CN110335844A - A kind of MicroLED flood tide transfer device and method based on selectivity heating degaussing - Google Patents

A kind of MicroLED flood tide transfer device and method based on selectivity heating degaussing Download PDF

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Publication number
CN110335844A
CN110335844A CN201910519471.6A CN201910519471A CN110335844A CN 110335844 A CN110335844 A CN 110335844A CN 201910519471 A CN201910519471 A CN 201910519471A CN 110335844 A CN110335844 A CN 110335844A
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microled
magnetic
array
square
substrate
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CN110335844B (en
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黄永安
杨彪
卞敬
尹周平
陈建魁
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Huazhong University of Science and Technology
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Huazhong University of Science and Technology
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F13/00Apparatus or processes for magnetising or demagnetising
    • H01F13/006Methods and devices for demagnetising of magnetic bodies, e.g. workpieces, sheet material
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    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
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    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
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    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • HELECTRICITY
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    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages

Abstract

The invention belongs to flood tide transfer techniques fields, and specifically disclose a kind of MicroLED flood tide transfer device and method based on selectivity heating degaussing, it includes substrate and the magnetic square array for being disposed on the substrate surface, it is synonyms pole that each magnetism square, which all has magnetic and upper and lower surface, in magnetic square array, and each magnetism square can lose magnetism under the action of the heating of outside, magnetism square array and the magnetic MicroLED array of tool to be transferred correspond when transfer operation, MicroLED array is picked up using magnetic square array is first whole, the heating magnetically square of reselection makes it lose magnetism with being transferred to MicroLED selectivity on the magnetic objective circuit substrate of tool.The patterning of MicroLED, selective flood tide transfer can be achieved in the present invention, has the advantages that easy to operate, strong applicability, registration.

Description

A kind of MicroLED flood tide transfer device and method based on selectivity heating degaussing
Technical field
The invention belongs to flood tide transfer techniques fields, heat degaussing based on selectivity more particularly, to a kind of MicroLED flood tide transfer device and method.
Background technique
Micro-led (MicroLED, μ LED) is display technology of new generation, than existing Organic Light Emitting Diode (OLED) brightness is higher, and luminous efficiency is higher, longer life expectancy, and power consumption is lower.It is micro-led that there is self-luminous, be not necessarily to The characteristic of backlight, and each pixel can addressing, be operated alone and light.
The preparation flow of micro-led display is usually by diode (LED) structural membrane, microminiaturization, array Change, make its size only in 10 microns, then by largely (the micro-led chip of tens of thousands of to several ten million) is transferred to LED array is formed on display circuit substrate, is finally packaged.Wherein, how by the miniature light-emitting diodes of a large amount of miniature scales Tube chip be transferred on display circuit substrate be this process key difficulties, flood tide transfer (Mass Transfer) technology also answer It transports and gives birth to.Flood tide transfer techniques require batch that the micro-led chip of micron order size is selective from primary substrate Amount is transferred on circuit substrate, and since micro-led size is very small, and the requirement of flood tide transfer techniques is very high Yield (99.9999%), efficiency and transfer precision, therefore flood tide transfer techniques also become micro-led R&D process Ultimate challenge hinders micro-led development.
Except micro-led batch to be transferred on circuit substrate in flood tide transfer process, also need to realize selectivity Transfer, to realize the purpose of pattern transfer.Currently, selectively transfer technology have it is following several: 1) by film stretch Realize variable spacing transfer with patterning laser, this method by the temporary adhesion chip on macromolecule transparent membrane tensile layer, Then stretch transparent membrane realize chip chamber away from adjustment, finally with patterning laser discharge chip, the method exist stretch when The problems such as spacing is uneven, and pattern laser higher cost;2) selectively transfer by transfer seal realization, this method passes through Using the pickup chip of transfer seal patterning, selectivity with micro-structure, then chip is discharged on circuit substrate again, The production of the method seal is more troublesome, and is existed and positioned the problems such as inaccurate.
Summary of the invention
Aiming at the above defects or improvement requirements of the prior art, the present invention provides a kind of based on selectivity heating degaussing MicroLED flood tide transfer device and method, by designing magnetic corresponding with the magnetic MicroLED array of tool to be transferred Property square array, and selective heating magnetically square so that it is lost magnetism with by MicroLED selectivity be transferred to target electricity On base board, realizes that the patterning of MicroLED, selective flood tide shift with this, there is easy to operate, strong applicability, positioning accurate The advantages that true.
To achieve the above object, according to one aspect of the present invention, it proposes a kind of based on selectivity heating degaussing MicroLED flood tide transfer device, the device include substrate and the magnetic square array that surface on the substrate is arranged, the magnetic Property square array in each magnetic square to all have magnetic and its upper and lower surface be synonyms pole, and each magnetic square can Lose magnetism under the action of heating in outside, the flood tide transfer device execute when transfer operation the magnetic square array with wait turn The magnetic MicroLED array of the tool of shifting corresponds, and picks up MicroLED array using the magnetism square array is first whole, The heating magnetically square of reselection makes it lose magnetism so that MicroLED selectivity is transferred to the magnetic target electricity of tool On base board, the MicroLED flood tide transfer based on selectivity heating degaussing is realized with this.
As it is further preferred that the magnetism square array is preferably prepared in the following way: steaming on the substrate Plating perhaps sputters one layer of magnetic material and is then cut by laser its array or etches, is finally putting into magnetic field and magnetizes The magnetic square array is prepared on substrate with this.
As it is further preferred that realizing that the selectivity heating of magnetic square makes it lose magnetism in the following way: choosing The electrode to objective circuit substrate of selecting property is powered to light corresponding MicroLED thereon, and MicroLED generates thermal effect after lighting It should be to be heated to corresponding magnetic square thereon, and then corresponding the magnetic of magnetic square is made to disappear.
As it is further preferred that it is preferred that realizing the selectivity of objective circuit electrode of substrate using driving circuit control unit Be powered, the driving circuit control unit include host computer, slave computer, row driving and column driving, wherein the slave computer with it is upper Machine realizes that communication, the row driving and column driving are connected with the slave computer and objective circuit electrode of substrate, the slave computer root Corresponding row driving and column driving conducting are controlled according to the instruction of host computer, so that corresponding objective circuit electrode of substrate is powered.
It is another aspect of this invention to provide that providing a kind of MicroLED flood tide transfer side based on selectivity heating degaussing Method comprising following steps:
MicroLED array to be transferred is transferred on the central, clear carrier substrate for being prepared with glue-line by S1 from substrate, Keep the electrode of MicroLED Nian Jie with glue-line;
S2 presses the device on the MicroLED array for having been transferred to central, clear carrier substrate, and makes device Magnetic square array and central, clear carrier substrate on MicroLED array correspond, then hit using ultraviolet lighting Between glue-line on transparent carrier substrate reduce its viscosity, each MicroLED in MicroLED array is to magnetropism square Effect is lower captured, realizes that the whole of MicroLED picks up with this;
S3 will pick up the device pressing after MicroLED on having magnetic objective circuit substrate, and make on device Electrod-array on MicroLED array and objective circuit substrate corresponds, in selective heating magnetically square array (12) Magnetic square so that it is lost magnetism, the MicroLED on magnetic square to lose magnetism is then by corresponding on objective circuit substrate The MicroLED flood tide transfer based on selectivity heating degaussing is completed in electrode capture by this method.
As it is further preferred that step S1 includes following sub-step:
S11 prepares the magnetic MicroLED array of tool in substrate;
S12 presses MicroLED array on the glue-line of central, clear carrier substrate, make the electrode of each MicroLED with Glue-line bonding;
S13 irradiates ultraviolet laser in the interface of MicroLED array and substrate, so that MicroLED array and substrate point From will be in MicroLED array global transfer to central, clear carrier substrate with this.
As it is further preferred that the magnetic square in selective heating magnetically square array loses it in step S3 Magnetic preferably to realize in the following way: the selective electrode to objective circuit substrate is powered corresponding to be transferred to light MicroLED, MicroLED to be transferred generate fuel factor to heat to corresponding magnetic square thereon after lighting, and then make to correspond to The magnetic of magnetic square disappear.
In general, through the invention it is contemplated above technical scheme is compared with the prior art, mainly have below Technological merit:
1. the present invention makes it lose magnetism (i.e. selective demagnetization) by selective heating magnetically square, selectivity is realized Shift the micro-led purpose on objective circuit substrate, can by array it is micro-led selectively, It is patterned to be transferred on objective circuit substrate, between effectively solving between micro-led array and objective circuit substrate Away from unmatched problem.
2. when preparing micro-led array on primary substrate, wherein there may be a certain amount of bad point, this hair It is bright to be powered by the electrode to objective circuit substrate of selectivity to light corresponding micro-led mode to be transferred Realize micro-led transfer, when it is micro-led be bad point when it will not be lit, namely will not be transferred, Compared to the method for other selectivity batch transfers, it can effectively avoid the transfer of bad point, guarantee the yield of transfer.
3. micro-led flood tide transfer is realized the present invention is based on the principle of selectivity heating degaussing, compared to existing For technology, there is no stretching times to have at low cost, simple structure, transfer without production seal away from non-uniform problem The advantages that high-efficient, registration.
Detailed description of the invention
Fig. 1 is the three-dimensional of the MicroLED flood tide transfer device provided in an embodiment of the present invention based on selectivity heating degaussing Structural schematic diagram;
Fig. 2 is the two dimension of the MicroLED flood tide transfer device provided in an embodiment of the present invention based on selectivity heating degaussing Diagrammatic cross-section;
Fig. 3 is provided in an embodiment of the present invention to be transferred to central, clear carrier substrate from substrate by micro-led On process schematic;
Fig. 4 is provided in an embodiment of the present invention the micro-led process integrally picked up to be realized by transfer device Schematic diagram;
Fig. 5 is the mistake provided in an embodiment of the present invention that micro-led selectivity release is realized by transfer device Journey schematic diagram;
Fig. 6 is provided in an embodiment of the present invention micro-led to the heating removal of magnetic square by selectively lighting Its magnetic process schematic;
Fig. 7 is the driving circuit control unit schematic diagram of objective circuit substrate provided in an embodiment of the present invention.
In all the appended drawings, identical appended drawing reference is used to denote the same element or structure, in which:
10- transfer device, 11- substrate, 12- magnetism square array, the magnetic square of 13- heating, the unheated magnetism of 14- Square, 20- substrate, 30- is micro-led, and the micro-led electrode of 31-, 32- is to be transferred micro-led, 33- is not required to micro-led, the 40- central, clear carrier substrate of transfer, and 41- glue-line, 50- ultraviolet laser, 51- is ultraviolet Light, 60- objective circuit substrate, 61- objective circuit electrode of substrate, 62- lead, 63- host computer, 64- slave computer, the driving of 65- row, 66- column driving.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and It is not used in the restriction present invention.As long as in addition, technical characteristic involved in the various embodiments of the present invention described below Not constituting a conflict with each other can be combined with each other.
As shown in Figs. 1-2, provided in an embodiment of the present invention a kind of based on the micro-led of selectivity heating degaussing (MicroLED) flood tide transfer device, the device include substrate 11 and the magnetic square array that 11 upper surface of substrate is arranged in 12, each magnetic square in magnetic square array 12 all has magnetism, and the upper and lower surface of each magnetic square is (i.e. up and down End) it is synonyms pole, i.e., magnetic square upper surface is the pole S, lower surface is the pole N or upper surface is the pole N, lower surface is the pole S, The magnetic pole arrangement of each magnetism square is consistent, and each magnetism square can reach its Curie temperature by outside heating to reduce its magnetism When disappearance, transfer operation, the magnetism square array 12 and the magnetic micro-led array one of tool to be transferred One is corresponding, and magnetic square array 12 is whole first to pick up micro-led array, then the heating magnetically side of reselection Block (selecting micro-led corresponding magnetic square to be transferred) makes it lose magnetism, with this selectivity by miniature hair Optical diode is transferred on the magnetic objective circuit substrate of tool, realizes miniature luminous two based on selectivity heating degaussing with this The transfer of pole pipe flood tide.
Specifically, magnetic square array 12 can be by being deposited on the substrate 11 or sputtering one layer of magnetic material, then It is cut by laser or the means such as reactive ion etching is by its array, be finally putting into magnetic field and magnetize.This kind of method The magnetic square of each obtained has certain magnetism, to be transferred micro-led in order to effectively adsorb.Due to The upper and lower surface of magnetic square is synonyms pole, so that surrounding magnetic field is concentrated mainly on the two sides of synonyms pole, that is, Say that the magnetic field strength of the two sides up and down of magnetic square is stronger, and the magnetic field strength of surrounding is weaker, so will not be to adjacent miniature Light emitting diode impacts, and after reaching by external heating the Curie temperature of magnetic square, can reduce rapidly its magnetic Property until disappear.By the above-mentioned characteristic of magnetic square 12, whole pickup may be implemented, then selective release miniature luminous two Micro-led patterning, selectivity are transferred on objective circuit substrate by pole pipe, final realize.
The present invention also provides a kind of micro-led flood tide transfer method based on selectivity heating degaussing, packets Include following steps:
Micro-led array to be transferred is transferred to the central, clear for being prepared with glue-line 41 by S1 from substrate 20 On carrier substrate 40, keep micro-led electrode Nian Jie with glue-line 41;
S2 realizes whole pickup (as shown in Figure 4):
The pressing of transfer device 10 of the invention is being had been transferred into the micro-led of central, clear carrier substrate 40 On array, and make the magnetic square array 12 of device and one a pair of micro-led array on central, clear carrier substrate It answers, then reduces its viscosity using the glue-line 41 on ultraviolet light central, clear carrier substrate 40, it is micro-led In array it is each it is micro-led captured under magneticaction by corresponding magnetic square, miniature light-emitting diodes are realized with this The whole of pipe picks up;
S3 realizes selectivity release (as shown in Figure 5):
By pick up it is micro-led after device pressing on there is magnetic objective circuit substrate 60, and make device On micro-led array and objective circuit substrate on electrod-array correspond, make micro-led electrode Good contact is generated with circuit substrate electrode;Then selective to be powered to objective circuit electrode of substrate, the target being energized Circuit substrate electrode can light thereon micro-led, and the objective circuit electrode of substrate being not powered on can not then be lighted Thereon micro-led.Specifically, objective circuit electrode of substrate has certain magnetism, intensity is much smaller than transfer device The magnetism of upper magnetism square, it is selective corresponding micro-led to light to the energization of objective circuit electrode of substrate.It is micro- Type light emitting diode can generate fuel factor when being lit, and the size by controlling input current can control miniature light-emitting diodes The thermal power of pipe, what is be lit micro-led can reach the Curie of magnetic square to its corresponding magnetic square heating Magnetic square magnetism can be reduced rapidly after temperature until disappearing.And due to the difference with magnetic square material, objective circuit base The curie point of plate electrode and micro-led electrode wants high, and magneticaction between the two is unaffected.In objective circuit Under the guidance of electrode of substrate magnetic force, the micro-led electrode by objective circuit substrate captures, and realizes selectivity with this Discharge it is micro-led, and finally realize selectivity objective circuit base is transferred to from substrate by micro-led On plate.
Specifically, as shown in figure 3, step S1 includes following sub-step:
S11 prepares the magnetic micro-led array of tool in substrate 20 (such as sapphire substrates), specifically Micro-led 30 electrode have it is certain magnetic, in order to be picked up or be discharged by magnetic square, and it is specific how Make micro-led electrode that there is magnetism, existing conventional method can be used and realize, such as miniature shine can made When diode electrode, some magnetic materials are adulterated, perhaps plate one layer of magnetic material or electrode on it using magnetic material Production so that it is had magnetism etc., be the prior art this will not be repeated here, ultimately form array, closely arrange it is miniature shine Diode array, single micro-led 30 size are 10 μm to 20 μm or so;
S12 presses micro-led array on the glue-line 41 of central, clear carrier substrate 40, makes each miniature hair The electrode of optical diode is Nian Jie with glue-line 41;
S13 is irradiated in the interface of micro-led 30 Yu substrate 20 using ultraviolet laser 50 through substrate 20, makes The micro-led 30 adhesion strength significant decreases with 20 interface of substrate are obtained, by micro-led 30 and substrate 20 Separation, thus by micro-led 30 global transfer to central, clear carrier substrate 40.
Specifically, the electrode of objective circuit substrate has magnetism, in order to make micro-led accurate positioning, and Specifically how to make objective circuit electrode of substrate that there is magnetism, existing conventional method can be used and realize, such as can be in production mesh When marking circuit substrate electrode, some magnetic materials are adulterated, or one layer of magnetic material is plated on objective circuit electrode of substrate, or Person's electrode makes it have magnetism etc. using magnetic material production, is that this will not be repeated here for the prior art.
Further, in step S2, since central, clear carrier substrate plays interim transitional function, miniature light-emitting diodes Interfacial adhesion between pipe electrode and glue-line 41 can decrease up to disappearance under certain effect, realize to miniature light-emitting diodes The release of pipe array, this kind of method include modified to reduce its viscosity etc. by ultraviolet irradiation glue-line.Specifically, in central, clear Carrier substrate 40 is radiated at certain time on glue-line 41 through central, clear carrier substrate 40 without glue-line side ultraviolet light 51, makes The viscosity that micro-led 30 glue-line 41 must be bonded significantly reduces.The remaining sticky size of this kind of glue-line can pass through purple External exposure light intensity and time control, and can guarantee that the chip of transfer will not be polluted, between specific irradiation light intensity is timely It can be determine according to actual needs.Specifically, glue-line 41 can be UV photodissociation glue or photic mistake viscose, the method is in transfer micro element Field has been widely used, and this will not be repeated here.In the magnetic square 12 and micro-led electrode of transfer device Between under the action of magnetic force, micro-led 30 are captured by corresponding magnetic square 12, with this realize it is whole pick up it is miniature On light emitting diode 30 to transfer device 10.
In a preferred embodiment, in step S3, by the coordination electrode lead of external control instruction selectivity to mesh The electrode of mark circuit substrate is powered to light corresponding to be transferred micro-led 32, it is to be transferred it is micro-led Fuel factor can be generated when being lit, to be transferred micro-led 32 be lit can add corresponding magnetic square thereon Heat, the Curie temperature for reaching magnetic square can reduce rapidly its magnetism until disappearing later, which is irreversible procedure, i.e., The magnetic square temperature of heated degaussing is restored to after room temperature, still no longer has magnetism.In objective circuit electrode of substrate Under the action of magnetic force, to be transferred micro-led 32 are captured by objective circuit electrode of substrate, realize miniature luminous two with this The transfer of pole pipe.Micro-led 33 (i.e. non-lit up is micro-led) without transfer are still adsorbed on It on its corresponding magnetic square, does not shift, patterned, selective is transferred to micro-led to realize On objective circuit substrate 60, patterning be selectively lighted by this kind of transfer method it is micro-led, and using micro- Fuel factor when type lumination of light emitting diode carries out heating degaussing to its corresponding magnetic square, realizes that selectivity release obtains. This be not transferred it is micro-led next group can be waited to shift, wait micro-led on transfer devices 10 After array is all transferred, this transfer device 10 can be placed again into magnetic field and be magnetized, open the transfer of a new round.
Fig. 6 is that micro-led schematic diagram to its magnetism of magnetic square heating removal is lighted by selectivity, Substantially process is held as follows: the transfer device 10 that will be adsorbed with micro-led array is pressed on objective circuit substrate 60, Keep micro-led array corresponding with objective circuit electrode of substrate 61, specifically make micro-led electrode 31 with Objective circuit electrode of substrate 61 realizes good contact, can be with normally.Each objective circuit electrode of substrate 61 is respectively connected with one Lead 62 is powered to 61 selectivity of objective circuit electrode of substrate by each lead 62 to light corresponding to be transferred miniature luminous two Pole pipe 32.Theoretical calculation shows that at room temperature the light irradiance of micro-led pixel is from 1 every square millimeter of milliwatt When rising to every square millimeter of 20 milliwatt, internal maximum temperature rises to 150 DEG C or so from 100 DEG C.Pass through coordination electrode lead The temperature of the size of input current, micro-led photovoltaic illumination and its working environment can control miniature light-emitting diodes The thermal power of pipe, and then control micro-led surface temperature.To be transferred micro-led 32 be lit can To heat to the magnetic square above it, the magnetic square 13 being heated reaches magnetic drop rapidly after itself Curie temperature It is low that up to disappearing, and after recovery room temperature, it still no longer has magnetism.Feasible magnetic square material a kind of for this step is A kind of soft magnetic ferrite, by mainly being formed by powder techniques such as iron oxide, manganese oxide and zinc oxide, this kind of material Preparation process is quite mature, is usually used in the temperature-sensitive magnet part of temperature sensor in electric cooker, Curie temperature is about 103 ± 2 °, and can its residence of upper down regulation by a relatively large margin by changing the ratio between each ingredient and adulterating some other materials In temperature.And micro-led electrode 31 selects Curie temperature to be higher than magnetic square Curie with objective circuit electrode of substrate 61 The material of temperature is made, so that micro-led fuel factor only reaches the Curie temperature of magnetic square, and is not achieved micro- The Curie temperature of type light-emitting diodes pipe electrode 31 and objective circuit electrode of substrate 61, micro-led electrode 31 and target electricity Magneticaction between roadbed plate electrode 61 is unaffected.The alternative material of such electrode has very much, such as Al-Ni-Co series Permanent-magnet alloy, Curie temperature are 860 DEG C or so, and siderochrome cobalt system permanent-magnet alloy, Curie temperature is 680 DEG C or so, all remote high In the Curie temperature of magnetic square.Under the action of objective circuit 61 magnetic force of electrode of substrate, to be transferred micro-led 32 It is captured by objective circuit electrode of substrate, micro-led transfer is realized with this.And non-lit up miniature luminous two Pole pipe is still adsorbed on its corresponding unheated magnetic square 14, is not shifted, to realize patterned, selectivity Be transferred to micro-led on objective circuit substrate.
Fig. 7 is the driving circuit control unit schematic diagram of objective circuit substrate, which mainly realizes to mesh The energization that the electrode on circuit substrate carries out selectivity is marked, it is micro-led with lighting for this selectivity, it is finally reached choosing Selecting property, the purpose of pattern transfer.The driving circuit control unit is the more conventional control system in this field, mainly includes upper Position machine 63 realizes the slave computer 64 communicated with host computer 63 and is connected respectively with slave computer 64 and objective circuit electrode of substrate Row driving 65 and column driving 66, ordinary PC can be used in host computer 63, is mainly responsible for the editor of display data, and sends to down Position machine 64, each rows of electrodes for then gating objective circuit substrate 60 in an orderly manner under the control of slave computer 64 (utilize row driving 65 make the electrode connection of the corresponding row of objective circuit substrate 60), the data that also row is arranged before gating every a line are quasi- It gets ready, once the row gates, the electrode in this line can carry out selective energization according to column data, that is, utilize column driving 66 So that the electrode of 60 respective column of objective circuit substrate is connected to, so selective keeps counter electrode on objective circuit substrate 60 logical Electricity.
Transfer device proposed by the present invention and method are selectively lighted miniature using mature driving circuit control technology Light emitting diode, fuel factor when utilizing micro-led luminous heat rapidly its corresponding magnetic square, make magnetic Property square temperature reach its Curie temperature, the magnetism of square magnetic in this way will reduce rapidly until disappear, and realize list with this The solely flood tide transfer of controllable micro-led patterning, selectivity.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should all include Within protection scope of the present invention.

Claims (7)

1. a kind of MicroLED flood tide transfer device based on selectivity heating degaussing, which is characterized in that the device includes substrate (11) and magnetic square array (12) of the setting in substrate (11) upper surface, each magnetic in magnetism square array (12) Property square to all have magnetic and its upper and lower surface be synonyms pole, and each magnetic square can lose under the action of the heating of outside Magnetism is gone, it is magnetic which executes the magnetic square array (12) and tool to be transferred when transfer action MicroLED array corresponds, and picks up MicroLED array using the magnetism square array (12) is first whole, reselection Heating magnetically square makes it lose magnetism with being transferred to MicroLED selectivity on the magnetic objective circuit substrate of tool, with This realizes the MicroLED flood tide transfer based on selectivity heating degaussing.
2. the MicroLED flood tide transfer device as described in claim 1 based on selectivity heating degaussing, which is characterized in that institute It states magnetic square array (12) preferably to prepare in the following way: one layer of magnetic material is deposited or sputtered on the substrate (11) Material, is then cut by laser its array or etches, is finally putting into magnetization in magnetic field and is prepared on substrate (11) with this Obtain the magnetic square array (12).
3. the MicroLED flood tide transfer device as claimed in claim 1 or 2 based on selectivity heating degaussing, feature exist In, it is preferred that realize that the selectivity heating of magnetic square makes it lose magnetism in the following way: selective to objective circuit The electrode of substrate is powered to light corresponding MicroLED thereon, and MicroLED generates fuel factor to corresponding thereon after lighting Magnetic square heating, and then corresponding the magnetic of magnetic square is made to disappear.
4. the MicroLED flood tide transfer device as claimed in claim 3 based on selectivity heating degaussing, which is characterized in that excellent Choosing realizes that the selectivity of objective circuit electrode of substrate is powered using driving circuit control unit, which includes Host computer (63), slave computer (64), row driving (65) and column driving (66), wherein the slave computer (64) and host computer (63) are real It now communicates, the row driving (65) and column driving (66) are connected with the slave computer (64) and objective circuit electrode of substrate, should Slave computer (64) controls corresponding row driving (65) and column driving (66) conducting according to the instruction of host computer (63), so that corresponding mesh Circuit substrate electrode is marked to be powered.
5. a kind of MicroLED flood tide transfer method based on selectivity heating degaussing, which comprises the steps of:
MicroLED array to be transferred is transferred to the central, clear carrier base for being prepared with glue-line (41) by S1 from substrate (20) On plate (40), keep the electrode of MicroLED Nian Jie with glue-line (41);
Device according to any one of claims 1-4 pressing is being had been transferred to central, clear carrier substrate (40) by S2 On MicroLED array, and the magnetic square array (12) for making device and the MicroLED array one on central, clear carrier substrate One is corresponding, then reduces its viscosity using the glue-line (41) on ultraviolet light central, clear carrier substrate (40), Each MicroLED in MicroLED array is captured under the action of to magnetropism square, and the entirety of MicroLED is realized with this It picks up;
S3 will pick up the device pressing after MicroLED on having magnetic objective circuit substrate (60), and make on device Electrod-array on MicroLED array and objective circuit substrate corresponds, in selective heating magnetically square array (12) Magnetic square so that it is lost magnetism, the MicroLED on magnetic square to lose magnetism is then by objective circuit substrate (60) on pair The MicroLED flood tide transfer based on selectivity heating degaussing is completed in the electrode capture answered by this method.
6. the MicroLED flood tide transfer method as claimed in claim 5 based on selectivity heating degaussing, which is characterized in that step Rapid S1 includes following sub-step:
S11 prepares the magnetic MicroLED array of tool on substrate (20);
S12 presses MicroLED array on the glue-line (41) of central, clear carrier substrate (40), makes the electricity of each MicroLED Pole is Nian Jie with glue-line (41);
S13 irradiates ultraviolet laser (50) in the interface of MicroLED array Yu substrate (20), so that MicroLED array and base Bottom (20) separation, will be in MicroLED array global transfer to central, clear carrier substrate (40) with this.
7. such as the MicroLED flood tide transfer method described in claim 5 or 6 based on selectivity heating degaussing, feature exists In in step S3, the magnetic square in selective heating magnetically square array (12) makes it lose magnetism preferably using such as lower section Formula is realized: the selective electrode to objective circuit substrate is powered to be lighted with lighting corresponding MicroLED, MicroLED thereon It generates fuel factor afterwards to heat to corresponding magnetic square thereon, and then corresponding the magnetic of magnetic square is made to disappear.
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