CN110026908B - Ultrasonic cavitation auxiliary jet polishing system and polishing method - Google Patents
Ultrasonic cavitation auxiliary jet polishing system and polishing method Download PDFInfo
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- CN110026908B CN110026908B CN201910362390.XA CN201910362390A CN110026908B CN 110026908 B CN110026908 B CN 110026908B CN 201910362390 A CN201910362390 A CN 201910362390A CN 110026908 B CN110026908 B CN 110026908B
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- 238000005498 polishing Methods 0.000 title claims abstract description 136
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 239000000243 solution Substances 0.000 claims description 40
- 239000002245 particle Substances 0.000 claims description 28
- 239000000919 ceramic Substances 0.000 claims description 23
- 238000003754 machining Methods 0.000 claims description 14
- 230000033001 locomotion Effects 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 4
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 4
- 239000002113 nanodiamond Substances 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 9
- 239000007921 spray Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 238000012937 correction Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/02—Abrasive blasting machines or devices; Plants characterised by the arrangement of the component assemblies with respect to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C5/00—Devices or accessories for generating abrasive blasts
- B24C5/005—Vibratory devices, e.g. for generating abrasive blasts by ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses an ultrasonic cavitation auxiliary jet polishing system which is characterized by comprising an ultrasonic transducer and a shell; a cavity with an opening at the upper end is arranged in the shell; the ultrasonic transducer sealing cover is sealed on the upper end opening of the containing cavity; the side surface of the shell is provided with a polishing liquid supply port; a jet nozzle is arranged on the lower side of the shell; the polishing solution supply port and the jet nozzle are communicated with the containing cavity. The invention also provides an ultrasonic cavitation auxiliary jet polishing method. The ultrasonic cavitation auxiliary jet polishing system can be arranged on a spindle box of a numerical control machine tool or an industrial robot mechanical arm, utilizes an ultrasonic transducer to enable polishing liquid to generate high-frequency vibration and cavitation bubbles, and sprays the high-pressure high-speed polishing liquid to the surface of a workpiece, so that the material removal efficiency of abrasive water jet is improved. The invention is not only suitable for surface finishing of ultra-smooth surfaces, but also suitable for processing and manufacturing of surfaces with microcosmic special shapes.
Description
Technical Field
The invention relates to a fluid polishing device and a polishing method, in particular to an ultrasonic cavitation auxiliary jet polishing system and a polishing method.
Background
At present, with the development of modern optical technology, the requirements for high-performance high-quality optical parts are more and more urgent, and meanwhile, the requirements for processing equipment and process of the high-quality optical parts are also more and more high. Various processing methods have been studied to obtain a high-precision surface, among which typical methods are plastic grinding, chemical polishing, float polishing, elastic shot processing, particle beam polishing, jet polishing, and the like. However, these typical processing methods have some drawbacks, such as damage to the processing surface of the element, too low processing efficiency, and poor controllability, and thus new processing methods have been proposed.
Abrasive water jet polishing is an ultra-precise processing technology integrating fluid dynamics, nano material removal and surface technology developed on the basis of water jet processing technology. The basic working principle is that a nozzle with an adjustable angle is utilized to spray the premixed polishing solution onto the surface of a workpiece at proper pressure and speed (the pressure range is generally 4bar-20 bar), nano-removal of materials is carried out by utilizing the interaction of particles in suspension and the workpiece, and finally, the purposes of surface shape correction and planarization of the surface of the polished workpiece are realized. Compared with the traditional processing technology, the abrasive water jet polishing has the advantages of no tool abrasion, no thermal reaction, small reaction force, high processing flexibility and the like. Although abrasive particle water jet polishing techniques can be used for ultra-precise machining of aspheric, free-surface, microstructured surfaces and high-steepness high aspect ratio cavity surface devices, the removal efficiency of polishing materials is low (typically less than 1 mm) due to unstable jet beam 3 /min) and the like, so that the polishing agent can not meet the requirements of high-efficiency polishing of superhard materials such as polycrystalline diamond, silicon carbide and the like
The fluid vibration polishing (Polishing based Vibration of Liquid, PVL) is different from a polishing millstone adopted by the traditional ultra-smooth surface fluid polishing technology, a workpiece is directly soaked in polishing liquid, an ultrasonic transducer is utilized to radiate high-frequency ultrasonic waves to the liquid, and a pressure field and a flow field generated by ultrasonic vibration are utilized to drive particles in the polishing liquid to wash the surface of the workpiece. When the sound pressure exceeds the cavitation threshold, a strong cavitation effect is generated, local energy concentration is generated near the surface of the workpiece, and extreme phenomena such as high temperature, high pressure, shock wave, high-speed jet flow and the like are caused, and the micro-jet flow can effectively realize the removal of materials by matching with the high-frequency motion of abrasive particles. At present, for the processing of fluid vibration polishing, a plurality of ultrasonic transducers are mainly installed on the top or the side surface of a polishing groove to form an ultrasonic transducer array, and a processed workpiece performs planetary motion in polishing liquid to keep certain uniformity. However, such fluid polishing devices also suffer from several disadvantages: the workpiece to be processed is completely immersed in the polishing groove, so that the excited abrasive and the excited jet can remove materials on all surfaces of the whole workpiece, and the removal amount of all parts is difficult to control, so that the current fluid vibration polishing device cannot carry out high-quality correction on the surfaces of the workpiece.
