CN110333051A - A kind of test equipment and method of semiconductor laser chip - Google Patents
A kind of test equipment and method of semiconductor laser chip Download PDFInfo
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- CN110333051A CN110333051A CN201910825510.5A CN201910825510A CN110333051A CN 110333051 A CN110333051 A CN 110333051A CN 201910825510 A CN201910825510 A CN 201910825510A CN 110333051 A CN110333051 A CN 110333051A
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- G—PHYSICS
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- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
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Abstract
The present invention provides the test equipment and method of a kind of semiconductor laser chip, which includes: rack；Rocking test mechanism in rack, rocking test mechanism include swinging the first support of connection, the first driver that rack opposite with second support, the driving first support of first support swing connection is swung and the second driver that the opposite first support of driving second support is swung with rack；Chip loading platform, setting on the secondary support bracket, which is provided with chip and load position；Test light beam mechanism is arranged on the rack and is located at the side of rocking test mechanism, for carrying out photoelectric conversion test to the light beam that chip to be measured issues, and obtain the test data of chip when rocking test mechanism drives chip to be measured to swing.In the present invention using by angle scanning method come the test beams angle of divergence, and devise can the mechanism that is swung towards multiple directions of driving chip, realization tests the beam emissions angle of chip multiple directions, improves the comprehensive of testing efficiency and data.
Description
Technical field
The present invention relates to semiconductor laser chip technical field, in particular to a kind of test equipment of semiconductor laser chip
And method.
Background technique
Semiconductor laser chip is also known as laser chip, is widely used in mobile terminal, computer equipment, recognition of face, intelligence
In the every field such as energy household, aerospace.In the research and development and use process of semiconductor laser chip, generally require half-and-half
The multiple parameters (such as beam divergence angle, optical power, electric current, voltage) of conductor Laser chip are tested, to determine semiconductor
Whether the performance and working condition of laser chip meet the requirements.
Wherein, the size of beam divergence angle determines whether light beam has good directionality and high brightness, half-and-half leads
The various aspects such as the transmission power and receiving sensitivity of volumetric laser chip have a significant impact, therefore it is in the ginseng of semiconductor laser chip
Belong to stress test index in number test.
In the prior art, the measurement method of the beam divergence angle of semiconductor laser chip generally has set hole measurement at present
Method, CCD camera mensuration and by three kinds of angle scanning method, over needs tester to be selected according to the practical caliber size of light beam
Take the aperture of respective diameters, when measurement needs to carry out manual calibration, different chips to the center of beam center and aperture
The light beam of transmitting needs to reselect aperture and carries out the alignment function at the center of beam center and aperture, the process of measurement
It is cumbersome, low efficiency, at high cost；And CCD mensuration needs to increase in measurement process damage of the attenuator to prevent CCD camera,
This method also needs to constantly look for the focus point of light beam, but the focus point of the light beam of different chip injections is different, therefore measures not
With chip emission light beam when, need tester to find the focus point of light beam again, low efficiency and real-time is poor；Meanwhile
At present using the instrument tested by angle scanning method beam divergence angle, primary load can only be tested on chip single direction
Beam divergence angle, low efficiency and data are not comprehensive.In addition, the equipment tested at present semiconductor laser chip is all
Single parameter can only be measured, testing efficiency is low.
Summary of the invention
Based on this, the object of the present invention is to provide a kind of test equipment of semiconductor laser chip and methods, existing to solve
The technical problem for having the beam divergence angle testing efficiency of semiconductor laser chip in technology low.
The present invention provides a kind of test equipment of semiconductor laser chip, comprising:
Rack；
Rocking test mechanism in the rack, the rocking test mechanism include swinging the first of connection with the rack
Bracket swings the opposite rack of second support, the driving first support of connection is swung first with the first support
The second driver that driver and the relatively described first support of the driving second support are swung, the pendulum of the first support
Moving axis is X-axis, and the swinging axle of the second support is Z axis, and X-axis and Z axis are spatially arranged in a crossed manner；
Chip loading platform is arranged in the second support, which is provided with an at least chip and loads position；
Test light beam mechanism is arranged in the rack and is located at the side of the rocking test mechanism, in the swing
When mechanism for testing drives semiconductor laser chip to be measured to swing, the light beam issued to the semiconductor laser chip to be measured carries out light
Electric conversion testing, and obtain the beam divergence angle of the semiconductor laser chip to be measured, the semiconductor laser chip dress to be measured
The chip is loaded in load on position.
