CN110311028A - A kind of high brightness sheen Wide-angle LED lamp bead and production technology - Google Patents
A kind of high brightness sheen Wide-angle LED lamp bead and production technology Download PDFInfo
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- CN110311028A CN110311028A CN201910592300.6A CN201910592300A CN110311028A CN 110311028 A CN110311028 A CN 110311028A CN 201910592300 A CN201910592300 A CN 201910592300A CN 110311028 A CN110311028 A CN 110311028A
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- lamp bead
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention discloses a kind of high brightness sheen Wide-angle LED lamp bead and production technologies, more particularly to LED lamp bead production field, including bracket, the bracket is equipped with LED chip, the LED chip is equipped with lead, the frame bottom is set there are two pin, the bracket and pin are integrally formed, the LED chip is connected with pin by lead, antiultraviolet glue is packaged on the outside of the LED chip, it is equipped with phosphor powder layer on the outside of the antiultraviolet glue, is equipped with epoxy resin layer on the outside of the phosphor powder layer.By the present invention in that once being encapsulated with antiultraviolet glue to LED chip; the epoxy resin for being mixed with fluorescent powder is reused to LED chip progress secondary encapsulation; prevent outside line glue from can prevent ultraviolet light; it adequately protects to LED chip; effectively extend the service life of LED chip, phosphor powder layer increases the soft degree of light, and epoxy resin layer plays a protective role; entirety make it is of the invention the service life is longer, shine it is softer.
Description
Technical field
The present invention relates to LED lamp bead production technical fields, it is more particularly related to a kind of high brightness sheen wide-angle
LED lamp bead and production technology.
Background technique
LED, i.e. light emitting diode are a kind of solid state semiconductor devices that can convert electrical energy into visible light, it can
Directly to convert electricity to light.The heart of LED is the chip of a semiconductor, and one end of chip is attached on a bracket, one end
It is cathode, the other end connects the anode of power supply, is encapsulated entire chip by epoxy resin.LED is solid with elargol or white glue
Change onto bracket, is then sealed with silver wire or gold thread connection chip and circuit board, surrounding with epoxy resin, play protection inner core
The effect of line, finally installs shell, so the anti-seismic performance of LED light is good.
Semiconductor wafer consists of two parts, and a part is P-type semiconductor, and hole is occupied an leading position inside it, another
End is N-type semiconductor, is mainly electronics in this side.But when both semiconductors connect, just formation one between them
A P-N junction.When electric current acts on this chip by conducting wire, electronics will be pushed to the area P, and electronics is with sky in the area P
Cave is compound, and energy then will be issued in the form of photon, and here it is the principles that LED light shines.And the wavelength i.e. light of light
Color, be to be determined by the material of formation P-N junction.
LED lamp bead in the prior art is usually primary encapsulation, causes light emitting angle few, the lamp bead service life is short, polished bard eye.
Summary of the invention
In order to overcome the drawbacks described above of the prior art, the embodiment of the present invention provides a kind of high brightness sheen wide-angle LED lamp
Pearl and production technology once encapsulate LED chip by using antiultraviolet glue, reuse the epoxy for being mixed with fluorescent powder
Resin carries out secondary encapsulation to LED chip, prevents outside line glue from can prevent ultraviolet light, adequately protects to LED chip, has
Effect extends the service life of LED chip, and phosphor powder layer increases the soft degree of light, and epoxy resin layer plays a protective role, integrally makes
It is of the invention the service life is longer, shine it is softer.
To achieve the above object, the invention provides the following technical scheme: a kind of high brightness sheen Wide-angle LED lamp bead, including
Bracket, the bracket are equipped with LED chip, and the LED chip is equipped with lead, and the frame bottom is set there are two pin, institute
It states bracket and pin is integrally formed, the LED chip is connected with pin by lead, is packaged on the outside of the LED chip anti-
Ultraviolet light glue, the antiultraviolet glue outside are equipped with phosphor powder layer, are equipped with epoxy resin layer, institute on the outside of the phosphor powder layer
It states and is equipped with flame-retardant layer on the outside of epoxy resin layer, be equipped with protective layer on the outside of the flame-retardant layer, the bracket and pin include substrate,
The first layers of copper, nickel layer, the second layers of copper, silver layer and tin layers are successively arranged on the substrate from inside to outside.
