CN110954029A - Three-dimensional measurement system under screen - Google Patents
Three-dimensional measurement system under screen Download PDFInfo
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- CN110954029A CN110954029A CN201911067700.1A CN201911067700A CN110954029A CN 110954029 A CN110954029 A CN 110954029A CN 201911067700 A CN201911067700 A CN 201911067700A CN 110954029 A CN110954029 A CN 110954029A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
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- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention provides an under-screen three-dimensional measurement system, comprising: the emitting module is used for emitting a first spot patterning light beam; the display screen is used for receiving the first speckle patterning light beam and then emitting a second speckle patterning light beam to the target object; and a third spot-patterned beam formed by the second spot-patterned beam after reflection by the target object is received and diffracted or scattered to form a fourth spot-patterned beam; and the acquisition module comprises a plurality of pixel units, and the fourth spot patterning light beam is incident on the pixel units to form a distinguishable spot image. The influence of diffraction/scattering light spots is effectively removed, and the precision of the collected image is greatly improved, so that a more accurate image is obtained.
Description
Technical Field
The invention relates to the technical field of three-dimensional measurement under a screen, in particular to a three-dimensional measurement system under a screen.
Background
Photographing and displaying are the necessary functions of many electronic devices at present, and a front camera and a display are arranged on the front side of the electronic device to meet various requirements, such as self-photographing, content display, touch interaction and the like.
Along with the increasingly high requirement of people on the aesthetic feeling of the mobile phone, the comprehensive screen electronic equipment, such as the comprehensive screen mobile phone, gradually becomes a new direction of mobile phone innovation, and the comprehensive screen mobile phone has a very high screen occupation ratio, is convenient to control, and has visual impact force with very good aesthetic feeling. The challenge faced by current full-screen electronic devices is the conflict between the front camera and the display screen, and the presence of the front camera makes it difficult for the display screen to fill the front of the whole mobile phone in a true sense so as to achieve a higher screen occupation ratio.
Set up the optical module in the display screen back and can realize the full face screen, the display screen is located the place ahead and is used for the display screen, the light that the optical module received or transmitted can pass through the display screen, but because the display screen comprises a plurality of pixel units along horizontal and vertical periodic arrangement, a plurality of pixel units have constituted periodic pixel diffraction structure, consequently, the display screen can produce diffraction/scattering effect to the light beam of incidenting, lead to setting up the projection or the image quality degradation of the optical module at the display screen back, make three-dimensional measurement system measure and produce the error.
Disclosure of Invention
The invention provides a three-dimensional measurement system under a screen, aiming at solving the problem that in the prior art, the projection or imaging quality of an optical module arranged on the back of a display screen is reduced due to the diffraction/scattering effect of the display screen, so that errors are generated in the measurement of the three-dimensional measurement system.
In order to solve the above problems, the technical solution adopted by the present invention is as follows:
an underscreen three-dimensional measurement system comprising: the emitting module is used for emitting a first spot patterning light beam; the display screen is used for receiving the first speckle patterning light beam and then emitting a second speckle patterning light beam to the target object; and a third spot-patterned beam formed by the second spot-patterned beam after reflection by the target object is received and diffracted or scattered to form a fourth spot-patterned beam; and the acquisition module comprises a plurality of pixel units, and the fourth spot patterning light beam is incident on the pixel units to form a distinguishable spot image.
In one embodiment of the invention, the resolvable spot image comprises a plurality of circular spots, and the distance between two adjacent circular spots is not less than the diameter of the circular spots. The distance between two adjacent circular light spots is 0.9-1.2 times of the diameter of each circular light spot.
In yet another embodiment of the present invention, the distinguishable spot image is composed of a plurality of elliptical spots, the semiaxis minor distance between two adjacent elliptical spots is not less than the minor axis of the elliptical spots, and the semiaxis major distance between two adjacent elliptical spots is not less than the major axis of the elliptical spots. The distance between the short half shafts of two adjacent elliptical light spots is 0.9-1.2 times of the short shaft of the elliptical light spot; the distance between the long half shafts of two adjacent elliptical light spots is 0.9-1.2 times of the long shaft of the elliptical light spot.