Further, the test equipment of the semiconductor laser chip further include:
Chip power supply mechanism is connect including the third driver being arranged in the second support and with the third driver
For electric probe, it is described to fall into the chip for electric probe and load in position to be measured half under the driving of the third driver
Conductor Laser chip is powered.
Further, the second support is equipped with the fourth drive that connect with the chip loading platform, and described the
Four drivers drive the chip loading platform to slide in the second support, so that each chip loading position is removable
Move be right against it is described for electric probe.
Further, the chip loading platform includes the temperature control console being arranged in the second support and stacking
Chip fixture at the top of the temperature control console is set.
Further, the chip fixture includes:
Loading plate is stacked on the top of the temperature control console；
Chip positioning plate is stacked on the top of the loading plate, and the chip loads position and is arranged in the chip positioning
On plate；And
Pressure plate is rotatablely connected at the top of the loading plate, and can turn to compress be loaded in the chip load on position to
Survey semiconductor laser chip.
Further, the pressure plate is equipped with evacuation notch on the position opposite with chip loading position, described to keep away
Allow notch inner wall on extend outward chip compact heap.
Further, the chip fixture further includes locking member, for compressing semiconductor laser to be measured in the pressure plate
The pressure plate is locked when chip.
Further, the test light beam mechanism includes:
Probe bracket is arranged in the rack, and is located at the side of the chip loading platform；
First photoelectric sensor is arranged on the probe bracket；
5th driver is arranged in the rack and for driving probe bracket telescopic moving in the rack.
Further, the test light beam mechanism is also used to test the LIV parameter and spectrum ginseng of semiconductor laser chip
Number, the test light beam mechanism further include:
Side of the probe bracket far from the chip loading platform is arranged in integrating sphere；
The second photoelectric sensor on the integrating sphere is set；
The spectrometer being connect by optical fiber with the integrating sphere；And
Mobile linear mould group, is arranged in the rack, and the integrating sphere is arranged in the linear mould group of the movement, described
It is mobile close to or far from the chip loading platform under the driving of mobile linear mould group.
Another aspect of the present invention also proposes a kind of test method of semiconductor laser chip, applied to above-mentioned test equipment
In, the test method includes:
When a semiconductor laser chip power up test to be measured, sequentially to the first driver and the second driver send with it is described to
The corresponding default driving signal of semiconductor laser chip is surveyed, with described to be measured by the pivot angle driving of the default driving signal setting
Semiconductor laser chip is sequentially around X-axis and Z axis at the uniform velocity reciprocally swinging；
During the semiconductor laser chip to be measured is swung, by test light beam mechanism constantly to the semiconductor to be measured
The light beam that laser chip issues carries out photoelectric conversion, to respectively obtain the semiconductor laser chip to be measured around X-axis and around Z
Light intensity data in axis swing process；
According to the light intensity data, the beam divergence angle of semiconductor laser chip to be measured is calculated.
Beneficial effects of the present invention: by the rocking test mechanism of setting driving chip loading platform swing and in the pendulum
The side setting of dynamic mechanism for testing carries out photoelectric conversion to light beam to obtain the test light beam mechanism of test data of chip, to pass through
Test the beam divergence angle of semiconductor laser chip by angle scanning method, without finding the focus point of light beam when test, also without
Need to change and aperture and carry out to alignment, in addition, this equipment have also been devised one kind can driving chip loading platform towards multiple sides
To the rocking test mechanism of swing, chip can arbitrarily be swung under the driving of rocking test mechanism in X-axis and Z axis, in this way
Countless test angle combination is had, makes once to load the beam emissions angle that can test chip multiple directions, improves test effect
Rate and data it is comprehensive, can also test to obtain the Two dimensional Distribution of the entire light field of chip.
