CN110291220A - Exposure mask, the alignment methods that exposure mask is deposited and the fixed device of vapor deposition exposure mask is deposited - Google Patents
Exposure mask, the alignment methods that exposure mask is deposited and the fixed device of vapor deposition exposure mask is deposited Download PDFInfo
- Publication number
- CN110291220A CN110291220A CN201880011467.2A CN201880011467A CN110291220A CN 110291220 A CN110291220 A CN 110291220A CN 201880011467 A CN201880011467 A CN 201880011467A CN 110291220 A CN110291220 A CN 110291220A
- Authority
- CN
- China
- Prior art keywords
- exposure mask
- vapor deposition
- alignment
- frame
- mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims abstract description 45
- 230000002093 peripheral effect Effects 0.000 claims abstract description 19
- 239000011521 glass Substances 0.000 claims description 36
- 238000010025 steaming Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 abstract description 15
- 238000005259 measurement Methods 0.000 description 14
- 238000013461 design Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 238000003466 welding Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000005323 electroforming Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Reduce positional shift when forming pattern on substrate in used exposure mask, being formed by pattern.Vapor deposition exposure mask (20) comprising the multiple drafting departments for being formed with predetermined pattern is comprised the steps of: into the 1st alignment procedures (S3) to the alignment methods of frame (30) fixed vapor deposition exposure mask, 1st offset of the 1st alignment mark (201) based on the 1st reference mark (101) for the vapor deposition exposure mask and frame contraposition and the edge for being formed in the vapor deposition exposure mask, the vapor deposition exposure mask is directed at the relative position of the frame；And the 2nd alignment procedures (S5), 2nd offset of the 2nd alignment mark (202) based on the 2nd reference mark (102) and the peripheral part for being formed in the drafting department for the vapor deposition exposure mask and frame contraposition, the vapor deposition exposure mask being aligned by the 1st alignment procedures is directed at the relative position of the frame again.
Description
Technical field
The present invention relates to exposure mask, the alignment methods that exposure mask is deposited and the fixed device of vapor deposition exposure mask is deposited.
Background technique
In the manufacturing engineering of display device, certain material is formed a film using vapor deposition exposure mask (also referred to as exposure mask)
Technology on substrate.In the film forming using exposure mask, using be formed with the exposure mask of predetermined pattern by certain material the shape on substrate
As predetermined pattern.For example, in the manufacturing engineering of organic EL display device, as forming the organic of red, green, blue on substrate
One of method of EL element and use exposure mask vapour deposition method.Sometimes multiple this exposure masks are fixed on frame to come as an exposure mask
It uses.
Patent Document 1 discloses following the description: when making two metal mask engagements by fixed exposure mask, passing through
Make to be arranged in contraposition through hole on metal mask with being arranged in fixed with the alignment mark on exposure mask and being aligned to be aligned.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2011-181208 bulletin
Summary of the invention
In patent document 1, the contraposition through hole of metal mask peripheral portion is arranged in monitoring on one side and setting is used fixed
The offset of alignment mark on exposure mask carries out the alignment of metal mask and fixed exposure mask on one side.
But disclosed in the patent document 1 in the prior art, it be not formed uniformly mask pattern or exposure mask itself skew
In the case of, even if the aligned in position of exposure mask peripheral part, it can also generate the very big project of the positional shift of the pattern in actual product.
The present invention is proposed in view of the above subject, it is intended that when forming pattern on substrate in the exposure mask that uses,
Reduce the positional shift for being formed by pattern.Additionally, it is provided a kind of pair for the positional shift for reducing the pattern formed on substrate
Quasi- method and the fixed device of exposure mask.
(1) in order to solve the above problems, vapor deposition exposure mask of the invention includes the multiple drafting departments for being formed with predetermined pattern,
It is characterized in that, is equipped with the 1st alignment mark in the edge of the vapor deposition exposure mask, is equipped in the peripheral part of the drafting department relative to institute
State the 2nd alignment mark that the 1st alignment mark is located inside.
(2) it is also possible in the vapor deposition exposure mask described in above-mentioned (1), the vapor deposition exposure mask has multiple corners, and described the
1 alignment mark be equipped with it is multiple, the 2nd alignment mark be equipped with it is multiple, multiple 1st alignment marks are located at the multiple
Each of corner, multiple 2nd alignment marks include multiple the 2nd alignment mark groups for being configured to a column.
(3) it is also possible in the vapor deposition exposure mask described in above-mentioned (1) or (2), the 2nd alignment mark is arranged described
In multiple drafting departments between two adjacent drafting departments.
(4) in order to solve the above problems, vapor deposition exposure mask of the invention includes: the 1st vapor deposition exposure mask comprising multiple drafting departments；
The 2nd vapor deposition exposure mask comprising multiple drafting departments；And it is fixed with the frame of the 1st vapor deposition exposure mask and the 2nd vapor deposition exposure mask,
The vapor deposition exposure mask is characterized in that the frame has multiple 1st reference marks and multiple 2nd reference marks, and the described 1st steams
Plating exposure mask has the edge for being located at the 1st vapor deposition exposure mask and 1st alignment mark opposite with the 1st reference mark,
With the peripheral part and 2nd alignment mark opposite with the 2nd reference mark for being located at the drafting department, the 2nd vapor deposition
Exposure mask has the edge for being located at the 2nd vapor deposition exposure mask and 1st alignment mark opposite with the 1st reference mark, and
Peripheral part and 2nd alignment mark opposite with the 2nd reference mark positioned at the drafting department, the 2nd pair of fiducial mark
Remember the inside for being located at the 1st vapor deposition exposure mask or the 2nd vapor deposition exposure mask compared with the 1st alignment mark.
(5) in order to solve the above problems, the alignment methods of vapor deposition exposure mask of the invention will be comprising being formed with predetermined pattern
Multiple drafting departments vapor deposition exposure masks are fixed to frame, and the alignment methods of the vapor deposition exposure mask are characterised by comprising following steps: the
1 alignment procedures, based on for covering the vapor deposition exposure mask and the 1st reference mark of frame contraposition with the vapor deposition is formed in
1st offset of the 1st alignment mark of the edge of film is directed at the vapor deposition exposure mask with the relative position of the frame；
And the 2nd alignment procedures, based on for by the 2nd reference mark of the vapor deposition exposure mask and frame contraposition and being formed in described
2nd offset of the 2nd alignment mark of the peripheral part of drafting department, described in being aligned by the 1st alignment procedures
Vapor deposition exposure mask is aligned again with the relative position of the frame.