In still another embodiment of the present invention, the first spot-patterned beam is configured such that a pitch between two adjacent spots becomes large so that the fourth spot-patterned beam is incident on the pixel unit to form the distinguishable spot image. The display screen is configured such that a spot diameter of the fourth spot-patterned beam becomes smaller such that the fourth spot-patterned beam is incident on the pixel cells to form the resolvable spot image. The distance between the acquisition module and the display screen is configured to enable the diameter of the light spot of the fourth spot patterned light beam to be reduced, so that the fourth spot patterned light beam is incident on the pixel unit to form the distinguishable light spot image.
In still another embodiment of the present invention, the method further comprises: a processor for receiving signals from the pixel units to calculate depth information of the target object. The processor calculates depth information of the target object based on a structured light principle or based on a ToF principle.
The invention has the beneficial effects that: the distance between two adjacent light spots is not smaller than the diameter of the light spot, namely, a fourth spot patterned light beam is incident on the acquisition module to form a distinguishable light spot image. Therefore, the influence of diffraction/scattering light spots can be effectively eliminated, and the precision of image acquisition is greatly improved, so that a more accurate image is obtained.
Drawings
Fig. 1 is a schematic structural diagram of an off-screen three-dimensional measurement system in an embodiment of the invention.
FIG. 2 is a schematic diagram of a spot image that can be resolved according to an embodiment of the present invention.
FIG. 3 is a schematic diagram of still another distinguishable spot image in an embodiment of the present invention.
The three-dimensional measuring system comprises a 10-under-screen three-dimensional measuring system, a 20-target object, an 11-emission module, a 12-collection module, a 13-display screen, a 101-first spot patterned light beam, a 102-second spot patterned light beam and a 103-third spot patterned light beam. 104-fourth spot patterned beam, 201-circular spot, 202-circular spot, 203-diameter of circular spot, 204-pitch of two adjacent circular spots, 301-elliptical spot, 302-pitch of semi-minor axes of two adjacent elliptical spots, 303-minor axis of elliptical spot, 304-pitch of semi-major axes of two adjacent elliptical spots, 305-major axis of elliptical spot, 306-elliptical spot.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the embodiments of the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. In addition, the connection may be for either a fixing function or a circuit connection function.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the embodiments of the present invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be in any way limiting of the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Fig. 1 is a schematic structural diagram of an off-screen three-dimensional measurement system 10 according to an embodiment of the present invention. The under-screen three-dimensional measurement system 10 comprises a transmitting module 11, an acquisition module 12, a display screen 13 and a processor (not shown). The emitting module 11 is used for emitting a first spot patterned light beam 101; the display screen 13 is used for receiving the first speckle patterning light beam 101 and then emitting a second speckle patterning light beam 102 to the target object 20; and for receiving and diffracting or scattering a third spot patterned beam 103 formed by reflection of said second spot patterned beam 102 by the target object 20 to form a fourth spot patterned beam 104; the collecting module 12 includes a plurality of pixel units, and the fourth speckle patterned beam 104 is incident on the pixel units to form a distinguishable speckle image; the processor receives signals from the pixel cells to calculate depth information of the target object 20.
It will be appreciated that the resolvable spot image may be a resolvable diffraction spot image or a resolvable scatter spot image.
The emitting module 11 includes a light source and an optical component (the optical component may include a diffractive optical element, etc.), wherein the light source 101 may be a light source such as a Light Emitting Diode (LED), an Edge Emitting Laser (EEL), a Vertical Cavity Surface Emitting Laser (VCSEL), etc., or a light source array composed of a plurality of light sources, the light source is configured to emit a structured light beam, and the emitted structured light beam may be visible light, infrared light, ultraviolet light, etc. The structured light emitted by the light source may form a randomly or regularly distributed projected pattern on the target object 20.
The display panel 13 includes a plasma display panel, a transparent display panel such as LCD, LED, OLED, etc., and the display panel 13 includes a plurality of pixel units for displaying, such as pixel units arranged periodically in the transverse direction and the longitudinal direction. In order to make the display 13 transparent so that the light beam can pass through, the display can be implemented by reasonably designing a plurality of pixel units, for example, gaps are arranged between the pixel units or a part of the structure inside the pixel units is made of a transparent material, so that the display 13 can reach a certain aperture ratio. In some embodiments, all structures of each pixel unit of the display 13 may also be made of a transparent material, so that the transparency can be improved.
