CN111189617A - MEMS micro-galvanometer monitoring device and method based on optical super-surface - Google Patents
MEMS micro-galvanometer monitoring device and method based on optical super-surface Download PDFInfo
- Publication number
- CN111189617A CN111189617A CN202010106616.2A CN202010106616A CN111189617A CN 111189617 A CN111189617 A CN 111189617A CN 202010106616 A CN202010106616 A CN 202010106616A CN 111189617 A CN111189617 A CN 111189617A
- Authority
- CN
- China
- Prior art keywords
- mems micro
- optical signal
- optical
- galvanometer
- beam sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/005—Testing of reflective surfaces, e.g. mirrors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0207—Details of measuring devices
- G01M11/0214—Details of devices holding the object to be tested
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/497—Means for monitoring or calibrating
- G01S7/4972—Alignment of sensor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
The invention provides an MEMS micro-galvanometer monitoring device and method based on an optical super-surface, wherein the device comprises the following components: the light source is used for emitting a light signal; the MEMS micro-vibration mirror is used for projecting the optical signal projected to the MEMS micro-vibration mirror to a measured object in a measured space, and a first optical signal reflected by the measured object is fed back to the light beam sensor; the MEMS micro-vibration mirror is provided with an optical super-surface and is used for feeding back a second optical signal reflected by the optical signal projected to the optical super-surface to the beam sensor; the light beam sensor is used for receiving the first light signal and the second light signal; the processor is used for extracting the first optical signal received by the light beam sensor to calculate first depth information; extracting a second optical signal received by the light beam sensor to calculate second depth information and calibrating the first depth information according to the second depth information; and monitoring the position and the working state of the MEMS micro-vibrating mirror according to the time sequence and the rule of the second optical signal. The safety of the MEMS micro-vibrating mirror and the integrity of signals are improved.
Description
Technical Field
The invention relates to the technical field of MEMS micro-vibration mirror monitoring, in particular to an MEMS micro-vibration mirror monitoring device and method based on an optical super surface.
Background
Micro-Electro-Mechanical systems (MEMS) are the integration of microcircuits and micromachines on a chip according to functional requirements, typically in the millimeter or micrometer range. The MEMS device can be used in the field of rapid optical scanning, and has wide application in the fields of projection display, bar code scanning, laser printers, medical imaging, optical communication and the like. In recent years, the MEMS micro-vibration mirror helps the laser radar to get rid of heavy mechanical motion devices such as motors and polygon mirrors, the size of the laser radar is greatly reduced by the micro-vibration mirror with millimeter-scale size, and the MEMS micro-vibration mirror has obvious advantages no matter from the angles of attractiveness, vehicle-mounted integration or cost.
The MEMS micro-vibrating mirror is mainly used for reflecting light beams emitted by a laser, and rapidly and uniformly projecting the light beams in a measured space to complete the full coverage of surface light signals of a measured object. However, when the MEMS micro-mirror is broken due to mechanical or mechanical failure, the MEMS micro-mirror stops working, the scanning range is lost, and the beam emitted from the laser is continuously focused on a point, which may cause personal injury and signal loss.
The prior art lacks a method for detecting whether the MEMS micro-vibrating mirror has faults or not.
The above background disclosure is only for the purpose of assisting understanding of the concept and technical solution of the present invention and does not necessarily belong to the prior art of the present patent application, and should not be used for evaluating the novelty and inventive step of the present application in the case that there is no clear evidence that the above content is disclosed at the filing date of the present patent application.
Disclosure of Invention
The invention provides a device and a method for monitoring an MEMS micro-galvanometer based on an optical super-surface, aiming at solving the existing problems.
In order to solve the above problems, the technical solution adopted by the present invention is as follows:
an optical super surface-based MEMS micro galvanometer monitoring device, comprising: a light source for emitting a light signal; the MEMS micro-galvanometer is used for projecting the optical signal projected to the MEMS micro-galvanometer by the light source to a measured object in a measured space, and the first optical signal reflected by the measured object is fed back to the light beam sensor; the MEMS micro-vibration mirror is provided with an optical super-surface and is used for feeding back a second optical signal reflected by the optical signal projected to the optical super-surface by the light source to the light beam sensor; a beam sensor for receiving the first and second optical signals fed back; a processor to: extracting the first optical signal received by the light beam sensor to calculate first depth information; extracting the second optical signal received by the light beam sensor to calculate second depth information and calibrating the first depth information according to the second depth information; and monitoring the position and the working state of the MEMS micro-vibration mirror according to the time sequence and the rule of the second optical signal.
