CN110308615A - Photomask structure - Google Patents

Photomask structure Download PDF

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Publication number
CN110308615A
CN110308615A CN201910448140.8A CN201910448140A CN110308615A CN 110308615 A CN110308615 A CN 110308615A CN 201910448140 A CN201910448140 A CN 201910448140A CN 110308615 A CN110308615 A CN 110308615A
Authority
CN
China
Prior art keywords
phase
frame
shadow mask
shift mask
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910448140.8A
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Chinese (zh)
Inventor
张永晖
李鹏
吴绍静
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN201910448140.8A priority Critical patent/CN110308615A/en
Publication of CN110308615A publication Critical patent/CN110308615A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26Phase shift masks [PSM]; PSM blanks; Preparation thereof

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

The present invention provides a kind of photomask structures, comprising: a transparent substrate, including transmission region and at least one lightproof area surrounded by the transmission region;One shadow mask layer is set to the transparent substrate and is covered with the lightproof area;One phase-shift mask layer, it is set on the transparent substrate and connect with the shadow mask layer, the phase-shift mask layer is connected on the edge of the shadow mask layer and is located at the transmission region, and the phase-shift mask layer is used to that scattered light to be made to obtain cancellation at interface with the light scattered by the shadow mask layer.

Description

Photomask structure
Technical field
The present invention relates to array substrate production fields, and in particular to a kind of photomask structure.
Background technique
In the process flow of oled panel manufacture, need to make tens of layer film layers on substrate, these film layers it Between exactitude position being successful with conclusive effect for array substrate.In order to monitor in real time each tunic layer with The aligning accuracy of its contraposition layer, it will usually which designing interlayer alignment confirmation operation is after exposure, etches to come to carry out reality to it When monitor.If it find that contraposition deviation has exceeded allowed band, then need to weed out photoresist, then re-starts contraposition photoetching Journey, until aligning accuracy is within allowed band.Such as after POLY layers complete, GE1, GE2, CNT and SD thereafter Etc. film layers require and POLY layers of progress aligning accuracy confirmation.Since the angle taper of photoresist is too small, cause with light sensitive device CCD There are larger random errors when crawl film layer boundary, not can accurately reflect the aligning accuracy between film layer, this has seriously affected batch For the real time monitoring effect of film layer aligning accuracy when production, make a big impact to production yield raising.
Therefore, the prior art is defective, needs to improve.
Summary of the invention
The present invention provides a kind of photomask structure, and product yield can be improved.
The present invention provides a kind of photomask structures, comprising:
One transparent substrate, including transmission region and at least one lightproof area surrounded by the transmission region;
One shadow mask layer is set to the transparent substrate and is covered with the lightproof area;
One phase-shift mask layer is set on the transparent substrate and connect with the shadow mask layer, and the phase shift is covered Film layer is connected on the edge of the shadow mask layer and is located at the transmission region, and the phase-shift mask layer is for making to be dissipated by it The light penetrated obtains cancellation with the light scattered by the shadow mask layer at interface.
In photomask structure of the present invention, the quantity of at least one lightproof area is one, the shading region Domain is rectangular;The phase-shift mask layer rectangular frame-shaped and its be arranged around the outer edge of the lightproof area, the phase shift covers The inward flange of film layer is overlapped with the outer edge of the shadow mask layer.
In photomask structure of the present invention, the lightproof area is in rectangular ring, and the phase-shift mask layer is in rectangle Frame-shaped and its be arranged around the outer edge of the lightproof area, the inward flange of the phase-shift mask layer and the shadow mask layer it is outer Coincident.
In photomask structure of the present invention, the lightproof area is in rectangular ring, and the phase-shift mask layer includes the One phase-shift mask frame and the second phase-shift mask frame, the first phase-shift mask frame and the second phase-shift mask frame are in rectangle frame Shape;
The shadow mask layer includes the first shadow mask block, the second shadow mask block and third shadow mask block, institute State the first shadow mask block, the second shadow mask block and the equal rectangular frame-shaped of third shadow mask block;First phase It moves mask frame to be arranged along the inward flange of the first shadow mask block, the second shadow mask block is along first phase shift The inward flange of mask frame is arranged, and the second phase-shift mask frame is arranged along the inward flange of the second shadow mask block, described Third shadow mask block is arranged along the inward flange of the second phase-shift mask frame;The inward flange of the first shadow mask block with The outer edge of the first phase-shift mask frame connects, the inward flange of the first phase-shift mask frame and the second shadow mask block Outer edge connection, the inward flange of the second shadow mask block is connect with the outer edge of the second phase-shift mask frame, described The inward flange of second phase-shift mask frame is connect with the outer edge of the third shadow mask block.