(6) in order to solve the above problems, the alignment methods of vapor deposition exposure mask of the invention will be comprising being formed with predetermined pattern
Multiple drafting department vapor deposition exposure masks are fixed to frame, and the alignment methods that exposure mask is deposited are characterized in that, the 1st offset of measurement, and the 1st
Offset is for the 1st reference mark and the edge for being formed in the vapor deposition exposure mask that exposure mask and the frame align to be deposited by described
The relative positional relationship of 1st alignment mark in portion, measure the 2nd offset, the 2nd offset be for by the vapor deposition exposure mask with
2nd reference mark of the frame contraposition and the relative position for the 2nd alignment mark being formed between the adjacent drafting department
Relationship carries out the relative position between the vapor deposition exposure mask and the frame based on the 1st offset and the 2nd offset
Alignment.
(7) it is also possible in the alignment methods that exposure mask is deposited described in above-mentioned (5) or (6), fixes on said frame
There are multiple vapor deposition exposure masks.
(8) in order to solve the above problems, the fixed device of vapor deposition exposure mask of the invention will be comprising being formed with the more of predetermined pattern
The vapor deposition exposure mask of a drafting department is fixed on frame, and the fixed device of the vapor deposition exposure mask is characterised by comprising: reference glass,
Its 1st reference mark and the 2nd reference mark for being formed with the benchmark as the vapor deposition exposure mask and frame contraposition；Camera shooting
Head shoots the 1st reference mark and the 2nd reference mark；And alignment tool, have and loads the vapor deposition exposure mask
Mounting portion and the alignment that makes the vapor deposition exposure mask move and be aligned along the frame surface opposite with the vapor deposition exposure mask
Mechanism, the camera measure the of the 1st reference mark and the 1st alignment mark of the edge for being formed in the vapor deposition exposure mask
1 offset, the camera measure the 2nd alignment mark of the 2nd reference mark with the peripheral part for being formed in the drafting department
The 2nd offset, the alignment tool based on the 1st offset to it is described vapor deposition exposure mask and the frame relative position carry out
Alignment, the alignment tool are being directed at the vapor deposition exposure mask with the relative position of the frame based on the 1st offset
Afterwards, also the relative position being aligned based on the 1st offset is aligned based on the 2nd offset.
(9) in order to solve the above problems, the fixed device of vapor deposition exposure mask of the invention will be comprising being formed with the more of predetermined pattern
The vapor deposition exposure mask of a drafting department is fixed on frame, and the fixed device of the vapor deposition exposure mask is characterised by comprising: reference glass,
Its 1st reference mark and the 2nd reference mark for being formed with the benchmark as the vapor deposition exposure mask and frame contraposition；Camera shooting
Head shoots the 1st reference mark and the 2nd reference mark；And alignment tool, have and loads the vapor deposition exposure mask
Mounting portion and the alignment that makes the vapor deposition exposure mask move and be aligned along the frame surface opposite with the vapor deposition exposure mask
Mechanism, the camera measure the 1st offset, and the 1st offset is the 1st reference mark and is formed in the vapor deposition exposure mask
Edge the 1st alignment mark relative positional relationship, the camera measures the 2nd offset, and the 2nd offset is described the
The relative positional relationship of 2 reference marks and the 2nd alignment mark being formed between the adjacent drafting department, the alignment stylobate
The vapor deposition exposure mask is aligned with the relative position of the frame in the 1st offset and the 2nd offset.
(10) it is also possible in the fixed device of the vapor deposition exposure mask described in above-mentioned (8) or (9), fixes on said frame
There are multiple vapor deposition exposure masks.
Invention effect
In accordance with the invention it is possible to reduce it is when forming pattern on substrate in used exposure mask, be formed by pattern
Positional shift.In addition, alignment methods according to the present invention and the fixed device of exposure mask, can reduce the pattern formed on substrate
Positional shift.
Detailed description of the invention
Fig. 1 is the schematic diagram for showing the overall structure of the fixed device of exposure mask of present embodiment.
Fig. 2 is the figure for showing an example of exposure mask of present embodiment.
Fig. 3 is the figure for showing an example of frame of present embodiment.
Fig. 4 is the 1st figure for showing the reference mark being arranged in the reference glass of present embodiment.
Fig. 5 is the 1st figure for showing the alignment mark being arranged on the exposure mask of present embodiment.
Fig. 6 is the 2nd figure for showing the reference mark being arranged in the reference glass of present embodiment.
Fig. 7 is the 2nd figure for showing the alignment mark being arranged on the exposure mask of present embodiment.
Fig. 8 is the 1st flow chart for showing exposure mask fixing process performed by the fixed device of exposure mask of present embodiment.
Fig. 9 is the figure for showing an example for the photographed images that camera takes.
Figure 10 is the figure for schematically showing an example of the movement of camera of present embodiment.
Figure 11 is the 2nd process for showing exposure mask fixing process performed by the fixed device of exposure mask of present embodiment
Figure.
Specific embodiment
Illustrate embodiments of the present invention referring to the drawings.
In addition, the attached drawing of reference exists each portion relative to virtual condition to make explanation definitely in following explanation
The case where width, thickness, the shape etc. divided are schematically shown, but only an example, and non-limiting explanation of the invention.Separately
Outside, in this specification and each attached drawing, sometimes to about in preceding attached drawing it is stated that identical element mark identical attached drawing
It marks and appropriate detailed description will be omitted.
Fig. 1 is the schematic diagram for showing the overall structure of the fixed device 1 of exposure mask of present embodiment.Fig. 1 is from side
The figure of the fixed device 1 of exposure mask.The fixed device 1 (the also referred to as fixed device of vapor deposition exposure mask, vapor deposition exposure mask laminating apparatus) of exposure mask be
The device for having carried out exposure mask 20 (also referred to as vapor deposition exposure mask) and being fixed on exposure mask 20 after the alignment of frame 30 on frame 30.It covers
The fixed device 1 of film is configured to, and includes frame maintaining part 11, reference glass 13, camera 14, alignment tool 16, welding unit 18.It is logical
The alignment that reference glass 13, camera 14 and alignment tool 16 carry out exposure mask 20 and frame 30 is crossed, is covered by welding unit 18
The fixation of film 20 and frame 30.
Frame 30 is maintained between reference glass 13 and alignment tool 16 by frame maintaining part 11.
Reference glass 13 is fixed on the top of the fixed device 1 of exposure mask, and is equipped with the contraposition become between exposure mask 20 and frame 30
The reference mark 100 of benchmark.Alignment mark 200 is equipped on exposure mask 20.By keeping alignment mark 200 and reference mark 100 right
Position, the alignment of the relative position between Lai Jinhang exposure mask 20 and frame 30.In addition, reference mark 100 also can be set in frame 30
On.
The top of reference glass 13 is arranged in camera 14.Camera 14 is configured to move along the direction X-Y.Camera
14 shoot reference mark 100 and alignment mark 200 from the surface of reference mark 100, to measure reference mark 100
With the relative positional relationship between alignment mark 200.In Fig. 1, a camera 14 is successively moved in the surface of reference mark 100
It is dynamic, reference mark 100 and alignment mark 200 are shot.In addition, being not limited to the example that camera 14 is equipped with one, take the photograph
Also more be can be set as first 14.
