CN111025317A - Adjustable depth measuring device and measuring method - Google Patents
Adjustable depth measuring device and measuring method Download PDFInfo
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- CN111025317A CN111025317A CN201911384703.8A CN201911384703A CN111025317A CN 111025317 A CN111025317 A CN 111025317A CN 201911384703 A CN201911384703 A CN 201911384703A CN 111025317 A CN111025317 A CN 111025317A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
- G01S17/32—Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated
- G01S17/36—Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated with phase comparison between the received signal and the contemporaneously transmitted signal
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
- G01S7/4815—Constructional features, e.g. arrangements of optical elements of transmitters alone using multiple transmitters
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4816—Constructional features, e.g. arrangements of optical elements of receivers alone
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- Computer Networks & Wireless Communication (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Electromagnetism (AREA)
- Measurement Of Optical Distance (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention discloses an adjustable depth measuring device, which comprises a transmitting unit, a receiving unit and a control and processing circuit, wherein the transmitting unit is used for transmitting a depth signal to the receiving unit; the emission unit comprises a light source array and a zoom projection lens; the light source array comprises at least two sub-light source arrays for emitting the speckle pattern light beam; the zoom projection lens receives the light beam and projects the light beam to a target area, and the focal length of the zoom projection lens is changed to change the field angle of the light beam projected by the light source; the receiving unit comprises a TOF image sensor and a zoom imaging lens; the zoom imaging lens projects the reflected light beam into the TOF image sensor to be collected by the sensor to form an electric signal, and the focal length of the zoom imaging lens is changed to change the field angle of the TOF image sensor for collecting the reflected light beam; the control and processing circuit calculates a depth image of the target area according to the electrical signal. The invention has more flexible and changeable depth of field by adjusting the focal length, thereby realizing depth measurement in a wider range and improving the precision of distance measurement.
Description
Technical Field
The invention relates to the technical field of optical measurement, in particular to an adjustable depth measuring device and a measuring method.
Background
The depth measuring device can be used for obtaining a depth image of an object, further can be used for 3D modeling, skeleton extraction, face recognition and the like, and has very wide application in the fields of 3D measurement, human-computer interaction and the like. The current depth measurement technologies mainly include a TOF ranging technology, a structured light ranging technology, a binocular ranging technology and the like.
TOF is called Time-of-Flight, i.e., Time-of-Flight, and TOF ranging technology is a technology for realizing accurate ranging by measuring the round-trip Time of Flight of an optical pulse between a transmitting/receiving device and a target object, and is classified into direct ranging technology and indirect ranging technology. The direct ranging technique is to obtain the target object distance by continuously sending light pulses to the target object, then receiving the light signals reflected from the object by using a sensor, and detecting the flight (round trip) time of the sent and reflected light pulses; the indirect ranging technique is to emit a time-sequence amplitude-modulated light beam to a target object, measure the phase delay of the reflected light beam relative to the emitted light beam, and calculate the flight time according to the phase delay. According to the modulation and demodulation type, the modulation and demodulation method can be divided into a Continuous Wave (CW) modulation and demodulation method and a Pulse Modulated (PM) modulation and demodulation method.
The structured light ranging technology projects a structured light beam to a target area, collects the reflected structured light beam to form a structured light pattern, and finally calculates a depth image of a target object by using a trigonometry method and the like. Commonly used structured light patterns are irregular speckle patterns, fringe patterns, phase shift patterns, etc. The structured light technology has the characteristics of high resolution, high precision, low power consumption and the like.
In the depth measuring device, due to the numerous application scenarios, the measuring range and the measuring accuracy of the depth measuring device are very high, but the measuring range of the depth measuring device is limited due to the influence of the internal structure, and the measuring accuracy is also influenced at different measuring ranges.
The above background disclosure is only for the purpose of assisting understanding of the inventive concept and technical solutions of the present invention, and does not necessarily belong to the prior art of the present patent application, and should not be used for evaluating the novelty and inventive step of the present application in the case that there is no clear evidence that the above content is disclosed at the filing date of the present patent application.
Disclosure of Invention
The present invention is directed to an adjustable depth measuring device and a measuring method thereof, which are used to solve at least one of the above problems.