Detailed description of the invention
Fig. 1 is the perspective view of the test equipment of the semiconductor laser chip in first embodiment of the invention；
Fig. 2 is the perspective view of the rocking test mechanism in first embodiment of the invention；
Fig. 3 is the perspective view of the chip fixture in first embodiment of the invention；
Fig. 4 is the stereogram exploded view of the chip fixture in first embodiment of the invention；
Fig. 5 is the enlarged drawing in Fig. 3 at I；
Fig. 6 is the perspective view of the test equipment of the semiconductor laser chip in second embodiment of the invention;
Fig. 7 is the flow chart of the test method of the semiconductor laser chip in third embodiment of the invention.
Main element symbol description:
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give several embodiments of the invention.But the invention can be realized in many different forms, however it is not limited to this paper institute
The embodiment of description.On the contrary, purpose of providing these embodiments is make it is more thorough and comprehensive to the disclosure.
It should be noted that it can directly on the other element when element is referred to as " being fixedly arranged on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
Fig. 1 to Fig. 5 is please referred to, the test equipment of the semiconductor laser chip in first embodiment of the invention is shown, is wrapped
Including rack 10, the chip loading platform 30 in rocking test mechanism 20, is set the rocking test mechanism 20 in rack 10
In the chip power supply mechanism 40 in rocking test mechanism 20 and the test light beam mechanism 50 in rack 10, in which:
Rack 10 includes bottom plate 11 and two support frames 12 on bottom plate 11, two 12 relative spacing of support frame arrangements, pendulum
Dynamic 20 integral erection of mechanism for testing is between two support frames 12, and entirety can be swung with respect to support frame 12.Specifically, it swings and surveys
Test-run a machine structure 20 includes that first support 21, second support 22, the first driver 23 and the second driver 24, first support 21 are set up in
It between two support frames 12, and swings and connects with support frame 12, the swinging axle of first support 21 is X-axis, and second support 22 is arranged
It in first support 21, and swings and connects with first support 21, the swinging axle of second support 22 is Z axis, and the first driver 23 is set
It sets on support frame 12 and is connect with first support 21, to drive first support 21 with respect to the at the uniform velocity reciprocally swinging of rack 10, second
Driver 24 is arranged in first support 21 and connect with second support 22, to drive second support 22 even with respect to first support 21
Fast reciprocally swinging.The quantity of first driver 23 is two, and one is arranged on each support frame 12, drives the to synchronize from both ends
One bracket 21 is swung, and the quantity of the second driver 24 is one, and the first driver 23 and the second driver 24 all can be steppings
Motor or servo motor can carry out controlled work by the control instruction of controller when operation.
Chip loading platform 30 is arranged in second support 22, and chip loading platform 30 is equipped with an at least chip and loads position
30a, each chip, which loads position 30a, can load a semiconductor laser chip to be measured.When the first driver 23 drives first support
When 21 opposite racks 10 are swung, chip loading platform 30 is swung around X-axis, when the second driver 24 driving second support 22 opposite the
When one bracket 21 is swung, chip loading platform 30 is swung about the z axis, correspondingly, is loaded in be measured on chip loading platform 30
Semiconductor laser chip will also be swung around X-axis or Z axis, and swing angle is controlled by the first driver 23 and the second driver 24, and
Different types of laser chip can be correspondingly arranged different swing angles, to meet the different types of laser chip angle of divergence
Test request.
Wherein, X-axis and Z axis are spatially arranged in a crossed manner, so that rocking test mechanism 20 can driving chip loading platform 30
On swung towards multiple directions, realize and the beam emissions angles of chip multiple directions test by angle scanning.In the present embodiment
In the middle, X-axis and Z axis are spatially vertically arranged, and make rocking test mechanism 20 that semiconductor laser chip to be measured can be driven in level
It swings on face and vertical plane, it can be achieved that testing the beam emissions angle of chip level direction and vertical direction.