The lower part of the fixed device 1 of exposure mask is arranged in alignment tool 16.Alignment tool 16 includes 161 He of mounting portion of mounting exposure mask 20
Make the exposure mask 20 being positioned in mounting portion 161 in the face along mounting surface or in the face parallel with mounting surface (along the side θ X-Y-
To) the mobile and aligning guide 162 that is aligned.Mounting surface herein is the face opposite with frame 30 of such as exposure mask 20, is changed
Yan Zhi is the face that side is loaded to frame 30 of exposure mask 20.Mounting surface is also possible to the face opposite with exposure mask 20 of frame 30.Separately
Outside, the direction θ herein includes the rotation in (such as in the mounting surface of exposure mask 20) plane comprising X-direction shown in FIG. 1 and Y-direction
Turn direction.In addition, the direction θ also may include the direction intersected with the mounting surface of exposure mask 20.Mounting portion 161 can be by multiple liftings
Pin is constituted, and can also be made of a mounting table.Aligning guide 162 is for example made of actuator and drive motor.
Alignment tool 16 is based on the relative positional relationship between the reference mark 100 measured of camera 14 and alignment mark 200, benefit
Keep the exposure mask 20 for being placed in mounting portion 161 mobile with aligning guide 162.Relative position pair between exposure mask 20 and frame 30 as a result,
It is quasi-.
Alignment tool 16 is arranged by exposure mask 20.For example, if alignment tool 16 corresponds to each exposure mask 20 and sets there are two exposure masks 20
Set two.In addition, the example for being not limited to alignment tool 16 by exposure mask 20 to be arranged, can also only be arranged an alignment tool 16 and by
Multiple exposure masks 20 share an alignment tool 16.
Exposure mask 20 is fixed on frame 30 after having carried out the alignment of exposure mask 20 and frame 30, by welding by welding unit 18
On.
Fig. 2 is the figure for showing an example of exposure mask 20 of present embodiment.Multiple drafting departments 210 are formed on exposure mask 20.
Material as exposure mask 20 is for example using metals such as invars.Drafting department 210 is formed as actual product, such as shows with organic EL
The faceplate part of device is suitable.It is formed with predetermined pattern on drafting department 210, such as is formed with the organic of organic EL display device
The pattern of EL element.Drafting department 210 can be formed by arbitrary Appropriate method.Specifically, electroforming appearance can be passed through
At, can also pass through etching formed.For example, drafting department 210 include by electroforming appearance at plated portions, exposure mask 20 become electroforming
Exposure mask.According to electroforming exposure mask, such as it can be realized precision and form a film higher than the pattern of previous metal mask.
In the present embodiment, multiple exposure masks 20 shown in Fig. 2 are arranged on substrate to form predetermined pattern by imagination.?
When multiple exposure masks 20 are arranged on substrate, multiple exposure masks 20 be fixed on frame 30 as an exposure mask come using.As a result, in base
In the size of the plate mode bigger than exposure mask 20, it is also able to use existing exposure mask 20.
Fig. 3 is the figure for showing an example of frame 30 of present embodiment.Frame 30 have be equipped with respectively with multiple exposure masks 20
The frame-shaped construction of corresponding multiple openings 300.Material as frame 30 is for example using metals such as invars.Frame shown in Fig. 3
30 show the example for being equipped with two openings 300 corresponding with two exposure masks 20 respectively.To cover the opening of frame 30 shown in Fig. 3
The fixed exposure mask 20 of 300 mode.
In addition, frame 30 also may include frame substrate and configuration in the joint element for being fixed with 20 side of exposure mask.Pass through
Exposure mask 20 is fixed on joint element, the rigidity of exposure mask entirety can be reduced.As a result, even if forming the base of object in pattern
In the case that the rigidity of plate is high, adaptation of the exposure mask relative to substrate also can be improved, inhibit material creep to exposure mask and substrate
Between, realize high-precision pattern film forming.
Illustrate the exposure mask 20 of present embodiment and the alignment methods of frame 30 below.Firstly, explanation alignment mask 20 with
The reference mark 100 being arranged in reference glass 13 used in frame 30 and the alignment mark 200 being arranged on exposure mask 20.
Fig. 4 is the 1st figure for showing the reference mark 100 being arranged in the reference glass 13 of present embodiment.Fig. 5 is
1st figure of the alignment mark 200 being arranged on the exposure mask 20 of present embodiment is shown.By carrying out benchmark shown in Fig. 4
The contraposition of label 100 and alignment mark 200 shown in fig. 5, to carry out the alignment of exposure mask 20 Yu frame 30.
Reference glass 13 shown in Fig. 4 is a glass plate corresponding with the size of frame 30, in Fig. 4, with fixed Fig. 3
Shown in two exposure masks 20 frame 30 it is corresponding.Reference glass 13 is formed by such as quartz glass.That is, shown in Fig. 4
Reference glass 13 is used to carry out the alignment of two exposure masks 20.The reference mark 100 of the reference glass 13 of present embodiment includes the 1st
Reference mark 101 and the 2nd reference mark 102.
The edge of reference glass 13 is arranged in 1st reference mark 101.The position of 1st reference mark 101 is according to exposure mask 20
The shape of the opening 300 of design shape or frame 30 determines.For example, the design with exposure mask 20 is arranged in the 1st reference mark 101
On edge or frame 30 opening 300 the corresponding position in edge.1st reference mark 101 be equipped with it is multiple, for example, the 1st benchmark
Multiple corners of reference glass 13 are arranged in label 101.In Fig. 6, the right side of reference glass 13 be equipped with respectively be assumed to be
According to the corresponding four 101 (101a of the 1st reference mark of the four corners of the ideal exposure mask (ideal exposure mask 21) designed and manufactured1
~101a4).In addition, similarly setting in the left side of reference glass 13, there are four 101 (101b of the 1st reference mark1~101b4)。
2nd reference mark 102 is arranged compared with the 1st reference mark 101 in inside (inner circumferential side).2nd reference mark 102
Position is determined according to the design configurations of drafting department 210 or shape.For example, the 2nd reference mark 102 in design be setting with
Positioned at the peripheral side of the drafting department 210 of the outermost side in (not adjacent with other drafting departments 210 while) corresponding position.2nd
Reference mark be equipped with it is multiple, multiple 2nd reference marks include multiple the 2nd reference mark groups for being configured to a column.In Fig. 4,
The right side of reference glass 13 is equipped with the periphery with 8 ideal pattern portions 211 of the most end of ideal exposure mask 21 being located in Y-direction
The corresponding 8 102 (102a of the 2nd reference mark in the side of side1~102a8).2nd reference mark, 102 (102a1~102a4) and the 2nd
102 (102a of reference mark5~102a8) respectively constitute the 2nd reference mark group.In addition, the left side of reference glass 13 similarly
Equipped with 8 102 (102b of the 2nd reference mark1~102b8).Similarly, 102 (102b of the 2nd reference mark1~102b4) and the 2nd base
Fiducial mark remembers 102 (102b5~102b8) respectively constitute the 2nd reference mark group.Dividing in addition, the 2nd reference mark 102 also can be set
Position not corresponding with the side of peripheral side in 8 ideal pattern portions 211 of most end of ideal exposure mask 21 being located in X-direction.