In order to achieve the above purpose, the technical solution of the embodiment of the present invention is realized as follows:
an adjustable depth measuring device comprises a transmitting unit, a receiving unit and a control and processing circuit; wherein the emission unit comprises a light source array and a zoom projection lens; the light source array comprises at least two sub light source arrays, each sub light source array is used for emitting a spot pattern light beam; the zoom projection lens is configured to receive the light beam and project the light beam to a target area, and the field angle of the light source projected light beam is changed by changing the focal length of the zoom projection lens; the receiving unit comprises a TOF image sensor and a zoom imaging lens; the TOF image sensor is configured to acquire at least a portion of the light beam reflected back from the target region and form an electrical signal; the zoom imaging lens is configured to project the reflected light beam into the TOF image sensor, and the angle of field of collection of the reflected light beam by the TOF image sensor is changed by changing the focal length of the zoom imaging lens; the control and processing circuit is connected with the transmitting unit and the receiving unit and calculates the depth image of the target area according to the electric signals.
In some embodiments, the control and processing circuit controls the driver to adjust the focal lengths of the zoom projection lens and the zoom imaging lens.
In some embodiments, the control and processing circuitry stores constraints on the relationship between the focal lengths of the zoom projection lens and the zoom imaging lens, and the control and processing circuitry controls the adjustment of the focal lengths of the zoom projection lens and the zoom imaging lens according to the constraints.
In some embodiments, the zoom projection lens is configured to have a first projection focal length and a second projection focal length, the first projection focal length being less than the second projection focal length, a first projection field angle at which the light beam is projected through the zoom projection lens to a target area being greater than a second projection field angle; the zoom imaging lens is configured to have a first imaging focal length and a second imaging focal length, the first imaging focal length is smaller than the second imaging focal length, and a first imaging field angle at which the TOF image sensor collects a reflected light beam through the zoom imaging lens is larger than a second imaging field angle.
In some embodiments, the first array of sub-sources projects a beam toward a target area, the zoom projection lens and the zoom imaging lens are configured to have a second projection focal length and a second imaging focal length, project the beam within the second projection field of view and collect a reflected beam within the second imaging field of view; the second array of sub-sources projects a beam toward a target area, the zoom projection lens and the zoom imaging lens are configured to have a first projection focal length and a first imaging focal length, project the beam at the first projection field angle and collect a reflected beam at the first imaging field angle.
In some embodiments, the number of light sources in each of the sub-light source arrays is unequal and can be controlled individually; the plurality of light sources in the sub light source array are irregularly arranged.
In some embodiments, the TOF image sensor comprises at least one pixel; wherein each of the pixels includes at least two taps for sequentially collecting the reflected light beams in an order within a single frame period and generating an electrical signal.
In some embodiments, the control and processing circuit receives the electrical signal for processing, calculates intensity information of the reflected light beam and generates a structured light image, and calculates a depth image of the target area based on the structured light image; or the control and processing circuit receives the electric signal for processing, calculates the phase difference from the emission of the light beam to the reception of the reflection, and further calculates the depth image of the target area based on the phase difference.
The other technical scheme of the invention is as follows:
a depth measurement method comprising the steps of:
controlling the emission unit to project a light beam to a target area; wherein the emission unit comprises a light source array and a zoom projection lens; the light source array comprises at least two sub light source arrays, each sub light source array is used for emitting a spot pattern light beam, the zoom projection lens is configured to receive the light beams and project the light beams to a target area, and the field angle of the light source projection light beams is changed by changing the focal length of the zoom projection lens;
the control receiving unit collects at least part of light beams reflected by the target area and forms an electric signal; wherein the receiving unit comprises a TOF image sensor and a zoom imaging lens; the TOF image sensor is configured to acquire at least a portion of the light beam reflected back from the target region and form an electrical signal; the zoom imaging lens is configured to project a reflected light beam into the TOF image sensor, and the angle of field of collection of the reflected light beam by the TOF image sensor is changed by changing the focal length of the zoom imaging lens;
and the control and processing circuit receives the electric signal, calculates a depth image of the target area according to the electric signal and completes depth measurement.