In one embodiment of the invention, the MEMS micro galvanometer is supported to project the optical signal of the light source to the measured object in the measured space through two-dimensional deflection oscillation. The gimbal is configured to oscillate in deflection around a central axis of the pedestal, and the MEMS micro-galvanometer is configured to oscillate in deflection around the central axis of the gimbal. The MEMS micro-vibration mirror is hinged with the universal frame through a first hinge and a second hinge, and the MEMS micro-vibration mirror oscillates and deflects along the direction of a first connecting line of the first hinge and the second hinge; the universal frame is hinged with the base frame through a third hinge and a fourth hinge, and the universal frame oscillates and deflects along a second connecting line direction of the third hinge and the fourth hinge; the first line direction is not parallel to the second line direction.
In another embodiment of the invention, the light source emits a periodic short pulse beam of light; the base frame is fixed at a certain inclination angle, so that the optical signal emitted by the light source is projected outwards to a measured object in a measured space through the MEMS micro-vibration mirror, and the first optical signal reflected by the measured object is incident on the light beam sensor through the same light path. The processor is further configured to obtain a time when the beam sensor receives the first optical signal and register the time with a polarization angle state of a polarization angle of the deflection oscillation of the MEMS micro-polarizer.
In yet another embodiment of the present invention, the optical super-surface comprises nanostructures. The light source comprises a pulsed laser diode and the beam sensor comprises an avalanche photodiode.
The invention also provides a method for monitoring the MEMS micro-galvanometer based on the optical super-surface, which comprises the following steps:
s1: controlling a light source to emit a light signal; s2: controlling the MEMS micro-galvanometer to project the optical signal projected to the MEMS micro-galvanometer by the light source to a measured object in a measured space, and feeding back a first optical signal reflected by the measured object to the light beam sensor; controlling an optical super surface arranged on the MEMS micro-vibration mirror to feed back a second optical signal reflected by an optical signal projected to the optical super surface by the light source to the light beam sensor; s3: controlling the light beam sensor to receive the fed back first light signal and second light signal; s4: extracting the first optical signal received by the light beam sensor to calculate first depth information; extracting the second optical signal received by the light beam sensor to calculate second depth information and calibrating the first depth information according to the second depth information; and monitoring the position and the working state of the MEMS micro-vibration mirror according to the time sequence and the rule of the second optical signal.
The invention further provides a computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, carries out the steps of the method as described above.
The invention has the beneficial effects that: the MEMS micro-vibration mirror is provided with the optical super surface, signals reflected by a scanning mirror and the optical super surface are subjected to double sampling, the position posture of the MEMS micro-vibration mirror is restored by detecting the time sequence and the rule of the occurrence of the signals, and then the time delay of the signals is compensated, so that the system error caused by the time delay of a light source and a light beam sensor can be eliminated, the position and the working state of the MEMS micro-vibration mirror are monitored in time, and the safety of the MEMS micro-vibration mirror and the integrity of the signals are improved.
Drawings
FIG. 1 is a schematic structural diagram of a MEMS micro-galvanometer monitoring device based on an optical super-surface according to the present invention.
FIG. 2 is a schematic structural diagram of another MEMS micro-galvanometer monitoring device based on an optical super-surface according to the present invention.
FIG. 3 is a schematic structural view of an optical super-surface according to the present invention.
FIG. 4 is a schematic diagram of a method for monitoring a MEMS micro-galvanometer based on an optical super-surface provided by the invention.
FIG. 5 is a signal graph of a monitoring MEMS micro-galvanometer according to the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the embodiments of the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. In addition, the connection may be for either a fixing function or a circuit connection function.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the embodiments of the present invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be in any way limiting of the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.