Specifically, chip loading platform 30 includes the temperature control console 31 being arranged in second support 22 and is stacked
Chip fixture 32 at 31 top of temperature control console, temperature control console 31 are semiconductor temperature-control platform, for providing constant temperature in test
Control achievees the purpose that protect chip to control temperature of the semiconductor laser chip to be measured in test.Chip fixture 32 includes
Loading plate 321, chip positioning plate 322, pressure plate 323 and locking member 324, loading plate 321 are stacked in temperature control console 31
Top, chip positioning plate 322 are stacked on the top of loading plate 321, and chip loads position 30a and is arranged in chip positioning plate
It on 322, is rotatablely connected at the top of pressure plate 323 and loading plate 321, and can turn to and cover on chip positioning plate 322, to compress dress
It is loaded in chip and loads semiconductor laser chip to be measured on the 30a of position, locking member 324 is used to compress in pressure plate 323 and to be measured partly lead
Pressure plate 323 is locked when volumetric laser chip, locking member 324 can be bolt, and when locking is screwed onto pressure plate 323 and loading plate
On 321, locking member 324 or bolt, when locking, are plugged on pressure plate 323 and loading plate 321.
In the present embodiment, set on chip positioning plate 322 there are five chip load position 30a, pressure plate 323 with chip
It loads and is equipped with evacuation notch 323a on the opposite each position position 30a, avoid and extend outward core on the inner wall of notch 323a
Piece compact heap 323b, when compression, semiconductor laser chip setting to be measured loads in the 30a of position in chip, chip compact heap 323b pressure
At the top of semiconductor laser chip to be measured.
Chip power supply mechanism 40 include the third driver 41 that is arranged in second support 22 and with third driver 41
Connection for electric probe 42, connect power supply for electric probe 42 and the top of chip fixture 32 be set, in third driver 41
Under driving, is loaded in the 30a of position for the chip that electric probe 42 can drop into lower section and semiconductor laser chip to be measured is powered (connects
Obturator piece positive and negative anodes).In the present embodiment, third driver 41 is cylinder, and piston shaft end is connected for electric probe 42.?
In other embodiments, third driver 41 can be with other flexible actuators (such as hydraulic stem), or can also use motor,
And it is driven by ball leading screw driving structure or belt drive structure for electric probe 42.
It is tested to make the semiconductor laser chip to be measured in five chips loading position 30a that can connect with the mains,
Second support 22 is equipped with the fourth drive 25 connecting with chip loading platform 30, and 25 driving chip of fourth drive loads flat
Platform 30 slides in second support 22, so that each chip loading position 30a can be moved into and be right against for electric probe 42, so only
It need to arrange a chip power supply mechanism 40, both can satisfy all power demands for loading position, and reduced cost.Work as in the present embodiment
In, fourth drive 25 is motor, and the motor is mobile come driving chip loading platform 30 by ball leading screw driving structure,
In other embodiments, which can also be by belt drive structure come the movement of driving chip loading platform 30 or the 4th
Driver 25 can also be the flexible actuators such as cylinder, hydraulic stem.
The side in rack 10 and being located at rocking test mechanism 20 is arranged in test light beam mechanism 50, in rocking test
When mechanism 20 drives semiconductor laser chip to be measured to swing, photoelectric conversion is carried out to the light beam that semiconductor laser chip to be measured issues
Test, and obtain the test data of semiconductor laser chip to be measured, which is loaded into chip and loads position
On 30a.