In some embodiments, the zoom projection lens is configured to have a first projection focal length and a second projection focal length, the first projection focal length being less than the second projection focal length, a first projection field angle at which the light beam is projected through the zoom projection lens to a target area being greater than a second projection field angle; the zoom imaging lens is configured to have a first imaging focal length and a second imaging focal length, the first imaging focal length being less than the second imaging focal length, a first imaging field angle at which reflected light beams are collected through the zoom imaging lens being greater than a second imaging field angle.
The technical scheme of the invention has the beneficial effects that:
the adjustable depth measuring device provided by the invention has the advantages that the depth measuring device has more flexible and changeable depth of field by adjusting the focal length, so that the depth measurement in a wider range is realized, and the precision of different distance measuring ranges is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of an adjustable depth measurement device according to one embodiment of the present invention.
Fig. 2a, 2b are schematic views of an array of light sources of an adjustable depth-measuring device according to one embodiment of the present invention.
FIG. 3 is a schematic diagram of an adjustable depth measurement device according to one embodiment of the present invention.
FIG. 4 is a flowchart illustration of a depth measurement method according to another embodiment of the invention.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the embodiments of the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. The connection may be for fixation or for circuit connection.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the embodiments of the present invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be in any way limiting of the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to FIG. 1, FIG. 1 is a schematic view of an adjustable depth measurement device according to one embodiment of the present invention. The depth measuring device 10 includes a transmitting unit 11, a receiving unit 12 and a control and processing circuit 13, wherein the transmitting unit 11 is used for transmitting a light beam 30 to a target area 20, the light beam is transmitted to the target area 20 to illuminate a target object 20 in the space, at least part of the transmitted light beam 30 is reflected by the target area 20 to form a reflected light beam 40, at least part of the reflected light beam 40 is received by the receiving unit 12, the control and processing circuit 13 is respectively connected with the transmitting unit 11 and the receiving unit 12 to control the transmission and the reception of the light beam, and simultaneously receives information generated by receiving the reflected light beam from the receiving unit 12 and calculates the information to obtain the depth information of the target object.
The light emitting unit 11 includes a light source 111, an optical element 112, a zoom projection lens 113, a light source driver (not shown in the figure), and the like. The light source 111 may be a Light Emitting Diode (LED), an Edge Emitting Laser (EEL), a Vertical Cavity Surface Emitting Laser (VCSEL), or the like, or may be a light source array composed of a plurality of light sources for emitting a spot-like light beam toward a target area. The arrangement of the light sources 111 may be regular or irregular, and the light beams emitted by the light sources 111 may be visible light, infrared light, ultraviolet light, and the like. The light source 111 emits a light beam outward under the control of a light source driver (which may be further controlled by the control and processing circuit 13), such as in one embodiment, the light source 111 emits a light beam amplitude-modulated in time sequence under the control of the control and processing circuit 13, which may be a pulse-modulated light beam, a square-wave modulated light beam, or a sine-wave modulated light beam. It will be appreciated that the light source 111 may be controlled to emit the associated light beam by means of a part of the control and processing circuitry 13 or independently of the sub-circuitry present in the control and processing circuitry 13, such as a pulse signal generator.
The optical element 112 receives the light beam from the light source 111, shapes the light beam, and projects the light beam to a target area. For example, in one embodiment, the optical element 112 receives the pulsed light beam from the light source 111 and optically modulates, such as diffracting, refracting, reflecting, etc., the pulsed light beam, and then emits the modulated light beam, such as a focused light beam, a flood light beam, a spot pattern light beam, etc., into space. The optical elements 112 may be in the form of one or more combinations of lenses, liquid crystal elements, diffractive optical elements, microlens arrays, super surface (Meta-surface) optical elements, masks, mirrors, MEMS mirrors, and the like. In one embodiment of the present invention, the spot pattern beam emitted by the irregularly arranged light source array projects a flood beam or spot pattern beam through the optical element 112 toward the target area.