FIG. 1 is a schematic structural diagram of a MEMS micro-galvanometer monitoring device provided by the invention. The MEMS micro-galvanometer monitoring device 100 includes a light source 101, a MEMS micro-galvanometer 102, a beam sensor 103, and a processor (not shown). A light source 101 for emitting a light signal to the MEMS micro-galvanometer 102; the MEMS micro-vibration mirror 102 is provided with an optical super-surface 104, and when an optical signal emitted by the light source 101 is projected onto the MEMS micro-vibration mirror 102, the optical signal projected onto the optical super-surface 104 is directly reflected to obtain a second optical signal and is fed back to the light beam sensor 103; the optical signal which does not pass through the optical super surface 104 is directly projected on the MEMS micro-galvanometer 102, and then is uniformly projected to the measured object in the measured space through two-dimensional deflection oscillation by the MEMS micro-galvanometer 102, and the first optical signal reflected by the measured object is fed back to the beam sensor 103. A light beam sensor 103 for receiving the first light signal and the second light signal fed back; a processor for extracting the first optical signal received by the optical beam sensor 103 to calculate first depth information; extracting a second optical signal received by the light beam sensor 103, calculating second depth information, and calibrating the first depth information according to the second depth information; and monitoring the position and the working state of the MEMS micro-vibrating mirror according to the time sequence and the rule of the second optical signal.
In one embodiment, the MEMS micro-galvanometer monitoring device 100 further includes a pedestal 105 and a gimbal 106, the pedestal 105 may be formed of a semiconductor substrate for supporting the MEMS micro-galvanometer 102 for two-dimensional deflection oscillation. The gimbal 106 performs fast deflection oscillation around the central axis of the pedestal 105, and the MEMS micro-galvanometer 102 performs high-speed deflection oscillation around the central axis of the gimbal 106, thereby implementing two-dimensional deflection oscillation of the MEMS micro-galvanometer 102, and projecting an optical signal to any position in space.
Fig. 2 is a schematic structural diagram of a MEMS micro-resonator monitoring apparatus 200 according to the present invention, and the MEMS micro-resonator monitoring apparatus 200 further includes a first hinge 201, a second hinge 202, a third hinge 203, and a fourth hinge 204. The MEMS micro-galvanometer 102 is hinged with the universal frame 106 through a first hinge 201 and a second hinge 202, so that the MEMS micro-galvanometer 102 oscillates and deflects at a high speed along a first connecting line direction of the first hinge 201 and the second hinge 202, and laser beams can be reflected and projected to any space position in a certain range; the gimbal 106 is hinged to the support 105 through the third hinge 203 and the fourth hinge 204, so that the gimbal 106 can oscillate and deflect rapidly along a second connecting line direction of the third hinge 203 and the fourth hinge 204, thereby realizing the two-dimensional oscillating and deflecting of the MEMS micro-resonator position monitoring device 200. It can be understood that the first connection line direction is not parallel to the second connection line direction, i.e. a certain included angle is present, so as to implement the two-dimensional oscillation deflection of the MEMS micro-resonator position monitoring apparatus 200. In a preferred embodiment, the first and second wire directions are perpendicular to each other.
In one embodiment, light source 101 comprises a pulsed laser diode and beam sensor 103 comprises an avalanche photodiode, but any other suitable type of emitting and sensing components may alternatively be adapted for use in device 100 and are not limiting in the present invention.
In one embodiment, the light source 101 emits periodic short pulse light beams, the pedestal 105 is fixed at a certain inclination angle, so that the light signal emitted by the light source 101 can just project outwards through the MEMS micro-galvanometer 102, the MEMS micro-galvanometer 102 reflects the pulse light beams emitted by the light source 101 to the measured object in the measured space through two-dimensional deflection oscillation, and the reflected light beams of the measured object are incident on the light beam sensor 103 through the same light path. An optical super surface 104 is arranged on the MEMS micro-vibrating mirror 102, the optical super surface 104 has reflecting surfaces with different spatial normal angles, and the reflecting surfaces are used for directly reflecting the optical signal projected to the optical super surface 104 by the light source 101 to enter the light beam sensor 103 without being reflected by a measured space. The processor extracts an optical signal received by the light beam sensor 103, wherein the optical signal emitted by the light source 101 and fed back through the MEMS micro-galvanometer 102 without the optical super-surface 104 has spatial position information of an object to be measured, and the processor extracts the optical signal to process the optical signal to obtain depth information, and the depth information has an error caused by time delay between the light source 101 and the light beam sensor 103; the light source 101 emits an optical signal which passes through the optical super-surface 104 and is not fed back by the MEMS micro-vibrating mirror 102, the optical signal has the space azimuth angle information of the optical super-surface 104, the processor extracts the optical signal to process the optical signal to obtain depth information, and the depth information can be used for calibrating and eliminating depth errors caused by time delay between the light source 101 and the light beam sensor 103 and restoring the three-dimensional depth of the measured surface.
