CN111624456B - Test system of laser - Google Patents
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- CN111624456B CN111624456B CN202010374728.6A CN202010374728A CN111624456B CN 111624456 B CN111624456 B CN 111624456B CN 202010374728 A CN202010374728 A CN 202010374728A CN 111624456 B CN111624456 B CN 111624456B
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- 238000012360 testing method Methods 0.000 title claims abstract description 194
- 239000004065 semiconductor Substances 0.000 claims abstract description 79
- 230000003287 optical effect Effects 0.000 claims abstract description 51
- 238000001228 spectrum Methods 0.000 claims abstract description 48
- 230000003595 spectral effect Effects 0.000 claims description 45
- 239000013307 optical fiber Substances 0.000 claims description 32
- 239000000835 fiber Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims 2
- 238000001514 detection method Methods 0.000 description 7
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000013522 software testing Methods 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
- G01J3/0254—Spectrometers, other than colorimeters, making use of an integrating sphere
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2637—Circuits therefor for testing other individual devices
Abstract
The embodiment of the invention discloses a test system of a laser, which comprises: PIV test module, PIV test module includes: a PIV test assembly and a temperature control assembly; the control module is used for sending out a PIV test instruction and a spectrum test instruction; the spectrum testing module is used for receiving the spectrum testing instruction sent by the control module and responding TO the spectrum testing instruction TO test the spectrum characteristic of the coaxial packaged (TO-Can) semiconductor laser TO obtain spectrum characteristic data; the temperature control assembly is used for receiving the PIV test instruction sent by the control module and responding TO the PIV test instruction TO control the temperature of the TO-Can semiconductor laser TO be a preset temperature; the PIV testing component is used for receiving a PIV testing instruction sent by the control module, responding TO the PIV testing instruction and carrying out PIV testing on the TO-Can semiconductor laser based on a first optical signal TO obtain PIV testing data; and the first optical signal is emitted by the TO-Can semiconductor laser when the temperature is a preset temperature.
Description
Technical Field
The invention relates to the field of optical communication, in particular to a test system of a laser.
Background
When a coaxially-packaged (TO-Can) semiconductor laser is tested, the spectral characteristics and PIV characteristics of the TO-Can semiconductor laser need TO be tested. In the relative technology, the PIV test of the TO-Can semiconductor laser generally adopts a method of receiving light by an integrating sphere TO test; the spectral test of the TO-Can semiconductor laser needs TO couple light emitted by the TO-Can semiconductor laser into an optical fiber, generally needs manual coupling TO meet the test requirement, and generally needs TO independently build a spectral test bench. However, the PIV test and the spectrum test of the TO-Can semiconductor laser require different devices for detection, and different test devices are required, which results in high cost and low detection efficiency.
Disclosure of Invention
In view of this, embodiments of the present invention are expected TO provide a laser test system, which integrates a PIV test and a spectrum test of a TO-Can semiconductor laser into one test system, and solves the problem of low efficiency of the spectrum test and the PIV test of the TO-Can semiconductor laser in the related art, thereby greatly improving the detection efficiency and reducing the cost.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
a system for testing a laser, comprising:
a PIV test module, the PIV test module comprising: a PIV test component and a temperature control component;
the control module is used for sending a PIV test instruction and a spectrum test instruction;
the spectrum testing module is used for receiving the spectrum testing instruction sent by the control module and responding the spectrum testing instruction TO test the spectrum characteristics of the TO-Can semiconductor laser TO obtain spectrum characteristic data;
the temperature control assembly is used for receiving the PIV test instruction sent by the control module and responding TO the PIV test instruction TO control the temperature of the TO-Can semiconductor laser TO be a preset temperature;
the PIV test component is used for receiving a PIV test instruction sent by the control module, responding TO the PIV test instruction and carrying out PIV test on the TO-Can semiconductor laser based on a first optical signal TO obtain PIV test data; and the first optical signal is emitted by the TO-Can semiconductor laser when the temperature is the preset temperature.