The zoom projection lens 113 is configured to receive a light beam emitted from the light source and project the light beam to a target area, and a field angle of the light beam projected from the light source is changed by changing a focal length of the zoom projection lens 113. The zoom projection lens may be continuously variable or may have multiple adjustable focal lengths, for example, in some embodiments, a zoom lens having at least two adjustable focal lengths. In some embodiments, the zoom projection lens may be a zoom function achieved by changing the focus of the lens via an actuator. In other embodiments, the variable focus projection lens may be a liquid lens, with the variable focus being achieved by changing the shape of the liquid.
The receiving unit 12 includes a TOF image sensor 121, a filter 122, and a zoom imaging lens 123, the zoom imaging lens 123 receives and images at least part of the light beam reflected back by the target object on at least part of the TOF image sensor 121, and the filter 122 is provided as a narrow band filter matched with the wavelength of the light source for suppressing background light noise of the remaining wavelength bands. The TOF image sensor 121 may be a Charge Coupled Device (CCD), Complementary Metal Oxide Semiconductor (CMOS), Avalanche Diode (AD), Single Photon Avalanche Diode (SPAD), etc. image sensor with an array size representing the resolution of the depth camera, e.g., 320 × 240, etc. Generally, a readout circuit (not shown in the figure) composed of one or more of a signal amplifier, a time-to-digital converter (TDC), an analog-to-digital converter (ADC), and the like is also included in connection with the TOF image sensor 121.
Likewise, the zoom imaging lens 123 may be continuously variable-focus or may have multiple adjustable focal lengths, for example, in some embodiments, a zoom lens having at least two adjustable focal lengths. In some embodiments, the zoom imaging lens may be a zoom function achieved by changing the focus of the lens by an actuator. In other embodiments, the zoom imaging lens may be a liquid lens, with zooming being achieved by changing the shape of the liquid.
In general, the TOF image sensor 121 includes at least one pixel, and each pixel of the TOF image sensor 121 includes two or more taps (taps for storing and reading or discharging charge signals generated by incident photons under control of corresponding electrodes) in comparison with a conventional image sensor for photographing only, and the taps are sequentially switched in a certain order within a single frame period (or a single exposure time) to collect corresponding photons to receive and convert the light signals into electrical signals.
The control and processing circuit 13 may be a separate dedicated circuit, such as a dedicated SOC chip, an FPGA chip, an ASIC chip, etc. including a CPU, a memory, a bus, etc., or may include a general-purpose processing circuit, such as when the depth camera is integrated into an intelligent terminal, such as a mobile phone, a television, a computer, etc., and the processing circuit in the terminal may be at least a part of the control and processing circuit 13.
The control and processing circuit 13 synchronizes the modulation and demodulation of the transmitting unit 11 and the receiving unit 12, and provides a modulation signal (transmission signal) required when the light source 111 emits laser light, and the light source emits a light beam whose amplitude is modulated in time sequence to the target object under the control of the modulation signal, for example, in some embodiments, the modulation signal is a sine wave signal, a square wave signal or a pulse signal, and the light source is amplitude-modulated in time sequence under the modulation of the modulation signal to generate a sine wave signal, a square wave signal or a pulse signal to be emitted. The control and processing circuit 13 also provides a demodulation signal (acquisition signal) for each tap in each pixel in the TOF image sensor 121, each tap acquiring the reflected beam and generating an electrical signal under the control of the demodulation signal.
In some embodiments, the control and processing circuit 13 receives the electrical signal and processes the electrical signal to calculate the intensity information of the reflected light beam, preferably, the intensity information of the light beam may be calculated by means of weighted average, a structured light image is generated according to the intensity information, and a depth image of the target area is obtained based on the structured light image by calculation using a matching algorithm, trigonometric calculation, and the like.
In some embodiments, the control and processing circuitry 13 receives the electrical signals for processing and calculates the phase difference between the light beam from being emitted to being reflected back to being received, and calculates the time required for the light beam from being emitted to being reflected back to being received based on the phase difference to calculate the depth image of the target area.
In some embodiments, the depth measuring device 10 may further include a driving circuit, a power supply, a color camera, an infrared camera, an IMU, and so on, which are not shown in the drawings, and the combination with these devices may realize more abundant functions, such as 3D texture modeling, infrared face recognition, SLAM, and so on. The depth measurement device 10 may be embedded in an electronic product such as a cell phone, a tablet computer, a computer, or the like.