FIG. 3 is a schematic view of an optical super-surface structure according to the present invention. The optical super-surface 104 on the MEMS micro-galvanometer 102 may redirect the light. Optical super-surface 104 includes a plurality of nanostructures (nanoantennas) therein, which are a homogeneous material, such as nanostructures 301. Optical super-surface 104 may confine and redirect incident light according to the refractive index contrast between nanostructures 301 and the background environment (e.g., any surrounding interface materials). It is to be understood that the optical super-surface 104 may be one or more layers and that the size, orientation and shape of the nanostructures 301 may be tailored to the particular application and is not limited thereto.
It can be understood that when the MEMS micro-galvanometer monitoring device is rotated to a specific position, the mirror phase angle of the optical super-surface on the MEMS micro-galvanometer device is perpendicular to the plane of the light source, so that when the light beam emitted from the light source is at the specific position, part of the light is emitted to the object to be measured through the MEMS micro-galvanometer (without the optical super-surface), and the light is reflected by the object to be measured and enters the beam sensor; and the other part of the light enters the beam sensor through the direct reflection of the optical super surface and does not pass through the object to be measured.
FIG. 4 is a schematic flow chart of a method for monitoring a MEMS micro-galvanometer based on an optical super-surface, which comprises the following steps:
s1: controlling a light source to emit a light signal;
s2: controlling the MEMS micro-galvanometer to project an optical signal projected to the MEMS micro-galvanometer by the light source to a measured object in a measured space, and feeding back a first optical signal reflected by the measured object to the light beam sensor; controlling the optical super surface arranged on the MEMS micro-vibration mirror to feed back a second optical signal reflected by an optical signal projected to the optical super surface by the light source to the light beam sensor;
s3: controlling the light beam sensor to receive the fed back first light signal and second light signal;
s4: extracting a first optical signal received by a light beam sensor to calculate first depth information; extracting a second optical signal received by the light beam sensor to calculate second depth information and calibrating the first depth information according to the second depth information; and monitoring the position and the working state of the MEMS micro-vibrating mirror according to the time sequence and the rule of the second optical signal.
More specifically, in step S2, the light source emits a light signal to the MEMS micro-resonator, the MEMS micro-resonator projects the light signal through two-dimensional deflection oscillation, and when the MEMS micro-resonator is at a specific spatial position, the light source emits a light signal that is not optically super-surface-projected through the MEMS micro-resonator to the object to be measured, and then enters the light beam sensor through the same light path by reflection of the object to be measured; the light source emits light signals which pass through the optical super surface on the MEMS micro-vibration mirror and do not pass through the MEMS micro-vibration mirror, and the light signals are directly reflected to enter the light beam sensor without being reflected by a measured object; when the MEMS micro-vibration mirror is in other positions, the optical signal can not be directly reflected to enter the optical beam sensor, and only enters the optical beam sensor through the reflection of the measured object.
In step S3, the light beam sensor receives the optical signal projected and fed back by the MEMS micro-resonator, where the optical signal includes a first optical signal and a second optical signal, the first optical signal is set to be an optical signal projected to the object to be measured by two-dimensional deflection of the MEMS micro-resonator and fed back to the light beam sensor, and the second optical signal is set to be an optical signal that is directly reflected by the optical super-surface of the MEMS micro-resonator and enters the light beam sensor when the MEMS micro-resonator is at a specific spatial position.