Wherein, in the present embodiment, the test data includes LIV parameter, spectrum parameter and beam divergence angle, that is, is surveyed
Try semiconductor laser chip LIV parameter, spectrum parameter and beam divergence angle, LIV parameter include optical power (L), electric current (I) and
Voltage (V) parameter, spectrum parameter include central wavelength, peak wavelength, half-peak breadth etc..Correspondingly, test light beam mechanism 50 has
Body includes probe bracket 51, the first photoelectric sensor 52, the 5th driver (not shown), test controller (not shown), integral
The the second photoelectric sensor (not shown) and the spectrum being connect by optical fiber with integrating sphere 53 that ball 53 is arranged on integrating sphere 53
Instrument (not shown), probe bracket 51 are disposed therein on a support frame 12, and can the telescopic moving on support frame 12, probe bracket
51 are located at the side of chip loading platform 30, and the first photoelectric sensor 52 is arranged on one end of probe bracket 51, the 5th driving
Device is arranged on the rack and connect with probe bracket 51 far from one end of the first photoelectric sensor 52, for driving probe bracket 51
Side of the probe bracket 51 far from chip loading platform 30 is arranged in the telescopic moving on support frame 12, integrating sphere 53.Test control
Device processed is respectively with the first photoelectric sensor 52 and spectrometer communication connection, and the first photoelectric sensor 52 is for acquiring semiconductor to be measured
The light intensity data of laser chip in the horizontal direction, on vertical direction and other combination angle degree in swing process, then testing and control
Device can calculate semiconductor laser chip to be measured in the horizontal direction, vertically according to by angle scanning algorithm and the light intensity data
Beam divergence angle on direction and other angles, the second photoelectric sensor is for cooperating integrating sphere 53 to semiconductor laser chip
Light beam photoelectric conversion calculates to obtain optical power (L) etc. according to the photoelectric current after conversion, is connected to optical fiber on integrating sphere for part
Light beam is imported into spectrometer, is completed spectrum analysis, is obtained the parameters such as central wavelength, peak wavelength, half-peak breadth.5th driver
It can be cylinder, hydraulic stem, telescope motor, stepper motor or servo motor, when operation can be controlled by the controller, accurately to control
For electric probe 42, the shift motion of chip loading platform 30 and the first photoelectric sensor 52.In addition, in other embodiments,
Any one of need data to be tested and can also work as LIV parameter and beam divergence angle, or some tests can also be increased
Project, then a part of corresponding test structure can also be saved accordingly or be increased to test equipment.
It should be pointed out that beam divergence angle refers to that width of light beam or diameter increase with increasing with a distance from beam waist position
Angle, semiconductor laser chip issue laser beam intensity distribution generally by beam center, luminous intensity is gradually outside
Enhancing, outermost most weak, center is most strong, is based on this beam characteristics by angle scanning method, surveys the principle of beam divergence angle are as follows: when half
In at the uniform velocity reciprocally swinging on either vertically or horizontally direction, the laser beam issued is equally conductor Laser chip to go out luminous point
The center of circle, the distance of luminous point to detector (photoelectric sensor) is that radius does circular motion out, and light beam is horizontal or vertical when swing
Each point on direction can successively pass through detector, set reciprocally swinging angle are as follows:-a to a degree (under normal circumstances, vertical direction a=
60, horizontal direction a=20), and set the acquisition rate of detector are as follows: m point light is acquired during swinging to a degree from-a each time
By force, then being m parts by the angle bisecting of 2a, that is, 2a/m is divided between angle, by m point luminous intensity respectively with each angle points
It corresponds, so that it may draw out light intensity with the change curve of angle, thus it can be concluded that the dispersion angle of laser beam.
This test equipment, test process are described in detail below in conjunction with specific test process are as follows:
Semiconductor laser chip to be measured is loaded in chip first to load on the 30a of position, and is driven in third driver 41 and the 4th
Under the action of device 25, one of chip is made to load electrical measurement on the semiconductor laser chip to be measured (being set as A chip) on the 30a of position
Examination, then the 5th driver driving probe bracket 51 extends, and the first photoelectric sensor 52 is pushed into the position opposite with A chip
On, then 23 driving chip of the first driver loads position 30a around X-axis at the uniform velocity reciprocally swinging set angle, to drive A chip to exist
Corresponding swing is done on vertical direction, in this swing process, the first photoelectric sensor 52 carries out light to the light beam that A chip issues
Electricity conversion, constantly to acquire the strength information of light beam in the vertical direction, in the same way, 41 driving chip of the second driver
Position 30a at the uniform velocity reciprocally swinging set angle about the z axis is loaded, to drive A chip to do corresponding swing, the first light in the horizontal direction
The electric transducer 52 constantly strength information of acquisition light beam in the horizontal direction, test controller are obtaining A chip in the horizontal direction
After the light intensity data in vertical direction swing process, can calculate A chip in the horizontal direction with the light beam of vertical direction
The angle of divergence；
Then, the 5th driver driving probe bracket 51 retracts, and the light beam for issuing A chip enters in integrating sphere 51, and the
Optical power (L), electric current (I) and voltage (V) parameter are obtained under the induction of two photoelectric sensings.
In addition, in test, when 23 driving chip of the first driver is around X-axis at the uniform velocity reciprocally swinging, the second driver 24
Can by chip drives to being on any position, such as with X-axis on the position of 0 °, 30 °, 45 ° angle, meanwhile, when second
24 driving chip of driver about the z axis at the uniform velocity reciprocally swinging when, the first driver 23 can be by chip drives to being in any position
On, such as with Z axis in 0 °, 30 °, 45 ° angle position on, can thus have countless angle combinations by angle measurement,
After being measured one by one by angle measurement principle, the Two dimensional Distribution of the available entire light field of chip.It should be pointed out that in this hair
In bright some alternative embodiments, which can also have for defensive shell, fill for the illumination of illumination
It sets and the display equipment for showing test data, in addition photoelectric sensor can also connect PD signal amplifier, to light
The electric signal of electricity conversion amplifies.
To sum up, the test equipment in the present embodiment, the rocking test swung by setting driving chip loading platform 30
Mechanism 20 simultaneously carries out photoelectric conversion to light beam in the setting of the side of the rocking test mechanism 20 to obtain the light of test data of chip
Beam mechanism for testing 50, with by data such as the beam divergence angles for testing semiconductor laser chip by angle scanning method, when test
Without finding the focus point of light beam, aperture and carried out to alignment without replacement, in addition, this equipment one kind has also been devised can
The rocking test mechanism 30 that driving chip loading platform is swung towards multiple directions, chip can under the driving of rocking test mechanism 30
Arbitrarily to swing in X-axis and Z axis, countless test angle combination is had in this way, makes once loading that can test chip multiple
The beam emissions angle in direction improves the comprehensive of testing efficiency and data, can also test to obtain the two dimension of the entire light field of chip
Distribution.
Fig. 6 is please referred to, the test equipment of the semiconductor laser chip in second embodiment of the invention, the present embodiment are shown
The difference of the test equipment in test equipment and first embodiment in the middle is:
Test light beam mechanism 50 further includes mobile linear mould group 54, and mobile linear mould group 54 is arranged on bottom plate 11, integrating sphere 53
It is arranged in the linear mould group 54 of movement, to be moved under the driving of the linear mould group 54 of movement close to or far from chip loading platform 30
It is dynamic, to meet the requirement of different chip testing distances.
In the specific implementation, mobile linear mould group 54 can be the modular form of ball-screw and linear guide cooperation,
It can be the modular form of synchronous belt and synchronous pulley cooperation.
It should be pointed out that some technologies of device provided by second embodiment of the invention, realization principle and generation
Effect is identical with first embodiment, and to briefly describe, the present embodiment does not refer to place, can refer in corresponding in first embodiment
Hold.
Another aspect of the present invention also proposes a kind of test method of semiconductor laser chip, please refers to Fig. 7, show this hair
The test method of semiconductor laser chip in bright 3rd embodiment, it is real that the test method can be applied to the above-mentioned first or second
It applies in the test equipment in example, can specifically apply in the test controller of the test equipment, the test method includes
Step S1- step S4:
Step S1 sends power supply signal to third driver, so as to be displaced downwardly to for electric probe to being currently located at below to be measured
Semiconductor laser chip is powered.
Specifically, before this step, it is also necessary to semiconductor laser chip to be measured is mounted in each chip in advance and is loaded on position, and
Can be mobile come driving chip loading platform using fourth drive, one of them semiconductor laser chip to be measured is in power supply
On designated position below probe.
Step S2 sequentially drives to the first driver and second when the semiconductor laser chip power up test to be measured
Device sends default driving signal corresponding with the semiconductor laser chip to be measured, with the pendulum set by the default driving signal
Angle drives the semiconductor laser chip to be measured sequentially around X-axis and Z axis at the uniform velocity reciprocally swinging.
It is pointed out that different types of semiconductor laser chip, because of its beam emissions angle difference, therefore can set
Different test swing angle, to be converted to different default driving signals.Driver (motor) receive it is any pre-
If when driving signal, the motor turnning circle operation of driving signal setting can be preset by this, to drive semiconductor laser core
Piece swings set angle.In addition, semiconductor laser chip can identical may be used around the angle that X-axis is swung with Z axis in test
With difference, can be controlled by sending different driving signals.
Specifically, the detailed process of this step can be with are as follows: first sends and semiconductor laser chip to be measured to the first driver
Corresponding first default driving signal, so as to partly be led by the pivot angle driving that the first driver first presets driving signal setting is to be measured
Volumetric laser chip is sequentially around X-axis at the uniform velocity reciprocally swinging, after duration of oscillation reaches setting time, then to the second driver send with to
The corresponding second default driving signal of semiconductor laser chip is surveyed, so as to preset driving signal setting by the second driver first
Pivot angle drives semiconductor laser chip to be measured sequentially at the uniform velocity reciprocally swinging about the z axis.
Step S3, during the semiconductor laser chip to be measured is swung, by test light beam mechanism constantly to institute
It states the light beam that semiconductor laser chip to be measured issues and carries out photoelectric conversion, existed with respectively obtaining the semiconductor laser chip to be measured
Light intensity data around X-axis and in swing process about the z axis.
Step S4 calculates the beam divergence angle of semiconductor laser chip to be measured according to the light intensity data.
It should be pointed out that, when the first driver driving chip is around X-axis at the uniform velocity reciprocally swinging, second drives in test
Dynamic device can by chip drives to being on any position, such as with X-axis on the position of 0 °, 30 °, 45 ° angle, meanwhile, when
Second driver driving chip about the z axis at the uniform velocity reciprocally swinging when, the first driver can be by chip drives to being in any position
On, such as with Z axis in 0 °, 30 °, 45 ° angle position on, can thus have countless angle combinations by angle measurement,
After being measured one by one by angle measurement principle, the Two dimensional Distribution of the available entire light field of chip.
Based on this, in some alternative embodiments of the present invention, after step s4, the survey of the semiconductor laser chip
Method for testing can with the following steps are included:
According to calculate come each angle dispersion angle, draw out the Two dimensional Distribution of the far field of semiconductor laser chip.
It should be pointed out that multiple angles must be combined and be tested in the light field Two dimensional Distribution for needing to draw chip,
To obtain the light intensity data in multiple angles, and the corresponding dispersion angle of light intensity data for calculating each angle, so
The Two dimensional Distribution of the far field of semiconductor laser chip is drawn out according to this calculated multiple dispersion angle afterwards.
To sum up, the test method in the present embodiment, by the light for testing semiconductor laser chip by angle scanning method
The data such as beam divergence angle without replacement aperture and are carried out to alignment without finding the focus point of light beam when test, in addition,
It is arbitrarily swung in X-axis and Z axis by driving chip, has countless test angle combination in this way, making once to load can survey
The beam emissions angle of chip multiple directions is tried, the comprehensive of testing efficiency and data is improved, can also test to obtain chip entire
The Two dimensional Distribution of light field.The embodiments described above only express several embodiments of the present invention, and description is more specific and detailed
Carefully, but it cannot be understood as limitations on the scope of the patent of the present invention.It should be pointed out that for the common skill of this field
For art personnel, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to this hair
Bright protection scope.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (8)
1. a kind of test equipment of semiconductor laser chip characterized by comprising
Rack；
Rocking test mechanism in the rack, the rocking test mechanism include swinging the first of connection with the rack
Bracket swings the opposite rack of second support, the driving first support of connection is swung first with the first support
The second driver that driver and the relatively described first support of the driving second support are swung, the pendulum of the first support
Moving axis is X-axis, and the swinging axle of the second support is Z axis, and X-axis and Z axis are spatially arranged in a crossed manner；
Chip loading platform is arranged in the second support, which is provided with an at least chip and loads position；
Test light beam mechanism is arranged in the rack and is located at the side of the rocking test mechanism, in the swing
When mechanism for testing drives semiconductor laser chip to be measured to swing, the light beam issued to the semiconductor laser chip to be measured carries out light
Electric conversion testing, and obtain the beam divergence angle of the semiconductor laser chip to be measured, the semiconductor laser chip dress to be measured
The chip is loaded in load on position；
Wherein, the test light beam mechanism includes:
Probe bracket is arranged in the rack, and is located at the side of the chip loading platform；
First photoelectric sensor is arranged on the probe bracket；
5th driver is arranged in the rack and for driving probe bracket telescopic moving in the rack；
The test light beam mechanism is also used to test the LIV parameter and spectrum parameter of semiconductor laser chip, and the light beam is surveyed
Test-run a machine structure further include:
Side of the probe bracket far from the chip loading platform is arranged in integrating sphere；
The second photoelectric sensor on the integrating sphere is set；
The spectrometer being connect by optical fiber with the integrating sphere；And
Mobile linear mould group, is arranged in the rack, and the integrating sphere is arranged in the linear mould group of the movement, described
It is mobile close to or far from the chip loading platform under the driving of mobile linear mould group.
2. the test equipment of semiconductor laser chip according to claim 1, which is characterized in that the semiconductor laser core
The test equipment of piece further include:
Chip power supply mechanism is connect including the third driver being arranged in the second support and with the third driver
For electric probe, it is described to fall into the chip for electric probe and load in position to be measured half under the driving of the third driver
Conductor Laser chip is powered.
3. the test equipment of semiconductor laser chip according to claim 2, which is characterized in that set in the second support
There is the fourth drive connecting with the chip loading platform, the fourth drive drives the chip loading platform described
Slided in second support so that each chip load position can be moved into be right against it is described for electric probe.
4. the test equipment of semiconductor laser chip according to claim 1, which is characterized in that the chip loading platform
Including the temperature control console being arranged in the second support and the chip fixture being stacked at the top of the temperature control console.
5. the test equipment of semiconductor laser chip according to claim 4, which is characterized in that the chip fixture packet
It includes:
Loading plate is stacked on the top of the temperature control console；
Chip positioning plate is stacked on the top of the loading plate, and the chip loads position and is arranged in the chip positioning
On plate；And
Pressure plate is rotatablely connected at the top of the loading plate, and can turn to compress be loaded in the chip load on position to
Survey semiconductor laser chip.
6. the test equipment of semiconductor laser chip according to claim 5, which is characterized in that the pressure plate with institute
It states chip and loads the opposite position in position equipped with notch is avoided, extend outward chip compression on the inner wall of the evacuation notch
Block.
7. the test equipment of semiconductor laser chip according to claim 5 or 6, which is characterized in that the chip fixture
It further include locking member, for locking the pressure plate when the pressure plate compresses semiconductor laser chip to be measured.
8. a kind of test method of semiconductor laser chip, which is characterized in that be applied to the described in any item surveys of claim 1-7
It tries in equipment, the test method includes:
When a semiconductor laser chip power up test to be measured, sequentially to the first driver and the second driver send with it is described to
The corresponding default driving signal of semiconductor laser chip is surveyed, with described to be measured by the pivot angle driving of the default driving signal setting
Semiconductor laser chip is sequentially around X-axis and Z axis at the uniform velocity reciprocally swinging；
During the semiconductor laser chip to be measured is swung, by test light beam mechanism constantly to the semiconductor to be measured
The light beam that laser chip issues carries out photoelectric conversion, to respectively obtain the semiconductor laser chip to be measured around X-axis and around Z
Light intensity data in axis swing process；
According to the light intensity data, the beam divergence angle of semiconductor laser chip to be measured is calculated.
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Denomination of invention: A testing equipment and method for semiconductor laser chips Effective date of registration: 20230922 Granted publication date: 20191217 Pledgee: CITIC Bank Nanchang branch of Limited by Share Ltd. Pledgor: JIANGXI DERAY PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Registration number: Y2023980058519 |