Fig. 2a and 2b are schematic structural diagrams of a light source array of an adjustable depth measuring device according to an embodiment of the present invention. The light source array 111 is composed of a plurality of sub light sources disposed on a single substrate (or a multi-substrate), and the sub light sources are arranged in a pattern on the substrate. The substrate may be a semiconductor substrate, a metal substrate, etc., and the sub-light sources may be light emitting diodes, edge emitting laser emitters, vertical cavity surface laser emitters (VCSELs), etc., and preferably, the light source array 111 is an array VCSEL chip composed of a plurality of VCSEL sub-light sources arranged in an irregular pattern on the semiconductor substrate. The sub-light sources are used to emit light beams of any desired wavelength, such as visible light, infrared light, ultraviolet light, and the like. The light source array 111 emits light under modulation driving of a driving circuit (which may be a part of the processing circuit 13), such as continuous wave modulation, pulse modulation, and the like, and the light source array 111 may also emit light in groups or as a whole under control of the driving circuit.
In one embodiment, as shown in fig. 2a, the light source array 111 comprises a first sub-light source array 201 (indicated by a circle with an empty outline in fig. 2 a), a second sub-light source array 202 (indicated by a shaded circle in fig. 2 a), and the like. The first sub light source array 201 is concentrated at an intermediate position of the light source array 111 and is less in number than the second sub light source array 202, and the first and second sub light source arrays emit the first spot pattern light beam and the second spot pattern light beam toward the target area under the control of the first and second driving circuits, respectively.
In another embodiment, as shown in fig. 2b, the light source array 111 comprises a first sub-light source array 203 (indicated by an open circle in fig. 2 b), another sub-light source array 204 (indicated by a shaded circle in fig. 2 a), and so on. The first sub light source array 203 is concentrated at the middle position of the light source array 111 and is smaller in number, and emits the first spot pattern light beam toward the target area under the control of the first drive circuit. The second driving circuit controls the first sub light source array 203 and the other sub light source array 204 to jointly emit light to form a second sub light source array so as to emit a second spot pattern light beam to the target area.
It is understood that the light source array 111 may also include a third sub light source array, a fourth sub light source array, and the like, which are not particularly limited in the embodiment of the present invention. The configuration mode of grouping or jointly emitting light by the plurality of sub light source arrays can realize emission light beams with different densities, and the higher the density is, the more suitable the emission light beams are for remote measurement, so that a measurement range consisting of a plurality of different measurement intervals can be realized.
FIG. 3 is a schematic diagram of a depth measurement device according to one embodiment of the present invention. The depth measuring device comprises a driver which drives the focal lengths of the zoom projection lens and the zoom imaging lens to be adjusted under the control of the control and processing circuit.
The light beam emitted from the light source array 111 passes through the zoom projection lens 113 and is projected into a target area, and the field angle of the projection light beam can be adjusted by adjusting the focal length of the zoom projection lens. The zoom projection lens 113 is configured to have at least two adjustable focal lengths. When the focal point of the zoom projection lens 113 is located at the first projection position, the first projection focal length is provided, and the emission light beam is projected into the target area 20 with the first projection field angle 301; when the focal point of the zoom projection lens is at the second projection position, the second projection focal length is provided, and the emission light beam is projected into the target area 20 with the second projection field angle 303; as the focal length of the zoom projection lens increases, the angle of field at which the emitted light beam is projected into the target area decreases.
The TOF image sensor collects at least part of the light beams reflected back by the target area and forms electric signals, the zoom imaging lens projects the reflected light beams into pixels of the TOF image sensor, and the angle of field of collection of the reflected light beams by the TOF image sensor is changed by changing the focal length of the zoom imaging lens. The zoom imaging lens 122 may be a zoom lens having at least two adjustable focal lengths, and has a first imaging focal length when the focal point of the zoom lens is located at the first imaging position, and the TOF image sensor collects the partial light beam reflected by the target region 20 within the first imaging field angle 302; when the focal point of the zoom imaging lens is at the second imaging position, having a second imaging focal length, the TOF image sensor now captures a portion of the light beam reflected by the target region 20 within the second imaging field angle 304. As the focal length of the zoom lens increases, the field angle at which the TOF image sensor collects the reflected light beam within the target area decreases.
In general, when depth measurements are taken, the focal lengths of the transmitting unit and the receiving unit should comply with a certain constraint relationship, also referred to as constraint condition, in which it is ensured that the light beam projected to the target area by the transmitting unit is finally able to achieve high quality imaging in the receiving unit. In some embodiments, the focal lengths of the transmitting unit and the receiving unit may be set to remain equal throughout zooming. That is, the first projection focal length is equal to the first imaging focal length when the first projection field of view substantially coincides with the area of the first imaging field of view; the second projection focal length is equal to the second imaging focal length when the second projection field of view substantially coincides with the area of the second imaging field of view. Of course, other constraints are possible. In one embodiment, these constraint relationships are stored in the control and processing circuitry, and need to be invoked when the control and processing circuitry sends an adjustment instruction to the driver, and the constraint relationships are converted into corresponding control instructions to control the adjustment of the focal length.
In some embodiments, adjusting the light source array to emit light in groups or as a whole, in combination with the focal length adjustment of the zoom lens, may enable higher precision imaging when corresponding to target objects at different distances. For example, when the target object is closer to the depth measuring device, the first driving circuit drives the first sub light source array to project the light beam towards the target area, and at this time, the zoom projection lens is adjusted to be located at the second projection position, and the second projection angle of view for controlling the light beam to project to the target area is smaller. At the moment, the projected light beams can be more concentrated when fewer light sources are used, the power consumption is reduced, the measurement resolution is improved, and the measurement precision is ensured. Correspondingly, the zoom imaging lens is adjusted to be located at the second imaging position, and the reflected light beam is collected in a second imaging view angle corresponding to the second projection view angle. At the moment, the light beams of all the projected light beams after being reflected by the target area can be received by the sensor, and the influence of ambient light can be effectively reduced.
Similarly, when the target object is far away from the depth measuring device, the second driving circuit drives the second sub light source array to project the light beam towards the target area, the zoom projection lens is adjusted to be located at the first projection position, and the first field angle of the light beam projected to the target area is controlled to be larger. When the target is far away, the intensity of the reflected light is reduced, which may cause that the sensor cannot receive effective light beams to form electric signals, and after the dense spot light beams are projected to the target area, the intensity of the projected light beams in the first view angle is high, which may improve the light intensity of the reflected light beams. Correspondingly, the zoom imaging lens is adjusted to be located at the first imaging position, and the reflected light beam is collected in the first imaging angle of view corresponding to the first projection angle of view.
The adjustable depth measuring device provided by the invention has the advantages that the depth measuring device has more flexible and changeable depth of field by adjusting the focal length, so that the depth measurement in a wider range is realized. On the other hand, the power consumption of the device can be effectively reduced by combining the regional work mode of the light source array, and the precision of different ranging ranges is improved.
Referring to fig. 4, fig. 4 is a flowchart illustrating a depth measurement method according to another embodiment of the present invention, where the depth measurement method includes:
s41, controlling the emission unit to project a light beam to the target area; wherein the emission unit comprises a light source array and a zoom projection lens; the light source array comprises at least two sub light source arrays, each sub light source array is used for emitting a spot pattern light beam, the zoom projection lens is configured to receive the light beams and project the light beams to a target area, and the field angle of the light source projection light beams is changed by changing the focal length of the zoom projection lens.
S42, controlling the receiving unit to collect at least part of the light beams reflected by the target area and forming an electric signal; the receiving unit comprises a TOF image sensor and a zoom imaging lens, the TOF image sensor is configured to collect at least part of light beams reflected back by the target area and form electric signals, the zoom imaging lens is configured to project reflected light beams into the TOF image sensor, and the angle of field of the reflected light beams collected by the TOF image sensor is changed by changing the focal length of the zoom imaging lens.
And S43, the control and processing circuit receives the electric signal, and the depth image of the target area is calculated according to the electric signal to finish depth measurement.
Specifically, the light beams emitted by the light source array pass through the zoom projection lens and are projected into the target area, and the field angle of the projection light beams is adjusted by adjusting the focal length of the zoom projection lens. The zoom projection lens is configured to have at least two adjustable focal lengths, or the zoom projection lens may be continuously variable-focal. When the focus of the zoom projection lens is positioned at a first projection position, the zoom projection lens has a first projection focal length, and the emission light beam is projected to a target area at the moment and has a first projection visual field angle; when the focus of the zoom projection lens is positioned at a second projection position, the zoom projection lens has a second projection focal length, and the emission light beam is projected to a target area at the moment and has a second projection visual field angle; as the focal length of the zoom projection lens increases, the angle of field at which the emitted light beam is projected into the target area decreases.
Specifically, the TOF image sensor collects at least part of light beams reflected back by the target area and forms an electric signal, the zoom imaging lens projects the reflected light beams into pixels of the TOF image sensor, and the angle of field of collection of the reflected light beams by the TOF image sensor is changed by changing the focal length of the zoom imaging lens. In some embodiments, the zoom imaging lens is configured as a zoom lens having at least two adjustable focal lengths, or the zoom projection lens may be continuously variable-focus. When the focus of the zoom lens is positioned at the first imaging position, the focus has a first imaging focal length, and the TOF image sensor collects partial light beams reflected by the target area in a first imaging field angle; when the focal point of the zoom imaging lens is located at the second imaging position, the TOF image sensor collects the partial light beam reflected by the target area within the second imaging field angle. As the focal length of the zoom lens increases, the field angle at which the TOF image sensor collects the reflected light beam within the target area decreases.
In some embodiments, the focal lengths of the transmitting unit and the receiving unit may be set to remain equal throughout zooming. That is, the first projection focal length is equal to the first imaging focal length when the first projection field of view substantially coincides with the area of the first imaging field of view; the second projection focal length is equal to the second imaging focal length when the second projection field of view substantially coincides with the area of the second imaging field of view.
According to the depth measurement method, the depth measurement device has more flexible and changeable depth of field by adjusting the focal length, so that depth measurement in a wider range is realized. On the other hand, the power consumption of the device can be effectively reduced by combining the regional work mode of the light source array, and the precision of different ranging ranges is improved.
It is to be understood that the foregoing is a more detailed description of the invention, and that specific embodiments are not to be considered as limiting the invention. It will be apparent to those skilled in the art that various substitutions and modifications can be made to the described embodiments without departing from the spirit of the invention, and these substitutions and modifications should be considered to fall within the scope of the invention. In the description herein, references to the description of the term "one embodiment," "some embodiments," "preferred embodiments," "an example," "a specific example," or "some examples" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention.
In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction. Although embodiments of the present invention and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the scope of the invention as defined by the appended claims.
Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. One of ordinary skill in the art will readily appreciate that the above-disclosed, presently existing or later to be developed, processes, machines, manufacture, compositions of matter, means, methods, or steps, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.
Claims (10)
1. An adjustable depth measuring device is characterized by comprising a transmitting unit, a receiving unit and a control and processing circuit; wherein the content of the first and second substances,
the emitting unit comprises a light source array and a zoom projection lens; the light source array comprises at least two sub light source arrays, each sub light source array is used for emitting a spot pattern light beam; the zoom projection lens is configured to receive the light beam and project the light beam to a target area, and the field angle of the light source projected light beam is changed by changing the focal length of the zoom projection lens;
the receiving unit comprises a TOF image sensor and a zoom imaging lens; the TOF image sensor is configured to acquire at least a portion of the light beam reflected back from the target region and form an electrical signal; the zoom imaging lens is configured to project the reflected light beam into the TOF image sensor, and the angle of field of collection of the reflected light beam by the TOF image sensor is changed by changing the focal length of the zoom imaging lens;
the control and processing circuit is connected with the transmitting unit and the receiving unit and calculates the depth image of the target area according to the electric signals.
2. The adjustable depth measurement apparatus of claim 1, wherein: the control and processing circuit controls the driver to adjust the focal lengths of the zoom projection lens and the zoom imaging lens.
3. An adjustable depth measurement apparatus as claimed in claim 2, wherein: the control and processing circuit stores constraint conditions of the relationship between the focal length of the zoom projection lens and the focal length of the zoom imaging lens, and controls the adjustment of the focal lengths of the zoom projection lens and the zoom imaging lens according to the constraint conditions.
4. The adjustable depth measurement apparatus of claim 1, wherein: the zoom projection lens is configured to have a first projection focal length and a second projection focal length, the first projection focal length being smaller than the second projection focal length, a first projection field angle at which the light beam is projected through the zoom projection lens to the target area being larger than a second projection field angle;
the zoom imaging lens is configured to have a first imaging focal length and a second imaging focal length, the first imaging focal length is smaller than the second imaging focal length, and a first imaging field angle at which the TOF image sensor collects a reflected light beam through the zoom imaging lens is larger than a second imaging field angle.
5. An adjustable depth measurement apparatus as claimed in claim 4, wherein: while the first array of sub-light sources projects light beams toward the target area, the zoom projection lens and the zoom imaging lens are configured to have a second projection focal length and a second imaging focal length, project light beams within the second projection field of view and collect reflected light beams within the second imaging field of view;
the second array of sub-sources projects a beam toward a target area, the zoom projection lens and the zoom imaging lens are configured to have a first projection focal length and a first imaging focal length, project the beam at the first projection field angle and collect a reflected beam at the first imaging field angle.
6. The adjustable depth measurement apparatus of claim 1, wherein: the number of light sources in each sub light source array is unequal and can be controlled independently; the plurality of light sources in the sub light source array are irregularly arranged.
7. The adjustable depth measurement apparatus of claim 1, wherein: the TOF image sensor comprises at least one pixel; wherein each of the pixels includes at least two taps for sequentially collecting the reflected light beams in an order within a single frame period and generating an electrical signal.
8. The adjustable depth measurement apparatus of claim 7, wherein: the control and processing circuit receives and processes the electric signal, calculates intensity information of a reflected light beam, generates a structured light image, and calculates a depth image of the target area based on the structured light image; or the control and processing circuit receives the electric signal for processing, calculates the phase difference from the emission of the light beam to the reception of the reflection, and further calculates the depth image of the target area based on the phase difference.
9. A depth measurement method, comprising the steps of:
controlling the emission unit to project a light beam to a target area; wherein the emission unit comprises a light source array and a zoom projection lens; the light source array comprises at least two sub light source arrays, each sub light source array is used for emitting a spot pattern light beam, the zoom projection lens is configured to receive the light beams and project the light beams to a target area, and the field angle of the light source projection light beams is changed by changing the focal length of the zoom projection lens;
the control receiving unit collects at least part of light beams reflected by the target area and forms an electric signal; wherein the receiving unit comprises a TOF image sensor and a zoom imaging lens; the TOF image sensor is configured to acquire at least a portion of the light beam reflected back from the target region and form an electrical signal; the zoom imaging lens is configured to project a reflected light beam into the TOF image sensor, and the angle of field of collection of the reflected light beam by the TOF image sensor is changed by changing the focal length of the zoom imaging lens;
and the control and processing circuit receives the electric signal, calculates a depth image of the target area according to the electric signal and completes depth measurement.
10. The depth measurement method of claim 9, wherein: the zoom projection lens is configured to have a first projection focal length and a second projection focal length, the first projection focal length being smaller than the second projection focal length, a first projection field angle at which the light beam is projected to a target area through the zoom projection lens being larger than a second projection field angle;
the zoom imaging lens is configured to have a first imaging focal length and a second imaging focal length, the first imaging focal length is smaller than the second imaging focal length, and a first imaging field angle at which the TOF image sensor collects a reflected light beam through the zoom imaging lens is larger than a second imaging field angle.
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| CN201911384703.8A CN111025317B (en) | 2019-12-28 | 2019-12-28 | Adjustable depth measuring device and measuring method |
| PCT/CN2020/077865 WO2021128587A1 (en) | 2019-12-28 | 2020-03-04 | Adjustable depth measuring device and measuring method |
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| CN111025317B (en) | 2022-04-26 |
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