In step S4, the processor extracts a first optical signal and a second optical signal received by the light beam sensor, where the first optical signal has spatial position information of the object to be measured, the spatial position information includes an error between the light beam sensor and the light source due to time delay, and the second optical signal includes spatial orientation information of the MEMS micro-galvanometer, and can be used for being calibrated to eliminate the error in the first optical signal due to time delay, so as to obtain more accurate spatial position information of the object to be measured. It should be understood that the second optical signal received by the beam sensor at a particular position can also be used to calibrate and eliminate the depth error due to time when the MEMS micro-vibrating mirror is at the rest position.
Step S4, registering the time of the depth information recorded by the beam sensor and reflected by the object to be measured with the polarization angle state of the MEMS micro-polarizer at a certain time to accurately match the depth information and orientation thereof, and calibrating the depth information recorded and processed by the beam sensor and reflected by the object to be measured with a certain system error, which can be compensated and eliminated by the depth information of the second optical signal reflected by the optical super-surface.
In one embodiment, when the MEMS micro-vibration mirror works normally, namely the MEMS micro-vibration mirror deflects and oscillates around the first hinge and the second hinge, the gimbal deflects and oscillates around the third hinge and the fourth hinge as shown in FIG. 5, the second optical signal 11 appears at intervals of 5 degrees in different periods of the relative deflection angle α angle of the pedestal and the gimbal, the first optical signal 12 always appears, and when the MEMS micro-vibration mirror works abnormally (such as the hinge is broken), the second optical signal 11 in FIG. 5 disappears.
All or part of the flow of the method of the embodiments may be implemented by a computer program, which may be stored in a computer readable storage medium and executed by a processor, to instruct related hardware to implement the steps of the embodiments of the methods. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, usb disk, removable hard disk, magnetic disk, optical disk, computer Memory, Read-only Memory (ROM), Random Access Memory (RAM), electrical carrier wave signals, telecommunications signals, software distribution medium, etc. It should be noted that the computer readable medium may contain content that is subject to appropriate increase or decrease as required by legislation and patent practice in jurisdictions, for example, in some jurisdictions, computer readable media does not include electrical carrier signals and telecommunications signals as is required by legislation and patent practice.
The invention achieves the following beneficial effects: the MEMS micro-vibration mirror is provided with the optical super-surface, the scanning mirror and signals reflected by the optical super-surface are subjected to double sampling, the position posture of the MEMS micro-vibration mirror is restored by detecting the time sequence and the rule of the occurrence of the signals, and the time delay of the signals is compensated, so that the system error caused by the time delay of a light source and a light beam sensor can be eliminated, the position and the working state of the MEMS micro-vibration mirror are monitored in time, and the safety of the MEMS micro-vibration mirror and the integrity of the signals are improved.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several equivalent substitutions or obvious modifications can be made without departing from the spirit of the invention, and all the properties or uses are considered to be within the scope of the invention.
Claims (10)
1. A MEMS micro-galvanometer monitoring device based on an optical super-surface is characterized by comprising:
a light source for emitting a light signal;
the MEMS micro-galvanometer is used for projecting the optical signal projected to the MEMS micro-galvanometer by the light source to a measured object in a measured space, and the first optical signal reflected by the measured object is fed back to the light beam sensor; the MEMS micro-vibration mirror is provided with an optical super-surface and is used for feeding back a second optical signal reflected by the optical signal projected to the optical super-surface by the light source to the light beam sensor;
a beam sensor for receiving the first and second optical signals fed back;
a processor to:
extracting the first optical signal received by the light beam sensor to calculate first depth information;
extracting the second optical signal received by the light beam sensor to calculate second depth information and calibrating the first depth information according to the second depth information;
and monitoring the position and the working state of the MEMS micro-vibration mirror according to the time sequence and the rule of the second optical signal.
2. The optical super-surface based MEMS micro-galvanometer monitoring device of claim 1, further comprising a pedestal and a gimbal for supporting the MEMS micro-galvanometer to project the optical signal of the optical source to the object under test in the space under test via two-dimensional deflection oscillation.
3. The optical super-surface based MEMS micro-galvanometer monitoring device of claim 2, wherein the gimbal is configured to oscillate in deflection about a central axis of the pedestal, and wherein the MEMS micro-galvanometer is configured to oscillate in deflection about a central axis of the gimbal.
