserted into the S pin of S pin via hole, S pin and S pin via hole are welded to connect, and the resistance of S terminal connecting plate is less than the electricity of S pin
Resistance.
As a preferred embodiment, the D terminal connecting plate, which is connected to any D pin root and flows through D to shorten electric current, draws
The distance of foot.
As a preferred embodiment, above-mentioned connection structure further includes one piece of pcb board, and a D pin is provided on the pcb board
It is fixedly installed gold respectively on connecting hole and two S pin connecting holes, the D pin connecting hole and S pin connecting hole inner sidewall
Belong to casing, the D connector being provided in insertion D pin connecting hole on the D terminal connecting plate, D connector and two D pins are inserted together
It connects in the metal sleeve in D pin connecting hole and passes through welded connecting；Two S pin connecting holes S with two metal-oxide-semiconductors respectively
Pin corresponds, be provided on S terminal connecting plate with two one-to-one S connectors of S pin connecting hole, with any S pin
The corresponding S pin of connecting hole and S connector are plugged on the metal sleeve in S pin connecting hole Nei together and by being welded to connect this hair
Bright beneficial effect is: by connecting the respective D pin of two metal-oxide-semiconductors by the D terminal that a resistance is less than any D pin
Piece is connected with each other, and then D terminal connecting plate is welded in D pin via hole again, realizes the parallel connection and and PCBA of two D pins
The connection of plate reduces the connection resistance of D pin and PCBA board, reduces the calorific value of D pin.
Similarly, pass through the S terminal connecting plate by the respective S pin of two metal-oxide-semiconductors by a resistance less than any S pin
It is connected with each other, then S terminal connecting plate is welded in S pin via hole again, realizes the parallel connection and and PCBA board of two S pins
Connection, reduce S pin and PCBA board connection resistance, reduce the calorific value of S pin.
In the present invention, since the G pin of metal-oxide-semiconductor is used for transmission signal code, belong to low current, thus G pin directly with
PCBA board connection can't generate much heats.
S terminal connecting plate is further connected to the root of two S pins by the present invention, and D terminal connecting plate is connected to two
The root of a D pin is for reducing the distance that electric current flows through D pin, S pin, reduces resistance value, reduces S pin and D draws
The calorific value of foot.
The present invention further by two S pins with the corresponding preparatory plug welding of S connector on pcb board, by two D pins with it is right
The preparatory plug welding of D connector answered is on pcb board, so that two metal-oxide-semiconductors, S terminal connecting plate, D terminal connecting plate and pcb board are formed
One module, convenient for the installation and welding in rear road and PCBA board.
Detailed description of the invention:
Specific embodiments of the present invention will be described in further detail with reference to the accompanying drawing, in which:
Fig. 1 is double metal-oxide-semiconductors in parallel of the present invention and PCBA board attachment structure schematic diagram；
Fig. 2 is the rearview of attachment structure schematic diagram described in Fig. 1；
Fig. 3 is the double metal-oxide-semiconductors of parallel connection and PCBA board attachment structure schematic diagram for being equipped with pcb board.
In FIG. 1 to FIG. 3: 1, metal-oxide-semiconductor, 2, PCBA board, 3, G pin via hole, 4, G pin, 5, D pin via hole, 6, S pin mistake
Hole, 7, D pin, 8, D terminal connecting plate, 9, D pin, 10, S pin, 11, S terminal connecting plate, 12, S pin, 13, pcb board,
14, D pin connecting hole, 15, S pin connecting hole, 16, metal sleeve, 17, D connector, 18, S connector.
Specific embodiment:
With reference to the accompanying drawing, detailed description of the present invention specific embodiment.
Embodiment 1:
The connection method of double metal-oxide-semiconductors and PCBA board in parallel connects two using the conductor that resistance value is less than metal-oxide-semiconductor pin
The conductor is connected in PCBA board again after the identical pin of metal-oxide-semiconductor.
Conductor is preferably connected to the root of metal-oxide-semiconductor pin.