Optionally, the spectrum testing module is further configured to send the spectral characteristic data to the control module;
the PIV testing component is also used for sending the PIV testing data to the control module;
the control module is further configured to receive the PIV test data and the spectral characteristic data, analyze the PIV test data to obtain first data, analyze the spectral characteristic data to obtain second data, and store and display the first data and the second data.
Optionally, the spectral test module comprises: an optical signal receiving assembly and a spectral line analysis assembly, wherein:
the optical signal receiving assembly is used for receiving a second optical signal emitted by the TO-Can semiconductor laser under the action of the PIV testing assembly and sending the optical signal TO the spectral line analyzing assembly;
the spectral line analysis component is used for analyzing and processing the second optical signal to generate spectral characteristic data and sending the spectral characteristic data to the control module.
Optionally, the PIV testing assembly includes: an integrating sphere and a power controller; wherein:
the first end of the integrating sphere is connected with the first end of the control module, and the second end of the integrating sphere receives the first optical signal;
the input end of the power controller is connected with the second end of the control module, and the output end of the power controller is externally connected with the TO-Can semiconductor laser;
the power controller is used for receiving the PIV test instruction and responding TO the PIV test instruction TO control the power of the TO-Can semiconductor laser;
the integrating sphere is used for receiving the PIV test instruction and responding to the PIV test instruction to carry out PIV test on the first optical signal to obtain the PIV test data.
Optionally, the integrating sphere moves towards the direction close TO the TO-Can semiconductor laser, so that the second end of the integrating sphere receives a first optical signal emitted by the TO-Can semiconductor laser.
Optionally, the integrating sphere is further configured to send the PIV test data to the control module.
Optionally, the optical signal receiving component comprises a multimode optical fiber, and the spectral line analysis component comprises a spectrometer, wherein:
the first end of the multimode optical fiber is connected with the third end of the integrating sphere, and the second end of the multimode optical fiber is connected with the input end of the spectrometer;
the integrating sphere drives the multimode optical fiber TO move when moving, so that the multimode optical fiber receives a second optical signal emitted by the TO-Can semiconductor laser;
the spectrometer is used for performing spectral analysis processing on the second optical signal to obtain the spectral characteristic data.
Optionally, the output end of the spectrometer is connected with the third end of the control module;
the spectrometer is further configured to send the spectral characteristic data to the control module.
Optionally, the optical signal receiving assembly further comprises an optical fiber ferrule;
the optical fiber sleeve rod is connected with the third end of the integrating sphere;
the first end of the multimode optical fiber is sleeved in the optical fiber loop bar;
and when the integrating sphere moves, the optical fiber sleeve rod is driven TO move towards the direction close TO the TO-Can semiconductor laser, so that the multimode optical fiber is coupled with the TO-Can semiconductor laser and receives the second optical signal.
Optionally, the test system further comprises a driving module;
the first end of the driving module is connected with the fourth end of the control module, and the second end of the driving module is connected with the fourth end of the integrating sphere;
the control module is also used for sending a position moving instruction to the driving module while sending the PIV test instruction or the spectrum test instruction;
and the driving module is used for receiving the position movement instruction and responding to the position movement instruction to drive the integrating sphere to move.
Optionally, the test system further comprises a slide rail;
the driving module drives the integrating sphere TO move on the slide rail so that the integrating sphere receives a first optical signal emitted by the TO-Can semiconductor laser;
or the driving module drives the integrating sphere TO move on the slide rail and drives the multimode optical fiber TO move so that the multimode optical fiber receives a second optical signal emitted by the TO-Can semiconductor laser.
According TO the test system of the laser, the control module Can respectively control the PIV test module and the spectrum test module TO carry out PIV test and spectrum characteristic test on the TO-Can semiconductor laser, so that the PIV test and the spectrum test of the TO-Can semiconductor laser are integrated into one test system, the problem that the spectrum test and the PIV test efficiency of the TO-Can semiconductor laser are low in the relative technology is solved, the detection efficiency is greatly improved, and the cost is reduced.