The collection module 12 includes an image sensor and may further include a lens unit (not shown), and the lens unit receives at least a part of the light beam reflected by the target object 20 and images the light beam on the image sensor. The image sensor may be a Charge Coupled Device (CCD), a Complementary Metal-Oxide-Semiconductor (CMOS), an Avalanche Diode (AD), a Single Photon Avalanche Diode (SPAD), or the like.
The processor may calculate depth information of the target object 20 based on the structured light principle. The collection module 12 receives the fourth speckle patterned beam 104 to form an electrical signal, and the processor processes the electrical signal, calculates intensity information reflecting the fourth speckle patterned beam 104 to form a structured light pattern, and finally performs image matching calculation, trigonometric calculation, and the like based on the structured light pattern to obtain a depth value of the target object 20.
The processor may also calculate depth information of the target object 20 based on ToF principles. The acquisition module 12 receives the fourth speckle patterned beam 104 to form an electrical signal, and the processor processes the electrical signal to calculate a phase difference, and calculates a time-of-flight for the beam to be transmitted from the transmission module 11 to the acquisition module 12 for reception based on the phase difference, and further calculates a depth value of the target object 20 based on the time-of-flight.
FIG. 2 is a schematic diagram of a spot image that can be resolved according to an embodiment of the invention. Based on the off-screen three-dimensional measurement system 10 shown in fig. 1, in one embodiment, the emitting module 11 is configured to emit a first speckle patterned beam 101; the display screen 13 is used for receiving the first speckle patterning light beam 101 and then emitting a projection pattern formed by a plurality of circular speckles 201 formed by the second speckle patterning light beam 102 to the target object 20, and the projection pattern is shown in fig. 2 and is represented by dotted hollow circles; and for receiving and diffracting or scattering a third spot-patterned beam 103 formed by the second spot-patterned beam 102 after reflection by the target object 20, to form a fourth spot-patterned beam 104; the collection module 12 includes a plurality of pixel units, and the fourth speckle patterned beam 104 is incident on the pixel units to form a distinguishable speckle image. The distinguishable spot image is shown in fig. 2 and is composed of a plurality of circular spots 202, which are indicated by solid line hollow circles, and the distance 204 between two adjacent circular spots is not smaller than the diameter 203 of the circular spots. It is understood that two adjacent circular spots 202 may also partially overlap, for example, the pitch 204 of the two adjacent circular spots may be 0.9-1.2 times the diameter 203 of the circular spot.
In one embodiment, it is understood that the first patterned beam 101 emitted by the emitting module 11 may be configured such that the distance between two adjacent spots becomes larger, and thus, the display 13 receives the first spot-patterned beam 101 and emits the second spot-patterned beam 102 to the target object 20 to form a projection pattern consisting of a plurality of circular spots 201, and the distance between two adjacent circular spots 201 in the projection pattern also becomes larger. It will be appreciated that the pitch between two adjacent circular spots 201 becomes larger, and the pitch 204 between two adjacent circular spots formed by the fourth spot patterning beam incident on the pixel unit also becomes larger, so that the pitch 204 between two adjacent circular spots is not smaller than the diameter 203 of the circular spot, i.e. a distinguishable spot image is formed.