Two exposure masks 20 (20a, 20b) shown in Fig. 5 are equipped with for carrying out and reference glass 13 shown in Fig. 4
The alignment mark 200 of the contraposition of the reference mark 100 of setting.Alignment mark 200 when manufacturing exposure mask 20 or manufacture exposure mask 20 it
It is arranged again afterwards.The alignment mark 200 of present embodiment includes the 1st alignment mark 201 and the 2nd alignment mark 202.
1st alignment mark 201 becomes the object of the relative positional relationship between the 1st reference mark 101 of measurement, is arranged in exposure mask
20 edge.1st alignment mark 201 is mainly used for making exposure mask 20 is whole to align with the opening 300 of corresponding frame 30.1st pair
Fiducial mark note 201 be equipped with it is multiple, for example, multiple corners of exposure mask 20a are arranged in the 1st alignment mark 201.In Fig. 5, in exposure mask
In 20a, four 201 (201a of the 1st alignment mark1~201a4) it is separately positioned on the four corners of exposure mask 20a.In addition, in exposure mask
In 20b similarly, four 201 (201b of the 1st alignment mark1~201b4) it is separately positioned on the four corners of exposure mask 20b.1st
201 (201a of alignment mark1~201a4) be separately positioned on and 101 (101a of the 1st reference mark1~101a4) opposite position,
1 alignment mark, 201 (201b1~201b4) be separately positioned on and 101 (101b of the 1st reference mark1~101b4) opposite position.
2nd alignment mark 202 is the object for measuring the relative positional relationship between the 2nd reference mark 102, is arranged in drafting department
210 peripheral part.More specifically, the 2nd alignment mark 202 is disposed proximate to drafting department 210 compared with the 1st alignment mark 201
Position (inside compared with the 1st alignment mark 201 in exposure mask 20).2nd alignment mark 202 is mainly used for making exposure mask 20
Multiple drafting departments 210 are aligned with predetermined position.
When manufacturing exposure mask 20, preferably multiple drafting departments 210 are formed according to preset design (such as at equal intervals).
But it there are in fact the case where multiple drafting departments 210 are formed in the position with predetermined position offset.Therefore, in manufacture exposure mask 20
When, it is reduced on each product in order in the case where being formed in the position with predetermined position offset even if in multiple drafting departments 210
The offset at film figure formed, and it is equipped with the 2nd alignment mark 202.
2nd alignment mark be equipped with it is multiple, multiple 2nd alignment marks include multiple the 2nd alignment mark groups for being configured to a column.
In Fig. 5, in exposure mask 20a, along the peripheral side of 8 drafting departments 210 of the most end of exposure mask 20a being located in Y-direction
Side is equipped with 8 202 (202a of the 2nd alignment mark1~202a8).2nd alignment mark, 202 (202a1~202a4) and the 2nd pair of fiducial mark
Remember 202 (202a5~202a8) respectively constitute the 2nd alignment mark group.In addition, in exposure mask 20b similarly, along exposure mask 20b
Be located at Y-direction on most end 8 drafting departments 210 peripheral side side be equipped with 8 202 (202b of the 2nd alignment mark1~
202b8).Similarly, 202 (202b of the 2nd alignment mark1~202b4) and 202 (202b of the 2nd alignment mark5~202b8) difference structure
At the 2nd alignment mark group.In addition, the 2nd alignment mark 202 can also be along 8 drafting departments of the most end being located in X-direction
The side of 210 peripheral side is arranged.
Fig. 6 is the 2nd figure for showing the reference mark 100 being arranged in the reference glass 13 of present embodiment.Fig. 7 is
2nd figure of the alignment mark 200 being arranged on the exposure mask 20 of present embodiment is shown.By carrying out benchmark shown in fig. 6
The contraposition of label 100 and alignment mark 200 shown in Fig. 7, to carry out the alignment of exposure mask 20 Yu frame 30.Base shown in fig. 6
Fiducial mark note 100 is other same other than 112 difference of the 2nd reference mark shown in Fig. 4 compared in the of the 1st.In addition, Fig. 7
Shown in alignment mark 200 shown in Fig. 5 compared in the of the 1st, it is other same other than 212 difference of the 2nd alignment mark.
Therefore, only illustrate the difference with the 1st herein.
2nd reference mark 112 is arranged compared with the 1st reference mark 101 in inside.The position of 2nd reference mark 112 according to
The design configurations or shape of drafting department 210 determine.For example, the 2nd reference mark 112 is arranged in and multiple drafting departments in design
Corresponding position between adjacent two drafting department 210 in 210.In Fig. 6, reference glass 13 right side and covered in ideal
16 the 2nd reference marks 112 are equipped between the ideal pattern portion 211 adjacent in the Y direction of film 21.In addition, in reference glass
13 left side is similarly equipped with 16 the 2nd reference marks 112.In addition, the 2nd reference mark 112 also can be set and cover in ideal
Between adjacent in the X direction the two ideal pattern portion 211 of film 21.
2nd alignment mark 212 is arranged between adjacent two drafting department 210 in multiple drafting departments 210.In Fig. 7,
In exposure mask 20a, 16 the 2nd alignment mark 212a are equipped between adjacent drafting department 210 in the Y direction.In addition, in exposure mask
In 20b similarly, 16 the 2nd alignment mark 212b are equipped between adjacent drafting department 210 in the Y direction.By according to this
Kind mode the 2nd alignment mark 212 is arranged between two adjacent drafting departments 210, to improve the contraposition essence of drafting department 210
Degree.In addition, the 2nd alignment mark 212 also can be set between two adjacent in the X direction drafting departments 210.
Here, illustrating the exposure mask bearing that the fixed device 1 of exposure mask of present embodiment executes using flow chart shown in Fig. 8
The 1st of reason.Here, by the contraposition for carrying out reference glass 13 and exposure mask 20 shown in fig. 5 shown in Fig. 4, to be covered
The alignment of film 20 and frame 30.In addition, when carrying out reference glass 13 shown in fig. 6 and the contraposition of exposure mask 20 shown in Fig. 7
It can apply.
Firstly, frame 30 is maintained in frame maintaining part 11, exposure mask 20 is placed in the mounting portion 161 of alignment tool 16
(S1).Here, first exposure mask 20a is placed in mounting portion 161.
Next, the 1st reference mark 101 and the phase between the 1st alignment mark 201 of exposure mask 20a of measurement reference glass 13
To positional relationship (the 1st offset) (S2).Here, on the basis of the position for being placed with exposure mask 20a in step sl, measurement the 1st
The 1st offset between reference mark 101 and the 1st alignment mark 201.In the present embodiment, camera 14 is from the 1st reference mark
101 surface shoots the 1st reference mark 101 and the 1st alignment mark 201, thus the 1st reference mark 101 of measurement with
The 1st offset between 1st alignment mark 201.
Illustrate the measurement of the offset of the reference mark 100 carried out by camera 14 and alignment mark 200 herein.Fig. 9 is
The figure of an example for the photographed images 400 that camera 14 takes is shown.As shown in figure 9, photographed images 400 include reference mark
100 and size be greater than reference mark 100 alignment mark 200.For the contraposition of alignment mark 200 and reference mark 100,
It is preferred that keeping exposure mask 20 mobile, reference mark 100 is included in alignment mark 200.In turn, by so that alignment mark 200
Central point is consistent with the central point of reference mark 100 and alignment mark 200 and gradient of the reference mark 100 on the direction θ
Consistent mode keeps exposure mask 20 mobile, so as to realize the contraposition of higher precision.The direction θ herein includes comprising shown in Fig. 9
X-direction and Y-direction plane in (such as in the mounting surface of exposure mask 20) direction of rotation.In addition, the direction θ also may include with
The direction that the mounting surface of exposure mask 20 is intersected.Therefore, the offset by measurement alignment mark 200 relative to reference mark 100, with
Offset is set to be directed at the movement of exposure mask 20 close to 0 mode.In the present embodiment, camera 14 is according to photographed images
Offset of the 400 measurement alignment marks 200 relative to reference mark 100.Specifically, alignment mark 200 is calculated relative to base
The offset of fiducial mark note 100, as using the offset on X-direction, Y-direction and the direction θ as the vector V (x, y, θ) of element.
In the present embodiment, as described above, calculating the 1st alignment mark 201 relative to the 1st fiducial mark using camera 14
Note 101 the 1st offset as using the offset on X-direction, Y-direction and the direction θ as element the 1st offset vector V1 (x, y,
θ).Further, camera 14 is successively to the 1st reference mark 101a1~101a4It is shot, calculates the 1st reference mark 101a1
~101a4With the 1st alignment mark 201a1~201a4Each 1st offset vector V1a~V1d.
Figure 10 is the figure for schematically showing an example of the movement of camera 14 of present embodiment.Figure 10 is from camera 14
The fixed device 1 of top observation exposure mask figure.As shown in Figure 10, camera 14 is successively in the 1st reference mark 101 and the 2nd benchmark
It moves on label 102, is shot in each position.The most upper of the fixed device 1 of exposure mask is arranged in the camera 14 of present embodiment
Portion can be moved freely along the direction X-Y, thus can the reference mark 100 to any position shoot.Therefore, with setting
The case where fixing camera, is compared, and can reduce the size of reference mark 100 or alignment mark 200 or the restriction of position is arranged,
It can be set as arbitrary size and location.
Then, the alignment (S3) of exposure mask 20a is carried out based on calculated 1st offset vector V1a~V1d in step s 2.
Here, calculating the amount of movement of exposure mask 20a as mobile vector P1 (x, y, θ) based on the 1st offset vector V1a~V1d.For example, root
Make each 1st offset vector V1a~V1d close to the smallest best mobile vector P1 according to calculating such as least square methods.Then, by right
The aligning guide 162 of quasi- platform 16 makes the mobile amount of movement indicated by mobile vector P1 of exposure mask 20a, carries out exposure mask 20a and frame 30
Alignment.
Next, the 2nd reference mark 102 and the phase between the 2nd alignment mark 202 of exposure mask 20a of measurement reference glass 13
To positional relationship (the 2nd offset) (S4).Here, on the basis of the position of the exposure mask 20a after being aligned in step s3, meter
Survey the 2nd offset between the 2nd reference mark 102 and the 2nd alignment mark 202.In the present embodiment, the 2nd alignment mark is calculated
202 the 2nd offset relative to the 2nd reference mark 102, as using the offset on X-direction, Y-direction and the direction θ as element
2nd offset vector V2 (x, y, θ).Further, camera 14 is successively to the 2nd reference mark 102a1~102a8It is shot, is counted
Calculate the 2nd reference mark 102a1~102a8With the 2nd alignment mark 202a1~202a8Each 2nd offset vector V2a~V2h.
Then, based on calculated each 2nd offset vector V2a~V2h in step s3, being aligned again for exposure mask 20a is carried out
(S5).Here, calculating the amount of movement of exposure mask 20a as mobile vector P2 (x, y, θ) based on the 2nd offset vector V2a~V2h.Example
Such as, make each 2nd offset vector V2a~V2h close to the smallest best mobile vector P2 according to calculating such as least square methods.Then,
Keep exposure mask 20a mobile with mobile vector P2 by the aligning guide 162 of alignment tool 16.By making to be aligned in step s3
Exposure mask 20a it is further mobile with the amount of movement that is indicated by mobile vector P2, Lai Jinhang exposure mask 20a is aligned again with frame 30.
2nd alignment mark 202 is sometimes due to exposure mask fixes the design constraint of device 1 or exposure mask 20a itself and becomes deflection and configure.Thus
In the presence of being difficult to realize the alignment of exposure mask 20a or the low worry of alignment precision with the 2nd alignment mark 202 itself.In alignment procedures
(S3) it on the basis of, carries out calculating the 2nd offset and compensates the alignment procedures again (S5) of (offset), so as to improve
Alignment precision.At this point, can also compensate and (be aligned again) with the half of calculated 2nd offset.In addition, being aligned again
The step of (S5) the step of also may include the compensation rate that aftermentioned exposure mask 20a is calculated in Figure 11 (S15 of Figure 11).
Then, if completing being aligned again for exposure mask 20a in step s 5, welding unit 18 is consolidated exposure mask 20a by welding
(S6) is scheduled on frame 30.
Then, camera 14 shoots reference mark 100 and alignment mark 200, measurement reference mark 100 be aligned
The offset (S7) of label 200.Here, by measure exposure mask 20a is fixed on frame 30 after reference mark 100 with it is right
The offset of fiducial mark note 200, the aligning accuracy after confirmation is fixed.By by the fixation measured herein after reference mark 100 with
The offset of alignment mark 200 feeds back to the design of exposure mask 20, covers so as to manufacture that aligning accuracy of sening as an envoy to further increases
Film 20.
Then, be made whether the judgement (S8) whole exposure masks 20 being fixed on frame 30.Frame is not secured to existing
In the case where 30 exposure mask 20 (S8:N), next exposure mask 20 (is positioned in mounting portion herein for exposure mask 20b) by return step S1
On 161, later step is executed.In the case where whole exposure masks 20 are fixed on frame 30 (S8:Y), exposure mask fixing process
Terminate.
According to the 1st of exposure mask fixing process the, after having carried out the alignment of exposure mask 20 based on the 1st offset, based on
The 2nd offset on the basis of position after alignment is directed at exposure mask 20 again.Carrying out the overall profile of exposure mask 20 as a result,
After alignment, the 2nd offset it can be finely adjusted caused by the skew to the uneven or exposure mask 20 as drafting department 210 itself.Its
As a result it is, even if can also be reduced on substrate in the case where the pattern of exposure mask 20 is not formed uniformly or exposure mask itself is crooked
The positional shift of the pattern of formation.
Illustrate the exposure mask fixing process that the fixed device 1 of exposure mask of present embodiment executes using flow chart shown in Figure 11
2nd.Here, by the contraposition for carrying out reference glass 13 and exposure mask 20 shown in fig. 5 shown in Fig. 4, to carry out exposure mask 20
With the alignment of frame 30.In addition, also can when carrying out reference glass 13 shown in fig. 6 and the contraposition of exposure mask 20 shown in Fig. 7
Using.
Firstly, frame 30 is maintained in frame maintaining part 11, exposure mask 20 is positioned in the mounting portion 161 of alignment tool 16
(S11).Here, first exposure mask 20a is positioned in mounting portion 161.
Next, the 1st reference mark 101 and the phase between the 1st alignment mark 201 of exposure mask 20a of measurement reference glass 13
To positional relationship (the 1st offset) (S12).Here, on the basis of the position for being placed with exposure mask 20a in step sl, measurement the 1st
The 1st offset between reference mark 101 and the 1st alignment mark 201.In the present embodiment, with above-mentioned exposure mask fixing process
The 1st similarly calculate 1st offset of the 1st alignment mark 201 relative to the 1st reference mark 101 using camera 14,
As using the offset on X-direction, Y-direction and the direction θ as the 1st offset vector V1 (x, y, θ) of element.Further, it images
First 14 successively to the 1st reference mark 101a1~101a4It is shot, calculates the 1st reference mark 101a1~101a4It is aligned with the 1st
Mark 201a1~201a4Each 1st offset vector V1a~V1d.
Next, the 2nd reference mark 102 and the phase between the 2nd alignment mark 202 of exposure mask 20a of measurement reference glass 13
To positional relationship (the 2nd offset) (S13).Here, on the basis of the position for being placed with exposure mask 20a in step sl, measurement the 2nd
The 2nd offset between reference mark 102 and the 2nd alignment mark 202.In the present embodiment, 202 phase of the 2nd alignment mark is calculated
For the 2nd offset of the 2nd reference mark 102, as using the offset on X-direction, Y-direction and the direction θ as element the 2nd partially
It moves vector V12 (x, y, θ).Further, camera 14 is successively to the 2nd reference mark 102a1~102a8It is shot, calculates the
2 reference mark 102a1~102a8With the 2nd alignment mark 202a1~202a8Each 2nd offset vector V12a~V12h.
Then, based on calculated 1st offset vector V1a~V1d in step S12, the amount of movement of exposure mask 20a is calculated
(S14).Here, calculating the amount of movement of exposure mask 20a as mobile vector P1 (x, y, θ) based on the 1st offset vector V1a~V1d.Example
Such as, make each 1st offset vector V1a~V1d close to the smallest best mobile vector P1 according to calculating such as least square methods.
Then, the compensation of exposure mask 20a is calculated based on calculated each 2nd offset vector V12a~V12h in step s 13
It measures (S15).Here, based on the 2nd offset vector V12a~V12h calculate relative to the amount of movement of exposure mask 20a compensation rate as
Compensation vector Q (x, y, θ).For example, making each 2nd offset vector V12a~V12h close to the smallest according to calculating such as least square methods
The optimal compensation vector Q.
Then, mobile vector P1 based on exposure mask 20a calculated in step S14 and in step S15 it is calculated
The compensation vector Q of exposure mask 20a carries out the alignment (S16) of exposure mask 20a.It is added here, calculating mobile vector P1 with compensation vector Q
The mobile vector P11 arrived.The shifting for making exposure mask 20a by the aligning guide 162 using alignment tool 16 to be indicated by mobile vector P11
Momentum is mobile, to carry out the alignment of exposure mask 20a Yu frame 30.In addition, the alignment procedures again (S5) of flow chart shown in Fig. 8
The step of may include the compensation rate that exposure mask 20a is calculated shown in above-mentioned Figure 11 (S15).
Step S17 later processing is identical as the later processing of step S6 shown in Fig. 8, therefore omits the description herein.
According to the 2nd of exposure mask fixing process the, exposure mask 20 and frame 30 are carried out based on the 1st offset and the 2nd offset
Alignment.It is carried out thereby, it is possible to consider the 2nd offset as caused by the skew of the uneven or exposure mask 20 of drafting department 210 itself
Alignment.As a result, even if can also be reduced in the case where the drafting department of exposure mask 20 is not formed uniformly or exposure mask itself is crooked
The positional shift of the pattern formed on substrate.
In addition, the present invention is not limited to above-mentioned embodiments.
For example, alignment mark 200 is bigger than reference mark 100, but is not limited to the example, alignment mark 200 in Fig. 9
Can be smaller than reference mark 100, it is also possible to size identical with reference mark 100.In addition, alignment mark 200 and fiducial mark
The shape of note 100 is round, but is not limited to the example, is also possible to rectangular-shaped etc..
Embodiments of the present invention are illustrated above, but the present invention is not limited to above-mentioned embodiments.For example,
The composition illustrated in the above-described embodiment can also be substituted for substantially the same composition, the composition with identical function and effect
Or it can be realized the composition of identical purpose.
Claims (12)
1. a kind of vapor deposition exposure mask, it includes the multiple drafting departments for being formed with predetermined pattern, the vapor deposition exposure mask is characterized in that,
It is equipped with the 1st alignment mark in the edge of the vapor deposition exposure mask,
The 2nd alignment mark for being located inside relative to the 1st alignment mark is equipped in the peripheral part of the drafting department.
2. vapor deposition exposure mask according to claim 1, which is characterized in that
The vapor deposition exposure mask has multiple corners,
1st alignment mark be equipped with it is multiple,
2nd alignment mark be equipped with it is multiple,
Multiple 1st alignment marks are located at each of the multiple corner,
Multiple 2nd alignment marks include multiple the 2nd alignment mark groups for being configured to a column.
3. vapor deposition exposure mask according to claim 1, which is characterized in that
2nd alignment mark is arranged between two drafting departments adjacent in the multiple drafting department.
4. a kind of vapor deposition exposure mask comprising: the 1st vapor deposition exposure mask comprising multiple drafting departments；The 2nd vapor deposition comprising multiple drafting departments
Exposure mask；And it is fixed with the frame of the 1st vapor deposition exposure mask and the 2nd vapor deposition exposure mask, the vapor deposition exposure mask is characterized in that,
The frame has multiple 1st reference marks and multiple 2nd reference marks,
The 1st vapor deposition exposure mask, which has, is located at the 1st vapor deposition edge of exposure mask and opposite with the 1st reference mark
1st alignment mark, and peripheral part and 2nd alignment mark opposite with the 2nd reference mark positioned at the drafting department,
The 2nd vapor deposition exposure mask, which has, is located at the 2nd vapor deposition edge of exposure mask and opposite with the 1st reference mark
1st alignment mark, and peripheral part and 2nd alignment mark opposite with the 2nd reference mark positioned at the drafting department,
2nd alignment mark is located at the 1st vapor deposition exposure mask or the 2nd vapor deposition exposure mask compared with the 1st alignment mark
Inside.
5. a kind of alignment methods that exposure mask is deposited, by the vapor deposition exposure mask comprising the multiple drafting departments for being formed with predetermined pattern to frame
Fixed, the alignment methods of the vapor deposition exposure mask are characterised by comprising following steps:
1st alignment procedures based on the 1st reference mark for aligning the vapor deposition exposure mask and the frame and are formed in described
The 1st offset of the 1st alignment mark of the edge of exposure mask is deposited, the relative position of the vapor deposition exposure mask and the frame is carried out
Alignment；And
2nd alignment procedures based on the 2nd reference mark for aligning the vapor deposition exposure mask and the frame and are formed in described
2nd offset of the 2nd alignment mark of the peripheral part of drafting department, described in being aligned by the 1st alignment procedures
Vapor deposition exposure mask is aligned again with the relative position of the frame.
6. a kind of alignment methods that exposure mask is deposited, by the vapor deposition exposure mask comprising the multiple drafting departments for being formed with predetermined pattern to frame
Fixed, the alignment methods that exposure mask is deposited are characterized in that,
The 1st offset is measured, the 1st offset is the 1st reference mark for aligning the vapor deposition exposure mask and the frame
Be formed in it is described vapor deposition exposure mask edge the 1st alignment mark relative positional relationship,
The 2nd offset is measured, the 2nd offset is the 2nd reference mark for aligning the vapor deposition exposure mask and the frame
The relative positional relationship of the 2nd alignment mark with being formed between the adjacent drafting department,
It is carried out pair based on the relative position of the 1st offset and the 2nd offset to the vapor deposition exposure mask and the frame
It is quasi-.
7. the alignment methods of vapor deposition exposure mask according to claim 5, which is characterized in that
Multiple vapor deposition exposure masks are fixed on said frame.
8. a kind of fixed device of vapor deposition exposure mask, the vapor deposition exposure mask of multiple drafting departments comprising being formed with predetermined pattern is fixed on
On frame, the fixed device of the vapor deposition exposure mask is characterised by comprising:
Reference glass is formed with the 1st reference mark and the 2nd base of the benchmark as the vapor deposition exposure mask and frame contraposition
Fiducial mark note；
Camera shoots the 1st reference mark and the 2nd reference mark；And
Alignment tool has the mounting portion for loading the vapor deposition exposure mask and makes the exposure mask that is deposited along the frame and the steaming
The aligning guide that the opposite face of exposure mask is mobile and is aligned is plated,
The camera measures the 1st of the 1st reference mark and the 1st alignment mark of the edge for being formed in the vapor deposition exposure mask
Offset,
The camera measures the 2nd of the 2nd reference mark and the 2nd alignment mark of the peripheral part for being formed in the drafting department
Offset,
The alignment tool is directed at the vapor deposition exposure mask with the relative position of the frame based on the 1st offset,
The alignment tool is being directed at the vapor deposition exposure mask with the relative position of the frame based on the 1st offset
Afterwards, also the relative position being aligned based on the 1st offset is aligned based on the 2nd offset.
9. a kind of fixed device of vapor deposition exposure mask, the vapor deposition exposure mask of multiple drafting departments comprising being formed with predetermined pattern is fixed on
On frame, the fixed device of the vapor deposition exposure mask is characterised by comprising:
Reference glass is formed with the 1st reference mark and the 2nd base of the benchmark as the vapor deposition exposure mask and frame contraposition
Fiducial mark note；
Camera shoots the 1st reference mark and the 2nd reference mark；And
Alignment tool has the mounting portion for loading the vapor deposition exposure mask and makes the exposure mask that is deposited along the frame and the steaming
The aligning guide that the opposite face of exposure mask is mobile and is aligned is plated,
The camera measures the 1st offset, and the 1st offset is the 1st reference mark and is formed in the vapor deposition exposure mask
Edge the 1st alignment mark relative positional relationship,
The camera measures the 2nd offset, and the 2nd offset is the 2nd reference mark and is formed in the adjacent figure
The relative positional relationship of the 2nd alignment mark between case portion,
The alignment tool is opposite with the frame to the vapor deposition exposure mask based on the 1st offset and the 2nd offset
Position is aligned.
10. the fixed device of vapor deposition exposure mask according to claim 8, which is characterized in that
Multiple vapor deposition exposure masks are fixed on said frame.
11. the alignment methods of vapor deposition exposure mask according to claim 6, which is characterized in that
Multiple vapor deposition exposure masks are fixed on said frame.
12. the fixed device of vapor deposition exposure mask according to claim 9, which is characterized in that
Multiple vapor deposition exposure masks are fixed on said frame.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017022872A JP2018127702A (en) | 2017-02-10 | 2017-02-10 | Vapor deposition mask, vapor deposition mask aligning method, and vapor deposition mask fixing device |
| JP2017-022872 | 2017-02-10 | ||
| PCT/JP2018/004253 WO2018147339A1 (en) | 2017-02-10 | 2018-02-07 | Vapor deposition mask, vapor deposition mask alignment method, and vapor deposition mask-securing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110291220A true CN110291220A (en) | 2019-09-27 |
Family
ID=63108348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880011467.2A Pending CN110291220A (en) | 2017-02-10 | 2018-02-07 | Exposure mask, the alignment methods that exposure mask is deposited and the fixed device of vapor deposition exposure mask is deposited |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2018127702A (en) |
| CN (1) | CN110291220A (en) |
| WO (1) | WO2018147339A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114381688A (en) * | 2021-12-30 | 2022-04-22 | 昆山工研院新型平板显示技术中心有限公司 | Mask assembly, mask, evaporation boundary confirmation method and evaporation deviation correction method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109285972B (en) | 2018-09-28 | 2021-01-22 | 京东方科技集团股份有限公司 | Position adjusting method and device for luminescent material |
| CN112962055B (en) * | 2021-01-29 | 2023-06-20 | 合肥维信诺科技有限公司 | Mask plate, display substrate evaporation assembly and display substrate |
| KR20230153052A (en) * | 2022-04-28 | 2023-11-06 | 캐논 톡키 가부시키가이샤 | Film forming apparatus, film forming method, manufacturing method of electronic device and computer program recording media |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999050712A1 (en) * | 1998-03-26 | 1999-10-07 | Nikon Corporation | Exposure method and system, photomask, method of manufacturing photomask, micro-device and method of manufacturing micro-device |
| CN1514675A (en) * | 2001-09-25 | 2004-07-21 | 精工爱普生株式会社 | Mask and its mfg. method, electroluminescent apparatus and its mfg. method, and electronic apparatus |
| JP2004303559A (en) * | 2003-03-31 | 2004-10-28 | Tohoku Pioneer Corp | Alignment device, alignment method, and organic el element manufactured by using the same |
| US20050063030A1 (en) * | 2003-09-22 | 2005-03-24 | Seiko Epson Corporation | Method of hologram exposure, mask for hologram exposure, semiconductor device, and electronic equipment |
| CN103160775A (en) * | 2011-12-14 | 2013-06-19 | 昆山工研院新型平板显示技术中心有限公司 | Vapor deposition shadow mask alignment system |
| CN103744214A (en) * | 2013-12-31 | 2014-04-23 | 深圳市华星光电技术有限公司 | Exposure method of glass substrate of LCD (Liquid Crystal Display) |
| JP2016053194A (en) * | 2014-09-03 | 2016-04-14 | 大日本印刷株式会社 | Vapor deposition mask, vapor deposition mask with frame, vapor deposition mask preparation body, and method of manufacturing organic semiconductor element |
| CN106086786A (en) * | 2016-08-19 | 2016-11-09 | 京东方科技集团股份有限公司 | offset calibration method and system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62198123A (en) * | 1986-02-26 | 1987-09-01 | Canon Inc | Exposing apparatus |
| JPH05142745A (en) * | 1991-01-07 | 1993-06-11 | Hitachi Ltd | Phase shift mask and manufacture of mask |
| JP2004335486A (en) * | 2004-08-12 | 2004-11-25 | Seiko Epson Corp | Mask and its manufacturing method, electroluminescent device and its manufacturing method, and electronic equipment |
-
2017
- 2017-02-10 JP JP2017022872A patent/JP2018127702A/en active Pending
-
2018
- 2018-02-07 WO PCT/JP2018/004253 patent/WO2018147339A1/en active Application Filing
- 2018-02-07 CN CN201880011467.2A patent/CN110291220A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999050712A1 (en) * | 1998-03-26 | 1999-10-07 | Nikon Corporation | Exposure method and system, photomask, method of manufacturing photomask, micro-device and method of manufacturing micro-device |
| CN1514675A (en) * | 2001-09-25 | 2004-07-21 | 精工爱普生株式会社 | Mask and its mfg. method, electroluminescent apparatus and its mfg. method, and electronic apparatus |
| JP2004303559A (en) * | 2003-03-31 | 2004-10-28 | Tohoku Pioneer Corp | Alignment device, alignment method, and organic el element manufactured by using the same |
| US20050063030A1 (en) * | 2003-09-22 | 2005-03-24 | Seiko Epson Corporation | Method of hologram exposure, mask for hologram exposure, semiconductor device, and electronic equipment |
| CN103160775A (en) * | 2011-12-14 | 2013-06-19 | 昆山工研院新型平板显示技术中心有限公司 | Vapor deposition shadow mask alignment system |
| CN103744214A (en) * | 2013-12-31 | 2014-04-23 | 深圳市华星光电技术有限公司 | Exposure method of glass substrate of LCD (Liquid Crystal Display) |
| JP2016053194A (en) * | 2014-09-03 | 2016-04-14 | 大日本印刷株式会社 | Vapor deposition mask, vapor deposition mask with frame, vapor deposition mask preparation body, and method of manufacturing organic semiconductor element |
| CN106086786A (en) * | 2016-08-19 | 2016-11-09 | 京东方科技集团股份有限公司 | offset calibration method and system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114381688A (en) * | 2021-12-30 | 2022-04-22 | 昆山工研院新型平板显示技术中心有限公司 | Mask assembly, mask, evaporation boundary confirmation method and evaporation deviation correction method |
| CN114381688B (en) * | 2021-12-30 | 2024-04-23 | 昆山工研院新型平板显示技术中心有限公司 | Mask assembly, mask, vapor deposition boundary confirmation and vapor deposition deviation correction method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018147339A1 (en) | 2018-08-16 |
| JP2018127702A (en) | 2018-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110291220A (en) | Exposure mask, the alignment methods that exposure mask is deposited and the fixed device of vapor deposition exposure mask is deposited | |
| KR101893708B1 (en) | Substrate mounting apparatus, substrate mounting method, film formation apparatus, film formation method, alignment apparatus, alignment method, and manufacturing method of electronic device | |
| TWI612169B (en) | Mask assembly for thin film vapor deposition and manufacturing method thereof | |
| KR100768491B1 (en) | Method of manufacturing liquid crystal display device | |
| CN111485216A (en) | Substrate mounting apparatus, film forming apparatus, substrate mounting method, film forming method, and method for manufacturing electronic device | |
| CN108136764B (en) | The transfer device of electronic equipment and the transfer method of electronic equipment | |
| CN111378925B (en) | Alignment system, film forming apparatus, film forming method, and method for manufacturing electronic device | |
| WO2016080235A1 (en) | Vapor deposition device, vapor deposition method, and method for manufacturing organic electroluminescence element | |
| JP7170524B2 (en) | Substrate mounting method, film forming method, film forming apparatus, organic EL panel manufacturing system | |
| KR102530431B1 (en) | Mask attaching device, film forming apparatus, mask attaching method, film forming method, manufacturing method of electronic device, mask, substrate carrier, and set of substrate carrier and mask | |
| CN106133182A (en) | The manufacture method of evaporation mask and the manufacture method of display device | |
| KR20150102935A (en) | Chuck, in particular for use in a mask aligner | |
| CN110419004B (en) | Lithographic apparatus and method | |
| KR101876331B1 (en) | Mask, method for manufacturing the same and stretcher for manufacturing the same | |
| WO2017130746A1 (en) | Exposure device and exposure method | |
| JP2014165331A (en) | Alignment device and alignment method | |
| JP7159238B2 (en) | Substrate carrier, deposition apparatus, and deposition method | |
| JP2012133122A (en) | Proximity exposing device and gap measuring method therefor | |
| US20090303483A1 (en) | Exposure apparatus and device manufacturing method | |
| CN110249071A (en) | Deposition mask fixes device | |
| JP2018031980A (en) | Measurement method, measurement device, exposure equipment and production method of article | |
| JP7428684B2 (en) | alignment device | |
| US20120202142A1 (en) | Manufacturing method of exposure mask, shipment judgment method and manufacturing method of semiconductor device using exposure mask | |
| JP7162631B2 (en) | Substrate carrier, deposition apparatus, substrate carrier transport method, and deposition method | |
| US20220364218A1 (en) | Alignment device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190927 |
|
| RJ01 | Rejection of invention patent application after publication |