Drawings
FIG. 1 is a schematic structural diagram of a laser testing system according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another laser testing system according to the present invention;
FIG. 3 is a schematic structural diagram of a testing system for a laser according to another embodiment of the present invention;
FIG. 4 is a schematic top view of an integrating sphere and optical fiber rod set connection structure of a laser testing system according to an embodiment of the present invention;
FIG. 5 is a schematic bottom view of an integrating sphere and an optical fiber rod set connection structure of a laser testing system according to an embodiment of the present invention;
fig. 6 is a schematic diagram illustrating a spectrum test result of a laser test system according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
An embodiment of the present invention provides a test system for a laser, as shown in fig. 1, the test system includes: a PIV test module 100, a control module 200, and a spectral test module 300, wherein the PIV test module 100 includes: a PIV test assembly 110 and a temperature control assembly 120;
the control module 200 is used for sending a PIV test instruction and a spectrum test instruction;
the spectrum testing module 300 is configured TO receive a spectrum testing instruction sent by the control module 200, and test the spectral characteristics of the TO-Can semiconductor laser 400 in response TO the spectrum testing instruction TO obtain spectral characteristic data;
the temperature control component 120 is used for receiving the PIV test instruction sent by the control module 200 and responding TO the PIV test instruction TO control the temperature of the TO-Can semiconductor laser 400 TO be a preset temperature;
the PIV test component 110 is used for receiving a PIV test instruction sent by the control module 200, responding TO the PIV test instruction and carrying out PIV test on the TO-Can semiconductor laser 400 based on the first optical signal TO obtain PIV test data;
the first optical signal is emitted by the TO-Can semiconductor laser when the temperature is the preset temperature.
In the embodiment, when a coaxial package TO-Can semiconductor laser is subjected TO PIV test, a PIV test instruction is sent TO the PIV test module 100 through the control module 200, and the PIV test module 100 responds TO the PIV test instruction; and the temperature control assembly 120 in the PIV test module simultaneously responds TO the PIV test instruction, the temperature of the TO-Can semiconductor laser 400 is controlled TO reach the preset temperature, the TO-Can semiconductor laser 400 sends out a first optical signal after reaching the preset temperature, and the PIV test assembly 110 performs PIV test on the first optical signal TO obtain PIV test data. When performing a spectrum test, the control module 200 sends a spectrum test instruction TO the spectrum test module 300, and the spectrum test module 300 tests the spectral characteristics of the TO-Can semiconductor laser 400 in response TO the spectrum test instruction TO obtain spectral characteristic data. Therefore, the TO-Can semiconductor laser 400 Can be tested for two functions of PIV testing and spectrum testing in one system, so that the detection efficiency is greatly improved, and the equipment utilization rate is improved.
In the present embodiment, the control module 200 is an electronic control device including, but not limited to, a PC, a tablet PC, etc. equipped with PIV testing software and spectrum testing software. In one possible implementation, the TO-Can semiconductor laser 400 may be a coaxial package refrigerated semiconductor laser.
In other embodiments of the present invention, temperature control component 120 may comprise a TEC control power supply and power controller 112 may comprise a power driven current source device.
In other embodiments of the present invention, the spectrum testing module 300 is further configured to send the spectrum characteristic data to the control module 200;
the PIV testing component 110 is also used for sending PIV testing data to the control module 200;
the control module 200 is further configured to receive the PIV test data and the spectral characteristic data, analyze the PIV test data to obtain first data, analyze the spectral characteristic data to obtain second data, and store and display the first data and the second data.
In this embodiment, the PIV test data includes, but is not limited to, the following parameters: presetting data indexes of temperature, threshold current, optical power, forward voltage drop, series resistance and EA current; the preset temperature is a standard constant test temperature TO be reached by testing the TO-Can semiconductor laser 400, and the preset temperature is realized by controlling the temperature of the TO-Can semiconductor laser 400 by the temperature control assembly 120.
The EA current is the current value of the electro-absorption modulator in the test TO-Can semiconductor laser 400. Spectral characteristic data includes, but is not limited to, the following parameters: wavelength-to-Side Mode Suppression Ratio (SMSR) test value.
The first data refers to more visual display data obtained after the PIV test data is processed and analyzed by the control module 200, the second data refers to more visual display image data obtained after the spectrum test data is analyzed and processed by the control module 200, and the first data and the second data can be displayed through the control module 200, stored in the control module 200 and printed out through the control module 200.