FIG. 3 is a schematic diagram of a spot image that can be resolved according to an embodiment of the invention. Based on the off-screen three-dimensional measurement system 10 shown in fig. 1, in one embodiment, the emitting module 11 is configured to emit a first speckle patterned beam 101; the display screen 13 is used for receiving the first speckle patterning light beam 101 and then emitting a projection pattern formed by a plurality of elliptical speckles 306 formed by the second speckle patterning light beam 102 to the target object 20, and the projection pattern is shown in fig. 3 and is represented by dotted hollow ellipses; and for receiving and diffracting or scattering a third spot-patterned beam 103 formed by the second spot-patterned beam 102 after reflection by the target object 20, to form a fourth spot-patterned beam 104; the collection module 12 includes a plurality of pixel units, and the fourth speckle patterned beam 104 is incident on the pixel units to form a distinguishable speckle image. The distinguishable spot image is shown in fig. 3 and is composed of a plurality of elliptical spots 301, which are indicated by solid hollow ellipses, wherein the semiaxis minor spacing 302 of two adjacent elliptical spots is not less than the minor axis 303 of the elliptical spots, and the semiaxis major spacing 304 of two adjacent elliptical spots is not less than the major axis 305 of the elliptical spots. In this way, a resolvable speckle image can be formed. It can be understood that two adjacent elliptical light spots can also be partially overlapped, for example, the short semi-axis distance 302 of the two adjacent elliptical light spots is 0.9-1.2 times of the short axis 303 of the elliptical light spot; the distance 304 between the major axes and the minor axes of two adjacent elliptical light spots is 0.9-1.2 times of the major axis 305 of the elliptical light spots.
In one embodiment, it is understood that the first patterned beam 101 emitted by the emitting module 11 may be configured such that the distance between two adjacent elliptical spots becomes larger, and thus, the display 13 receives the first spot-patterned beam 101 and emits the second spot-patterned beam 102 to the target object 20 to form a projection pattern composed of a plurality of elliptical spots 306, and the distance between two adjacent elliptical spots 306 becomes larger. It can be understood that the distance between two adjacent elliptical spots 306 is increased, the semiminor axis 302 of two adjacent elliptical spots 301 formed by the fourth spot patterning light beam incident on the pixel unit is also increased, so that the semiminor axis 302 of two adjacent elliptical spots 301 is not smaller than the minor axis 303 of the elliptical spot 301, and the semimajor axis 304 of two adjacent elliptical spots 301 is also increased, so that the semimajor axis 304 of two adjacent elliptical spots 301 is not smaller than the major axis 305 of the elliptical spot 301, i.e. a distinguishable spot image is formed.
It will be appreciated that the diameter of the spot 202 is dependent on the diffractive properties of the display screen 13 and the distance between the display screen 13 and the collection module 12.
In one embodiment, the display screen 13 is configured such that when the third spot-patterned beam 103 is incident on the display screen 13, the diffraction or scattering effect of the display screen 13 on the beam is reduced, so that the spot diameter of the fourth spot-patterned beam 104 formed by the display screen 13 receiving and diffracting or scattering the third spot-patterned beam 103 is reduced, it can be understood that the spot diameter formed by the fourth spot-patterned beam incident on the pixel unit is reduced, that is, the distance between two adjacent spots is not less than the diameter of the spot, so that a distinguishable spot image can be formed.
In one embodiment, the distance between the collecting module 12 and the display 13 is configured to reduce the diameter of the light spot forming the fourth spot-patterned light beam, and it can be understood that the diameter of the light spot formed by the fourth spot-patterned light beam 104 incident on the pixel unit is reduced, that is, the distance between two adjacent light spots is not less than the diameter of the light spot, so that a distinguishable light spot image can be formed.
It is understood that, with any two or more of the above embodiments, a better distinguishable spot image can be obtained, that is, by configuring the distance between the light spots emitted by the emission module 11 and/or designing the diffraction performance of the display 13 and/or adjusting the distance between the collection module 12 and the display 13. So that the distance between two adjacent spots is not less than the diameter of the spot, i.e. the fourth spot-patterned beam 104 is incident on the collection module 12 to form a distinguishable spot image. Therefore, the influence of diffraction/scattering light spots can be effectively eliminated, and the precision of image acquisition is greatly improved, so that a more accurate image is obtained.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention. It will be appreciated that when the off-screen three-dimensional measurement system of the present invention is embedded in a device or hardware, corresponding structural or component changes may be made to accommodate the needs, and the nature of which still employs the distance measuring system of the present invention should be considered as the scope of the present invention. The foregoing is a more detailed description of the invention in connection with specific/preferred embodiments and is not intended to limit the practice of the invention to those descriptions. It will be apparent to those skilled in the art that various substitutions and modifications can be made to the described embodiments without departing from the spirit of the invention, and these substitutions and modifications should be considered to fall within the scope of the invention. In the description herein, references to the description of the term "one embodiment," "some embodiments," "preferred embodiments," "an example," "a specific example," or "some examples" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction. Although embodiments of the present invention and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the scope of the invention as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. One of ordinary skill in the art will readily appreciate that the above-disclosed, presently existing or later to be developed, processes, machines, manufacture, compositions of matter, means, methods, or steps, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.