4. The optical super-surface based MEMS micro-galvanometer monitoring device of claim 3, wherein the MEMS micro-galvanometer is articulated to the gimbal by a first hinge and a second hinge, the MEMS micro-galvanometer being oscillatingly deflectable along a first line direction of the first hinge and the second hinge; the universal frame is hinged with the base frame through a third hinge and a fourth hinge, and the universal frame oscillates and deflects along a second connecting line direction of the third hinge and the fourth hinge; the first line direction is not parallel to the second line direction.
5. The optical super surface based MEMS micro-galvanometer monitoring device of claim 2, wherein the light source emits a periodic short pulse beam; the base frame is fixed at a certain inclination angle, so that the optical signal emitted by the light source is projected outwards to a measured object in a measured space through the MEMS micro-vibration mirror, and the first optical signal reflected by the measured object is incident on the light beam sensor through the same light path.
6. The optical super-surface based MEMS micro-galvanometer monitoring device of claim 2, wherein the processor is further configured to obtain a time when the first optical signal is received by the beam sensor and to register with a polarization angle state of a polarization angle of the MEMS micro-galvanometer deflection oscillation.
7. The optical super surface based MEMS micro-galvanometer monitoring device of any of claims 1-6, wherein the optical super surface comprises nanostructures.
8. The optical super surface based MEMS micro-galvanometer monitoring device of any one of claims 1-6, wherein the light source comprises a pulsed laser diode and the beam sensor comprises an avalanche photodiode.
9. A method for monitoring a micro-electro-mechanical system (MEMS) micro-galvanometer based on an optical super-surface is characterized by comprising the following steps of:
s1: controlling a light source to emit a light signal;
s2: controlling the MEMS micro-galvanometer to project the optical signal projected to the MEMS micro-galvanometer by the light source to a measured object in a measured space, and feeding back a first optical signal reflected by the measured object to the light beam sensor; controlling an optical super surface arranged on the MEMS micro-vibration mirror to feed back a second optical signal reflected by an optical signal projected to the optical super surface by the light source to the light beam sensor;
s3: controlling the light beam sensor to receive the fed back first light signal and second light signal;
s4: extracting the first optical signal received by the light beam sensor to calculate first depth information; extracting the second optical signal received by the light beam sensor to calculate second depth information and calibrating the first depth information according to the second depth information; and monitoring the position and the working state of the MEMS micro-vibration mirror according to the time sequence and the rule of the second optical signal.
10. A computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, carries out the steps of the method as claimed in claim 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010106616.2A CN111189617B (en) | 2020-02-21 | 2020-02-21 | MEMS micro-galvanometer monitoring device and method based on optical super-surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010106616.2A CN111189617B (en) | 2020-02-21 | 2020-02-21 | MEMS micro-galvanometer monitoring device and method based on optical super-surface |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111189617A true CN111189617A (en) | 2020-05-22 |
CN111189617B CN111189617B (en) | 2021-08-03 |
Family
ID=70708461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010106616.2A Active CN111189617B (en) | 2020-02-21 | 2020-02-21 | MEMS micro-galvanometer monitoring device and method based on optical super-surface |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111189617B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112345207A (en) * | 2020-10-28 | 2021-02-09 | 歌尔光学科技有限公司 | Galvanometer detection device, galvanometer detection method and readable storage medium |