In other embodiments of the present invention, as shown in FIG. 3, the EA current is recorded by an ammeter 600, and the optical power is converted TO current by the integrating sphere 111 receiving the first optical signal emitted by the TO-Can semiconductor laser 400 and tested by a power test meter 500.
In other embodiments of the present invention, when the PIV test is performed, after the temperature control component 120 stabilizes the internal temperature of the TO-Can semiconductor laser 400 at 45 °, the power controller 112 adjusts the current from 0 TO 80mA TO output the current TO the TO-Can semiconductor laser 400, and at this time, the integrating sphere 111 receives the first optical signal generated by the TO-Can semiconductor laser 400, and the integrating sphere 111 converts the first optical signal into PIV test data and then transmits the PIV test data TO the control module 200. The mode control module 200 may obtain first data after analyzing and processing the PIV test data, and the first data may be stored in a form shown in table 1.
TABLE 1
In other embodiments of the present invention, as shown in FIG. 2, the spectral test module 300 includes: an optical signal receiving component 310 and a spectral line analysis component 320, wherein:
the optical signal receiving component 310 is used for receiving a second optical signal emitted by the TO-Can semiconductor laser 400 under the action of the PIV testing component 110 and sending the optical signal TO the spectral line analyzing component 320;
the spectral line analysis component 320 is configured to analyze and process the second optical signal to generate spectral characteristic data, and send the spectral characteristic data to the control module 200.
In other embodiments of the present invention, as shown in FIG. 3, the PIV test assembly 110 includes: an integrating sphere 111 and a power controller 112; wherein:
the first end of integrating sphere 111 is connected with the first end of control module 200, and the first end of integrating sphere 111 and the first end of control module 200 are connected through a wire or data for data or power transmission. The second end of the integrating sphere 111 receives light TO be measured emitted by the TO-Can semiconductor laser 400; the second end of the integrating sphere 111 is a light-receiving port of the integrating sphere 111.
And the integrating sphere 111 is used for receiving the PIV test instruction and responding the PIV test instruction to carry out PIV test on the light to be tested to obtain PIV test data.
And a power controller 112 for receiving the PIV test command from the control module 200 and controlling the power of the TO-Can semiconductor laser 400 in response TO the PIV test command.
The input end of the power controller 112 is connected to the second end of the control module 200, and the input end of the power controller 112 is connected to the second end of the control module 200 through a data line; the control module 200 is capable of receiving the power output value sent by the control module 200 and also sending the current output power value to the control module 200. The output of the power controller 112 is externally connected TO the TO-Can semiconductor laser 400 by a wire.
In other embodiments of the present invention, integrating sphere 111 is further configured to send PIV test data to control module 200; the integrating sphere 111 sends the PIV test data to the control module 200 through a data line, so that the control module 200 performs analysis processing to obtain first data.
In other embodiments of the present invention, the optical signal receiving component 310 comprises a multimode optical fiber 311, and the spectral line analyzing component 320 comprises a spectrometer 321, wherein:
the first end of the multimode optical fiber 311 is connected with the third end of the integrating sphere 111; the first end of the multimode optical fiber 311 is a light receiving port of the multimode optical fiber 311.
The end of the light-receiving port of the multimode fiber 311 is connected to the integrating sphere 111 through a connector, and the connector assembly is a third end of the integrating sphere and is preset on the integrating sphere 111. The integrating sphere 111 drives the multimode fiber 311 TO move, so that the multimode fiber 311 receives the second optical signal emitted by the TO-Can semiconductor laser 400.
The second end of the multimode optical fiber 311 is connected with the input end of the spectrometer 321;
the spectrometer 321 is configured to obtain spectral characteristic data by performing analysis processing on the second optical signal.
In other embodiments of the present invention, the output terminal of the spectrometer 321 is connected to the third terminal of the control module 200;
specifically, the output end of the spectrometer 321 is connected to the control module 200 through a data line;
the spectrometer 321 is also used to send spectral characteristic data to the control module 200.
In other embodiments of the present invention, as shown in fig. 4 and 5, the optical signal receiving assembly 310 further comprises a fiber ferrule 312, wherein:
the optical fiber sleeve rod 312 is connected with the third end of the integrating sphere; the first end of the multimode optical fiber 311 is sleeved in the optical fiber loop bar 312; one end of the light receiving port of the multimode fiber 311 is sleeved on the fiber loop bar 312.
When the integrating sphere 111 moves, the optical fiber sleeve 312 is driven TO move towards the direction close TO the TO-Can semiconductor laser 400, so that the multimode optical fiber 311 is coupled with the TO-Can semiconductor laser 400 and receives a second optical signal emitted by the TO-Can semiconductor laser 400.
In the process of optically coupling the multimode fiber 311 and the TO-Can semiconductor laser 400, the height of the multimode fiber 311 on the integrating sphere is set TO be close TO the focal length of the TO-Can semiconductor laser 400, and the maximum light emitted by the TO-Can semiconductor laser 400 Can be better found at the position for optically coupling.
In other embodiments of the present invention, when performing a spectrum test on the TO-Can semiconductor laser 400, the integrating sphere 111 drives the fiber rod 312 TO move TO a position right above the TO-Can semiconductor laser 400, the integrating sphere 111 drives the fiber rod TO rotate, at this time, the multimode fiber 311 starts TO couple with the second optical signal emitted by the TO-Can semiconductor laser 400, when the optical power received by the multimode fiber 311 reaches a set value, the coupling stops, and the spectrometer 321 records the spectral characteristic data at this time and sends the spectral characteristic data TO the control module 200. After receiving the spectral characteristic data, the control module 200 may process and analyze the spectral characteristic data to obtain second data, and display the second data in a manner as shown in fig. 6.
In other embodiments of the present invention, the test system further comprises a driver module (not shown in the figures);
the first end of the driving module is connected with the fourth end of the control module 200, and the second end of the driving module is connected with the fourth end of the integrating sphere 111;
the control module 200 is further configured to send a position movement instruction to the driving module while sending a PIV test instruction or a spectrum test instruction;
and the driving module is used for receiving the position movement instruction and responding to the position movement instruction to drive the integrating sphere 111 to move.
In other embodiments of the present invention, the driving module may be a stepping motor device or a slide cylinder device. The belt pulley in the stepping motor device drives the integrating sphere 111 to move, and the moving distance of the stepping motor device can be controlled through the control module 200. In addition, the integrating sphere 111 can be driven to move through the sliding table cylinder device, and the moving distance of the sliding table cylinder can be controlled through the control module 200.
In other embodiments of the present invention, the test system further comprises a slide rail (not shown in the figures);
the driving module drives the integrating sphere 111 TO move on the slide rail, so that the integrating sphere 111 receives a first optical signal emitted by the TO-Can semiconductor laser 400;
or, the driving module drives the integrating sphere 111 TO move on the slide rail and drives the multimode fiber 311 TO move, so that the multimode fiber 311 receives the second optical signal emitted by the TO-Can semiconductor laser 400.
In another embodiment of the present invention, the slide rail is provided with a plurality of measuring holes (not shown in the figure) for fixing the TO-Can semiconductor laser, and the driving module drives the integrating sphere TO move on the slide rail in a direction close TO the measuring holes. Through setting up this survey hole, can divide batch measurement a plurality of TO-Can semiconductor laser, promoted detection efficiency.
In other embodiments of the invention, a circuit board capable of being embedded with the TO-Can semiconductor laser is arranged below the slide rail; the circuit board is used for forming a power supply loop by the TO-Can semiconductor laser, the temperature control assembly and the power controller. Through setting up this circuit board, can be regular with the circuit that is connected with TO-Can semiconductor laser, improve efficiency of software testing.
According TO the test system of the laser, provided by the embodiment of the invention, the control module Can respectively control the PIV test module and the spectrum test module TO carry out PIV test and spectrum characteristic test on the TO-Can semiconductor laser, so that the PIV test and the spectrum test of the TO-Can semiconductor laser are integrated into one test system, the problem that the spectrum test and the PIV test efficiency of the TO-Can semiconductor laser are low in the relative technology is solved, the detection efficiency is greatly improved, and the labor cost is reduced.