It is preferred that by the way of plug welding by the pin of metal-oxide-semiconductor and connect the pin conductor be pre-welded to it is lesser
On pcb board, a fixed module is formed.
It is preferred that two metal-oxide-semiconductors are oppositely arranged, keep the D pin of two metal-oxide-semiconductors close to each other, by two D pins with connect D
The conductor plug welding of pin is integral.
Below with 1~attached drawing of attached drawing 3 as an example, the specific implementation process of the above method is described in detail.
As shown in Figure 1, two S pins 10 are connected using the S terminal connecting plate 11 that resistance value is less than metal-oxide-semiconductor 1S pin 10
Get up, then again connect S terminal connecting plate 11 and PCBA board 2, similarly, metal-oxide-semiconductor 1D pin 7 is less than using resistance value
D terminal connecting plate 8 connects two D pins 7, then again connects D terminal connecting plate 11 and PCBA board 2.
Since the G pin 4 of metal-oxide-semiconductor 1 is used for transmission signal code, belong to low current, thus G pin 4 directly with PCBA board 2
Connection can't generate much heats, therefore be directly connected to D pin 4 and PCBA board 2 in the present embodiment, naturally it is also possible to use
The conductor that resistance value is less than D pin is connect with PCBA board 2 again after connecting two D pins 4.
It can be seen from figure 1 that S terminal connecting plate 11 is connected to the root of two S pins 10, D terminal connecting plate 8 is connected to two
The root of a D pin 7 can shorten the length that electric current flows through S pin 10 and D pin 7 in this way, reduce resistance, reduce S pin 10
With the calorific value of D pin 7.
As shown in Figure 1, two metal-oxide-semiconductors 1 are oppositely arranged, being oppositely arranged for heretofore described metal-oxide-semiconductor refers to two
The pin of metal-oxide-semiconductor is opposite, as shown in figure 3, two D pins 7 and a D connector 17 are welded on pcb board 13 together to realize more
Firm connection and lower circulation resistance can not be welded since two S pins 10 are located remotely from each other as two D pins 7
It is connected together, therefore, by two S pins 10 respectively with corresponding S weld on pcb board 13, by this connection type,
The bonding strength for strengthening metal-oxide-semiconductor reduces the connection resistance value of metal-oxide-semiconductor 1 Yu PCBA board 2, reduces the S pin 10 of metal-oxide-semiconductor 1
With the calorific value of D pin 7 at work.
Embodiment 2:
The connection structure of parallel connection as depicted in figs. 1 and 2 double metal-oxide-semiconductors and PCBA board, including two metal-oxide-semiconductors 1 and a use
In setting in the PCBA board 2 of installation metal-oxide-semiconductor 1, the PCBA board 2, there are two G pin via holes 3, respectively correspond the G of two metal-oxide-semiconductors
Pin 4, a D pin via hole 5, a S pin via hole 6 are preset with the circuit of two G pin via holes 3 of connection in PCBA board 2,
The pin of two metal-oxide-semiconductors 1 is oppositely arranged, and two respective G pins 4 of metal-oxide-semiconductor 1 are plugged on two in PCBA board 2 correspondingly
In a G pin via hole 3 and it is welded to connect；
Two respective D pins 7 of metal-oxide-semiconductor 1 are connected with each other by a D terminal connecting plate 8, are also set on D terminal connecting plate 8
It is equipped with the D pin 9 of insertion D pin via hole 5, D pin 9 and D pin via hole 5 are welded to connect, and D terminal connecting plate 8 and D pin 7 connect
The position connect is provided with the groove that can accommodate D pin 7, and D pin 7 is embedded in groove, is then attached by welding.
The resistance of D terminal connecting plate 8 is less than the resistance of D pin 7；
Two respective S pins 10 of metal-oxide-semiconductor 1 are connected with each other by a S terminal connecting plate 11, on S terminal connecting plate 11
It is additionally provided with the S pin 12 of insertion S pin via hole 6, S pin 12 and S pin via hole 6 are welded to connect, S terminal connecting plate 11 and S
The position that pin 10 connects is provided with the groove that can accommodate S pin 10, and S pin 10 is embedded in groove, then passes through the side of welding
Formula is attached.The resistance of S terminal connecting plate 11 is less than the resistance of S pin 10.
The D terminal connecting plate 8 is connected to any 7 root of D pin to shorten the distance that electric current flows through D pin 7.
It is the further improvement to above-mentioned connection structure as shown in Figure 3, as shown in figure 3, in connection structure shown in Fig. 1
It is additionally arranged one piece of pcb board 13, a D pin connecting hole 14 and two S pin connecting holes 15, the D are provided on the pcb board 13
It is fixedly installed metal sleeve 16, the D terminal connecting plate 8 respectively on 15 inner sidewall of pin connecting hole 14 and S pin connecting hole
On be provided with insertion D pin connecting hole 14 in D connector 17, D connector 17 and two D pins 7 are plugged on D pin connecting hole together
In metal sleeve 16 in 14 and pass through welded connecting；Two S pin connecting holes 15 S pin 10 1 with two metal-oxide-semiconductors 1 respectively
One is corresponding, be provided on S terminal connecting plate 11 with two one-to-one S connectors 18 of S pin connecting hole 15, with any S pin
In the metal sleeve 16 that the corresponding S pin 10 of connecting hole 15 and S connector 18 are plugged on together in S pin connecting hole 15 and pass through weldering
It connects in succession.
Due to using pcb board 13, so that two metal-oxide-semiconductors 1, S terminal connecting plate 11, D terminal connecting plate 8 and pcb board
13 one module of formation strengthen the bonding strength of metal-oxide-semiconductor 1 convenient for the installation and welding in rear road and PCBA board 2.
Working principle of the present invention is: using low resistance conductor connection 1 same pin of metal-oxide-semiconductor root after again by conductor with
PCBA board 2 connects, so that realizing reduces the resistance value that metal-oxide-semiconductor 1 is connect with PCBA board 2, reduces the calorific value of 1 pin of metal-oxide-semiconductor, together
When, since the conductor of use is thicker, conductor and the connection of PCBA board 2 are more secured, improve the stable connection of metal-oxide-semiconductor 1
Property, the present invention further passes through pcb board 13 and two metal-oxide-semiconductors 1 and conductor is carried out pre-connection, forms modularization, further strengthen
The bonding strength of metal-oxide-semiconductor 1, while the installation of road and PCBA board 2 and the convenience welded after raising.Conductor described herein is Fig. 1
D terminal connecting plate 8, S terminal connecting plate 11 shown in~Fig. 3；Pin described herein is D pin shown in FIG. 1 to FIG. 3
7 and S pin 10.
The principles and effects of the invention, and the embodiment that part uses only is illustrated in above-described embodiment,
And is not intended to limit the present invention；It should be pointed out that for those of ordinary skill in the art, not departing from the invention structure
Under the premise of think of, various modifications and improvements can be made, and these are all within the scope of protection of the present invention.
Claims (7)
1. the connection method of double metal-oxide-semiconductors and PCBA board in parallel, which is characterized in that be less than the conductor of metal-oxide-semiconductor pin using resistance value
The conductor is connected in PCBA board again after connecting the identical pin of two metal-oxide-semiconductors.
2. the connection method of double metal-oxide-semiconductors and PCBA board in parallel according to claim 1, which is characterized in that conductor is connected to MOS
The root of pipe pin.
3. the connection method of double metal-oxide-semiconductors and PCBA board in parallel according to claim 1, which is characterized in that using the side of plug welding
Formula is by the pin of metal-oxide-semiconductor and connects the conductor of the pin and is pre-welded on lesser pcb board, forms a fixed mould
Block.
4. the connection method of double metal-oxide-semiconductors and PCBA board in parallel according to claim 3, which is characterized in that by two metal-oxide-semiconductor phases
To setting, keep the D pin of two metal-oxide-semiconductors close to each other, two D pins and the conductor plug welding for connecting D pin are integral.
5. the connection structure of double metal-oxide-semiconductors and PCBA board in parallel, including two metal-oxide-semiconductors (1) and one for installing metal-oxide-semiconductor (1)
PCBA board (2), which is characterized in that there are two G pin via holes (3) for setting on the PCBA board (2), respectively correspond two metal-oxide-semiconductors
G pin (4), a D pin via hole (5), a S pin via hole (6) is preset with two G pin mistakes of connection in PCBA board (2)
The pin of the circuit in hole (3), two metal-oxide-semiconductors (1) is oppositely arranged, and the respective G pin (4) of two metal-oxide-semiconductors (1) is inserted correspondingly
It connects in two G pin via holes (3) on PCBA board (2) and is welded to connect；
The respective D pin (7) of two metal-oxide-semiconductors (1) is connected with each other by a D terminal connecting plate (8), on D terminal connecting plate (8)
It is additionally provided with the D pin (9) of insertion D pin via hole (5), D pin (9) and D pin via hole (5) are welded to connect, D terminal connecting plate
(8) resistance is less than the resistance of D pin (7)；
The respective S pin (10) of two metal-oxide-semiconductors (1) is connected with each other by a S terminal connecting plate (11), S terminal connecting plate
(11) the S pin (12) of insertion S pin via hole (6) is additionally provided on, S pin (12) and S pin via hole (6) are welded to connect, the end S
The resistance of sub- connection sheet (11) is less than the resistance of S pin (10).
6. the connection structure of double metal-oxide-semiconductors and PCBA board in parallel according to claim 5, which is characterized in that the D terminal connects
Contact pin (8) is connected to any D pin (7) root to shorten the distance that electric current flows through D pin (7).
7. the connection structure of double metal-oxide-semiconductors and PCBA board in parallel according to claim 5, which is characterized in that further include one piece
Pcb board (13) is provided with a D pin connecting hole (14) and two S pin connecting holes (15) on the pcb board (13), and the D draws
It is fixedly installed respectively metal sleeve (16) on foot connecting hole (14) and S pin connecting hole (15) inner sidewall, the D terminal connection
The D connector (17) being provided on piece (8) in insertion D pin connecting hole (14), D connector (17) and two D pin (7) grafting together
In metal sleeve (16) in D pin connecting hole (14) and pass through welded connecting；Two S pin connecting holes (15) are respectively with two
The S pin (10) of a metal-oxide-semiconductor (1) corresponds, and is provided with and two S pin connecting holes (15) one on S terminal connecting plate (11)
One corresponding S connector (18), S pin (10) corresponding with any S pin connecting hole (15) and S connector (18) are plugged on S together
In metal sleeve (16) in pin connecting hole (15) and pass through welded connecting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910676627.1A CN110337194B (en) | 2019-07-25 | 2019-07-25 | Connecting structure of parallel double MOS (Metal oxide semiconductor) tubes and PCBA (printed circuit board assembly) |
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| CN201910676627.1A CN110337194B (en) | 2019-07-25 | 2019-07-25 | Connecting structure of parallel double MOS (Metal oxide semiconductor) tubes and PCBA (printed circuit board assembly) |
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| CN204315553U (en) * | 2014-12-08 | 2015-05-06 | 无锡中星微电子有限公司 | A kind of semiconductor chip encapsulation structure |
| CN104812164A (en) * | 2015-04-21 | 2015-07-29 | 宁波动一电器有限公司 | Motor controller |
| US20170345749A1 (en) * | 2016-05-25 | 2017-11-30 | Delphi International Operations Luxembourg S.A.R.L | Power commutation module |
| DE102017111944A1 (en) * | 2017-05-31 | 2018-12-06 | Eberspächer Controls Landau Gmbh & Co. Kg | Electrical circuit unit and method for producing an electrical circuit unit |
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| CN109728737A (en) * | 2019-01-24 | 2019-05-07 | 浙江动一新能源动力科技股份有限公司 | A kind of brushless motor controller system and its assembly method |
| CN210469887U (en) * | 2019-07-25 | 2020-05-05 | 苏州华之杰电讯股份有限公司 | Connecting structure of parallel double MOS tubes and PCBA (printed circuit board assembly) |
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