Disclosure of Invention
The invention provides an ultrasonic cavitation auxiliary jet polishing system and a polishing method for polishing the surface of a workpiece to be polished.
The invention adopts the technical proposal for solving the technical problems in the prior art that: an ultrasonic cavitation auxiliary jet polishing system comprises an ultrasonic transducer and a shell; a cavity with an opening at the upper end is arranged in the shell; the ultrasonic transducer sealing cover is sealed on the upper end opening of the containing cavity; the side surface of the shell is provided with a polishing liquid supply port; a jet nozzle is arranged on the lower side of the shell; the polishing solution supply port and the jet nozzle are communicated with the containing cavity.
Further, the ultrasonic transducer comprises a spherical piezoelectric ceramic plate which is recessed upwards; the piezoelectric ceramic piece is positioned above the upper end opening of the containing cavity.
Further, the spherical focal length of the piezoelectric ceramic piece is 10-100mm.
Further, the spherical focus of the piezoelectric ceramic piece is positioned at the center of the upper end of the jet nozzle.
Further, the accommodating cavity is a conical accommodating cavity with a downward conical top, and a diversion hole is arranged at the conical top of the conical accommodating cavity; the jet nozzle is communicated with the diversion hole.
Further, the jet nozzle is detachably connected with the housing.
Further, the jet nozzle is provided with an injection hole, and the diameter of the injection hole is 0.1-3mm.
The invention also provides an ultrasonic cavitation auxiliary jet polishing method, which is applied to the ultrasonic cavitation auxiliary jet polishing system and comprises the following steps: the ultrasonic cavitation auxiliary jet polishing system is arranged on a spindle box of a numerical control machine tool or an industrial robot arm; and injecting the pressurized polishing solution into the inner cavity of the shell through the polishing solution supply port, and spraying the polishing solution from the jet nozzle to the surface of the workpiece after the ultrasonic wave action in the cavity.
Further, the removal amount of the surface material to be polished and the surface machining precision of the workpiece are controlled by adjusting the ultrasonic frequency emitted by the ultrasonic transducer, the distance between the jet nozzle and the workpiece, the jet angle of the jet nozzle, the concentration of the polishing solution, the supply pressure of the polishing solution, the residence time of the machining point and/or the movement track of the jet nozzle relative to the workpiece.
Further, the abrasive particles in the polishing solution are one or a combination of more of cerium oxide particles, aluminum oxide particles, silicon oxide particles or nano diamond particles, and the supply pressure of the polishing solution is as follows: the polishing solution injection speed at the outlet of the jet nozzle is 0.1-10 Mpa: 10-100m/s.
The invention has the advantages and positive effects that:
the ultrasonic cavitation auxiliary jet polishing system can be arranged on a spindle box of a numerical control machine tool or an industrial robot mechanical arm, utilizes an ultrasonic transducer to enable polishing liquid to generate high-frequency vibration and cavitation bubbles, focuses the cavitated polishing liquid on a jet nozzle, utilizes the jet nozzle to spray high-pressure and high-speed polishing liquid on the surface of a workpiece to be polished, and increases the speed of particles in the polishing liquid impacting the surface of the workpiece along with rapid rupture of the cavitation bubbles, so that the material removal efficiency of abrasive water jet is improved.
According to the ultrasonic cavitation auxiliary jet polishing method, the ultrasonic cavitation auxiliary jet polishing system is utilized, the motion track and the residence time of the jet nozzle can be controlled in the implementation process to accurately control the removal amount of the surface material of the workpiece, and therefore the precise polishing of the surface of the workpiece is achieved.
The ultrasonic cavitation auxiliary jet polishing system and the polishing method can be suitable for surface finishing of ultra-smooth surfaces and processing and manufacturing of surfaces with microcosmic special shapes.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
fig. 2 is a schematic view of the structure of the piezoelectric ceramic sheet of the present invention.
In the figure: 1. an ultrasonic power supply; 2. an ultrasonic transducer; 3. a housing; 4. a jet nozzle; 5. a workpiece; 6. a seal ring; 7. a polishing liquid supply port; 8. a deflector aperture; 9. polishing solution; r, spherical radius of the piezoelectric ceramic piece.
Detailed Description
For a further understanding of the invention, its features and advantages, reference is now made to the following examples, which are illustrated in the accompanying drawings in which:
referring to fig. 1 to 2, an ultrasonic cavitation auxiliary jet polishing system includes an ultrasonic transducer 2 and a housing 3; a containing cavity with an opening at the upper end is arranged in the shell 3; the ultrasonic transducer 2 is sealed and sealed on the upper end opening of the containing cavity; the side surface of the shell 3 is provided with a polishing solution supply port 7; a jet nozzle 4 is arranged on the lower side of the shell 3; the polishing liquid supply port 7 and the jet nozzle 4 are communicated with the containing cavity. The jet nozzle 4 can be detachably connected with the shell 3, and the jet nozzle and the shell can be in threaded connection. The ultrasonic waves emitted by the ultrasonic transducer 2 may have a frequency range of 10KHz to 20MHz.
The ultrasonic power supply 1 supplies electric energy to the ultrasonic transducer 2, the ultrasonic transducer 2 is arranged on the shell 3 through a bolt, in order to prevent the polishing solution 9 from leaking, a rubber sealing ring 6 is adopted on the joint surface for sealing, a polishing solution supply port 7 is arranged on the side surface of the shell 3 and is used for injecting the polishing solution 9 with certain pressure into the inner cavity of the shell 3; the jet nozzle 4 is arranged on the lower side of the shell 3, and the position of the jet nozzle 4 can be used as the focusing focal position of the ultrasonic transducer 2; during polishing, the jet nozzle 4 is kept at a distance from the workpiece 5.
The ultrasonic transducer 2 may include a spherical piezoelectric ceramic plate recessed upward; the ultrasonic transducer 2 is directly focused using the spherical focusing principle. The piezoelectric ceramic plates can be ground into spherical crowns, or a spherical crown can be formed by gluing tens or hundreds of plane piezoelectric ceramic plates. The spherical radius R of the piezoelectric ceramic plate can be set, and then the piezoelectric ceramic plate is processed or assembled according to the set value; spherical piezoelectric ceramic plates which are commercially available finished products can also be selected.
The piezoelectric ceramic piece can be positioned above the upper end opening of the accommodating cavity. The spherical focal length of the piezoelectric ceramic piece can be 10-100mm. In order to make the abrasive particles in the polishing liquid 9 sprayed from the jet nozzle faster and make the polishing effect better, the spherical focus of the piezoelectric ceramic plate may be located at the center of the upper end of the jet nozzle 4.
In order to make the abrasive grain speed in the polishing solution 9 sprayed from the jet nozzle faster and the polishing effect better, the cavity can be a conical cavity with downward conical top, and the conical top of the conical cavity can be provided with a diversion hole 8; the jet nozzle 4 may be in communication with the pilot hole 8. The jet nozzle 4 may be provided with jet holes, which may have a diameter of 0.1-3mm. The upper end opening of the jet nozzle 4 can be a horn mouth; the diameter of the diversion hole 8 is the same as the diameter of the bell mouth at the upper end of the jet nozzle 4.
The shell 3 can be arranged on a spindle box of a numerical control machine tool, and the jet nozzle 4 is always aligned to the surface of a part to be processed of the workpiece 5 through the combined movement of the workbench and the spindle box. The shell 3 can also be arranged on an industrial robot mechanical arm, and the distance between the jet nozzle 4 and the surface of the workpiece 5 and the relative posture of the jet nozzle 4 and the surface of the workpiece 5 are controlled by adjusting the position of the mechanical arm.
The invention also provides an embodiment of an ultrasonic cavitation auxiliary jet polishing method, which is applied to the ultrasonic cavitation auxiliary jet polishing system, and comprises the following steps: the ultrasonic cavitation auxiliary jet polishing system is arranged on a spindle box of a numerical control machine tool or an industrial robot arm; the pressurized polishing solution 9 is injected into the internal cavity of the shell 3 through the polishing solution supply port 7, and the polishing solution 9 is sprayed out of the jet nozzle 4 and onto the surface of the workpiece 5 after the ultrasonic wave action in the cavity.
Further, the amount of surface material to be polished and the surface machining precision of the workpiece 5 can be controlled by adjusting the ultrasonic frequency emitted by the ultrasonic transducer, the distance between the jet nozzle 4 and the workpiece 5, the injection angle of the jet nozzle 4, the concentration of the polishing liquid 9, the supply pressure of the polishing liquid 9, the residence time of the machining point and/or the movement track of the jet nozzle 4 relative to the workpiece. Namely, the removal amount of the surface material to be polished and the surface machining precision of the workpiece 5 are controlled by one or more of the following parameters: ultrasonic frequency, distance between the jet nozzle 4 and the workpiece 5, jet angle of the jet nozzle 4, concentration of the polishing liquid 9, supply pressure of the polishing liquid 9, residence time of a processing point, and movement track of the jet nozzle 4 relative to the workpiece.
Further, the abrasive particles in the polishing solution 9 may be one or a combination of several of cerium oxide particles, aluminum oxide particles, silicon oxide particles or nano diamond particles, and the supply pressure of the polishing solution 9 may be: the polishing solution injection speed at the outlet of the jet nozzle 4 is 0.1-10 Mpa: 10-100m/s.
First preferred embodiment: in this example, the housing 3 of the present invention may be mounted vertically to a headstock above a work table of a numerically controlled machine tool, the workpiece 5 is fixed to the work table, and the jet nozzle 4 is moved to a suitable position above the surface of the workpiece 5 by the combined movement of the work table and headstock; pressurizing the polishing solution 9 mixed with particles in advance to the range of 0.1-10MPa by using a pressure pump, injecting the pressurized polishing solution 9 into the shell 3 through a polishing solution supply port 7, starting an ultrasonic power supply 1, spraying the polishing solution 9 subjected to ultrasonic cavitation onto the surface of the workpiece 5, and washing the surface of a processing area of the workpiece 5 by using particles in the polishing solution 9 to remove materials on the surface of the workpiece 5. In the machining process, firstly, the residence time and the optimized machining track are calculated according to the initial surface type error of the workpiece 5, a numerical control machining program is generated, the machining program is guided into a machine tool, and the surface of the workpiece 5 is precisely polished.
Second preferred embodiment:
in this example, the housing 3 of the present invention may be mounted on a flexible adjustable mechanical arm of an industrial robot, and the distance between the jet nozzle 4 and the surface of the workpiece 5 and the relative posture between the jet nozzle 4 and the surface of the workpiece 5 may be controlled by adjusting the mechanical arm. Thus, the polishing machine can flexibly meet the requirements of polishing processing of the inner surfaces of different complex free curved surfaces and special-shaped cavities.
The working principle of the invention is as follows: the invention combines the principle of abrasive water jet polishing device and focused ultrasonic, the ultrasonic is elastic wave with the frequency exceeding 20kHz, the wave length is short, the frequency is high, the beam-jet performance is stronger, and the energy is highly concentrated. Ultrasonic polishing is a polishing method which uses ultrasonic waves as power to push fine abrasive particles to impact the surface of a workpiece at an extremely high speed so as to force the abrasive to process the processed surface, thereby reducing the surface roughness of the processed surface. The ultrasonic transducer generates high-frequency vibration, the ultrasonic transducer 2 adopts a spherical piezoelectric ceramic plate to have the characteristic of self-focusing, the polishing solution 9 in the shell 3 vibrates at high frequency under the action of a sound field and generates cavitation bubbles, the polishing solution 9 containing the cavitation bubbles and polishing particles are sprayed to the surface of a workpiece 5 to be processed by utilizing the characteristic of high pressure and high speed of abrasive water jet polishing, and the dynamic behaviors of cavitation bubbles such as formation, growth, cracking and the like accelerate the particle impact surface speed in the polishing solution 9, so that the water jet polishing efficiency is improved.
The ultrasonic transducer 2 adopts a spherical piezoelectric ceramic plate, the focusing distance of the spherical piezoelectric ceramic plate can be 10-100mm according to application requirements, and the focal position of the ultrasonic transducer 2 is positioned at the jet nozzle 4.
The frequency range of the ultrasonic wave emitted by the ultrasonic transducer 2 is between 10KHz and 20MHz, and the ultrasonic frequencies of cavitation bubbles generated in the ultrasonic focusing wall body are different due to the different materials and concentrations of the polishing solution 9, so that the proper frequency range can be selected according to application requirements.
Injecting a pre-prepared polishing solution 9 into the shell 3 at a certain pressure, wherein the polishing in the polishing solution 9 can be cerium oxide, aluminum oxide, silicon oxide or nano diamond particles, and the supply pressure range of the polishing solution 9 is as follows: the spraying speed range of the polishing solution 9 at the nozzle is 0.1-10 Mpa: 10-100m/s.
In the polishing device, the jet nozzle 4 is made of stainless steel, sapphire glass, ceramic or other pressure-resistant and corrosion-resistant materials, and the micropore diameter range of the jet nozzle 4 is as follows: 0.1-3mm.
In the machining process, the material removal amount and the surface machining precision of a machining area can be controlled by controlling the ultrasonic vibration frequency, the distance and the injection angle between the nozzle and the workpiece 5, the concentration of the polishing liquid 9, the supply pressure of the polishing liquid 9, the residence time and the movement track of a machining point, so that the precise polishing process of the surface of the workpiece 5 is realized.
The above-described embodiments are only for illustrating the technical spirit and features of the present invention, and it is intended to enable those skilled in the art to understand the content of the present invention and to implement it accordingly, and the scope of the present invention is not limited to the embodiments, i.e. equivalent changes or modifications to the spirit of the present invention are still within the scope of the present invention.
Claims (8)
1. An ultrasonic cavitation auxiliary jet polishing system is characterized by comprising an ultrasonic transducer and a shell; a cavity with an opening at the upper end is arranged in the shell; the ultrasonic transducer sealing cover is sealed on the upper end opening of the containing cavity; the side surface of the shell is provided with a polishing liquid supply port; a jet nozzle is arranged on the lower side of the shell; the polishing solution supply port and the jet nozzle are communicated with the containing cavity;
the ultrasonic transducer comprises a spherical piezoelectric ceramic plate which is recessed upwards; the piezoelectric ceramic piece is positioned above the upper end opening of the accommodating cavity;
the accommodating cavity is a conical accommodating cavity with a downward conical top, and a diversion hole is arranged at the conical top of the conical accommodating cavity; the jet nozzle is communicated with the diversion hole.
2. The ultrasonic cavitation assisted jet polishing system of claim 1, wherein the spherical focal length of the piezoelectric ceramic plate is 10-100mm.
3. The ultrasonic cavitation assisted jet polishing system of claim 1, wherein the spherical focus of the piezoelectric ceramic plate is centered at the upper end of the jet nozzle.
4. The ultrasonic cavitation assisted jet polishing system of claim 1, wherein the jet nozzle is detachably connected to the housing.
5. The ultrasonic cavitation assisted jet polishing system of claim 1, wherein the jet nozzle is provided with an injection orifice having a diameter of 0.1-3mm.
6. An ultrasonic cavitation assisted jet polishing method, characterized by being applied to the ultrasonic cavitation assisted jet polishing system according to any one of claims 1 to 5, comprising: the ultrasonic cavitation auxiliary jet polishing system is arranged on a spindle box of a numerical control machine tool or an industrial robot arm; and injecting the pressurized polishing solution into the inner cavity of the shell through the polishing solution supply port, and spraying the polishing solution from the jet nozzle to the surface of the workpiece after the ultrasonic wave action in the cavity.
7. The ultrasonic cavitation assisted jet polishing method according to claim 6, wherein the amount of surface material removal and the surface machining accuracy of the workpiece to be polished are controlled by adjusting the ultrasonic frequency emitted by the ultrasonic transducer, the distance between the jet nozzle and the workpiece, the jet angle of the jet nozzle, the concentration of the polishing liquid, the supply pressure of the polishing liquid, the residence time of the machining point and/or the movement track of the jet nozzle relative to the workpiece.
8. The ultrasonic cavitation auxiliary jet polishing method according to claim 6, wherein the abrasive particles in the polishing liquid are one or a combination of a plurality of cerium oxide particles, aluminum oxide particles, silicon oxide particles or nano diamond particles, and the supply pressure of the polishing liquid is as follows: the polishing solution injection speed at the outlet of the jet nozzle is 0.1-10 Mpa: 10-100m/s.
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| CN201910362390.XA CN110026908B (en) | 2019-04-30 | 2019-04-30 | Ultrasonic cavitation auxiliary jet polishing system and polishing method |
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| CN201910362390.XA CN110026908B (en) | 2019-04-30 | 2019-04-30 | Ultrasonic cavitation auxiliary jet polishing system and polishing method |
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| CN110026908B true CN110026908B (en) | 2024-01-30 |
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