In photomask structure of the present invention, the lightproof area is in rectangular ring, and the phase-shift mask layer includes the One phase-shift mask frame and the second phase-shift mask frame, the first phase-shift mask frame and the second phase-shift mask frame are in rectangle frame Shape;
The shadow mask layer includes the first shadow mask block, the second shadow mask block, the first shadow mask block, the The two equal rectangular frame-shapeds of shadow mask block;The first phase-shift mask frame is located at the inside of the first shadow mask block, described Second shadow mask block is located at the inside of the first phase-shift mask frame, and the second phase-shift mask frame is located at second shading The inside of exposure mask block;
The outer edge of the first phase-shift mask frame is overlapped with the inward flange of the first shadow mask block, and described second hides The outer edge of the outer edge of photomask block and the first phase-shift mask frame is spaced the first pre-determined distance value, second phase shift The inward flange of the outer edge of mask frame and the second shadow mask block is spaced the second pre-determined distance value.
In photomask structure of the present invention, the border width of the four edges of the first phase-shift mask frame is 1um, The outer edge of the second shadow mask block is 1um, second shading at a distance from the first phase-shift mask frame inward flange The width of the frame of exposure mask block is 0.5um, the outer edge of the second phase-shift mask frame and the second shadow mask block 0.5um is divided between inward flange is equal.
In photomask structure of the present invention, the quantity of at least one lightproof area is at least four, it is described extremely Few four lightproof areas are arranged respectively along the four edges of default rectangle, and the lightproof area rectangular-blocklike, the phase shift is covered Film layer is arranged respectively along the shadow mask layer in four lightproof areas towards the edge of the central side.
In photomask structure of the present invention, the quantity of at least one lightproof area is four, four shading regions Domain is respectively arranged at the medium position of the four edges of rectangle.
In photomask structure of the present invention, the width of the phase-shift mask layer is 0.1 μm -2 μm.
In photomask structure of the present invention, the phase shift knots modification of the phase-shift mask layer is between -180 ° to 180 ° In any value.
The present invention is connected on the edge of the shadow mask layer by the phase-shift mask layer and is located at the transparent area Domain, the phase-shift mask layer is for making scattered light obtain phase at interface with the light scattered by the shadow mask layer Disappear, so as to improve product yield.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some of invention Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these Figure obtains other attached drawings.
Fig. 1 is the layer structure figure of one of some embodiments of the invention photomask structure.
Fig. 2 is the first plane structure chart of one of some embodiments of the invention photomask structure.
Fig. 3 is second of plane structure chart of one of some embodiments of the invention photomask structure.
Fig. 4 is the third plane structure chart of one of some embodiments of the invention photomask structure.
Fig. 5 is the 4th kind of plane structure chart of one of some embodiments of the invention photomask structure.
Fig. 6 is the 5th kind of plane structure chart of one of some embodiments of the invention photomask structure.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic. " first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.? In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can To be mechanical connection, it is also possible to be electrically connected or can mutually communicate;It can be directly connected, it can also be by between intermediary It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower" It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above " Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter, This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with Recognize the application of other techniques and/or the use of other materials.
It is the structure chart of one of some embodiments of the invention photomask structure please refer to Fig. 1, Fig. 1.The light shield knot Structure includes: transparent substrate 10, shadow mask layer 20 and phase-shift mask layer 30.Wherein, which includes transmission region And at least one lightproof area surrounded by the transmission region.One shadow mask layer 20 is set to the transparent substrate 10 simultaneously It is covered with the lightproof area.Phase-shift mask layer 30 is set on the transparent substrate 10 and connect with the shadow mask layer 20, The phase-shift mask layer 30 is connected on the edge of the shadow mask layer 20 and is located at the transmission region, and the phase shift is covered Film layer 30 is used to make scattered light and obtains cancellation at interface by the light that the shadow mask layer 20 scatters.Phase shift The width of mask layer is 0.1 μm -2 μm.The phase shift knots modification of phase-shift mask layer be -180 ° to 180 ° between in any value.Phase The phase shift knots modification for moving mask layer is 180 °, 120 °, 90 °, -120 ° or -90 °.
Specifically, in some embodiments, referring to Fig. 2, the quantity of at least one lightproof area 11 is one, The lightproof area 11 is rectangular;30 rectangular frame-shaped of phase-shift mask layer and its around the lightproof area 11 outer edge Setting, the inward flange of the phase-shift mask layer 30 are overlapped with the outer edge of the shadow mask layer 20.The phase-shift mask layer 30 Border width is 1 μm.The phase shift knots modification of phase-shift mask layer 30 is 180 °, can make phase-shift mask layer 30 and shadow mask layer Light intensity at 20 interfaces reaches cancellation.This kind of photomask structure is the Poly layer being used to form in array substrate.
Light intensity is reduced to 0 distance for having approximately passed through 1.5 μm from 1.That reflects the designs for having passed through phase-shift mask layer 30 The length for significantly shortening penumbra region, it is highly beneficial to photosensitive element crawl boundary.
Specifically, in some embodiments, referring to Fig. 3, lightproof area 11 is in rectangular ring, the phase-shift mask Layer 30 rectangular frame-shaped and its around the lightproof area 11 inward flange be arranged, the outer edge of the phase-shift mask layer 30 with it is described The outer edge of shadow mask layer 20 is overlapped.Photomask structure in the embodiment is used to form GE2 (second grid metal layer).The phase The border width for moving mask layer 30 is 1 μm.The phase shift knots modification of phase-shift mask layer 30 be 180 °, can make phase-shift mask layer 30 with Light intensity at 20 interface of shadow mask layer reaches cancellation.Penumbra region is significantly shortened by the design of phase-shift mask layer 30 Length, to CCD crawl boundary it is highly beneficial.
Specifically, in some embodiments, referring to Fig. 4, phase-shift mask layer 30 includes the first phase-shift mask frame 31 And the second phase-shift mask frame 32, the first phase-shift mask frame 31 and the equal rectangular frame-shaped of the second phase-shift mask frame 32;Institute It states shadow mask layer 20 and includes the first shadow mask block 21, the second shadow mask block 22 and third shadow mask block 23, it is described First shadow mask block 21, the second shadow mask block 22 and the equal rectangular frame-shaped of the third shadow mask block 23;Described One phase-shift mask frame 31 along the first shadow mask block 21 inward flange be arranged, the second shadow mask block 22 along The inward flange of the first phase-shift mask frame 31 is arranged, and the second phase-shift mask frame 32 is along the second shadow mask block 22 Inward flange setting, the third shadow mask block 23 along the second phase-shift mask frame 32 inward flange be arranged;Described The inward flange of one shadow mask block is connect with the outer edge of the first phase-shift mask frame, the inner edge of the first phase-shift mask frame Edge is connect with the outer edge of the second shadow mask block, and the inward flange of the second shadow mask block is covered with second phase shift The outer edge of film frame connects, and the inward flange of the second phase-shift mask frame is connect with the outer edge of the third shadow mask block. Photomask structure in the figure is mainly used in the Source and drain metal level of production array substrate, the first phase-shift mask frame 31 and the second phase shift The border width of mask frame 32 is 1 μm.The border width of second shadow mask block 22 and third shadow mask block 23 difference It is 0.5 μm.
Specifically, in some embodiments, referring to Fig. 5, lightproof area 11 is in rectangular ring, the phase-shift mask Layer 30 includes the first phase-shift mask frame 31 and the second phase-shift mask frame 32, the first phase-shift mask frame 31 and the second phase shift The equal rectangular frame-shaped of mask frame 32;The shadow mask layer 20 includes the first shadow mask block 21, the second shadow mask block 22, The first shadow mask block 21, the equal rectangular frame-shaped of the second shadow mask block 22;The first phase-shift mask frame 31 is located at institute The inside of the first shadow mask block 21 is stated, the second phase-shift mask frame 32 is located at the inside of the first phase-shift mask frame 31, The second shadow mask block 22 is located at the inside of the second phase-shift mask frame 32.The outer edge of the first phase-shift mask frame It is overlapped with the inward flange of the first shadow mask block, the outer edge of the second phase-shift mask frame 32 and the first phase-shift mask frame Interval between 31 inward flange is the first pre-determined distance value, and the inward flange of the second phase-shift mask frame and described second hide The outer edge of photomask block is spaced the second pre-determined distance value.First pre-determined distance value and the second pre-determined distance value are respectively 1um And 0.5um.Structure in the figure is used to form the M2 metal layer of array substrate.In some embodiments, the first phase-shift mask frame The border widths of four edges be 1um, the outer edge of the second shadow mask block and the first phase-shift mask frame inner edge The distance of edge is 1um, and the width of the frame of the second shadow mask block is 0.5um, outside the second phase-shift mask frame 0.5um is divided between the inward flange of edge and the second shadow mask block is equal.
Referring to Fig. 6, the quantity of at least one lightproof area 11 is at least four, at least four lightproof area 11 are arranged respectively along the four edges of default rectangle, the lightproof area rectangular-blocklike, the phase-shift mask layer 30 edge respectively Four lightproof areas shadow mask layer 20 towards the central side edge be arranged.The quantity of at least one lightproof area 11 It is four, four lightproof areas 11 are respectively arranged at the medium position of the four edges of rectangle.Phase-shift mask layer 30 and shadow mask The coincident towards inside of layer 20.Photomask structure in the embodiment is photomask structure used in GE1 layers.
The present invention is connected on the edge of the shadow mask layer by the phase-shift mask layer and is located at the transparent area Domain, the phase-shift mask layer is for making scattered light obtain phase at interface with the light scattered by the shadow mask layer Disappear, so as to improve product yield.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention Decorations, therefore protection scope of the present invention subjects to the scope of the claims.

Claims (10)

1. a kind of photomask structure characterized by comprising
One transparent substrate, including transmission region and at least one lightproof area surrounded by the transmission region;
One shadow mask layer is set to the transparent substrate and is covered with the lightproof area;
One phase-shift mask layer is set on the transparent substrate and connect with the shadow mask layer, the phase-shift mask layer It is connected on the edge of the shadow mask layer and is located at the transmission region, the phase-shift mask layer is scattered for making Light obtains cancellation with the light scattered by the shadow mask layer at interface.
2. photomask structure according to claim 1, which is characterized in that the quantity of at least one lightproof area is one A, the lightproof area is rectangular;The phase-shift mask layer rectangular frame-shaped and its set around the outer edge of the lightproof area It sets, the inward flange of the phase-shift mask layer is overlapped with the outer edge of the shadow mask layer.
3. photomask structure according to claim 1, which is characterized in that the lightproof area is in rectangular ring, the phase shift Mask layer rectangular frame-shaped and its outer edge setting around the lightproof area, inward flange and the screening of the phase-shift mask layer The outer edge of photomask layer is overlapped.
4. photomask structure according to claim 1, which is characterized in that the lightproof area is in rectangular ring, the phase shift Mask layer includes the first phase-shift mask frame and the second phase-shift mask frame, the first phase-shift mask frame and the second phase-shift mask The equal rectangular frame-shaped of frame;
The shadow mask layer includes the first shadow mask block, the second shadow mask block and third shadow mask block, and described the One shadow mask block, the second shadow mask block and the equal rectangular frame-shaped of third shadow mask block;First phase shift is covered Film frame is arranged along the inward flange of the first shadow mask block, and the second shadow mask block is along first phase-shift mask The inward flange of frame is arranged, and the second phase-shift mask frame is arranged along the inward flange of the second shadow mask block, the third Shadow mask block is arranged along the inward flange of the second phase-shift mask frame;The inward flange of the first shadow mask block with it is described The outer edge of first phase-shift mask frame connects, and the inward flange of the first phase-shift mask frame is outer with the second shadow mask block Edge connection, the inward flange of the second shadow mask block are connect with the outer edge of the second phase-shift mask frame, and described second The inward flange of phase-shift mask frame is connect with the outer edge of the third shadow mask block.
5. photomask structure according to claim 1, which is characterized in that the lightproof area is in rectangular ring, the phase shift Mask layer includes the first phase-shift mask frame and the second phase-shift mask frame, the first phase-shift mask frame and the second phase-shift mask The equal rectangular frame-shaped of frame;
The shadow mask layer includes the first shadow mask block, the second shadow mask block, and the first shadow mask block, second hide The equal rectangular frame-shaped of photomask block;The first phase-shift mask frame is located at the inside of the first shadow mask block, and described second Shadow mask block is located at the inside of the first phase-shift mask frame, and the second phase-shift mask frame is located at second shadow mask The inside of block;
The outer edge of the first phase-shift mask frame is overlapped with the inward flange of the first shadow mask block, and second shading is covered The outer edge of the outer edge of film block and the first phase-shift mask frame is spaced the first pre-determined distance value, second phase-shift mask The inward flange of the outer edge of frame and the second shadow mask block is spaced the second pre-determined distance value.
6. photomask structure according to claim 5, which is characterized in that the frame of the four edges of the first phase-shift mask frame Width is 1um, and the outer edge of the second shadow mask block is 1um at a distance from the first phase-shift mask frame inward flange, The width of the frame of the second shadow mask block is 0.5um, the outer edge of the second phase-shift mask frame and described second 0.5um is divided between the inward flange of shadow mask block is equal.
7. photomask structure according to claim 1, which is characterized in that the quantity of at least one lightproof area is at least Four, at least four lightproof area is arranged respectively along the four edges of default rectangle, the lightproof area rectangular-blocklike, The phase-shift mask layer is arranged respectively along the shadow mask layer in four lightproof areas towards the edge of the central side.
8. photomask structure according to claim 7, which is characterized in that the quantity of at least one lightproof area is four A, four lightproof areas are respectively arranged at the medium position of the four edges of rectangle.
9. photomask structure according to claim 1, which is characterized in that the width of the phase-shift mask layer is 0.1 μm -2 μm.
10. photomask structure according to claim 1, which is characterized in that the phase shift knots modification of the phase-shift mask layer be- Any value between 180 ° to 180 °.
CN201910448140.8A 2019-05-27 2019-05-27 Photomask structure Pending CN110308615A (en)

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Application Number Priority Date Filing Date Title
CN201910448140.8A CN110308615A (en) 2019-05-27 2019-05-27 Photomask structure

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Application Number Priority Date Filing Date Title
CN201910448140.8A CN110308615A (en) 2019-05-27 2019-05-27 Photomask structure

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115542655A (en) * 2022-09-21 2022-12-30 京东方科技集团股份有限公司 Phase shift mask, preparation method and film layer opening method

Citations (5)

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Publication number Priority date Publication date Assignee Title
CN1373861A (en) * 1999-11-08 2002-10-09 松下电器产业株式会社 Photomask, method of producing photomask, and method of making pattern using photomask
CN1596385A (en) * 2001-11-27 2005-03-16 Hoya株式会社 Half-tone type phase shift mask blank, half-tone type phase shift mask and process for producing same
KR20080098789A (en) * 2007-05-07 2008-11-12 동부일렉트로닉스 주식회사 Half tone phase shifting mask and method for manufacturing the same
CN108363270A (en) * 2018-02-11 2018-08-03 京东方科技集团股份有限公司 A kind of phase shifting mask plate, array substrate, preparation method and display device
CN108445707A (en) * 2018-05-15 2018-08-24 睿力集成电路有限公司 The production method of phase shifting mask plate, phase shifted mask lithography equipment and phase shifting mask plate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1373861A (en) * 1999-11-08 2002-10-09 松下电器产业株式会社 Photomask, method of producing photomask, and method of making pattern using photomask
CN1596385A (en) * 2001-11-27 2005-03-16 Hoya株式会社 Half-tone type phase shift mask blank, half-tone type phase shift mask and process for producing same
KR20080098789A (en) * 2007-05-07 2008-11-12 동부일렉트로닉스 주식회사 Half tone phase shifting mask and method for manufacturing the same
CN108363270A (en) * 2018-02-11 2018-08-03 京东方科技集团股份有限公司 A kind of phase shifting mask plate, array substrate, preparation method and display device
CN108445707A (en) * 2018-05-15 2018-08-24 睿力集成电路有限公司 The production method of phase shifting mask plate, phase shifted mask lithography equipment and phase shifting mask plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115542655A (en) * 2022-09-21 2022-12-30 京东方科技集团股份有限公司 Phase shift mask, preparation method and film layer opening method

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Application publication date: 20191008