CN112379354A (en) * | 2020-11-16 | 2021-02-19 | 哈尔滨工业大学 | Time error self-calibration method of MEMS scanning laser radar system |
CN112747907A (en) * | 2021-01-28 | 2021-05-04 | 歌尔光学科技有限公司 | Galvanometer performance testing device, method and equipment and computer readable storage medium |
US20220146816A1 (en) * | 2020-11-11 | 2022-05-12 | Northrop Grumman Systems Corporation | Actively deformable metamirror |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050007557A1 (en) * | 2000-08-30 | 2005-01-13 | Huibers Andrew G. | Rear projection TV with improved micromirror array |
CN103426709A (en) * | 2013-09-03 | 2013-12-04 | 北京中科科仪股份有限公司 | Angle scanning light emission electron micro-imaging system and method |
CN104551411A (en) * | 2014-11-18 | 2015-04-29 | 南京大学 | Calibration method of laser galvanometer processing system under guidance of binocular stereoscopic vision |
CN106444015A (en) * | 2016-11-23 | 2017-02-22 | 青岛小优智能科技有限公司 | MEMS (micro-electromechanical system) microvibration mirror based laser source structured light generation method and system |
CN106595519A (en) * | 2016-12-07 | 2017-04-26 | 西安知象光电科技有限公司 | Flexible 3D contour measurement method and device based on laser MEMS projection |
CN106644052A (en) * | 2016-12-14 | 2017-05-10 | 西北工业大学 | Feedback system and method for micro-vibration mirror |
DE102016200505A1 (en) * | 2016-01-16 | 2017-07-20 | Robert Bosch Gmbh | Micromirror device |
US20180045953A1 (en) * | 2016-04-29 | 2018-02-15 | The Board Of Trustees Of The Leland Stanford Junior University | Device components formed of geometric structures |
CN108406092A (en) * | 2016-12-22 | 2018-08-17 | 温州大学激光与光电智能制造研究院 | A kind of coaxial vibration mirror scanning laser processing detected in real time |
CN109782252A (en) * | 2017-11-14 | 2019-05-21 | 北京万集科技股份有限公司 | MEMS galvanometer synchronizing device, method and laser radar based on laser radar |
CN109974979A (en) * | 2019-02-27 | 2019-07-05 | 大族激光科技产业集团股份有限公司 | A kind of auto-correction method and system of laser equipment galvanometer label |
CN110333501A (en) * | 2019-07-12 | 2019-10-15 | 深圳奥比中光科技有限公司 | Depth measurement device and distance measurement method |
CN110687675A (en) * | 2019-09-09 | 2020-01-14 | 歌尔股份有限公司 | Galvanometer system, micro-projection device and electronic device |
CN110763160A (en) * | 2019-11-22 | 2020-02-07 | 成都市众智三维科技有限公司 | Integrated three-dimensional measurement system and measurement method |
-
2020
- 2020-02-21 CN CN202010106616.2A patent/CN111189617B/en active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050007557A1 (en) * | 2000-08-30 | 2005-01-13 | Huibers Andrew G. | Rear projection TV with improved micromirror array |
CN103426709A (en) * | 2013-09-03 | 2013-12-04 | 北京中科科仪股份有限公司 | Angle scanning light emission electron micro-imaging system and method |
CN104551411A (en) * | 2014-11-18 | 2015-04-29 | 南京大学 | Calibration method of laser galvanometer processing system under guidance of binocular stereoscopic vision |
DE102016200505A1 (en) * | 2016-01-16 | 2017-07-20 | Robert Bosch Gmbh | Micromirror device |
US20180045953A1 (en) * | 2016-04-29 | 2018-02-15 | The Board Of Trustees Of The Leland Stanford Junior University | Device components formed of geometric structures |
CN106444015A (en) * | 2016-11-23 | 2017-02-22 | 青岛小优智能科技有限公司 | MEMS (micro-electromechanical system) microvibration mirror based laser source structured light generation method and system |
CN106595519A (en) * | 2016-12-07 | 2017-04-26 | 西安知象光电科技有限公司 | Flexible 3D contour measurement method and device based on laser MEMS projection |
CN106644052A (en) * | 2016-12-14 | 2017-05-10 | 西北工业大学 | Feedback system and method for micro-vibration mirror |
CN108406092A (en) * | 2016-12-22 | 2018-08-17 | 温州大学激光与光电智能制造研究院 | A kind of coaxial vibration mirror scanning laser processing detected in real time |
CN109782252A (en) * | 2017-11-14 | 2019-05-21 | 北京万集科技股份有限公司 | MEMS galvanometer synchronizing device, method and laser radar based on laser radar |
