CN110315464A - A kind of metal micro member pick-up method based on electrochemical deposition - Google Patents
A kind of metal micro member pick-up method based on electrochemical deposition Download PDFInfo
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- CN110315464A CN110315464A CN201910722059.4A CN201910722059A CN110315464A CN 110315464 A CN110315464 A CN 110315464A CN 201910722059 A CN201910722059 A CN 201910722059A CN 110315464 A CN110315464 A CN 110315464A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/008—Gripping heads and other end effectors with sticking, gluing or adhesive means
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Abstract
A kind of metal micro member pick-up method based on electrochemical deposition, is related to a kind of metal micro member pick-up method.Purpose is to solve the problems, such as that existing metal micro member picks up difficult and easy damaged, pick-up method: calculating the minimum ozzle radius that can successfully pick up required pipette according to the stress condition for picking up object, chooses pipette；Steady-state current is calculated, deposition height and sedimentation time is calculated, powers on and be picked up.The pipette volume that uses is small when metal micro member of the present invention picks up, and can pick up a plurality of types of metal micro members and apply in manufacturing complicated MEMS, and when pickup does not damage metal micro member.The present invention is suitable for the pickup of metal micro member.
Description
Technical field
The present invention relates to a kind of metal micro member pick-up methods.
Background technique
Metal micro member refers to the component of micro-meter scale, more typically linear metal micro member, such as micro- copper wire.To gold
Belong to generally requiring when micro structures are assembled and be picked up using tool, it is desirable that micro structures can be turned over tool after pickup
The operation such as turn, move or align, and micro structures in operating process is required not fall or damage.
And existing pick-up method is to be clamped to operation object using mechanical operation tool such as micro-clipper etc.
Realize movement, but micro structures are small in size, and mechanical operation tool volume is larger, the operating process such as overturning, moving or aligning
In be easy to generate micro structures irreversible damage, and falling for micro structures easily occurs.Therefore, existing mechanical operation work
Tool is only able to achieve the transfer of micro structures, and cannot achieve the complex operations such as the overturning of micro structures.
Summary of the invention
The present invention proposes a kind of base in order to which damage easily occurs when solving the problems, such as that existing metal micro member picks up or falls
In the metal micro member pick-up method of electrochemical deposition.
The present invention is based on the metal micro member pick-up methods of electrochemical deposition to follow the steps below:
Step 1: the minimum ozzle radius that can successfully pick up required pipette is calculated according to the stress condition of micro structures
rNozzle；
The stress condition of the metal micro member meets formula (1):
FVDW+ G=σe*SNozzle (1)
In formula (1), FVDWThe Van der Waals force generated between the metal micro member and substrate of unit length, unit N；G
For the gravity of metal micro member, unit N；σeFor the tensile strength of metal micro member, unit MPa；SNozzleFor pipette pipe
The cross-sectional area of mouth, unit mm2；WhenWhen ignore gravity；
Step 2: taking ozzle radius is rNozzlePipette；It is provided between the pipette tip and pipette body
Straight pipe, the radius of straight pipe are greater than pipette tip radius, and the radius of straight pipe is r, and pipette tip length is Ll；
Step 3: steady-state current i is calculated；
The expression formula of the steady-state current i are as follows:
In formula (5), Z is the corresponding metal ion charging number of metal micro member, Z=2；F is Faraday constant, F=
96485.3383C/mol；D is the diffusion coefficient of ion, unit m2/ s, D=2 × 10-10m2/s；L1It is ozzle length, unit
For m；C is the concentration of electrolyte, unit mol/m3；D is nozzle diameter, unit m；
Step 4: deposited metal height L is calculatedz；Deposited metal height LzFor deposited metal in pipette tip height and
The summation of the minimum constructive height of deposited metal in the straight pipe of pipette tip top；The deposited metal height LzExpression formula are as follows:
Lz=L1+h (6)
In formula (6), L1It is the length of pipette tip, i.e., the height of deposited metal, unit m in pipette tip；h
It is the minimum constructive height of deposited metal in straight pipe above pipette tip, unit m；
Step 5:, calculate deposited metal growth rate v；
The expression formula of the growth rate v of the deposited metal are as follows:
In formula (8), i indicates steady-state current；The molal weight of M expression deposited metal；The band of n expression metal ions
Electric number；F is Faraday constant；ρ is the density of deposited metal；DwFor the diameter of deposited metal, when deposited metal is in pipette pipe
When being formed in mouth, the diameter D of deposited metalwEqual to nozzle diameter d, when deposited metal is formed in the straight pipe of pipette,
The diameter D of deposited metalwEqual to 2 times of the radius r of straight pipe；
Step 6: it is L that height, which is calculated,zDeposited metal needed for sedimentation time t；
Step 7: metal micro member is placed in conductive substrates, the filling electrolyte into pipette, in pipette input end
It is arranged switching casing, the switching casing other end connects air inlet pipe, in switching casing sidewall opening, by microelectrode one end from reducing sleeve
Pipe sidewall opening is inserted into inside electrolyte, and then sealing adaptor sleeve side walls are open, and the microelectrode other end is connected to power supply sun
Pole, conductive substrates connect power cathode, and pipette is fixed on micromotion platform, pipette is moved to gold using micromotion platform
Belong to above micro structures；
It is passed through gas to the air inlet pipe of pipette, the electrolyte of pipette tip end face is made to form the electrolyte table of protrusion
Face, while reducing pipette to pipette tip using micromotion platform and contacting metal micro member, it is then turned on power supply and applies step
The three steady-state current i being calculated are deposited, sedimentation time t, after the completion of deposition mobile pipette and metal micro member with
Pipette is mobile, i.e. completion metal micro member picks up.
Further, F described in step 1VDWExpression formula are as follows:
In formula (2), R is the radius of metal micro member, unit m；d1Between metal micro member and conductive substrates
Distance, unit m；AHFor Hamaker constant, AH=1 × 10-19J。
Further, the expression formula of G described in step 1 are as follows:
G=mg=ρ π R2L*·g (3)
In formula (3), m is micro structures quality, unit Kg, m=ρ π R2L*；G is acceleration of gravity, value 9.8N/
Kg；ρ is the density of micro structures, unit Kg/m3；R is micro structures radius, unit m；L*For micro structures length, unit m.
Further, S described in rapid oneNozzleExpression formula are as follows:
In formula (4), SNozzleFor the cross-sectional area of pipette tip, unit mm2.It calculates, is moved through formula (4)
The radius r of liquid pipe ozzleNozzle, unit mm.
Further, Step 2: in metallic element in electrolyte described in step 3 and step 7 and the micro- structure of metal
Metallic element is identical.
Further, the concentration of the electrolyte is 100~300mol/m3。
Further, above pipette tip described in step 4 in straight pipe the minimum constructive height h of deposited metal expression
Formula are as follows:
In formula (7), FVDWThe Van der Waals force generated between the metal micro member and substrate of unit length, unit N；σ
For the shearing strength of deposited metal, unit MPa.
Further, the expression formula of t described in step 6 are as follows:
Further, the gas being passed through described in step 7 into pipette is inert gas.
Further, the inert gas is nitrogen.
Further, the material of microelectrode described in step 7 is identical as deposited metal.
The principle of the invention are as follows:
Metal micro member is contacted with conductive substrates when the present invention picks up, filling electrolyte in pipette, pipette Inner electrolysis
Microelectrode is placed in liquid and is connected to power anode, and conductive substrates connect power cathode；Electrolyte and metal in pipette is micro-
Component connects into circuit.After energization, reduction reaction occurs at cathode, that is, metal micro member, between metal micro member and pipette
Metal deposit is generated, pipette and metal micro member bond at this time, complete picking action indirectly by mobile pipette.It needs to release
It only needs to be electrolysed after exchanging cathode and anode when putting, becomes electrolyte after metal deposit electrolysis, deposited metal disappears, withdraws
Pipette realizes release.
Under micro, because capillarity can generate absorption between the electrolyte in pipette and liquid relief inside pipe wall,
It is concave surface that absorption, which will lead to the electrolyte of pipette nozzle face, and the electrolyte of concave surface can not sufficiently connect between operation object
Touching, influences depositional area indirectly.The present invention applies pressure to electrolyte using the gas being passed through, and promotes pipette nozzle face
Electrolyte forms the liquid surface of protrusion, makes to come into full contact between electrolyte and operation object, ensure that the area of deposition, then
Improve the success rate of pickup.
The beneficial effects of the present invention are:
1, the pipette volume used when metal micro member of the present invention picks up is small, can apply and manufacture complicated micro-electro-mechanical systems
In system.
2, existing mechanical operation tool is only able to achieve the transfer of micro structures, and micro structures are such as transferred to conductive substrates
On, but using mechanical operation tool to the overturnings of micro structures, the operation such as move or align when easily damage metal micro member.
The present invention realizes the pickup to metal micro member by metal deposit, by heavy between metal micro member and pipette
Product metal securely connects, and only needs to be electrolysed after exchanging cathode and anode when needing to discharge, and becomes electricity after metal deposit electrolysis
Liquid is solved, pipette is withdrawn and realizes release, therefore pick-up method of the present invention will not cause irreversible damage to metal micro member, by
It is securely connected between metal micro member and pipette by deposited metal, when operation will not fall, and can be realized metal
The overturning of micro structures such as moves or aligns at the operation.The success rate that the present invention picks up can reach 100%；And needs when picking up
Liquid relief tube preparation method it is simple, short preparation period, preparation cost is low.
3, compared with existing metal micro member pick-up method, the method for the present invention is adopted in electrolyte metallic element and gold
The metallic element belonged in micro- structure is identical, and the deposited metal of generation is identical as metal micro member, avoids current wave in deposition process
It is dynamic, it ensure that deposition quality.
Detailed description of the invention
The schematic diagram of pipette in Fig. 1 embodiment 1；
Fig. 2 is enlarged drawing at a in Fig. 1；
Pick process schematic diagram in Fig. 3 embodiment 1.
Specific embodiment
In order to keep the objectives, technical solutions, and advantages of the present invention more clear, with reference to the accompanying drawings and embodiments,
This hair is further described.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and unlimited
The fixed present invention.
Illustrate in conjunction with Fig. 1 and Fig. 2, metal micro member is micro- copper wire in the present embodiment, and the length of micro- copper wire is 400 μm, partly
Diameter is 20 μm.The electrolyte that the present embodiment uses is concentration 200mol/m3Copper-bath；
The present embodiment is followed the steps below based on the metal micro member pick-up method of electrochemical deposition:
Step 1: the minimum ozzle radius that can successfully pick up required pipette is calculated according to the stress condition of micro structures
rNozzle；
The stress condition of the micro structures meets formula (1):
FVDW+ G=σe*SNozzle (1)
In formula (1), FVDWThe Van der Waals force generated between the micro structures and substrate of unit length, unit are N；G is micro-
The gravity of component, unit are N；σeFor the tensile strength of micro structures, unit MPa, value 280MPa；SNozzleFor pipette
The cross-sectional area of ozzle, unit mm2；Due toTherefore ignore gravity, i.e. G=0；
In formula (2), R is the radius of metal micro member, and unit m, value is 2 × 10-5m；d1For metal micro member with
The distance between conductive substrates, unit m, d=2 × 10-10m；AHFor Hamaker constant, AH=1 × 10-19J；
G=mg=ρ π R2L*·g (3)
In formula (3), m is micro structures quality, unit Kg, m=ρ π R2L*；G is acceleration of gravity, value 9.8N/
Kg；ρ is the density of micro structures, unit Kg/m3, 8.9 × 103Kg/m3；R is micro structures radius, unit m, R=2 × 10-5；
L*For micro structures length, unit m, L*=4 × 10-4m；
In formula (4), SNozzleFor the cross-sectional area of pipette tip, unit mm2；
R in formula (4)NozzleFor the radius of pipette tip, unit mm is computed rNozzle=6 × 10-3Mm,；
Step 2: taking ozzle radius is rNozzlePipette (quartzy pipette)；The pipette tip and pipette master
Straight pipe is provided between body, the radius of straight pipe is greater than pipette tip radius, and the radius of straight pipe is r=10 × 10-6, move
Liquid pipe ozzle length is L1=5 × 10-6m；Wherein, the preparation of pipette tip and straight pipe uses existing micromachined work
Skill is completed；
Step 3: steady-state current i is calculated；
Wherein, Z is the charging number of copper ion, Z=2；F is Faraday constant, F=96485.3383C/mol；D is ion
Diffusion coefficient, unit m2/ s, D=2 × 10-10m2/s；L1It is ozzle length, unit m, L1=5 × 10-6m；C is electrolysis
The concentration of liquid, unit mol/m3, value 200mol/m3, d is nozzle diameter, and unit m, value is 12 × 10-6m；
Step 4: deposited metal height L is calculatedz；Deposited metal height LzFor deposited metal in pipette tip height and
The summation of the minimum constructive height of deposited metal in the straight pipe of pipette tip top；The deposited metal height LzExpression formula are as follows:
Lz=L1+h (6)
In formula (6), L1It is the length of pipette tip, i.e., the height of deposited metal in pipette tip；H is pipette
The minimum constructive height of deposited metal in the straight pipe of ozzle top；
The expression formula of the minimum constructive height h of deposited metal in the straight pipe of the pipette tip top are as follows:
In formula (7), FVDWThe Van der Waals force generated between the metal micro member and substrate of unit length, unit N；σ
For the shearing strength of deposited metal copper, unit MPa, value 150MPa.
It is computed, Lz=L1+ h=10 μm；
Step 5:, calculate deposited metal growth rate v；
The expression formula of the growth rate v of the deposited metal are as follows:
In formula (8), i indicates steady-state current, i=2.42 × 10-7A；M indicates the molal weight of deposited metal, takes M=
6.4×10-2Kg/mol；N indicates the electrification number of metal ions, takes n=2；F is Faraday constant, takes F=
96485.3383C/mol；ρ is the density of deposited metal, takes ρ=8.9 × 103Kg/m3；DwFor the diameter of deposited metal, work as deposition
When metal is formed in pipette tip, the diameter D of deposited metalwEqual to nozzle diameter d, i.e., the diameter of deposited metal in ozzle
Dw=12 × 10-6M, when deposited metal is formed in the straight pipe of pipette, the diameter D of deposited metalwEqual to straight pipe
2 times of radius r, i.e. Dw=20 × 10-6m；
Step 6: it is L that height, which is calculated,zDeposited metal needed for sedimentation time t；
The expression formula of the t are as follows:
It is computed to obtain t=238s；
Step 7: metal micro member is placed in conductive substrates (silicon base), the filling electrolyte into pipette, in liquid relief
Pipe input end is arranged switching casing, and the switching casing other end connects air inlet pipe, in switching casing sidewall opening, by microelectrode one end
It is inserted into inside electrolyte from switching casing sidewall opening, then sealing adaptor sleeve side walls are open, the connection of the microelectrode other end
To power anode, conductive substrates connect power cathode, and pipette is fixed on micromotion platform, using micromotion platform by pipette
It is moved to above metal micro member；
It is passed through gas to the air inlet pipe of pipette, the electrolyte of pipette tip end face is made to form the electrolyte table of protrusion
Face, while reducing pipette to pipette tip using micromotion platform and contacting metal micro member, it is then turned on power supply and applies step
The three steady-state current i being calculated are deposited, sedimentation time t, after the completion of deposition mobile pipette and metal micro member with
Pipette is mobile, i.e. completion metal micro member picks up.
The gas being passed through described in step 7 into pipette is nitrogen.
The material of microelectrode described in step 7 is identical as deposited metal.
The schematic diagram of pipette in Fig. 1 embodiment 1；1 is air inlet pipe in figure, and 2 be microelectrode, and 3 be switching casing, and 4 be electricity
Solve liquid；Fig. 2 is enlarged drawing at a in Fig. 1, and 5 straight pipes being arranged between pipette tip and pipette body in Fig. 2,6 be shifting
Liquid pipe ozzle, L are the length of pipette lower end ozzle；Pick process schematic diagram in Fig. 3 embodiment 1, d is the deposition generated in figure
Metal, e are ozzle, and f is micro structures；State a is pipette tip lower end shape after being passed through gas to the air inlet pipe of pipette in figure
At protrusion liquid level of electrolyte when schematic diagram；State b is to apply when steady-state current i is deposited and pipette tip end face
Contact schematic diagram when metal micro member；State c is schematic diagram when generating deposited metal in straight pipe.As shown in Figure 2, it deposits
Metal one end is connect with micro structures；Due to ozzle is relatively thin and straight pipe is thicker, deposited metal can form jail with pipette
Solid connection.
The pipette volume that the present embodiment micro structures use when picking up is small, can apply and manufacture complicated MEMS
In；The present embodiment realizes the pickup to metal micro member by metal deposit, only needs to exchange cathode and anode when needing to discharge
After be electrolysed, become electrolyte after metal deposit electrolysis, therefore avoid and directly contact to micro- using excessive operational instrument
Irreversible damage caused by component.The operation such as it can be realized the overturning of metal micro member, move or align using pipette, and
And securely connected between micro structures and pipette by deposited metal during making, when operation, will not fall.The present embodiment
The success rate of pickup can reach 100%；And the liquid relief tube preparation method needed when picking up is simple, short preparation period, preparation
It is at low cost.Compared with existing metal micro member pick-up method, the present embodiment method use electrolyte in metallic element with
Metallic element in the micro- structure of metal is identical, avoids current fluctuation in deposition process, ensure that deposition quality.
Claims (10)
1. a kind of metal micro member pick-up method based on electrochemical deposition, it is characterised in that: this method according to the following steps into
Row:
Step 1: the minimum ozzle radius that can successfully pick up required pipette is calculated according to the stress condition of metal micro member
rNozzle；
The stress condition of the metal micro member meets formula (1):
FVDW+ G=σe*SNozzle (1)
In formula (1), FVDWThe Van der Waals force generated between the metal micro member and substrate of unit length；G is metal micro member
Gravity；σeFor the tensile strength of metal micro member；SNozzleFor the cross-sectional area of pipette tip；WhenWhen
Ignore gravity；
Step 2: taking ozzle radius is rNozzlePipette；Straight tube is provided between the pipette tip and pipette body
Section, the radius of straight pipe are greater than pipette tip radius, and the radius of straight pipe is r, and pipette tip length is Ll；
Step 3: steady-state current i is calculated；
The expression formula of the steady-state current i are as follows:
In formula (5), Z is the corresponding metal ion charging number of metal micro member；F is Faraday constant, and D is the diffusion system of ion
Number；LlIt is ozzle length；C is the concentration of electrolyte；D is nozzle diameter；
Step 4: deposited metal height L is calculatedz；Deposited metal height LzFor the height and liquid relief of deposited metal in pipette tip
The summation of the minimum constructive height of deposited metal in the straight pipe of pipe ozzle top；The deposited metal height LzExpression formula are as follows:
Lz=L1+h (6)
In formula (6), Ll is the length of pipette tip, i.e., the height of deposited metal in pipette tip；H is pipette tip
The minimum constructive height of deposited metal in the straight pipe of top；
Step 5:, calculate deposited metal growth rate v；
The expression formula of the growth rate v of the deposited metal are as follows:
In formula (8), i indicates steady-state current；The molal weight of M expression deposited metal；The electrification of n expression metal ions
Number；F is Faraday constant；ρ is the density of deposited metal: DwFor the diameter of deposited metal, when deposited metal is in pipette tip
When interior formation, the diameter D of deposited metalwEqual to nozzle diameter d；, when deposited metal is formed in the straight pipe of pipette, sink
The diameter D of product metalwEqual to 2 times of the radius r of straight pipe；
Step 6: it is L that height, which is calculated,zDeposited metal needed for sedimentation time t；
Step 7: metal micro member is placed in conductive substrates, the filling electrolyte into pipette, is arranged in pipette input end
Transfer casing, switching the casing other end connect air inlet pipe, switching casing sidewall opening, by microelectrode one end from switching casing side
Wall opening is inserted into inside electrolyte, and then sealing adaptor sleeve side walls are open, and the microelectrode other end is connected to power anode, leads
Electric substrate connects power cathode, and pipette is fixed on micromotion platform, and it is micro- that pipette is moved to metal using micromotion platform
Above component；
It is passed through gas to the air inlet pipe of pipette, so that the electrolyte of pipette tip end face is formed the electrolyte surface of protrusion, together
Shi Liyong micromotion platform reduces pipette to pipette tip and contacts metal micro member, is then turned on power supply and applies step 3 calculating
Obtained steady-state current i is deposited, sedimentation time t, deposits mobile pipette after the completion and metal micro member is with pipette
Mobile, i.e. completion metal micro member picks up.
2. the metal micro member pick-up method according to claim 1 based on electrochemical deposition, it is characterised in that: step 1
Described in FVDWExpression formula are as follows:
In formula (2), R is the radius of metal micro member；d1For the distance between metal micro member and conductive substrates；AHFor
Hamaker constant.
3. the metal micro member pick-up method according to claim 1 based on electrochemical deposition, it is characterised in that: step 1
Described in G expression formula are as follows:
G=mg=ρ π R2L*·g (3)
In formula (3), m is metal micro member quality；M=ρ π R2L*；G is acceleration of gravity；ρ is the density of metal micro member；
R is metal micro member radius；L*For metal micro member length.
4. the metal micro member pick-up method according to claim 1 based on electrochemical deposition, it is characterised in that: step 1
Described in SNozzleExpression formula are as follows:
In formula (4), SNozzleFor the cross-sectional area of pipette tip.
5. the metal micro member pick-up method according to claim 1 based on electrochemical deposition, it is characterised in that: step
Two, the metallic element in electrolyte described in step 3 and step 7 is identical as the metallic element in the micro- structure of metal.
6. the metal micro member pick-up method according to claim 5 based on electrochemical deposition, it is characterised in that: the electricity
The concentration for solving liquid is 100~300mol/m3。
7. the metal micro member pick-up method according to claim 1 based on electrochemical deposition, it is characterised in that: step 4
Described in above pipette tip in straight pipe the minimum constructive height h of deposited metal expression formula are as follows:
In formula (7), FVDWThe Van der Waals force generated between the metal micro member and substrate of unit length；σ is deposited metal
Shearing strength.
8. the metal micro member pick-up method according to claim 1 based on electrochemical deposition, it is characterised in that: step 6
Described in t expression formula are as follows:
。
9. the metal micro member pick-up method according to claim 1 based on electrochemical deposition, it is characterised in that: step 7
Described in the gas that is passed through into pipette be inert gas.
10. the metal micro member pick-up method according to claim 1 based on electrochemical deposition, it is characterised in that: step
The material of seven microelectrodes is identical as deposited metal.
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| CN111719178A (en) * | 2020-07-02 | 2020-09-29 | 橙河微系统科技(上海)有限公司 | Three-dimensional micro-area electrochemical deposition control method and adaptive system thereof |
| CN113496094A (en) * | 2021-07-07 | 2021-10-12 | 哈尔滨理工大学 | Method for manufacturing operation tool for electrochemical-based metal micro-component operation |
| CN114894860A (en) * | 2022-04-14 | 2022-08-12 | 哈尔滨理工大学 | Process monitoring method for metal micro-component operation based on electrochemistry |
| CN115079395A (en) * | 2022-07-06 | 2022-09-20 | 哈尔滨理工大学 | Operating device based on binocular microscopic visual servo |
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