A kind of production technology of high brightness sheen Wide-angle LED lamp bead, comprising the following steps:
Step 1: the production of bracket, to the substrate of bracket and pin once carry out the first layers of copper, nickel layer, the second layers of copper, silver layer and
The plating of tin layers；
Step 2: the production of antiultraviolet glue, antiultraviolet additive is added into silica gel, and carry out being mixed to form UV resistance
Line glue；
Step 3: LED chip, is fixed on the bracket by plating by primary encapsulation by die bond technology；
Step 4: secondary encapsulation, adds fluorescent powder in epoxy resin, then fluorescent powder and epoxy resin are carried out by centrifugation
Layering, fluorescent powder is precipitated downwards；
Step 5: molding, fire retardant is added into transparent wear material, then asphalt mixtures modified by epoxy resin will be wrapped in by mixed mixture
Rouge surface；
Step 6: polishing, polishes to molding LED light bead surface.
In a preferred embodiment, the step 1 is specifically, using electroplating device to bracket and its bottom
Pin substrate is electroplated, and electroplated layer is followed successively by the first layers of copper, nickel layer, the second layers of copper, silver layer and tin layers from inside to outside, into excessively electric
Dehumidifying is dried to bracket and pin using air-cooler after plating.
In a preferred embodiment, the step 2 specifically, into silica gel add antiultraviolet additive, make
Silica gel and antiultraviolet additive are carried out with mixing plant to be thoroughly mixed to form antiultraviolet glue used in primary encapsulate.
In a preferred embodiment, the step 3 in step 2 by mixing specifically, will be formed by anti-
Ultraviolet light glue by dispenser dispensing in LED chip, LED chip is fixed on bracket, and by two leads respectively with
Two pins are connected.
In a preferred embodiment, the step 4 is heated into specifically, add fluorescent powder into epoxy resin
It is liquid, dispenser is reused by epoxy resin and phosphor mixture dispensing to the outside of antiultraviolet glue, will entirely be propped up
Frame wraps up, and is then centrifuged using centrifuge to the bracket by package, is layered to fluorescent powder and epoxy resin,
Fluorescent powder, which is deposited in downwards on the inside of epoxy resin layer, forms phosphor powder layer, then stands again, waits its natural cooling.
In a preferred embodiment, the step 5 is specifically, using heating equipment to transparent wear material system
It is liquid at being heated into, then to fire retardant is added inside it, then epoxy resin layer will be applied to by mixed mixture
Surface is then allowed to stand and waits the molding of its natural cooling.
In a preferred embodiment, the step 6 is specifically, using grinding apparatus to molding in step 5
LED light bead surface is polished, and is processed by shot blasting to its surface, keeps its surface smooth, completes the life of LED lamp bead
It produces, finally reuses light splitting machine and brightness is distinguished as requested to the LED lamp bead of different brightness, pack respectively.
Technical effect and advantage of the invention:
1, by the present invention in that once being encapsulated with antiultraviolet glue to LED chip, the epoxy for being mixed with fluorescent powder is reused
Resin carries out secondary encapsulation to LED chip, prevents outside line glue from can prevent ultraviolet light, adequately protects to LED chip, has
Effect extends the service life of LED chip, and phosphor powder layer increases the soft degree of light, and epoxy resin layer plays a protective role, integrally makes
It is of the invention the service life is longer, shine it is softer；
2, the present invention can effectively increase the thermal conductivity of bracket and pin by copper and silver, can be sufficiently to LED chip work institute
The heat of generation is dissipated, and radiating efficiency is increased, and tin layers play protection to internal the first layers of copper, silver layer and the second layers of copper and make
With preventing the first layers of copper, silver layer and the second layers of copper to be oxidized influence electric conductivity, further increase service life of the invention；
3, the present invention, which is formed by flame-retardant layer by fire retardant, can play fine flame retardant effect, increase safety, transparent wear
Material, which is formed by protective layer, can effectively increase whole wear-resisting property, improve service life, to protective layer carry out polishing and
Polishing, can make its surface smooth, reduce to luminous adverse effect.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention.
Fig. 2 is schematic enlarged-scale view at A in Fig. 1 of the invention.
Fig. 3 is schematic enlarged-scale view at B in Fig. 1 of the invention.
Fig. 4 is bracket of the invention and pin sectional structure chart.
Fig. 5 is pin three-dimensional structure diagram of the invention.
Fig. 6 is bracket three-dimensional structure diagram of the invention.
Fig. 7 is production technological process of the invention.
Appended drawing reference are as follows: 1 bracket, 2 LED chips, 3 leads, 4 pins, 5 antiultraviolet glue, 6 phosphor powder layers, 7 epoxies
Resin layer, 8 flame-retardant layers, 9 protective layers, 10 substrates, 11 first layers of copper, 12 nickel layers, 13 second layers of copper, 14 silver layers, 15 tin layers.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
A kind of high brightness sheen Wide-angle LED lamp bead according to shown in Fig. 1-7, including bracket 1, the bracket 1 are equipped with LED
Chip 2, the LED chip 2 are equipped with lead 3, and 1 bottom of bracket is set there are two pin 4, and the bracket 1 and pin 4 are integrated
Molding, the LED chip 2 are connected with pin 4 by lead 3, are packaged with antiultraviolet glue 5 on the outside of the LED chip 2,
It is equipped with phosphor powder layer 6 on the outside of the antiultraviolet glue 5, is equipped with epoxy resin layer 7, the epoxy on the outside of the phosphor powder layer 6
It is equipped with flame-retardant layer 8 on the outside of resin layer 7, protective layer 9 is equipped on the outside of the flame-retardant layer 8, the bracket 1 and pin 4 include substrate
10, it is successively arranged the first layers of copper 11, nickel layer 12, the second layers of copper 13, silver layer 14 and tin layers 15 from inside to outside on the substrate 10.
A kind of production technology of high brightness sheen Wide-angle LED lamp bead, comprising the following steps:
Step 1: the production of bracket 1, once carries out the first layers of copper 11, nickel layer 12, the second bronze medal to the substrate 10 of bracket 1 and pin 4
The plating of layer 13, silver layer 14 and tin layers 15；
Step 2: the production of antiultraviolet glue 5, antiultraviolet additive is added into silica gel, and carry out being mixed to form anti-purple
Outside line glue 5；
Step 3: LED chip 2, is fixed on the bracket 1 by plating by primary encapsulation by die bond technology；
Step 4: secondary encapsulation, adds fluorescent powder in epoxy resin, then fluorescent powder and epoxy resin are carried out by centrifugation
Layering, fluorescent powder is precipitated downwards；
Step 5: molding, fire retardant is added into transparent wear material, then asphalt mixtures modified by epoxy resin will be wrapped in by mixed mixture
Rouge surface；
Step 6: polishing, polishes to molding LED light bead surface.
The step 1 using pin 4 substrate 10 of the electroplating device to bracket 1 and its bottom specifically, be electroplated, electricity
Coating is followed successively by the first layers of copper 11, nickel layer 12, the second layers of copper 13, silver layer 14 and tin layers 15 from inside to outside, uses into after crossing plating
Dehumidifying is dried to bracket 1 and pin 4 in air-cooler.
The step 2 is specifically, add antiultraviolet additive into silica gel, using mixing plant to silica gel and anti-purple
Outside line additive carries out being thoroughly mixed to form antiultraviolet glue 5 used in primary encapsulate.
The step 3 passes through dispenser point specifically, will pass through mixing in step 2 and be formed by antiultraviolet glue 5
LED chip 2 is fixed on bracket 1 by glue in LED chip 2, and two leads 3 are connected with two pins 4 respectively.
The step 4 is heated into liquid specifically, add fluorescent powder into epoxy resin, reuses dispenser for ring
Oxygen resin and phosphor mixture dispensing wrap up entire bracket 1 to the outside of antiultraviolet glue 5, then use from
Scheming is centrifuged the bracket 1 by package, is layered to fluorescent powder and epoxy resin, fluorescent powder is deposited in downwards epoxy
Phosphor powder layer 6 is formed on the inside of resin layer 7, is then stood again, is waited its natural cooling.
The step 5 specifically, transparent wear material is made using heating equipment be heated into it is liquid, then to it
Then addition fire retardant in inside will be applied to 7 surface of epoxy resin layer by mixed mixture, be then allowed to stand and wait its nature
It is cooled and shaped.
The step 6 is and right specifically, polished using grinding apparatus LED light bead surface molding in step 5
Its surface is processed by shot blasting, keeps its surface smooth, completes the production of LED lamp bead, finally reuses light splitting machine to difference
The LED lamp bead of brightness distinguishes brightness as requested, packs respectively.
Working principle of the present invention:
Referring to Figure of description 1-7, antiultraviolet additive is added into silica gel, using mixing plant to silica gel and antiultraviolet
Additive carries out being thoroughly mixed to form antiultraviolet glue 5 used in primary encapsulate, and antiultraviolet glue 5 can be effectively prevent
The radiation of ultraviolet light adequately protects to LED chip 2, effectively prolongs its service life, and mixing institute's shape will be passed through in step 2
At antiultraviolet glue 5 by dispenser dispensing in LED chip 2, LED chip 2 is fixed on bracket 1, LED chip 2
Installation put down to up, change light emitting angle, and two leads 3 are connected with two pins 4 respectively, add into epoxy resin
Add fluorescent powder, be heated into liquid, reuses dispenser for epoxy resin and phosphor mixture dispensing to antiultraviolet glue 5
Outside, entire bracket 1 is wrapped up, then using centrifuge to by package bracket 1 be centrifuged, to fluorescent powder with
Epoxy resin is layered, and fluorescent powder is deposited in downwards formation phosphor powder layer 6 on the inside of epoxy resin layer 7, then stands again, is waited
Its natural cooling completes secondary encapsulation, and molding phosphor powder layer 6 is more concentrated close to LED chip 2, and phosphor powder layer 6 is to light emitting anger
Degree plays good progradation, and diffusion and refraction action by light increase the soft degree of light, and improve luminous efficiency, ring
Oxygen resin layer 7 can play the role of a protection, effectively extend the service life of LED lamp bead, by using antiultraviolet glue
Water 5 once encapsulates LED chip 2, reuses the epoxy resin for being mixed with fluorescent powder to the progress secondary encapsulation of LED chip 2, prevents
Only outside line glue 5 can prevent ultraviolet light, adequately protect to LED chip 2, effectively extend the service life of LED chip 2,
Phosphor powder layer 6 increases the soft degree of light, and epoxy resin layer 7 plays a protective role, integrally make it is of the invention the service life is longer,
It shines softer；
Referring to Figure of description 1-7, it is electroplated using pin 4 substrate 10 of the electroplating device to bracket 1 and its bottom, electroplated layer
It is followed successively by the first layers of copper 11, nickel layer 12, the second layers of copper 13, silver layer 14 and tin layers 15 from inside to outside, uses cold wind into after crossing plating
Dehumidifying is dried to bracket 1 and pin 4 in machine, and the first layers of copper 11, silver layer 14 and the second layers of copper 13 can guarantee the conduction of pin 4
Property, so that they can work normally, while copper and silver can effectively increase the thermal conductivity of bracket 1 and pin 4, can be sufficiently to LED
Chip 2 work caused by heat dissipated, increase radiating efficiency, first layers of copper 11 of 15 pairs of inside of tin layers, 14 and of silver layer
Second layers of copper 13 plays a protective role, and prevents the first layers of copper 11, silver layer 14 and the second layers of copper 13 to be oxidized influence electric conductivity, into one
Step improves service life of the invention；
Referring to Figure of description 1-7, transparent wear material is made using heating equipment be heated into it is liquid, then to inside it
Fire retardant is added, then 7 surface of epoxy resin layer will be applied to by mixed mixture, be then allowed to stand and waits its natural cooling
Molding, polishes to LED light bead surface molding in step 5 using grinding apparatus, and be processed by shot blasting to its surface,
Keep its surface smooth, complete the production of LED lamp bead, finally reuses light splitting machine to the LED lamp beads of different brightness according to wanting
Differentiation brightness is asked, is packed respectively, fire retardant, which is formed by flame-retardant layer 8, can play fine flame retardant effect, increase safety, transparent
Wear-resistant material, which is formed by protective layer 9, can effectively increase whole wear-resisting property, improve service life, and carry out to protective layer 9
Grinding and buffing can make its surface smooth, reduce to luminous adverse effect.
The several points that should finally illustrate are: firstly, in the description of the present application, it should be noted that unless otherwise prescribed and
It limits, term " installation ", " connected ", " connection " shall be understood in a broad sense, can be mechanical connection or electrical connection, be also possible to two
Connection inside element, can be directly connected, and "upper", "lower", "left", "right" etc. are only used for indicating relative positional relationship, when
The absolute position for being described object changes, then relative positional relationship may change；
Secondly: the present invention discloses in embodiment attached drawing, relates only to the structure being related to the embodiment of the present disclosure, and other structures can
With reference to being commonly designed, under not conflict situations, the same embodiment of the present invention and different embodiments be can be combined with each other；
Last: the foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of high brightness sheen Wide-angle LED lamp bead, including bracket (1), it is characterised in that: the bracket (1) is equipped with LED core
Piece (2), the LED chip (2) are equipped with lead (3), and bracket (1) bottom is set there are two pin (4), the bracket (1)
It is integrally formed with pin (4), the LED chip (2) is connected with pin (4) by lead (3), on the outside of the LED chip (2)
It is packaged with antiultraviolet glue (5), is equipped with phosphor powder layer (6) on the outside of the antiultraviolet glue (5), the phosphor powder layer (6)
Outside is equipped with epoxy resin layer (7), is equipped with flame-retardant layer (8) on the outside of the epoxy resin layer (7), sets on the outside of the flame-retardant layer (8)
Matcoveredn (9), the bracket (1) and pin (4) include substrate (10), are successively arranged from inside to outside on the substrate (10)
First layers of copper (11), nickel layer (12), the second layers of copper (13), silver layer (14) and tin layers (15).
2. a kind of production technology of high brightness sheen Wide-angle LED lamp bead, it is characterised in that: the following steps are included:
Step 1: the production of bracket (1), once carries out the first layers of copper (11), nickel to the substrate (10) of bracket (1) and pin (4)
The plating of layer (12), the second layers of copper (13), silver layer (14) and tin layers (15)；
Step 2: the production of antiultraviolet glue (5), antiultraviolet additive is added into silica gel, and be mixed to form anti-
Ultraviolet light glue (5)；
Step 3: LED chip (2), is fixed on the bracket by plating (1) by primary encapsulation by die bond technology；
Step 4: secondary encapsulation, adds fluorescent powder in epoxy resin, then fluorescent powder and epoxy resin are carried out by centrifugation
Layering, fluorescent powder is precipitated downwards；
Step 5: molding, fire retardant is added into transparent wear material, then asphalt mixtures modified by epoxy resin will be wrapped in by mixed mixture
Rouge surface；
Step 6: polishing, polishes to molding LED light bead surface.
3. a kind of production technology of high brightness sheen Wide-angle LED lamp bead according to claim 2, it is characterised in that: described
Step 1 specifically, be electroplated using pin (4) substrate (10) of the electroplating device to bracket (1) and its bottom, electroplated layer by
It is followed successively by the first layers of copper (11), nickel layer (12), the second layers of copper (13), silver layer (14) and tin layers (15) from inside to outside, into after crossing plating
Dehumidifying is dried to bracket (1) and pin (4) using air-cooler.
4. a kind of production technology of high brightness sheen Wide-angle LED lamp bead according to claim 2, it is characterised in that: described
Step 2 specifically, add antiultraviolet additive into silica gel, using mixing plant to silica gel and antiultraviolet additive into
Row is thoroughly mixed to form antiultraviolet glue (5) used in primary encapsulate.
5. a kind of production technology of high brightness sheen Wide-angle LED lamp bead according to claim 2, it is characterised in that: described
Step 3 is specifically, be formed by antiultraviolet glue (5) by dispenser dispensing in LED chip for mixing is passed through in step 2
(2) on, LED chip (2) is fixed on bracket (1), and two leads (3) are connected with two pins (4) respectively.
6. a kind of production technology of high brightness sheen Wide-angle LED lamp bead according to claim 2, it is characterised in that: described
Step 4 is heated into liquid specifically, add fluorescent powder into epoxy resin, reuses dispenser for epoxy resin and fluorescence
Powder mixture dispensing wraps up entire bracket (1) to the outside of antiultraviolet glue (5), then using centrifuge to warp
The bracket (1) for crossing package is centrifuged, and is layered to fluorescent powder and epoxy resin, fluorescent powder is deposited in downwards epoxy resin layer
(7) inside forms phosphor powder layer (6), then stands again, waits its natural cooling.
7. a kind of production technology of high brightness sheen Wide-angle LED lamp bead according to claim 2, it is characterised in that: described
Step 5 specifically, transparent wear material is made using heating equipment be heated into it is liquid, it is then fire-retardant to adding inside it
Agent is then allowed to stand then by epoxy resin layer (7) surface is applied to by mixed mixture and waits the molding of its natural cooling.
8. a kind of production technology of high brightness sheen Wide-angle LED lamp bead according to claim 2, it is characterised in that: described
Step 6 is specifically, polish to LED light bead surface molding in step 5 using grinding apparatus, and throw to its surface
Light processing keeps its surface smooth, completes the production of LED lamp bead, finally reuses light splitting machine to the LED lamp bead of different brightness
Brightness is distinguished as requested, is packed respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910592300.6A CN110311028A (en) | 2019-07-03 | 2019-07-03 | A kind of high brightness sheen Wide-angle LED lamp bead and production technology |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910592300.6A CN110311028A (en) | 2019-07-03 | 2019-07-03 | A kind of high brightness sheen Wide-angle LED lamp bead and production technology |
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| CN110311028A true CN110311028A (en) | 2019-10-08 |
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