CN109974979A (en) * | 2019-02-27 | 2019-07-05 | 大族激光科技产业集团股份有限公司 | A kind of auto-correction method and system of laser equipment galvanometer label |
CN110333501A (en) * | 2019-07-12 | 2019-10-15 | 深圳奥比中光科技有限公司 | Depth measurement device and distance measurement method |
CN110687675A (en) * | 2019-09-09 | 2020-01-14 | 歌尔股份有限公司 | Galvanometer system, micro-projection device and electronic device |
CN110763160A (en) * | 2019-11-22 | 2020-02-07 | 成都市众智三维科技有限公司 | Integrated three-dimensional measurement system and measurement method |
Non-Patent Citations (3)
Title |
---|
BOURGADE, T: "Compact Lens-less Digital Holographic Microscope for MEMS Inspection and Characterization", 《JOVE-JOURNAL OF VISUALIZED EXPERIMENTS》 * |
CHUNHUI WANG: "A study of relationship between laser intensity and scanning frequency in MEMS scanning system", 《INFRARED PHYSICS & TECHNOLOGY》 * |
单国航: "相移法探测表面轮廓技术的研究", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112345207A (en) * | 2020-10-28 | 2021-02-09 | 歌尔光学科技有限公司 | Galvanometer detection device, galvanometer detection method and readable storage medium |
US20220146816A1 (en) * | 2020-11-11 | 2022-05-12 | Northrop Grumman Systems Corporation | Actively deformable metamirror |
CN112379354A (en) * | 2020-11-16 | 2021-02-19 | 哈尔滨工业大学 | Time error self-calibration method of MEMS scanning laser radar system |
CN112379354B (en) * | 2020-11-16 | 2021-09-28 | 哈尔滨工业大学 | Time error self-calibration method of MEMS scanning laser radar system |
CN112747907A (en) * | 2021-01-28 | 2021-05-04 | 歌尔光学科技有限公司 | Galvanometer performance testing device, method and equipment and computer readable storage medium |
Also Published As
Publication number | Publication date |
---|---|
CN111189617B (en) | 2021-08-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111189617B (en) | MEMS micro-galvanometer monitoring device and method based on optical super-surface | |
CN111323205B (en) | Micro-mirror array-based MEMS micro-galvanometer monitoring device and method | |
CN109154552B (en) | Optical particle sensor | |
EP2940489B1 (en) | Object detection device and sensing apparatus | |
US10330780B2 (en) | LIDAR based 3-D imaging with structured light and integrated illumination and detection | |
EP3821275B1 (en) | Scanning lidar systems with moving lens assembly | |
US7576837B2 (en) | Micro-mirror optical tracking and ranging system | |
CN109613515B (en) | Laser radar system | |
CN108693515B (en) | Lidar system and method for ascertaining a system state of a lidar system | |
US10935640B2 (en) | Multiplexed LIDAR transceiver | |
US20200033474A1 (en) | Lidar system with flexible scan parameters | |
JP2015178975A (en) | Object detection device and sensing device | |
JP2023549774A (en) | LiDAR system with transmission optical power monitor | |
CN110794382A (en) | Laser radar and detection method thereof | |
JP2019074361A (en) | Projector for three-dimensional measurement and three-dimensional measuring device | |
US20220299759A1 (en) | Light deflector, image projection apparatus, and distance-measuring apparatus | |
CN112859048A (en) | Light beam scanning apparatus, laser radar including the same, and control method | |
JP7314661B2 (en) | Optical scanning device, object detection device and sensing device | |
CN113030912B (en) | Laser radar system based on scanning galvanometer | |
JP2000035375A (en) | Optical scanner tester | |
CN219475831U (en) | Line sweeps laser subassembly and vehicle | |
US20210156967A1 (en) | Method and system for detecting fiber position in a fiber scanning projector | |
CN215264016U (en) | Laser radar system based on micro-reflector array | |
CN113514813B (en) | Scanning device and laser radar comprising same | |
EP4130787A1 (en) | Sensor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 11-13 / F, joint headquarters building, high tech Zone, 63 Xuefu Road, Yuehai street, Nanshan District, Shenzhen, Guangdong 518000 Applicant after: Obi Zhongguang Technology Group Co., Ltd Address before: 12 / F, joint headquarters building, high tech Zone, 63 Xuefu Road, Nanshan District, Shenzhen, Guangdong 518000 Applicant before: SHENZHEN ORBBEC Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant |