CN110293483B - Polishing device and method based on confocal megasonic microjet - Google Patents
Polishing device and method based on confocal megasonic microjet Download PDFInfo
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- CN110293483B CN110293483B CN201910661952.0A CN201910661952A CN110293483B CN 110293483 B CN110293483 B CN 110293483B CN 201910661952 A CN201910661952 A CN 201910661952A CN 110293483 B CN110293483 B CN 110293483B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
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Abstract
The invention discloses a polishing device and method based on confocal megasonic microjet, belonging to the field of ultra-precise optical surface processing. The polishing device comprises a top outer cover, a megasonic transducer, a transducer cluster seat, a connecting seat, a liquid storage cavity, a sealing ring and a nozzle, wherein the nozzle is provided with a small hole for spraying polishing liquid. The confocal megasonic microjet polishing device and the confocal megasonic microjet polishing method have the advantages of traditional jet polishing, and because the polishing solution is pushed by high-frequency and high-energy megasonic waves to generate microjets to realize jet polishing, the agglomeration effect of polishing powder particles can be inhibited, and the suspension property and the dispersibility of the polishing solution are improved; compared with the traditional jet polishing, the device and the method have more controllable parameters, can realize different light spot polishing, polishing efficiency and polishing quality by regulating and controlling the power and frequency parameters of the megasonic transducer array, and have good time response characteristics.
Description
Technical Field
The invention belongs to the field of optical element processing, in particular relates to a polishing device and a polishing method based on confocal megasonic microjet, which are particularly suitable for the fine polishing stage of an optical element and also belong to the field of ultra-precise optical surface processing.
Background
Ultra-precision machining is one of the important indexes of the national manufacturing technology level, and the precision, surface roughness, machining size range and geometric shape which can be achieved by ultra-precision machining directly determine the height which can be achieved by the manufacturing industry. In addition, ultra-precision machining is also an important support for advanced manufacturing technology and intelligent manufacturing technology. However, in the field of optics, the aperture and surface precision of an optical element directly determine the performance of an optical system, and the ultra-precision processing technology of a large-aperture and high-precision optical element still is a difficult problem to be solved urgently in China.
The basic principle of the traditional jet polishing is that polishing liquid is sprayed out from a small hole of a nozzle at a high speed by using pressure, and the material is removed by the high-speed collision shearing action of polishing powder particles. Compared with other traditional polishing technologies, the polishing tool for jet polishing is liquid, the problem of tool abrasion does not exist, the removal function is stable, the surface shape precision is easy to control, and the polishing head for jet polishing is a liquid column, so that the polishing tool can be suitable for polishing various special and complex surfaces, and the polishing characteristic is not influenced by the position of a workpiece. Although the jet polishing has the advantages, because the polishing powder particles are nano-sized and have large surface energy, the polishing powder particles have the tendency of agglomeration in the process of forming the pressure-driven jet, and the polishing quality is influenced; in addition, in order to obtain ideal removal efficiency, the size of the small holes of the nozzle of the traditional jet polishing is small, and blockage is easy to generate.
In the current field of optical component processing, megasonic waves are mainly used for cleaning optical components. The megasonic waves are too high in frequency, so that the cavitation effect of the sonic waves in the cleaning liquid is difficult to occur, so that cavitation bubbles can not be formed during ultrasonic cleaning, high-frequency sonic wave energy can form high-speed micro water flow in the cleaning liquid due to the sound field effect, and the megasonic waves have a good removing effect on submicron-grade impurity particles on the surface of an optical element during cleaning. However, there are demands for processing efficiency and processing energy in processing the surface of the optical element, and thus a corresponding processing apparatus and method more suitable for using megasonic waves for processing the optical element are required.
Disclosure of Invention
In order to overcome the defects of the processing method in the prior art, the invention provides a novel polishing device and method based on confocal megasonic microjet, which not only has the advantages of the traditional jet polishing, but also can eliminate the defects of the traditional jet polishing.
The technical scheme adopted by the invention is as follows:
on one hand, the invention provides a confocal megasonic microjet polishing device, which comprises a top outer cover 1, a megasonic transducer 2, a transducer cluster seat 3, a connecting seat 4, a liquid storage cavity 5, a sealing ring 6 and a nozzle 7, wherein the nozzle 7 is provided with a small hole 71 for spraying polishing liquid 8;
the top outer cover 1, the liquid storage cavity 5 and the nozzle 7 are sequentially connected to form a polishing device shell containing a closed space;
the energy converter bundling seat 3 is fixedly arranged between the top outer cover 1 and the liquid storage cavity 5, and the megasonic energy converter 2 is arranged on the energy converter bundling seat 3; the convergence direction of the megasonic waves emitted by the megasonic transducer 2 is the direction of the small hole 71 on the nozzle 7, and the convergence focus 22 is a point outside the small hole 71;
a liquid inlet 51 is arranged on the cavity wall of the liquid storage cavity 5, and the polishing liquid 8 fills the whole liquid storage cavity through the liquid inlet 51; when megasonic waves emitted by the megasonic transducer 2 are focused at the focus 22 along with the polishing liquid 8 in the liquid storage cavity 5, the polishing liquid 8 is accelerated under the action of the megasonic waves, and the strongest micro-jet effect is generated at the focus 22.
Further, wherein the top outer cover 1 and the liquid storage cavity 5 are both clamped on the energy converter bundling seat 3, and the nozzle 7 is clamped at the other end of the liquid storage cavity 5.
Furthermore, the two ends of the liquid storage cavity 5 are respectively sealed with the joint parts of the transducer cluster base 3 and the nozzle 7 through sealing rings 6.
Further, when the micro-jet polishing device is used for element processing, the small hole 71 is placed at the surface of the element 9 to be processed, so that the strongest micro-jet generated by the polishing liquid 8 at the focal point 22 can be effectively used for processing the surface of the element, and finally, the micro-jet polishing effect is achieved.
Furthermore, the transducer cluster base 3 is provided with a plurality of mounting holes for mounting the megasonic transducers, and the number of the mounting holes is greater than or equal to the number of the megasonic transducers used.
Further, the inner surface of the transducer cluster base 3 is an arc-shaped inner wall, the inner wall is in a spherical shell shape with the focal length of the transducer as a radius, the center of a circle where the arc-shaped inner wall is located is the center 33 of the sphere of the inner wall of the transducer cluster base, and the radius of the circle where the arc-shaped inner wall is located is the focal length of the transducer, so that the center of the sphere coincides with the focal point 22 of the transducer.
Furthermore, the central axis 32 of the mounting hole corresponding to all the mounting holes 31 of the transducer passes through the center 33 of the inner wall of the transducer cluster base, so that the megasonic waves emitted by all the mounted megasonic transducers can be focused on the center 33 of the inner wall of the transducer cluster base, and the most concentrated megasonic wave convergence energy can be obtained at the center 33 of the inner wall of the transducer cluster base.
Further, for quick and easy to assemble or change the transducer, every transducer mounting hole 31 inner wall all is equipped with the screw thread to can be quick carry out spiral installation and dismantlement with the transducer that the outer wall was equipped with the screw thread.
Further, the connecting seat 4 is located on a housing of the polishing device, and is used for fixedly mounting the polishing device on other numerical control equipment.
In another aspect, the present invention further provides a confocal megasonic microjet polishing method, which is implemented based on any one of the above microjet polishing apparatuses operating an optical element to be processed, and the method includes:
respectively installing selected megasonic transducers in the transducer installation holes 31 on the transducer cluster base 3 according to the processing requirement, and ensuring that megasonic waves emitted by all the megasonic transducers are focused on the spherical center 33 on the inner wall of the transducer cluster base;
fixedly mounting the micro-jet polishing device on a numerical control machine tool, starting the device, placing a small hole of a nozzle 7 of the device on the surface of a processing element 9 through the motion control and accurate positioning capability of the numerical control machine tool, filling a liquid storage cavity with polishing liquid 8 with certain pressure through a liquid inlet at the moment, and spraying the polishing liquid out of the small hole of the nozzle 7, thereby polishing and removing relatively high points on the surface of the processing element 9;
and adjusting the working frequency, power and other processing parameters of the megasonic transducer according to the surface shape error of the element to be processed to finish polishing.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
the confocal megasonic microjet polishing device and the confocal megasonic microjet polishing method have the advantages of traditional jet polishing, and because the polishing solution is pushed by high-frequency and high-energy megasonic waves to generate microjet to realize jet polishing, the blocking phenomenon caused by reducing the size of a nozzle pore in order to obtain more ideal removal efficiency in the traditional jet polishing can be avoided, and the megasonic waves can inhibit the agglomeration effect of polishing powder particles and improve the suspension property and the dispersibility of the polishing solution; compared with the traditional jet polishing, the device and the method have more controllable parameters, can realize different light spot polishing, polishing efficiency and polishing quality by regulating and controlling the power and frequency parameters of the megasonic transducer array, and have good time response characteristics.
Drawings
FIG. 1 is a schematic diagram of a central cross-sectional structure of a confocal megasonic microjet polishing apparatus provided by the present invention.
Fig. 2 is a three-dimensional view of a transducer cluster head of the apparatus of the present invention.
FIG. 3 is a schematic diagram of a cross-sectional view of the center of a transducer cluster base of the apparatus of the present invention.
Fig. 4 is a schematic view of a transducer and its focal point of the inventive device.
Fig. 5 is an overall three-dimensional view of the device of the present invention.
FIG. 6 is a schematic view of the apparatus of the present invention.
In the drawings, the reference numerals are respectively as follows: 1-a top cover; 2-megasonic transducer; 3-a transducer cluster base; 4-a connecting seat; 5-a liquid storage cavity; 6-sealing ring; 7-a nozzle; 8-polishing solution; 9-a processing element; 21-megasonic propagation direction; 22-transducer focus; 31-transducer mounting holes; 32-mounting hole center axis; 33-the centre of sphere of the inner wall of the transducer cluster seat; 51-liquid inlet; 71-small hole.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the accompanying drawings and the detailed description, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The invention discloses a confocal megasonic microjet polishing scheme, which mainly realizes the polishing of an optical element through the microjet excited by megasonic and a particle resonance effect, and particularly utilizes the emitted megasonic to take polishing liquid in a liquid storage cavity as a propagation medium, and finally focuses the megasonic at one point outside a nozzle through a cavity and the nozzle; when the machining work is performed, the focus of the megasonic wave is placed near the surface of the workpiece to be machined, and the workpiece is polished.
The energy converter bundling seat 3 is fixedly arranged between the top outer cover 1 and the liquid storage cavity 5, and the megasonic energy converter 2 is arranged on the energy converter bundling seat 3; the convergence direction of the megasonic waves emitted by the megasonic transducer 2 is the direction of the small hole 71 on the nozzle 7, and the convergence focus 22 is a point outside the small hole 71; a liquid inlet 51 is arranged on the cavity wall of the liquid storage cavity 5, and the polishing liquid 8 fills the whole liquid storage cavity through the liquid inlet 51; when megasonic waves emitted by the megasonic transducer 2 are focused at the small holes 71 on the nozzle 7 along with the polishing liquid 8 in the liquid storage cavity 5 after being started, the polishing liquid 8 accelerates under the action of the megasonic waves and generates the strongest micro-jet effect at the focus 22; when the micro-jet polishing device is used for element processing, the small hole 71 can be placed at the surface of the element 9 to be processed, so that the strongest micro-jet generated by the polishing liquid at the focus 22 can be effectively used for processing the surface of the element, and finally, the micro-jet polishing effect is achieved.
Example 2
Fig. 2 is a three-dimensional view of a transducer beam seat 3 in the confocal megasonic microjet polishing apparatus. The transducer cluster seat 3 is provided with a plurality of transducer mounting holes for mounting the megasonic transducers, and the number of the transducer mounting holes is larger than or equal to the number of the used megasonic transducers, because the actually adopted number of the megasonic transducers needs to be selected according to the actual use requirement, the number of the megasonic transducers can be determined according to the actual requirement and fixedly mounted in the transducer mounting holes of the transducer cluster seat 3. In actual operation, the working frequency and power of the megasonic transducer can be adjusted through hardware or software, and the whole working frequency and power of the transducer can be controlled by controlling a transducer driver.
For the transducer cluster base 3 shown at an angle in FIG. 3, the upper surface is a flat or nearly flat surface; from another angle, for example, as can be seen from the side cross-sectional view shown in fig. 4, the inner surface of the transducer cluster base 3 is a circular arc inner wall, the inner wall is in the shape of a spherical shell with the focal length of the transducer as a radius, the center of the circle of the circular arc inner wall is the center 33 of the sphere of the inner wall of the transducer cluster base, and the radius of the circle of the circular arc inner wall is the focal length of the transducer.
On the other hand, as shown in fig. 3, the orientation of the transducer mounting holes 31 on the transducer beam seat 3 may be non-vertical, because in order to ensure that the megasonic waves emitted by all the megasonic transducers converge at the same focal point, it is required that the megasonic waves emitted by all the installed megasonic transducers are focused at the spherical center 33 of the inner wall of the transducer beam seat. In order to ensure that the megasonic waves emitted by all the megasonic transducers mounted on the transducer beam seat 3 can be focused on the spherical center 33 of the inner wall of the transducer beam seat, the central axes 32 of the mounting holes corresponding to all the transducer mounting holes 31 are required to pass through the spherical center 33 of the inner wall of the transducer beam seat. Based on the corresponding position relationship, the orientation of each transducer mounting hole 31, and the position and the direction of the mounted transducer can be determined, so that the most concentrated megasonic wave convergence energy can be obtained at the position of the spherical center 33 of the inner wall of the transducer beam seat.
In one embodiment, the inner wall of each transducer mounting hole 31 is threaded for quick and easy installation or replacement of the transducer, thereby allowing quick screw installation and removal of the transducer having the outer wall threaded.
Example 3
In the confocal megasonic-based microjet polishing device, the polishing liquid 8 is a liquid medium for conducting megasonic energy, such as a stainless steel polishing liquid. In other embodiments, the polishing liquid 8 may be other liquids capable of performing the same function, and the liquid storage chamber must be filled with the polishing liquid 8 to serve as a medium for megasonic wave conduction during actual operation.
As shown in fig. 4, which is a schematic diagram of the transducer and its focal point, the megasonic waves emitted by the megasonic transducer in the previous embodiment focus the polishing liquid 8 at a point outside the end face of the transducer, which is the focal point of the transducer and at which the maximum megasonic acoustic field intensity is present, while at this point the polishing liquid exhibits the maximum jet velocity.
As shown in fig. 5, which is an overall three-dimensional view of a confocal megasonic microjet polishing apparatus provided by an embodiment of the present invention, the connection seat 4 is located on a housing of the polishing apparatus, and is used for fixedly mounting the polishing apparatus on other numerical control devices. In one embodiment, the polishing device can be fixed on the numerical control polishing head through the connecting seat during polishing, so that fixed-point polishing can be realized through the precise positioning function of the numerical control machine tool.
As shown in fig. 6, which is a schematic diagram of performing micro-jet polishing by using the confocal megasonic micro-jet polishing apparatus, when actually polishing a processing element 9, firstly, the micro-jet polishing apparatus is fixedly mounted on a numerical control machine tool, and the small hole of the nozzle 7, i.e. the megasonic convergence focus, is placed at a relatively high point on the surface of the processing element 9 for polishing and removing by the motion control and accurate positioning capability of the numerical control machine tool; meanwhile, the polishing solution 8 with certain pressure is filled in the liquid storage cavity through the liquid inlet and is sprayed out from the small hole of the nozzle 7, a medium is provided for the energy transmission of the megasonic wave, the working frequency and the power of the megasonic transducer can be adjusted according to the specific appearance of the processed point, and the processing efficiency and the processing quality of the workpiece are further improved to the maximum extent.
Example 4
The embodiment is a confocal megasonic microjet polishing method, which is implemented based on the operation of an optical element to be processed by the microjet polishing apparatus in any of the foregoing embodiments, and the method includes:
respectively installing selected megasonic transducers in the transducer installation holes 31 on the transducer cluster base 3 according to the processing requirement, and ensuring that megasonic waves emitted by all the megasonic transducers are focused on the spherical center 33 on the inner wall of the transducer cluster base;
fixedly mounting the micro-jet polishing device on a numerical control machine tool, starting the device, placing a small hole of a nozzle 7 of the device on the surface of a processing element 9 through the motion control and accurate positioning capability of the numerical control machine tool, filling a liquid storage cavity with polishing liquid 8 with certain pressure through a liquid inlet at the moment, and spraying the polishing liquid out of the small hole of the nozzle 7, thereby polishing and removing relatively high points on the surface of the processing element 9;
and adjusting the working frequency, power and other processing parameters of the megasonic transducer according to the surface shape error of the element to be processed to finish polishing.
As can be seen from the detailed description of the above embodiments, the confocal megasonic microjet polishing device and method provided by the embodiments of the present invention have the advantages of the conventional jet polishing, and because the high-frequency and high-energy megasonic waves are used to push the polishing solution to generate microjets to realize the jet polishing, the blocking phenomenon caused by reducing the size of the nozzle orifice to obtain a more ideal removal efficiency in the conventional jet polishing can be avoided, and the megasonic waves can inhibit the agglomeration effect of the polishing powder particles, and improve the suspension property and the dispersibility of the polishing solution; compared with the traditional jet polishing, the device and the method have more controllable parameters, can realize different light spot polishing, polishing efficiency and polishing quality by regulating and controlling the power and frequency parameters of the megasonic transducer array, and have good time response characteristics.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should take the description as a whole, and the technical solutions in the embodiments may be appropriately combined to form other embodiments understood by those skilled in the art.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.
Claims (6)
1. A confocal megasonic microjet polishing device is characterized by comprising a top outer cover (1), a megasonic transducer (2), a transducer cluster base (3), a connecting base (4), a liquid storage cavity (5), a sealing ring (6) and a nozzle (7), wherein the nozzle (7) is provided with a small hole (71) for spraying polishing liquid (8);
the top outer cover (1), the liquid storage cavity (5) and the nozzle (7) are sequentially connected to form a polishing device shell containing a closed space;
the energy converter bundling seat (3) is fixedly arranged between the top outer cover (1) and the liquid storage cavity (5), and the megasonic energy converter (2) is arranged on the energy converter bundling seat (3); the convergence direction of megasonic waves emitted by the megasonic transducer (2) is the direction of the small hole (71) on the nozzle (7), and the convergence focus (22) is a point outside the small hole (71);
the inner surface of the transducer cluster base (3) is an arc-shaped inner wall, the inner wall is in a spherical shell shape taking the focal length of the megasonic transducer (2) as the radius, the circle center of a circle where the arc-shaped inner wall is located is the spherical center (33) of the inner wall of the transducer cluster base (3), and the radius of the circle where the arc-shaped inner wall is located is the focal length of the megasonic transducer (2), so that the spherical center is superposed with the focal point (22) of the megasonic transducer (2);
the transducer cluster base (3) is provided with a plurality of mounting holes for mounting the megasonic transducers (2), and the number of the mounting holes is more than or equal to that of the megasonic transducers (2); when in use, the number of the megasonic transducers (2) is determined according to actual requirements and fixedly installed in the transducer installation holes (31) of the transducer cluster base (3), and the inner wall of each transducer installation hole (31) is provided with threads, so that the megasonic transducers (2) with the threads on the outer wall can be quickly and spirally installed and disassembled;
the central axes (32) of the mounting holes corresponding to all the transducer mounting holes (31) pass through the center (33) of the inner wall of the transducer cluster base (3), so that megasonic waves emitted by all the mounted megasonic transducers (2) can be focused on the center (33) of the inner wall of the transducer cluster base (3), and the most concentrated megasonic wave convergence energy is obtained at the position of the center (33) of the inner wall of the transducer cluster base (3);
a liquid inlet (51) is arranged on the cavity wall of the liquid storage cavity (5), and the polishing liquid (8) fills the whole liquid storage cavity (5) through the liquid inlet (51); when megasonic waves emitted by the megasonic transducer (2) are focused at the focus (22) along with the polishing liquid (8) in the liquid storage cavity (5), the polishing liquid (8) is accelerated under the action of the megasonic waves, and the strongest micro-jet effect is generated at the focus (22).
2. The confocal megasonic-based microjet polishing apparatus as claimed in claim 1, wherein the top housing (1) and the reservoir (5) are both clamped to the transducer cluster base (3), and the nozzle (7) is clamped to the other end of the reservoir (5).
3. The polishing device according to claim 1 or 2, wherein the two ends of the reservoir (5) are sealed with the joints of the transducer cluster base (3) and the nozzle (7) by the sealing ring (6).
4. The confocal megasonic-based microjet polishing device according to claim 1 or 2, characterized in that when the microjet polishing device is used for component processing, the small holes (71) are placed at the surface of the component (9) to be processed, so that the strongest microjet generated by the polishing liquid (8) at the focal point (22) can be effectively used for processing the surface of the component, and finally, the microjet polishing effect is achieved.
5. The polishing device based on the confocal megasonic microjet as claimed in claim 1, wherein the connecting seat (4) is located on the housing of the polishing device for fixedly mounting the polishing device on a numerical control device.
6. A confocal megasonic microjet polishing method, which is implemented based on the operation of the optical element to be processed by the microjet polishing device as claimed in any one of claims 1 to 5, the method comprising:
according to the processing requirement, selected megasonic transducers (2) are respectively installed in transducer installation holes (31) on the transducer beam-collecting seat (3), so that megasonic waves emitted by all the megasonic transducers (2) are ensured to be focused on the spherical center (33) of the inner wall of the transducer beam-collecting seat (3);
fixedly mounting the micro-jet polishing device on a numerical control machine tool, starting the device, placing a small hole of a nozzle (7) of the device on the surface of a processing element (9) through the motion control and accurate positioning capability of the numerical control machine tool, filling a liquid storage cavity with polishing liquid (8) with certain pressure through a liquid inlet at the moment, and spraying the polishing liquid from the small hole of the nozzle (7), thereby polishing and removing relatively high points on the surface of the processing element (9);
and adjusting the working frequency and power processing parameters of the megasonic transducer according to the surface shape error of the element to be processed to finish polishing.
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| JP3805756B2 (en) * | 2003-03-28 | 2006-08-09 | 株式会社東芝 | Inkjet recording device |
| CN201744425U (en) * | 2010-07-02 | 2011-02-16 | 苏州英诺迅科技有限公司 | Ultrasonic-focusing liquid sprayer |
| CN202214671U (en) * | 2011-08-05 | 2012-05-09 | 宝鸡市晋旺达机械设备有限公司 | Microwave heating beam concentration pipe |
| CN102352595B (en) * | 2011-08-05 | 2014-01-08 | 宝鸡市晋旺达机械设备有限公司 | Bundling tube for microwave oven |
| CN102601687A (en) * | 2012-03-06 | 2012-07-25 | 中国科学院长春光学精密机械与物理研究所 | Phased-array ultrasound focused fluid vibration polishing device |
| US20150206738A1 (en) * | 2014-01-21 | 2015-07-23 | Sematech, Inc. | Surface Cleaning Method and Apparatus Using Surface Acoustic Wave Devices |
| CN103920397B (en) * | 2014-04-15 | 2016-01-20 | 江苏大学 | A kind of Composite Field UF membrane experimental provision being applicable to conventional flat-panel membrane component |
| CN107694449A (en) * | 2017-10-30 | 2018-02-16 | 碧爱姆沃克斯株式会社 | Ultrasonic energy compaction system |
| CN110026908B (en) * | 2019-04-30 | 2024-01-30 | 天津大学 | Ultrasonic cavitation auxiliary jet polishing system and polishing method |
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