In the description of the present invention, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," "some examples," or "other examples of the invention" or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In the present invention, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "connected" or "connected" and the like are to be construed broadly, and for example, may be fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature described. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or any other related technical fields, are included in the scope of the present invention.
Claims (8)
1. A system for testing a laser, comprising:
a PIV test module, the PIV test module comprising: a PIV test assembly; wherein, the PIV test subassembly includes: an integrating sphere; wherein the integrating sphere includes: a first end, a second end, a third end and a fourth end;
the control module is connected with the first end of the integrating sphere, and is used for sending a PIV test instruction and a spectrum test instruction and sending a position moving instruction while sending the PIV test instruction or the spectrum test instruction;
the spectrum testing module comprises an optical signal receiving component and a spectral line analyzing component;
the driving module is connected with the fourth end of the integrating sphere and used for driving the integrating sphere TO move close TO the TO-Can semiconductor laser of the coaxial package or move far away from the TO-Can semiconductor laser of the coaxial package according TO the position moving instruction;
the integrating sphere is used for moving TO a position close TO the coaxial packaging TO-Can semiconductor laser under the driving of the driving module when the control module transmits a PIV test instruction, and receiving a first optical signal transmitted by the coaxial packaging TO-Can semiconductor laser by using the second end TO obtain PIV test data;
the optical signal receiving assembly is connected with the third end of the integrating sphere and used for moving towards the position close TO the TO-Can semiconductor laser of the coaxial package along with the integrating sphere when the control module emits a spectrum test instruction, receiving a second optical signal emitted by the TO-Can semiconductor laser of the coaxial package and emitting the second optical signal TO the spectral line analysis assembly TO obtain spectral characteristic data.
2. The test system of claim 1,
the spectrum testing module is also used for sending the spectrum characteristic data to the control module;
the integrating sphere is also used for sending the PIV test data to the control module;
the control module is further configured to receive the PIV test data and the spectral characteristic data, analyze and process the PIV test data to obtain first data, analyze and process the spectral characteristic data to obtain second data, and store and display the first data and the second data.
3. The test system of claim 2,
the spectral line analysis assembly includes: and the spectrometer is used for analyzing and processing the second optical signal to generate spectral characteristic data and sending the spectral characteristic data to the control module.
4. The test system of claim 3, wherein the PIV test assembly further comprises: a power controller;
the input end of the power controller is connected with the second end of the control module, and the output end of the power controller is externally connected with the TO-Can semiconductor laser;
and the power controller is used for receiving the PIV test instruction and responding TO the PIV test instruction TO control the power of the TO-Can semiconductor laser.
5. The test system of claim 4, wherein the optical signal receiving assembly comprises a multimode optical fiber, wherein:
and the first end of the multimode optical fiber is connected with the third end of the integrating sphere, and the second end of the multimode optical fiber is connected with the input end of the spectrometer.
6. The test system of claim 5,
the output end of the spectrometer is connected with the third end of the control module;
the spectrometer is further configured to send the spectral characteristic data to the control module.
7. The test system of claim 5, wherein the optical signal receiving assembly further comprises a fiber optic ferrule;
the optical fiber sleeve rod is connected with the third end of the integrating sphere;
the first end of the multimode optical fiber is sleeved in the optical fiber sleeve rod.
8. The test system of claim 7, further comprising a slide;
the driving module is specifically used for driving the integrating sphere to move on the slide rail.
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|---|---|---|---|---|
| CN201993440U (en) * | 2010-12-16 | 2011-09-28 | 西安炬光科技有限公司 | Laser characteristic test device |
| CN109765473A (en) * | 2019-01-14 | 2019-05-17 | 武汉光迅科技股份有限公司 | A kind of high power laser test macro and method |
| CN110646725A (en) * | 2019-09-02 | 2020-01-03 | 深圳市极致兴通科技有限公司 | Rapid testing device and testing method for laser chip semi-finished product |
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2020
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