Claims (10)
1. An underscreen three-dimensional measurement system, comprising:
the emitting module is used for emitting a first spot patterning light beam;
the display screen is used for receiving the first speckle patterning light beam and then emitting a second speckle patterning light beam to the target object; and a third spot-patterned beam formed by the second spot-patterned beam after reflection by the target object is received and diffracted or scattered to form a fourth spot-patterned beam;
and the acquisition module comprises a plurality of pixel units, and the fourth spot patterning light beam is incident on the pixel units to form a distinguishable spot image.
2. The underscreen three-dimensional measuring system according to claim 1 wherein the resolvable spot image comprises a plurality of circular spots, and the distance between two adjacent circular spots is not less than the diameter of the circular spots.
3. The under-screen three-dimensional measurement system according to claim 2, wherein the distance between two adjacent circular light spots is 0.9-1.2 times the diameter of the circular light spots.
4. The underscreen three-dimensional measuring system according to claim 1 wherein said resolvable spot image is composed of a plurality of elliptical spots, the minor axis spacing of two adjacent elliptical spots is not less than the minor axis of the elliptical spots, and the major axis spacing of two adjacent elliptical spots is not less than the major axis of the elliptical spots.
5. The under-screen three-dimensional measurement system according to claim 4, wherein the minor semi-axis spacing of two adjacent elliptical light spots is 0.9-1.2 times the minor axis of the elliptical light spots; the distance between the long half shafts of two adjacent elliptical light spots is 0.9-1.2 times of the long shaft of the elliptical light spot.
6. The underscreen three-dimensional measurement system according to claim 1 wherein the first spot patterned beam is configured such that the spacing between two adjacent spots becomes larger such that the fourth spot patterned beam is incident on the pixel cell to form the resolvable spot image.
7. The underscreen three-dimensional measurement system according to claim 1 wherein the display screen is configured such that the spot diameter of the fourth spot-patterned beam becomes smaller such that the fourth spot-patterned beam is incident on the pixel cells to form the resolvable spot image.
8. The underscreen three-dimensional measurement system according to claim 1, wherein the distance between the acquisition module and the display screen is configured to reduce a spot diameter of the fourth spot-patterned beam so that the fourth spot-patterned beam is incident on the pixel unit to form the distinguishable spot image.
9. The underscreen three-dimensional measurement system according to any one of claims 1-8, further comprising: a processor for receiving signals from the pixel units to calculate depth information of the target object.
10. The underscreen three-dimensional measurement system according to claim 9 wherein the processor calculates depth information for the target object based on a structured light principle or based on a ToF principle.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111540293A (en) * | 2020-05-08 | 2020-08-14 | 云谷（固安）科技有限公司 | Display panel testing device and testing method |
| CN111678457A (en) * | 2020-05-08 | 2020-09-18 | 西安交通大学 | ToF device under OLED transparent screen and distance measuring method |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1116703A (en) * | 1994-08-08 | 1996-02-14 | 陈明彻 | Non-contact 3-D profile real-time measuring method and system |
| US20090268214A1 (en) * | 2006-05-26 | 2009-10-29 | Miljenko Lucic | Photogrammetric system and techniques for 3d acquisition |
| JP2012037292A (en) * | 2010-08-04 | 2012-02-23 | Shimadzu Corp | Etching monitoring device |
