CN210469887U - Connecting structure of parallel double MOS tubes and PCBA (printed circuit board assembly) - Google Patents
Connecting structure of parallel double MOS tubes and PCBA (printed circuit board assembly) Download PDFInfo
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- CN210469887U CN210469887U CN201921184452.4U CN201921184452U CN210469887U CN 210469887 U CN210469887 U CN 210469887U CN 201921184452 U CN201921184452 U CN 201921184452U CN 210469887 U CN210469887 U CN 210469887U
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- 238000003466 welding Methods 0.000 claims abstract description 14
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract 15
- 239000002184 metal Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 description 7
- CJDNEKOMKXLSBN-UHFFFAOYSA-N 1-chloro-3-(4-chlorophenyl)benzene Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC(Cl)=C1 CJDNEKOMKXLSBN-UHFFFAOYSA-N 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The utility model relates to a connection structure of parallelly connected two MOS pipes and PCBA board, including two MOS pipes and a PCBA board, be provided with two G pin via holes on the PCBA board and correspond the G pin of two MOS pipes respectively, a D pin via hole, an S pin via hole, preset the circuit of connecting two G pin via holes on the PCBA board, the pin of two MOS pipes sets up relatively, the G pin one-to-one of two MOS pipes welds in two G pin via holes; the pins D of the two MOS tubes are mutually connected through a terminal D connecting sheet, a pin D on the terminal D connecting sheet is in welded connection with the pin D through hole, and the resistance of the terminal D connecting sheet is smaller than that of the pin D; the S pins of the two MOS tubes are connected with each other through the S terminal connecting sheet, the S pin on the S terminal connecting sheet is connected with the S pin through hole in a welding mode, and the resistance of the S terminal connecting sheet is smaller than that of the S pin. The utility model discloses the resistance that MOS pipe pin and PCBA board are connected has been reduced to reduce the calorific capacity of MOS pipe during operation pin.
Description
The technical field is as follows:
the utility model relates to a connection structure of parallelly connected two MOS pipes and PCBA board.
Background art:
the MOS transistor is usually used to control the on/off of a large current, pins D and S of the MOS transistor are used for the input and output of a power supply, respectively, and pin G outputs a driving current, and thus, the MOS transistor is commonly used in a switching circuit.
In order to reduce the heat productivity of the switch circuit, two MOS transistors are usually connected in parallel to reduce the magnitude of the current flowing through each MOS transistor, so that the overall heat productivity of the switch circuit is reduced, and meanwhile, the bearable current limit value of the switch circuit can be effectively improved, and the service performance of the switch is improved.
Two MOS pipes are arranged in the same switch, the common method is that the two MOS pipes are respectively connected on a PCBA board, then the parallel connection of the two MOS pipes is realized through a preset circuit on the PCBA board, but because the pins of the MOS pipes are relatively slender, a larger resistor can be formed by connecting the two MOS pipes on the PCBA board, and although the current of a single MOS pipe is reduced after the two MOS pipes are connected in parallel, the larger resistance of the pins still can lead to more serious heating.
The utility model has the following contents:
the to-be-solved technical problem of the utility model is: the utility model provides a connection structure of parallelly connected two MOS pipes and PCBA board, this structure can effectively alleviate MOS pipe pin problem of generating heat.
In order to solve the technical problem, the utility model discloses a technical scheme is: the connecting structure of the parallel double MOS tubes and the PCBA comprises two MOS tubes and the PCBA for mounting the MOS tubes, wherein two G pin through holes are formed in the PCBA and respectively correspond to G pins of the two MOS tubes, one D pin through hole and one S pin through hole;
the respective D pins of the two MOS tubes are connected with each other through a D terminal connecting sheet, a D pin inserted into a D pin through hole is further arranged on the D terminal connecting sheet, the D pin is welded with the D pin through hole, and the resistance of the D terminal connecting sheet is smaller than that of the D pin;
the S pins of the two MOS tubes are connected with each other through an S terminal connecting sheet, an S pin inserted into the S pin through hole is further arranged on the S terminal connecting sheet, the S pin is connected with the S pin through hole in a welded mode, and the resistance of the S terminal connecting sheet is smaller than that of the S pin.
Preferably, the D terminal connecting piece is connected to the root of any D pin to shorten the distance for current to flow through the D pin.
As a preferred scheme, the connecting structure further comprises a PCB, the PCB is provided with a D pin connecting hole and two S pin connecting holes, the inner side walls of the D pin connecting hole and the S pin connecting hole are respectively and fixedly provided with a metal sleeve, the D terminal connecting piece is provided with a D connector inserted into the D pin connecting hole, and the D connector and the two D pins are inserted into the metal sleeve in the D pin connecting hole and connected by welding; the two S pin connecting holes are respectively in one-to-one correspondence with the S pins of the two MOS tubes, the S terminal connecting sheet is provided with S connectors in one-to-one correspondence with the two S pin connecting holes, and the S pin and the S connector corresponding to any one S pin connecting hole are inserted into the metal sleeve in the S pin connecting hole and connected through welding
The utility model has the advantages that: through the respective D pin of two MOS pipes through a resistance D terminal connection piece interconnect that is less than arbitrary D pin, then weld the D terminal connection piece in the D pin mistake, realize parallelly connected and the being connected with the PCBA board of two D pins, reduce the connecting resistance of D pin and PCBA board, reduce D pin calorific capacity.
Similarly, the S pins of the two MOS tubes are connected with each other through the S terminal connecting sheet with the resistance smaller than any one S pin, and then the S terminal connecting sheet is welded in the S pin through hole, so that the two S pins are connected in parallel and connected with the PCBA, the connecting resistance of the S pins and the PCBA is reduced, and the heat productivity of the S pins is reduced.
The utility model discloses in, because the G pin of MOS pipe is used for transmitting signal electric current, belongs to the low current, consequently the G pin is direct to be connected with the PCBA board and can not produce big heat.
The utility model discloses further connect the S terminal connection piece at the root of two S pins, connect the D terminal connection piece at the root of two D pins, all be the distance of D pin, S pin for the reduction current flow through, reduce the resistance value, reduce the calorific capacity of S pin and D pin.
The utility model discloses further with two S pins and the S that corresponds connect the plug welding in advance on the PCB board, connect the plug welding in advance on the PCB board with two D pins and the D that corresponds for two MOS pipes, S terminal connection piece, D terminal connection piece and PCB board form a module, the installation and the welding of the back of being convenient for and PCBA board.
Description of the drawings:
the following detailed description of embodiments of the present invention is provided with reference to the accompanying drawings, in which:
FIG. 1 is a schematic view of the connection structure of the parallel double MOS tube and the PCBA board of the present invention;
FIG. 2 is a rear view of the connection arrangement of FIG. 1;
fig. 3 is a schematic view of the connection structure of the parallel double MOS tube and the PCBA board mounted with the PCB board.
In fig. 1 to 3: 1. MOS pipe, 2, PCBA board, 3, G pin via hole, 4, G pin, 5, D pin via hole, 6, S pin via hole, 7, D pin, 8, D terminal connecting sheet, 9, D pin, 10, S pin, 11, S terminal connecting sheet, 12, S pin, 13, PCB board, 14, D pin connecting hole, 15, S pin connecting hole, 16, metal sleeve, 17, D joint, 18, S joint.
The specific implementation mode is as follows:
the following describes in detail a specific embodiment of the present invention with reference to the drawings.
The connecting structure of the parallel double MOS tubes and the PCBA board shown in fig. 1 and fig. 2 comprises two MOS tubes 1 and a PCBA board 2 for mounting the MOS tubes 1, wherein the PCBA board 2 is provided with two G pin via holes 3 corresponding to G pins 4 of the two MOS tubes, one D pin via hole 5 and one S pin via hole 6, a circuit for connecting the two G pin via holes 3 is preset on the PCBA board 2, the pins of the two MOS tubes 1 are arranged oppositely, and the G pins 4 of the two MOS tubes 1 are inserted into the two G pin via holes 3 on the PCBA board 2 in a one-to-one correspondence manner and are welded;
the respective D pin 7 of two MOS pipes 1 is through a D terminal connection piece 8 interconnect, still be provided with the D that inserts D pin via hole 5 on the D terminal connection piece 8 and participate in 9, D participates in 9 and D pin via hole 5 welded connection, and the position that D terminal connection piece 8 and D pin 7 are connected is provided with the recess that can hold D pin 7, and D pin 7 imbeds in the recess, then connects through the welded mode. The resistance of the D terminal connecting sheet 8 is smaller than that of the D pin 7;
the respective S pins 10 of the two MOS tubes 1 are mutually connected through an S terminal connecting sheet 11, an S pin 12 inserted into the S pin via hole 6 is further arranged on the S terminal connecting sheet 11, the S pin 12 is connected with the S pin via hole 6 in a welding mode, a groove capable of containing the S pin 10 is arranged at the position where the S terminal connecting sheet 11 is connected with the S pin 10, and the S pin 10 is embedded into the groove and then connected in a welding mode. The resistance of the S-terminal connecting piece 11 is smaller than that of the S pin 10.
Because the G pin 4 of the MOS transistor 1 is used for transmitting signal current, and belongs to low current, the G pin 4 is directly connected with the PCBA board 2 and does not generate much heat, so the D pin 4 is directly connected with the PCBA board 2 in this embodiment, and certainly, a conductor with a resistance value smaller than that of the D pin can be connected with the PCBA board 2 after connecting the two D pins 4.
As can be seen from fig. 1, the S-terminal connecting piece 11 is connected to the roots of the two S pins 10, and the D-terminal connecting piece 8 is connected to the roots of the two D pins 7, so that the length of current flowing through the S pins 10 and the D pins 7 can be shortened, the resistance can be reduced, and the heat generation of the S pins 10 and the D pins 7 can be reduced.
As shown in fig. 1, two MOS transistors 1 are arranged relatively, and the relative arrangement of the MOS transistors in the present invention means that the pins of the two MOS transistors are opposite.
As shown in fig. 3, which is a further improvement of the above-mentioned connection structure, as shown in fig. 3, a PCB 13 is additionally arranged on the connection structure shown in fig. 1, the PCB 13 is provided with a D pin connection hole 14 and two S pin connection holes 15, metal sleeves 16 are fixedly arranged on the inner side walls of the D pin connection hole 14 and the S pin connection hole 15 respectively, a D connector 17 inserted into the D pin connection hole 14 is arranged on the D terminal connection plate 8, and the D connector 17 and the two D pins 7 are inserted into the metal sleeves 16 in the D pin connection hole 14 and connected by welding; the two S pin connecting holes 15 are respectively in one-to-one correspondence with the S pins 10 of the two MOS tubes 1, the S terminal connecting sheet 11 is provided with S connectors 18 in one-to-one correspondence with the two S pin connecting holes 15, and the S pin 10 and the S connector 18 corresponding to any one S pin connecting hole 15 are inserted into the metal sleeve 16 in the S pin connecting hole 15 and connected through welding.
Two D pins 7 and a D connect 17 weld on PCB board 13 in order to realize more firm connection and lower circulation resistance together, because two S pins 10 keep away from each other, consequently can't weld together like two D pins 7 are general, consequently, weld two S pins 10 on PCB board 13 with the S that corresponds respectively, through this kind of connected mode, the joint strength of MOS pipe has been strengthened, the connecting resistance value of MOS pipe 1 with PCBA board 2 has been reduced, the calorific capacity of S pin 10 and the D pin 7 of MOS pipe 1 in the work has been reduced.
Due to the adoption of the PCB 13, the two MOS tubes 1, the S terminal connecting sheet 11, the D terminal connecting sheet 8 and the PCB 13 form a module, so that the subsequent installation and welding with the PCBA board 2 are facilitated, and the connection strength of the MOS tubes 1 is enhanced.
The utility model discloses the theory of operation is: adopt the low resistance conductor to connect and be connected conductor and PCBA board 2 again behind the root of the same pin of MOS pipe 1 to the realization reduces the resistance value that MOS pipe 1 and PCBA board 2 are connected, reduces calorific capacity of MOS pipe 1 pin, simultaneously, because the conductor of adoption is thicker, so the conductor is more firm with PCBA board 2's connection, has improved MOS pipe 1's connection stability, the utility model discloses further connect two MOS pipes 1 and conductor in advance through PCB board 13, form the modularization, further strengthen MOS pipe 1's joint strength, improve the installation and the welded convenience of back way and PCBA board 2 simultaneously. The conductors are a D terminal connecting sheet 8 and an S terminal connecting sheet 11 shown in figures 1-3; the leads described herein are the D-lead 7 and the S-lead 10 shown in fig. 1-3.
The above embodiments are merely illustrative of the principles and effects of the present invention, and some embodiments in use, and are not intended to limit the invention; it should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the inventive concept of the present invention, and these changes and modifications belong to the protection scope of the present invention.
Claims (3)
1. The connecting structure of the parallel double MOS tubes and the PCBA comprises two MOS tubes (1) and the PCBA (2) for mounting the MOS tubes (1), and is characterized in that the PCBA (2) is provided with two G pin through holes (3) which respectively correspond to G pins (4), a D pin through hole (5) and an S pin through hole (6) of the two MOS tubes, a circuit for connecting the two G pin through holes (3) is preset on the PCBA (2), the pins of the two MOS tubes (1) are oppositely arranged, and the respective G pins (4) of the two MOS tubes (1) are correspondingly inserted into the two G pin through holes (3) on the PCBA (2) and are welded;
the respective D pins (7) of the two MOS tubes (1) are connected with each other through a D terminal connecting sheet (8), the D terminal connecting sheet (8) is also provided with a D pin (9) inserted into a D pin through hole (5), the D pin (9) is welded with the D pin through hole (5), and the resistance of the D terminal connecting sheet (8) is smaller than that of the D pin (7);
the S pins (10) of the two MOS tubes (1) are connected with each other through an S terminal connecting sheet (11), an S pin (12) inserted into the S pin through hole (6) is further arranged on the S terminal connecting sheet (11), the S pin (12) is connected with the S pin through hole (6) in a welding mode, and the resistance of the S terminal connecting sheet (11) is smaller than that of the S pin (10).
2. The structure of connecting the parallel double MOS tubes and the PCBA board as recited in claim 1, wherein the D terminal connecting piece (8) is connected at the root of any D pin (7) to shorten the distance of current flowing through the D pin (7).
3. The connecting structure of the parallel double MOS tube and the PCBA board as recited in claim 1, further comprising a PCB board (13), wherein the PCB board (13) is provided with a D pin connecting hole (14) and two S pin connecting holes (15), the inner side walls of the D pin connecting hole (14) and the S pin connecting holes (15) are respectively and fixedly provided with a metal sleeve (16), the D terminal connecting sheet (8) is provided with a D joint (17) inserted into the D pin connecting hole (14), and the D joint (17) and the two D pins (7) are inserted into the metal sleeve (16) in the D pin connecting hole (14) and connected by welding; the two S pin connecting holes (15) are respectively in one-to-one correspondence with the S pins (10) of the two MOS tubes (1), the S terminal connecting sheet (11) is provided with S connectors (18) in one-to-one correspondence with the two S pin connecting holes (15), and the S pin (10) and the S connector (18) corresponding to any one S pin connecting hole (15) are inserted into a metal sleeve (16) in the S pin connecting hole (15) and connected through welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921184452.4U CN210469887U (en) | 2019-07-25 | 2019-07-25 | Connecting structure of parallel double MOS tubes and PCBA (printed circuit board assembly) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921184452.4U CN210469887U (en) | 2019-07-25 | 2019-07-25 | Connecting structure of parallel double MOS tubes and PCBA (printed circuit board assembly) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210469887U true CN210469887U (en) | 2020-05-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921184452.4U Withdrawn - After Issue CN210469887U (en) | 2019-07-25 | 2019-07-25 | Connecting structure of parallel double MOS tubes and PCBA (printed circuit board assembly) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210469887U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110337194A (en) * | 2019-07-25 | 2019-10-15 | 苏州华之杰电讯股份有限公司 | The connection method and connection structure of double metal-oxide-semiconductors and PCBA board in parallel |
-
2019
- 2019-07-25 CN CN201921184452.4U patent/CN210469887U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110337194A (en) * | 2019-07-25 | 2019-10-15 | 苏州华之杰电讯股份有限公司 | The connection method and connection structure of double metal-oxide-semiconductors and PCBA board in parallel |
| CN110337194B (en) * | 2019-07-25 | 2024-02-13 | 苏州华之杰电讯股份有限公司 | Connecting structure of parallel double MOS (Metal oxide semiconductor) tubes and PCBA (printed circuit board assembly) |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20200505 Effective date of abandoning: 20240213 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20200505 Effective date of abandoning: 20240213 |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |