CN110333501A - Depth measurement device and distance measurement method - Google Patents
Depth measurement device and distance measurement method Download PDFInfo
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- CN110333501A CN110333501A CN201910632082.4A CN201910632082A CN110333501A CN 110333501 A CN110333501 A CN 110333501A CN 201910632082 A CN201910632082 A CN 201910632082A CN 110333501 A CN110333501 A CN 110333501A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
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- Computer Networks & Wireless Communication (AREA)
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- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Measurement Of Optical Distance (AREA)
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Abstract
The present invention provides a kind of depth measurement device and distance measurement method, depth measurement device includes: light emitting mould group, include light source and patterned optical element, the light source is for emitting the light beam that amplitude in timing is modulated, and the patterned optical element is for receiving after the light beam to target object emitting structural light light beam；TOF imaging sensor includes at least one pixel, and the pixel is for receiving the structure light light beam reflected by the target object and forming electric signal；Control and processing circuit, receive the electric signal and calculate the strength information of the structure light light beam of the reflection to form structured light patterns, and, the depth image of the target object is calculated using the structured light patterns.TOF imaging sensor is combined with structured light light source, transmitting terminal uses amplitude modulation, acquires in receiving end using multi-tap pixel, from the depth measurement method for realizing that the environment resistant light that traditional scheme is difficult to realize interferes.
Description
Technical field
The present invention relates to field of optical measuring technologies more particularly to a kind of depth measurement devices and distance measurement method.
Background technique
The full name of ToF is Time-of-Flight, i.e. the flight time, and ToF ranging technology is a kind of by measurement light pulse
Turnaround time between transmission/reception and target object realizes the technology of precision ranging.In ToF technology directly
DToF (direct-TOF) is referred to as to the technology that the light flight time measures；Periodic modulation is carried out to transmitting optical signal,
It is measured by the phase delay to reflected light signal relative to transmitting optical signal, then the flight time is carried out by phase delay
The measuring technique of calculating is known as iToF (Indirect-TOF) technology.It can be divided into according to the difference of modulation /demodulation type fashion
Continuous wave (Continuous Wave, CW) modulation-demo-demodulation method and impulse modulation (Pulse Modulated, PM) modulation /demodulation
Method.
Structure light measurement technology is then to space object emitting structural light light beam, after secondly acquisition is modulated and reflected by object
Structure light light beam is formed by structured light patterns, finally carries out depth calculation using trigonometry to obtain the depth data of object.
Common structured light patterns have irregular speckle patterns, candy strip, phase-shift pattern etc..
In comparison, TOF technology calculates (such as structure light image matching primitives) without carrying out complicated image procossing, in
Relatively high measurement accuracy is able to maintain when long distance；And structured light technique then has very high precision when low coverage measures, but
Linear increase can at least be presented as distance increases precision.In addition, structured light technique is by then passing through acquisition reflection reflective light intensity
The image of degree carries out calculating depth, therefore inevitably will receive influence of the environment light to luminous intensity, and in contrast TOF is then in ring
Light anti-interference aspect in border is better than structured light technique.
Summary of the invention
The present invention in order to solve the existing problems, provides a kind of depth measurement device and distance measurement method.
At least one of to solve the above-mentioned problems, the technical solution adopted by the present invention is as described below:
Depth measurement device, comprising: light emitting mould group includes light source and patterned optical element, and the light source is for sending out
Penetrate the light beam that amplitude in timing is modulated, the patterned optical element is for receiving after the light beam to target object emitter junction
Structure light light beam；TOF imaging sensor, includes at least one pixel, and the pixel is used to receive to be reflected by the target object
Structure light light beam simultaneously forms electric signal；Control and processing circuit, receive the electric signal and calculate the structure light of the reflection
The strength information of light beam to form structured light patterns, and, the depth of the target object is calculated using the structured light patterns
Image.
In an embodiment of the present invention, the structure light light beam includes irregular speckle patterns light beam, candy strip
Light beam, two-dimensional encoded patterned beam；In the irregular speckle patterns light beam amplitude of the corresponding light beam of each spot when
It is modulated in a manner of continuous wave, square wave or pulse in sequence.
In another embodiment of the invention, the pixel includes at least three tap, and the tap is used in single frame
The electric signal as caused by the structure light light beam reflected comprising the target object is acquired in period respectively.The light emitting mould group
Amplitude includes at least 4 taps by the light beam of sine wave modulation, each pixel of the TOF imaging sensor in transmitting timing,
It is respectively used to acquire 4 optical signals respectively within the single frame period and is converted into described electric signal C1, C2, C3 and C4,4 acquisitions
Time and interval it is identical；The intensity B of the structure light light beam is calculated using average weighted mode, specific as follows:Or, calculating the intensity of the structure light light beam by the way of environment light excretion factor is added
B, specific as follows:Amplitude is pulse modulation in the light emitting mould group transmitting timing
Each pixel of light beam, the TOF imaging sensor includes at least 3 taps, is respectively used to adopt respectively within the single frame period
Collecting 3 optical signals and is converted into electric signal C1, C2 and C3, the triggered time of the first tap and the launch time of light pulse are synchronous,
And the of same size of duration and pulse is triggered, the second tap, third tap are triggered in succession at the end of first tap, touching
It is identical as first tap to send out duration；The intensity B of the structure light light beam is calculated using average weighted mode, specifically such as
Under:Or, the intensity B of the structure light light beam is calculated by the way of environment light excretion factor is added,
It is specific as follows: B=C1+C2-2C3。
The present invention also provides a kind of distance measurement methods, comprising: the light beam modulated using amplitude in light source transmitting timing,
The light beam, which is patterned after optical element receives, forms structure light light beam to target object transmitting；Using including at least one picture
The pixel of the TOF imaging sensor of element receives the structure light light beam reflected by the target object and forms electric signal；It connects
It receives the electric signal and calculates the strength information of the structure light light beam of the reflection to form structured light patterns, and, it utilizes
The structured light patterns calculate the depth image of the target object.
In an embodiment of the present invention, the structure light light beam includes irregular speckle patterns light beam, candy strip
Light beam, two-dimensional encoded patterned beam；In the irregular speckle patterns light beam amplitude of the corresponding light beam of each spot when
It is modulated in a manner of continuous wave, square wave or pulse in sequence.
In another embodiment of the invention, the pixel includes at least three tap, and the tap is used in single frame
The electric signal as caused by the structure light light beam reflected comprising the target object is acquired in period respectively.The structure light light beam
It is that by the light beam of sine wave modulation, each pixel is respectively used to including at least 4 taps in single frame week amplitude in timing
4 optical signals are acquired in phase respectively and are converted into described electric signal C1, C2, C3 and C4, the time of 4 acquisitions and interval phase
Together；The intensity B of the structure light light beam is calculated using average weighted mode, specific as follows:
Or, the intensity B of the structure light light beam is calculated by the way of environment light excretion factor is added, it is specific as follows:The structure light light beam is the light beam that amplitude is pulse modulation in timing, each described
Pixel includes at least 3 taps, be respectively used to acquire 3 optical signals respectively within the single frame period and be converted into electric signal C1,
C2 and C3, the triggered time of the first tap and the launch time of light pulse are synchronous, and trigger the of same size of duration and pulse, the
Two taps, third tap are triggered in succession at the end of first tap, and triggering duration is identical as first tap；Using
Average weighted mode calculates the intensity B of the structure light light beam, specific as follows:Or, using being added
The mode of environment light excretion factor calculates the intensity B of the structure light light beam, specific as follows: B=C1+C2-2C3。
The invention has the benefit that a kind of depth measurement device and distance measurement method are provided, by TOF imaging sensor
It being combined with structured light light source, transmitting terminal uses amplitude modulation, it is acquired in receiving end using multi-tap pixel, so as to
So that apparatus and method of the present invention possesses functions more more than traditional scheme, the environment resistant light that traditional scheme is difficult to realize is realized
The depth measurement method of interference.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of depth measurement device in the embodiment of the present invention.
Fig. 2 is a kind of depth measurement device schematic illustration in the embodiment of the present invention.
Fig. 3 is another depth measurement device schematic illustration in the embodiment of the present invention.
Fig. 4 is a kind of structural schematic diagram of fusion TOF and the depth measurement device of structure light scheme in the embodiment of the present invention.
Fig. 5 is the structural representation of another fusion TOF and the depth measurement device of structure light scheme in the embodiment of the present invention
Figure.
Fig. 6 is structure light and TOF timing control schematic diagram in the embodiment of the present invention.
Fig. 7 is control and processing circuit configuration diagram in the embodiment of the present invention.
Fig. 8 is a kind of distance measurement method schematic diagram in the embodiment of the present invention.
Fig. 9 is another distance measurement method schematic diagram in the embodiment of the present invention.
Figure 10 is that one kind carries out processing method schematic diagram to the electric signal in the embodiment of the present invention.
Figure 11 is that another kind carries out processing method schematic diagram to the electric signal in the embodiment of the present invention.
Wherein, 10- depth measurement device, 11- light emitting mould group, 12- acquire mould group, 13- control and processing circuit, 14-
Floodlight light source module group, 111- light source, 112- patterned optical element, 121-TOF imaging sensor, 122- lens unit, 20- mesh
Object is marked, 30- emits light beam, 40- the reflected beams, 201- spot structured light patterns light beam, 202- hot spot, 40- depth measurement
Device, 41- light emitting mould group, 42- acquire mould group, 43- control and processing circuit, 44- floodlight light source module group, 51- pixel, 52-
Hot spot, 70- chip, 71- phase calculation module, 72- demarcating module, the first post-processing module of 73-, 74-1- splitter, 74-2-
Multiplexer, 75- magnitude determinations module, 76- pre-processing module, 77- matching module, the second post-processing module of 78-, 79- merge mould
Block.
Specific embodiment
In order to which technical problem to be solved of the embodiment of the present invention, technical solution and beneficial effect is more clearly understood,
The present invention is further described in detail below with reference to the accompanying drawings and embodiments.It should be appreciated that specific implementation described herein
Example is only used to explain the present invention, is not intended to limit the present invention.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or indirectly on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.In addition, connection can be for fixing
Effect is also possible to act on for circuit communication.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on the figure or position are closed
System is merely for convenience of the description embodiment of the present invention and simplifies description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the embodiment of the present invention, the meaning of " plurality " is two or two
More than, unless otherwise specifically defined.
Fig. 1 is depth measurement device according to an embodiment of the invention.Depth measurement device 10 includes light emitting mould group
11, mould group 12 and control and processing circuit 13 are acquired, wherein light emitting mould group 11 is used to emit transmitting light to target object 20
Beam 30, transmitting light beam 30 are the structure light light beams that amplitude is modulated in timing, and the structure light light beam is into object space to shine
Target object 20 in prescribed space, at least partly transmitting light beam 30 form the reflected beams 40, reflection after the reflection of target object 20
At least partly collected mould group 12 of light beam 40 acquires, control and processing circuit 13 respectively with light emitting mould group 11 and acquisition mould
12 connection of group to control the transmitting and acquisition of light beam, while being received from the 12 collected electric signal of institute of acquisition mould group, and to this
Electric signal is calculated to obtain the depth information of target object.
Light emitting mould group 11 includes light source 111, patterned optical element 112 and light source drive (not shown)
Deng.Light source 111 can be light emitting diode (LED), edge-emitting laser (EEL), vertical cavity surface emitting laser (VCSEL) etc.
Light source, is also possible to the array of source of multiple light sources composition, and the light beam that light source is emitted can be visible light, infrared light, ultraviolet
Light etc..Light source 111 is under the control of light source drive (it can further be controlled by control and processing circuit 13) with certain
Timing amplitude modulated after to outgoing irradiating light beam, such as, light source 111 is sent out under control with certain frequency
Penetrate the light beams such as impulse modulation light beam, square-wave frequency modulation light beam, sine wave modulation light beam.It is understood that can use control and
A part in processing circuit 13 emits phase independently of sub-circuit existing for control and processing circuit 13 to control light source 111
The light beam of pass, such as pulse signal generator.
Patterned optical element 112 receives the light beam from light source 111, and launches outward structure light light beam, for example do not advise
Speckle patterns light beam, candy strip light beam, two-dimensional encoded patterned beam for then arranging etc..In some embodiments, pattern
Change the light beam that optical element 112 is also used to receive to expand, to expand field angle.It is understood that passing through pattern
Change 112 modulated light beam its amplitude of optical element and remain and modulated with certain timing, is i.e. incident sine wave modulation light
Beam, outgoing remain sine wave modulation light beam.In an embodiment of the present invention, each in irregular speckle patterns light beam
The amplitude of the corresponding light beam of spot is modulated in a manner of continuous wave, square wave or pulse in timing.
Acquiring mould group 12 includes TOF imaging sensor 121, lens unit 122, (can not also be shown in figure comprising optical filter
Out), lens unit 122 is received and by at least partly structure light light beam being reflected back by target object and is imaged at least partly
On TOF imaging sensor 121, optical filter need to select the narrow band filter to match with optical source wavelength, for inhibiting remaining wave band
Background noise.TOF imaging sensor 121 can be charge coupled cell (CCD), complementary metal oxide semiconductor
(CMOS), the imaging sensor of the compositions such as avalanche diode (AD), single-photon avalanche diode (SPAD), array size represent
Resolution ratio of the depth camera, such as 320x240 etc..Generally, what is connect with imaging sensor 121 further includes being amplified by signal
The reading circuit of one of devices such as device, time to digital converter device (TDC), analog-digital converter (ADC) or a variety of compositions (does not show in figure
Out).
Generally, TOF imaging sensor 121 includes at least one pixel, with traditional image sensing for being only used for taking pictures
Device is compared, and each pixel then includes more than two taps (tap, for storing and reading under the control of respective electrode here
Or the charge signal that is generated by incident photon of discharge), such as including 3 taps, in (or single exposure time in single frame period
It is interior) in tap switched successively to acquire corresponding photon with certain order, for receiving optical signal and being converted into electric signal.
Control can be independent special circuit with processing circuit 13, for example include the compositions such as CPU, memory, bus
Special SOC chip, fpga chip, asic chip etc. also may include general purpose processing circuits, such as when the depth camera is collected
At into intelligent terminals such as such as mobile phone, TV, computers, the processing circuit in terminal can be used as the control and processing circuit 13
At least part.
When control emits laser for providing light source 111 (or light source in floodlight light source module group 14 etc.) with processing circuit 13
Required modulated signal (transmitting signal), light source emits light beam to target object under the control of modulated signal.Such as at one
In embodiment, modulated signal be continuous wave signal such as sine wave signal, light source under the modulation of the sine wave signal amplitude when
Emitted in sequence with sine wave；In one embodiment, modulated signal is square-wave signal or pulse signal, and light source is in the modulation
Amplitude is launched outward by modulation in timing with generating square-wave signal or pulse signal under the modulation of signal.
In addition, control also provides the demodulated signal of each tap in each pixel of TOF imaging sensor 121 with processing circuit 13
(acquisition signal), tap is acquired as caused by the light beam for the reflection being reflected back comprising target object under the control of demodulated signal
Electric signal.The electric signal is related to the intensity of the reflected beams, and control is then handled simultaneously the electric signal with processing circuit 13
The strength information of reflection reflected light beam intensities is calculated to form structured light patterns, finally carries out picture based on the structured light patterns
It is calculated with calculating, trigonometric calculations etc. to obtain the depth image of target object.
In some embodiments, depth measurement device 10 further includes floodlight light source module group 14, for launching outward timing
The flood beam that amplitude is modulated.Control can be synchronous to floodlight light source module group 14 and TOF imaging sensor with processing circuit 13
121 are modulated and demodulate, to realize traditional TOF measurement method to obtain the depth image of target, i.e., by flood beam
By being emitted to the mode for being received the required time to carry out depth value calculating.
In some embodiments, depth measurement device 10 can also include driving circuit, power supply, color camera, infrared phase
The devices such as machine, IMU, do not show that in figure, and function more abundant, such as 3D texture may be implemented in the combination with these devices
The functions such as modeling, infrared face recognition, SLAM.Depth measurement device 10 can be embedded in mobile phone, tablet computer, computer etc.
In electronic product.
Fig. 2 is depth measurement device schematic illustration according to a first embodiment of the present invention.In control and processing circuit 13
Control under, light emitting mould group 11 is to the structure light light beam 30 that is modulated sinusoidally of target object transmitting amplitude, in the present embodiment
Structure light light beam 30 is irregular spot structure light, i.e., the spot structure light figure formed by multiple hot spots 202 with irregular alignment
The amplitude of case light beam 201, each hot spot 202 is modulated sinusoidally in timing.Acquire the TOF imaging sensor in mould group 12
Each pixel includes at least 4 taps, is respectively used to acquire 4 optical signals respectively within the single frame period and is converted into electric signal
C1, C2, C3 and C4, the time of 4 acquisitions and interval are identical.
Control receives the strength information that electric signal C1, C2, C3 and C4 calculate structure light light beam with processing circuit 13.One
In a embodiment, strength information calculates according to the following formula:
It is understood that this calculation is similar to tradition not by the structure light light beam of amplitude modulation, i.e., single
The strength information for obtaining optical signal in the frame period by way of single tap continuous integral, is only averaged here.?
After the strength information for obtaining all pixels, so that it may form structured light patterns, finally recycle structured light patterns progress
With calculating to obtain parallax and calculate depth image according to parallaxometer.
For there are when ambient light signal, this beam intensity calculation is difficult to disappear as traditional approach
It removes, it is relatively low so as to cause final structured light patterns noise.Therefore, in one embodiment, strength information will be counted according to the following formula
It calculates:
What above- mentioned information substantially calculated is the amplitude of amplitude-modulated signal, this amplitude is calculated due to being taken out
Subtracting each other between head and square root, it is constant in very small time range can to regard environment light as, therefore subtracting each other just can be with
The noise as caused by environment light is highly desirable removed, while the amplitude has also fully reflected target object surface very much
Intensity of reflected light information corresponding to texture.It is understood that can also be by handling to obtain amplitude progress square is equal
The strength information of light beam.
The structured light patterns of above-mentioned TOF imaging sensor and sine wave modulation light emitting signal based on 4 taps obtain
Scheme can equally be well applied to the depth measurement dress of other taps TOF imaging sensor and other types modulation light emission signal
It sets.
As shown in figure 3, being depth measurement device schematic illustration according to a second embodiment of the present invention.In control and processing
Under the control of circuit 13, light emitting mould group 11 is knot by square wave or pulse modulated transmitting light beam 30 to target object transmitting amplitude
Structure light light beam, structure light light beam is irregular spot structure light in the present embodiment, i.e., by multiple hot spots 202 with irregular alignment
The spot structured light patterns light beam 201 of formation, the amplitude of each hot spot 202 is in timing by square wave or impulse modulation.Acquisition
Each pixel of TOF imaging sensor in mould group 12 includes at least 3 taps, is respectively used to adopt respectively within the single frame period
Collecting 3 optical signals and is converted into electric signal C1, C2 and C3, the triggered time of the first tap and the launch time of light pulse are synchronous,
And the of same size of duration and pulse is triggered, second and third tap is triggered in succession at the end of the first tap, triggering duration and the
One tap is identical.
The structure light light beam being reflected back as a result, will be collected by the first, second, third tap, control and processing circuit
13 reception electric signal C1, C2 and C3 calculate the strength information of structure light light beam.In one embodiment, strength information according to
Following formula calculates:
Similarly, although this numerical value that can calculate reflection structure light beam intensity in the way of average weighted,
But noise problem caused by bias light can not be eliminated as conventional method.Therefore in one embodiment, strength information
It will calculate according to the following formula:
B=C1+C2-2C3 (4)
It is understood that average equal calculating can also be taken to obtain strength information to above-mentioned.Compared with formula (3), due to
The acquisition of third tap is ambient light signal, therefore by subtracting each other the influence that can effectively eliminate environment light to promote noise
Than.
Figure 2 above, in 3 illustrated embodiments, schematically illustrate respectively transmitting terminal by sine wave or it is pulse modulated in a manner of, receive
End uses the acquisition mode of 4 taps or 3 taps.It, can be using weighting when carrying out the calculating of structured light patterns strength information
Mode average or that environment light excretion factor is added is calculated.It is understood that similar transmitting terminal modulation system, connecing
The combination of receiving end acquisition mode and strength information calculation is included within the scope of the present invention.
Compared with traditional structure light depth measurement method, transmitting terminal of the present invention uses amplitude modulation, adopts in receiving end
It is acquired with multi-tap pixel, so that this method possesses functions more more than traditional scheme, for example may be implemented to pass
The depth measurement method for the environment resistant light interference that system scheme is difficult to realize.
Depth measurement device based on the above embodiment can also realize that structure light merges depth measurement in conjunction with TOF
Scheme.Fig. 4 is the structural representation of the depth measurement device of fusion TOF according to an embodiment of the invention and structure light scheme
Figure.Depth measurement device 40 includes light emitting mould group 41, acquisition mould group 42, floodlight light source module group 44 and control and processing circuit
43.It is similar to foregoing embodiments, wherein can group with processing circuit 43 by light emitting mould group 41, acquisition mould group 42 and control
At structure light depth measurement subelement, the principle for obtaining depth image is identical as the illustrated embodiment of Fig. 1~3.In addition, depth is surveyed
TOF depth measurement is constituted by floodlight light source module group 44, acquisition mould group 42 and control and processing circuit 43 in amount device 40
Unit, similarly, the light source in floodlight light source module group 44 equally carry out amplitude with processing circuit 43 by control with certain timing
Modulation, such as, design control and processing circuit 43 for convenience, light source in floodlight light source module group 44 with
Light source in light emitting mould group 41 is modulated in an identical manner, for example the parameters such as amplitude modulation intensity, modulating waveform are all the same.
Control with processing circuit 43 also may include multiple sub-circuits correspond respectively to structure light depth measurement subelement with
And TOF depth measurement subelement.TOF depth measurement subelement controls and processing unlike structure light depth measurement subelement
Performed depth calculation principle in circuit 43, for structure light depth measurement subelement, as described in foregoing embodiments,
Control and processing circuit 43 are handled and calculate reflection reflected light beam intensities to being formed by electric signal by acquisition mould group 42
Strength information utilize the progress depth value calculating of structure light trigonometry to form structured light patterns, then based on structured light patterns；And
For TOF depth measurement subelement, control is then formed by electric signal acquisition mould group 42 with processing circuit 43
Reason is emitted to receiving end by transmitting terminal based on the phase difference calculating the reflected beams and receives flight used to calculate phase difference
Time is based further on the depth value that the flight time calculates target.What control can be a highly integrated with processing circuit 43
The chips such as circuit components, such as FPGA, SOC, ASIC, it is internal to be calculated comprising structure optical oomputing and TOF carried out respectively
Circuit module, present invention likewise provides a specific embodiments, will be described in detail in the embodiment shown in fig. 7.
Fig. 4 is returned to, in the present embodiment, structure light depth measurement subelement and TOF depth measurement subelement are used respectively
In measurement range in Δ Z1And Δ Z2Interior target, and Δ Z1≠ΔZ2.In one embodiment, Δ Z1For low coverage, Δ Z2
It for long distance, i.e., is measured by target object of the structure light depth measurement subelement to low coverage, by TOF depth measurement subelement pair
The target object of long distance measures.Due to structure light arithmetic accuracy in short distance it is higher and with distance increase can rapidly reduce
Even be unable to measure, and TOF algorithm depth resolution in close-in measurement it is lower and to possessing higher essence at a distance
Degree.Two subelements can be started simultaneously to measure, such as the form of before and after frames switching, obtain structure light depth map respectively
After picture and TOF depth image, two amplitude deepness images can be merged to obtain a wide range of, high accuracy depth figure
Picture, amalgamation mode can use the modes such as the weighted average based on confidence level.Such as in one embodiment, according to relative accuracy
Design confidence level, for structure light depth image, depth value is bigger, and confidence level is lower, and for TOF depth image and
Speech, depth value is bigger, and confidence level is higher.Beneficial effect brought by the scheme of the present embodiment is can depth measurement to be filled
The bigger measurement range of 40 realizations is set, while keeping higher measurement accuracy interior on a large scale.
Fig. 5 is that the structure of the fusion TOF and the depth measurement device of structure light scheme of another embodiment according to the present invention are shown
It is intended to.The depth measurement device equally includes structure light depth measurement subelement and TOF depth measurement subelement, it is possible to understand that
It is that TOF depth measurement subelement can be made of floodlight light source module group and acquisition mould group, can also be surveyed with structure optical depth
Quantum boxes are identical to be made of light emitting mould group and acquisition mould group, and difference is the processing of control and processing circuit to electric signal
Mode is different, and for TOF depth measurement subelement, what is calculated is phase information.In the present embodiment, default TOF is deep
Degree measurement subelement is made of floodlight light source module group and acquisition mould group, the TOF depth of the available acquisition each pixel of mould group
Value.
Since structure light depth calculation needs to carry out matching primitives, matching primitives are most consumed in entire depth calculating link
Resource is also to influence maximum link to precision.Matching primitives generally comprise the estimation of initial depth value, iteration optimization, sub-pix height
Several steps such as precision depth value calculating, wherein the estimation of initial depth value directly influences the efficiency of later step and calculates essence
Degree.In the present embodiment, using the TOF depth value as acquired in TOF depth measurement subelement as the initial of structure light depth calculation
Depth value, as shown in figure 5, the TOF imaging sensor in acquisition mould group includes multiple pixels 51, the spot that light emitting mould group is emitted
Point light beam is imaged on formation hot spot 52 in some pixels of TOF imaging sensor after target object reflects, it is to be understood that
It is assumed herein that hot spot 52 substantially accounts for 2x2=4 pixel, actually hot spot 52 can be other sizes, it is not limited here.First
The TOF depth value of each pixel 51 is obtained (for being made of light emitting mould group and acquisition mould group by TOF depth measurement subelement
TOF depth measurement subelement for, TOF depth value D1~D4 of 52 respective pixel of hot spot can only be obtained), secondly by structure
Optical depth measures the structured light patterns that subelement acquisition includes each speckle patterns, and finally carrying out will when structure light depth value calculates
Initial depth value d of the TOF depth value as matching primitives.
Since TOF depth value inherently has higher precision, in this, as the initial value of structure optical depth matching primitives,
It is iterated again and calculates the depth value estimation for realizing sub-pix, may be implemented to calculate higher precision than independent structure light or TOF
Depth calculation.
Melting to structure light depth measurement subelement and TOF depth measurement subelement is all referred in Fig. 4,5 illustrated embodiments
It closes, in the actual operation process, two subelements will be worked with certain timing, for example Fig. 6 is one according to the present invention
The structure light and TOF timing control schematic diagram of embodiment, in the present embodiment, structure light and TOF are with certain frequency error factor work
Make, i.e., depth measurement device is worked in cycle T 1, T3, T5 etc. with structure optical mode, and in cycle T 2, T4, T6 etc.
It is worked with TOF mode.It is understood that can also be controlled according to actual needs by other timing, such as right
For implementing shown in Fig. 5, it can be controlled in a manner of mono- frame of TOF, two frame of structure light.
Fig. 7 is control according to an embodiment of the invention and processing circuit configuration diagram.In order to promote meter as far as possible
It calculates efficiency and reduces power consumption, some calculating, control function are designed to special chip, such as FPGA, ASIC or SOC chip
Form be very effective mode.The present embodiment provides in a kind of achievable the various embodiments described above control or computing function it is special
With control and processing circuit chip architecture.Chip 70 is for receiving the electric signal from TOF imaging sensor, by internal each
Depth image is exported after the calculating of module, also can carry out data communication, such as memory etc. with other devices in calculating process.
Chip 70 may be implemented multiplex mode depth calculation, TOF depth calculation mode, structure light depth calculation mode and
Merge depth calculation mode.
(1) TOF depth calculation mode.
When carrying out TOF depth calculation under TOF depth calculation mode, chip 70 is received from TOF imaging sensor
The each collected value of electrical signals of tap institute of pixel in electric signal, such as Fig. 2 or embodiment illustrated in fig. 3.Electric signal will first
Into splitter 74-1, splitter 74-1 is allowed under the control of master controller (not shown) according to current mode selective
Electric signal enters next computing module, and electric signal will enter phase calculation module 71 under TOF depth calculation mode.Phase calculation
Module 71 is executed to the phase calculation of electric signal to obtain phase value, there are linear relationship between the phase value and depth value, because
This in some embodiments, which can also directly calculate depth value.Subsequent phase value is admitted to calibration mold
Block is demarcated, since TOF measurement is frequently subjected to noise jamming, so that there is a certain error between measured value and actual value,
Therefore a demarcating steps will be used before actual use, for example will be arranged in certain surveying range every a distance and demarcated
Plate, and the actual depth value of scaling board obtains respectively it is known that then gradually carrying out actual measurement to the scaling board in different distance
It is a apart from corresponding measured value, the relationship between measured value and actual value can serve as pre- calibrating parameters and be stored in memory
In, demarcating module will call pre- calibrating parameters to demarcate current measurement value in calibration from memory.Here pre- mark
Determine the table of comparisons (index) that parameter can be actual value and measured value, 72 calibration process of demarcating module is actually and looks at this time
Table process；It is also possible to model error by certain mathematical measure, and by preparatory multiple measurement to calculate
Unknown parameter into model, the calibration process of demarcating module 72 is actually based on model, measured value calculates actual value
Process.It will be admitted to the first post-processing module 73 through calibrated phase value/depth value, the first post-processing module 73 is to phase
Value/depth value progress optimizes it such as image enhancement, interpolation calculation, such as holes filling, edge optimization etc..By
One post-processing module 73 treated phase value/depth value is exported via multiplexer 74-2.
(2) structure light depth calculation mode.
When carrying out structure light depth calculation under structure light depth calculation mode, chip 70 is received to be passed from TOF image
The each collected value of electrical signals of tap institute of pixel in the electric signal of sensor, such as Fig. 2 or embodiment illustrated in fig. 3.Electric signal
Splitter 74-1 will be initially entered, splitter 74-1 is selected under the control of master controller (not shown) according to current mode
Selecting property allows electric signal to enter next computing module, and electric signal will enter magnitude determinations module under structure light depth calculation mode
75.Magnitude determinations module 75 executes the phase calculation to electric signal to obtain the strength information of reflected collimated light beam intensity, such as amplitude
Value.Subsequent amplitude is admitted to the processing such as pre-processing module 76 is denoised, contrast enhances, and can also execute figure to amplitude
The pre-treatments tasks such as image distortion correction.By the amplitude after pre-treatment subsequently enter matching module 77 carry out matching primitives, into
Matching module 77 will call the reference picture being previously stored from memory when row matching primitives, in one embodiment,
Pixel is carried out to the corresponding image of amplitude and reference picture using zero-mean normalization minimum squared distance function with module 77
The matching of deviation value is estimated.According to structure light trigonometry, there are certain relationship between pixel deviation value and the depth value of target,
Therefore in some embodiments, matching module 77 can also directly carry out the calculating of depth value, and the calculating of certain depth value can also
It is executed with being placed on other subsequent modules.Deviation value/depth value that matching module 77 exports is subsequently fed into the second post-processing module
78 optimize such as image enhancement, interpolation calculation to it, such as holes filling, edge optimization etc..After second
Treated the deviation value/depth value of module 78 is managed to export via multiplexer 74-2.
(3) depth calculation mode is merged.
When carrying out depth calculation under merging depth calculation mode, modules carry out work under above two mode
Make, and TOF depth image is exported by the first post-processing module 73, and by 78 export structure optical depth figure of the second post-processing module
Picture, TOF depth image are subsequently fed into Fusion Module 79 with structure light depth image and are merged to export final fusion depth
Image is spent, fusion depth image is exported via multiplexer 74-2.The mode specifically merged can refer to embodiment illustrated in fig. 4.
In some embodiments, after the TOF depth image exported by the first post-processing module 73, it is directly entered matching module
77, using the initial value as matching primitives, specific integration program refers to embodiment illustrated in fig. 5.
In some embodiments, phase calculation module 71 and magnitude determinations module 75 can be the same computing module, should
Module calculates phase and amplitude based on electric signal for synchronous, and phase and amplitude will be sent directly into next module and calculate, or
Person is admitted to splitter 74-1, and phase and/or amplitude are sent into corresponding module according to current mode and carried out by splitter 74-1
It calculates.
In some embodiments, above-mentioned Three models can synchronize progress, and multiplexer 74-2 can be with real-time synchronization or continuous
The depth image that output different mode is exported.
In some embodiments, chip 70 can also include such as bus, master controller, input/output interface module, than
It will include these modules if chip 70 is integrated SOC chip, splitter 74-1 receives data, multiplexing by input interface
The data of device 74-2 are exported by output interface, and input/output interface can be the interface of the forms such as USB, MIPI, DVP；Bus
It is responsible for communication, transmission inside SOC between modules and external module；Master controller is then responsible between internal modules
Resource allocation and function triggering etc. work.
Based on the depth measurement device in the various embodiments described above, the application also provides following depth measurement methods.
As shown in figure 8, a kind of distance measurement method is as follows in the application:
The light beam modulated using amplitude in light source transmitting timing, the light beam are patterned after optical element receives and are formed
Structure light light beam emits to target object；
It is reflected using the pixel reception of the TOF imaging sensor comprising at least one pixel by the target object
Structure light light beam simultaneously forms electric signal；
It receives the electric signal and calculates the strength information of the structure light light beam of the reflection to form structured light patterns,
And the depth image of the target object is calculated using the structured light patterns.
As shown in figure 9, a kind of distance measurement method is as follows in the application:
The light beam modulated using amplitude in the light source transmitting timing of light emitting mould group, the light beam are patterned optics member
Part forms structure light light beam after receiving and emits to target object；
Utilize the floodlight light source module group flood beam that amplitude is modulated in target object transmitting timing；
It is reflected using the pixel reception of the TOF imaging sensor comprising at least one pixel by the target object
Structure light light beam simultaneously forms the first electric signal；And it receives the flood beam of the target object reflection and forms the second telecommunications
Number；
The timing of the light emitting mould group and the floodlight light source module group is controlled, receives institute respectively by the timing
First electric signal that the structure light light beam of target object reflection is formed is stated, and, the institute of the target object reflection
State second electric signal of flood beam formation；Processing is carried out to first electric signal and the second electric signal respectively and obtains institute
State the depth image of target object.
As shown in Figure 10, carrying out processing to the electric signal in a kind of embodiment includes:
The strength information of the structure light light beam is calculated according to first electric signal that the structure light light beam is formed
To form structured light patterns, the first depth image of the target object is calculated using the structured light patterns；
Phase difference is calculated according to second electric signal that the flood beam is formed, and is based on the phase difference calculating
The flood beam is received the required flight time by being emitted to, and calculates the target object based on the flight time
Depth value obtains the second depth image of the target object using the depth value；
First depth image and second depth image fusion are obtained to the depth image of the target object.
As shown in figure 11, carrying out processing to the electric signal in another embodiment includes:
Phase difference is calculated according to second electric signal that the flood beam is formed, and is based on the phase difference calculating
The flood beam is received the required flight time by being emitted to, and calculates each pixel based on the flight time
TOF depth value；
The strength information of the structure light light beam is calculated according to first electric signal that the structure light light beam is formed
To form structured light patterns；
Using the TOF depth value as the initial depth value of the structured light patterns matching primitives, the structure light is utilized
Pattern calculates the depth image of the target object.
The present invention realizes all or part of the process in above-described embodiment method, can also be instructed by computer program
Relevant hardware is completed, and the computer program can be stored in a computer readable storage medium, the computer program
When being executed by processor, it can be achieved that the step of above-mentioned each embodiment of the method.Wherein, the computer program includes computer
Program code, the computer program code can be source code form, object identification code form, executable file or certain centres
Form etc..The computer-readable medium may include: can carry the computer program code any entity or device,
Recording medium, USB flash disk, mobile hard disk, magnetic disk, CD, computer storage, read-only memory (ROM, Read-Only
Memory), random access memory (RAM, Random Access Memory), electric carrier signal, telecommunication signal and software
Distribution medium etc..It should be noted that the content that the computer-readable medium includes can be according to making laws in jurisdiction
Requirement with patent practice carries out increase and decrease appropriate, such as in certain jurisdictions, according to legislation and patent practice, computer
Readable medium does not include electric carrier signal and telecommunication signal.
What the present invention reached has the beneficial effect that, provides a kind of based on the structured light end of amplitude timing modulation and TOF
The depth measurement device of imaging sensor composition, and the scheme that a variety of depth images based on the device obtain is proposed, with reality
High-precision that now current traditional scheme is difficult to realize, a wide range of depth measurement.A kind of depth calculation chip carrier is additionally provided simultaneously
Structure finally realizes the purpose that low-power consumption, high efficiency calculate to realize the program from chip-scale.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those skilled in the art to which the present invention belongs, it is not taking off
Under the premise of from present inventive concept, several equivalent substitute or obvious modifications can also be made, and performance or use is identical, all answered
When being considered as belonging to protection scope of the present invention.
Claims (10)
1. depth measurement device characterized by comprising
Light emitting mould group includes light source and patterned optical element, and the light source is for emitting the light that amplitude in timing is modulated
Beam, the patterned optical element is for receiving after the light beam to target object emitting structural light light beam；
TOF imaging sensor includes at least one pixel, and the pixel is for receiving the structure light reflected by the target object
Light beam simultaneously forms electric signal；
Control and processing circuit, receive the electric signal and calculate the strength information of the structure light light beam of the reflection to be formed
Structured light patterns, and, the depth image of the target object is calculated using the structured light patterns.
2. depth measurement device as described in claim 1, which is characterized in that the structure light light beam includes irregular spot figure
Case light beam, candy strip light beam, two-dimensional encoded patterned beam；
The amplitude of the corresponding light beam of each spot is in timing with continuous wave, square wave or arteries and veins in the irregular speckle patterns light beam
The mode of punching is modulated.
3. depth measurement device as described in claim 1, which is characterized in that the pixel includes at least three tap, the pumping
Head for acquiring the electric signal as caused by the structure light light beam reflected comprising the target object respectively within the single frame period.
4. depth measurement device as described in claim 1, which is characterized in that amplitude quilt in the light emitting mould group transmitting timing
Each pixel of the light beam of sine wave modulation, the TOF imaging sensor includes at least 4 taps, is respectively used in single frame
4 optical signals are acquired in period respectively and are converted into described electric signal C1, C2, C3 and C4, the time of 4 acquisitions and interval phase
Together；
The intensity B of the structure light light beam is calculated using average weighted mode, specific as follows:
Or, the intensity B of the structure light light beam is calculated by the way of environment light excretion factor is added, it is specific as follows:
5. depth measurement device as described in claim 1, which is characterized in that amplitude quilt in the light emitting mould group transmitting timing
Each pixel of pulse modulated light beam, the TOF imaging sensor includes at least 3 taps, is respectively used in single frame week
3 optical signals are acquired in phase respectively and are converted into electric signal C1, C2 and C3, the triggered time of the first tap and the transmitting of light pulse
Time synchronization, and trigger the of same size of duration and pulse, the second tap, third tap at the end of first tap in succession
It is triggered, triggering duration is identical as first tap；
The intensity B of the structure light light beam is calculated using average weighted mode, specific as follows:
Or, the intensity B of the structure light light beam is calculated by the way of environment light excretion factor is added, it is specific as follows:
B=C1+C2-2C3。
6. a kind of distance measurement method characterized by comprising
The light beam modulated using amplitude in light source transmitting timing, the light beam are patterned after optical element receives and form structure
Light light beam emits to target object；
The structure reflected by the target object is received using the pixel of the TOF imaging sensor comprising at least one pixel
Light light beam simultaneously forms electric signal；
It receives the electric signal and calculates the strength information of the structure light light beam of the reflection to form structured light patterns, with
And the depth image of the target object is calculated using the structured light patterns.
7. distance measurement method as claimed in claim 6, which is characterized in that the structure light light beam includes irregular spot figure
Case light beam, candy strip light beam, two-dimensional encoded patterned beam；
The amplitude of the corresponding light beam of each spot is in timing with continuous wave, square wave or arteries and veins in the irregular speckle patterns light beam
The mode of punching is modulated.
8. distance measurement method as claimed in claim 6, which is characterized in that the pixel includes at least three tap, the pumping
Head for acquiring the electric signal as caused by the structure light light beam reflected comprising the target object respectively within the single frame period.
9. distance measurement method as claimed in claim 6, which is characterized in that the structure light light beam be in timing amplitude by just
The light beam of string wave modulation, each pixel include at least 4 taps, are respectively used to acquire respectively 4 times within the single frame period
Optical signal is simultaneously converted into described electric signal C1, C2, C3 and C4, and the time of 4 acquisitions and interval are identical；
The intensity B of the structure light light beam is calculated using average weighted mode, specific as follows:
Or, the intensity B of the structure light light beam is calculated by the way of environment light excretion factor is added, it is specific as follows:
10. distance measurement method as claimed in claim 6, which is characterized in that the structure light light beam is amplitude quilt in timing
Pulse modulated light beam, each pixel include at least 3 taps, are respectively used to acquire respectively 3 times within the single frame period
Optical signal is simultaneously converted into electric signal C1, C2 and C3, and the triggered time of the first tap and the launch time of light pulse are synchronous, and triggers
Duration and pulse it is of same size, the second tap, third tap are triggered in succession at the end of first tap, trigger duration
It is identical as first tap；
The intensity B of the structure light light beam is calculated using average weighted mode, specific as follows:
Or, the intensity B of the structure light light beam is calculated by the way of environment light excretion factor is added, it is specific as follows:
B=C1+C2-2C3。
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