| CN107682689A (en) * | 2017-09-29 | 2018-02-09 | 舜宇光学（浙江）研究院有限公司 | 3 D scanning system based on structure light |
| CN107748475A (en) * | 2017-11-06 | 2018-03-02 | 深圳奥比中光科技有限公司 | Structured light projection module, depth camera and the method for manufacturing structured light projection module |
| CN107832752A (en) * | 2017-12-15 | 2018-03-23 | 京东方科技集团股份有限公司 | Fingerprint recognition panel, full frame fingerprint identification method and display device |
| CN107908064A (en) * | 2017-11-06 | 2018-04-13 | 深圳奥比中光科技有限公司 | Structured light projection module, depth camera and the method for manufacturing structured light projection module |
| CN109143607A (en) * | 2018-09-17 | 2019-01-04 | 深圳奥比中光科技有限公司 | It compensates display screen, shield lower optical system and electronic equipment |
| CN109196525A (en) * | 2017-07-18 | 2019-01-11 | 深圳市汇顶科技股份有限公司 | Refuse the anti-spoofing sensing of false fingerprint pattern in optical sensor module under the screen for shielding upper fingerprint sensing |
| CN109188711A (en) * | 2018-09-17 | 2019-01-11 | 深圳奥比中光科技有限公司 | Shield lower optical system, the design method of diffraction optical element and electronic equipment |
| CN109981902A (en) * | 2019-03-26 | 2019-07-05 | Oppo广东移动通信有限公司 | Terminal and control method |
| CN110333501A (en) * | 2019-07-12 | 2019-10-15 | 深圳奥比中光科技有限公司 | Depth measurement device and distance measurement method |
-
2019
- 2019-11-04 CN CN201911067700.1A patent/CN110954029B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1116703A (en) * | 1994-08-08 | 1996-02-14 | 陈明彻 | Non-contact 3-D profile real-time measuring method and system |
| US20090268214A1 (en) * | 2006-05-26 | 2009-10-29 | Miljenko Lucic | Photogrammetric system and techniques for 3d acquisition |
| JP2012037292A (en) * | 2010-08-04 | 2012-02-23 | Shimadzu Corp | Etching monitoring device |
| CN109196525A (en) * | 2017-07-18 | 2019-01-11 | 深圳市汇顶科技股份有限公司 | Refuse the anti-spoofing sensing of false fingerprint pattern in optical sensor module under the screen for shielding upper fingerprint sensing |
| CN107682689A (en) * | 2017-09-29 | 2018-02-09 | 舜宇光学（浙江）研究院有限公司 | 3 D scanning system based on structure light |
| CN107748475A (en) * | 2017-11-06 | 2018-03-02 | 深圳奥比中光科技有限公司 | Structured light projection module, depth camera and the method for manufacturing structured light projection module |
| CN107908064A (en) * | 2017-11-06 | 2018-04-13 | 深圳奥比中光科技有限公司 | Structured light projection module, depth camera and the method for manufacturing structured light projection module |
| CN107832752A (en) * | 2017-12-15 | 2018-03-23 | 京东方科技集团股份有限公司 | Fingerprint recognition panel, full frame fingerprint identification method and display device |
| CN109143607A (en) * | 2018-09-17 | 2019-01-04 | 深圳奥比中光科技有限公司 | It compensates display screen, shield lower optical system and electronic equipment |
| CN109188711A (en) * | 2018-09-17 | 2019-01-11 | 深圳奥比中光科技有限公司 | Shield lower optical system, the design method of diffraction optical element and electronic equipment |
| CN109981902A (en) * | 2019-03-26 | 2019-07-05 | Oppo广东移动通信有限公司 | Terminal and control method |
| CN110333501A (en) * | 2019-07-12 | 2019-10-15 | 深圳奥比中光科技有限公司 | Depth measurement device and distance measurement method |
Non-Patent Citations (1)
| Title |
|---|
| 刘永春等: "基于全息定向散射屏的光场三维成像系统研究", 《激光与光电子学进展》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111540293A (en) * | 2020-05-08 | 2020-08-14 | 云谷（固安）科技有限公司 | Display panel testing device and testing method |
| CN111678457A (en) * | 2020-05-08 | 2020-09-18 | 西安交通大学 | ToF device under OLED transparent screen and distance measuring method |
| CN111678457B (en) * | 2020-05-08 | 2021-10-01 | 西安交通大学 | ToF device under OLED transparent screen and distance measuring method |
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| CN110954029B (en) | 2022-11-18 |
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