CN110289223B - Pressure automatic control device for electronic packaging - Google Patents
Pressure automatic control device for electronic packaging Download PDFInfo
- Publication number
- CN110289223B CN110289223B CN201910534841.3A CN201910534841A CN110289223B CN 110289223 B CN110289223 B CN 110289223B CN 201910534841 A CN201910534841 A CN 201910534841A CN 110289223 B CN110289223 B CN 110289223B
- Authority
- CN
- China
- Prior art keywords
- control device
- pressure
- automatic control
- chip
- top end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
- H01L2224/7592—Load or pressure adjusting means, e.g. sensors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention relates to the technical field of integrated circuit equipment, and discloses a pressure automatic control device for electronic packaging, which comprises a conveying device, wherein a base plate is arranged at the top end of the conveying device, a chip is arranged at the top of the base plate, a negative pressure sucking disc is arranged at the top end of the chip, an air path joint is communicated with the inside of the negative pressure sucking disc, the top end of the air path joint is fixedly connected with the inside of an automatic control device through a fixed connecting rod, and a driving module I is arranged on one side of the outside of the automatic control device. This pressure automatic control device that electronic packaging used, through automatic control device's setting, utilize the gravity of bearing weight and self to adjust the pressure between chip and the base plate, compare with current pressure control system, this pressure control device does not have the feedback time, and the great or small control of pressure is comparatively accurate, the effectual spoilage that has reduced the chip when dress pastes, and whole device simple structure controls in a flexible way simultaneously, has reduced this paster machine pressure control device's configuration cost and daily maintenance cost.
Description
Technical Field
The invention relates to the technical field of integrated circuit equipment, in particular to a pressure automatic control device for electronic packaging.
Background
Flip chip is as a high-accuracy electronic packaging technique, it is on organic base plate to pass through the direct connection of welding protruding to bare chip, along with the size of high performance chip constantly increases, the continuous increase of quantity of welding protruding, the thickness of substrate is more and more thin, it is also more rigorous to the pressure control requirement that its dress pasted, at flip chip's in-process, too big pressure is very easily with chip fracturing, also can be with the tiny protruding pressure deformation of welding simultaneously, pressure undersize then can lead to laminating between chip and the substrate not tight, the welding is insecure, take place the phenomenon that the chip drops in the use in the future.
At present, all that adopts in current dress subsides machine is that pressure sensor and hydraulic control system regulate and control the dress pressure between chip and the base plate, but the hydraulic means emergence action is sensed in pressure sensor emergence, need pass through the conversion and the transmission of a series of signals and the operation and control action of equipment, reaction time is longer, and the pressure of this in-process equipment can continuously increase, and then lead to pressure overload, cause extrusion damage to the chip, or cause the extrusion deformation of welding the arch, the spoilage of chip when dress subsides has been increased, serious influence this dress machine's result of use, and whole pressure control device's configuration cost and maintenance schedule cost are higher.
Disclosure of Invention
Technical problem to be solved
The invention provides a pressure automatic control device for electronic packaging, which has the advantages of precise regulation and control, no reaction time and lower configuration and maintenance cost of the whole device, solves the problems that the existing mounting machine adopts a pressure sensor and a hydraulic control system to regulate and control the mounting pressure between a chip and a substrate, however, when the pressure sensor senses the action of the hydraulic device, a series of signal conversion and transmission and equipment control actions are required, the reaction time is long, the pressure of the equipment can be continuously increased in the process, and the pressure overload is further caused, the chip is extruded and damaged or the extrusion deformation of the welding projection is caused, so that the damage rate of the chip during mounting and pasting is increased, the use effect of the mounting and pasting machine is seriously influenced, and the configuration cost and schedule maintenance cost of the whole pressure control device are high.
(II) technical scheme
The invention provides the following technical scheme: the utility model provides a pressure automatic control device that electronic packaging used, includes conveyer, the base plate has been placed on conveyer's top, the top of base plate is equipped with the chip, and the top of chip is equipped with negative sucker, negative sucker's inside intercommunication has the gas circuit to connect, and the inside fixed connection of fixed connecting rod and automatic control device is passed through on the top that the gas circuit connects, the outside one side of automatic control device is equipped with drive module I, and the middle part of I one side of drive module is equipped with drive module II.
Preferably, the automatic control device comprises a fixed sleeve, a connecting supporting plate, a fixing device and bearing weights, one side of the outside of the fixed sleeve is movably connected with the inside of the driving module I, the inside of the fixed sleeve is provided with the connecting supporting plate, the bottom end of the connecting supporting plate is fixedly connected with the top end of the fixed connecting rod, the top end of the connecting supporting plate is fixedly provided with the fixing device, and the bearing weights are arranged between the top end of the connecting supporting plate and the bottom end of the fixing device.
Preferably, the bottom of the inner cavity of the fixed sleeve is provided with a buffer block made of rubber.
Preferably, the fixing device is a threaded spring sleeve structure, and a movable pressing plate is sleeved on the outer surface of the fixing device.
(III) advantageous effects
The invention has the following beneficial effects:
this pressure automatic control device that electronic packaging used, through automatic control device's setting, utilize the gravity of bearing weight and self to adjust the pressure between chip and the base plate, compare with current pressure control system, this pressure control device does not have the feedback time, and the great or small control of pressure is comparatively accurate, the effectual spoilage that has reduced the chip when dress pastes, and whole device simple structure controls in a flexible way simultaneously, has reduced this paster machine pressure control device's configuration cost and daily maintenance cost.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural diagram of the automatic control device of the present invention;
fig. 3 is a schematic structural view of the fixing device of the present invention.
In the figure: 1. a conveying device; 2. a substrate; 3. a chip; 4. a negative pressure sucker; 5. a gas circuit joint; 6. fixing the connecting rod; 7. an automatic control device; 71. fixing the sleeve; 72. connecting the supporting plate; 73. a fixing device; 74. a load-bearing weight; 8. a driving module I; 9. and a driving module II.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, a pressure automatic control device for electronic packaging comprises a conveying device 1, a substrate 2 is placed on the top end of the conveying device 1, a chip 3 is arranged on the top of the substrate 2, a negative pressure suction cup 4 is arranged on the top end of the chip 3, an air path joint 5 is in threaded connection with the inside of the negative pressure suction cup 4, the top end of the air path joint 5 is fixedly connected with the inside of an automatic control device 7 through a fixed connecting rod 6, a driving module i 8 is arranged on one side of the outside of the automatic control device 7, and a driving module ii 9 is arranged in the middle of one side of the driving module i 8.
In this technical scheme, automatic control device 7 includes fixed sleeve 71, connect layer board 72, fixing device 73 and bearing weight 74, the outside one side of fixed sleeve 71 and the inside swing joint of drive module I8, the inside of fixed sleeve 71 is equipped with connects layer board 72, and the bottom of connecting layer board 72 and the top fixed connection of fixed connecting rod 6, the top fixed mounting who connects layer board 72 has fixing device 73, and be equipped with bearing weight 74 between the top of connecting layer board 72 and fixing device 73's the bottom.
The pressure between the chip 3 and the substrate 2 is adjusted by the self gravity of the automatic control device 7 when the automatic control device 7 falls, the regulation and control are accurate, the reaction time is not needed, and the reliability of the chip mounter during working is effectively improved.
In this technical scheme, the bottom of fixed sleeve 71 inner chamber is equipped with the buffer block of rubber material.
Wherein, to the setting of buffer block, can slow down the impact force that causes of connecting the layer board 72 when the whereabouts, improved the stability when connecting the layer board 72 downstream under the effect of gravity.
In this embodiment, the fixing device 73 is a threaded spring sleeve structure, and a movable pressing plate is sleeved on the outer surface thereof.
Wherein, to fixing device 73's setting for fixed bearing weight 74 ensures that bearing weight 74 can not take place the phenomenon of rocking at the in-process of up-and-down motion, further improves the stability of automatic control device 7 in the motion process, and when the chip of equidimension type is pasted in the dress simultaneously, increase and decrease bearing weight 74 that can make things convenient for in a flexible way, with the atress between accurate regulation and control chip 3 and the base plate 2.
Wherein, to the setting of drive module I8 and drive module II 9, can drive negative sucker 4 and make up-down side-to-side movement for the position coordinate who removes negative sucker 4 absorbs chip 3.
The use method and the working principle of the embodiment are as follows:
firstly, according to the sizes of the models of the substrate 2 and the chip 3, loosening the nut on the fixing device 73 to take out the spring and the movable pressing plate therein, increasing or decreasing the proper number of bearing weights 74 to adjust the pressure of the whole automatic control device 7, then starting the mounting and pasting machine, under the action of a driving module I8 and a driving module II 9, firstly driving the negative pressure suction cup 4 to move to a proper position to suck the chip 3, then returning to an initial position, simultaneously moving the substrate 2 on the negative pressure suction cup to a position right below the chip 3 under the transmission action of the conveying device 1, connecting the supporting plate 72 to be always at a bottommost position under the action of gravity, then driving the automatic control device 7, the negative pressure suction cup 4 and the chip 3 on the negative pressure suction cup 4 to be away from the lower end under the action of the driving module I8, when the chip 3 on the negative pressure suction cup 4 is contacted with the substrate 2, under the reaction force between base plate 2 and chip 3, thereby withstand fixed connecting rod 6 and connection layer board 72, drive fixing device 73 and bearing weight 74 rebound, and then exert between base plate 2 and chip 3 automatic control device 7 and self gravity, utilize gravity to exert pressure to base plate 2 and chip 3, and even drive module I8 drives automatic control device 7 distance of rebound too big, automatic control device 7 can not change to the pressure between base plate 2 and the chip 3, whole device simple structure, control the flexibility, and the time of not having the feedback, the pressure between regulation and control base plate 2 that can be accurate and chip 3, can not cause the condition of extrusion damage to base plate 2 or chip 3.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (1)
1. A pressure self-control device for electronic packaging comprises a conveying device (1), and is characterized in that: a base plate (2) is placed at the top end of the conveying device (1), a chip (3) is arranged at the top end of the base plate (2), a negative pressure sucker (4) is arranged at the top end of the chip (3), an air channel connector (5) is communicated with the inside of the negative pressure sucker (4), the top end of the air channel connector (5) is fixedly connected with the inside of an automatic control device (7) through a fixed connecting rod (6), a driving module I (8) is arranged on one side of the outside of the automatic control device (7), and a driving module II (9) is arranged in the middle of one side of the driving module I (8);
the automatic control device (7) comprises a fixed sleeve (71), a connecting supporting plate (72), a fixing device (73) and bearing weights (74), one side of the outer portion of the fixed sleeve (71) is movably connected with the inner portion of the driving module I (8), the connecting supporting plate (72) is arranged inside the fixed sleeve (71), the bottom end of the connecting supporting plate (72) is fixedly connected with the top end of the fixed connecting rod (6), the fixing device (73) is fixedly installed at the top end of the connecting supporting plate (72), and the bearing weights (74) are arranged between the top end of the connecting supporting plate (72) and the bottom end of the fixing device (73);
the bottom of the inner cavity of the fixed sleeve (71) is provided with a buffer block made of rubber;
the fixing device (73) is of a threaded spring clamping sleeve structure, and a movable pressing plate is sleeved on the outer surface of the fixing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910534841.3A CN110289223B (en) | 2019-06-20 | 2019-06-20 | Pressure automatic control device for electronic packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910534841.3A CN110289223B (en) | 2019-06-20 | 2019-06-20 | Pressure automatic control device for electronic packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110289223A CN110289223A (en) | 2019-09-27 |
| CN110289223B true CN110289223B (en) | 2021-06-15 |
Family
ID=68003940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910534841.3A Active CN110289223B (en) | 2019-06-20 | 2019-06-20 | Pressure automatic control device for electronic packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110289223B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114664701B (en) * | 2022-03-12 | 2023-04-18 | 上海潞淼物联网信息科技有限公司 | Metal-attached RFID electronic tag packaging equipment and application method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105023860A (en) * | 2014-04-16 | 2015-11-04 | 北京中电科电子装备有限公司 | Chip precision operation device |
| CN109192685A (en) * | 2018-10-10 | 2019-01-11 | 曾繁洪 | A kind of chip manufacture placement equipment |
| CN109511258A (en) * | 2018-12-25 | 2019-03-22 | 东莞市沃德精密机械有限公司 | Automatic mounting device |
-
2019
- 2019-06-20 CN CN201910534841.3A patent/CN110289223B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105023860A (en) * | 2014-04-16 | 2015-11-04 | 北京中电科电子装备有限公司 | Chip precision operation device |
| CN109192685A (en) * | 2018-10-10 | 2019-01-11 | 曾繁洪 | A kind of chip manufacture placement equipment |
| CN109511258A (en) * | 2018-12-25 | 2019-03-22 | 东莞市沃德精密机械有限公司 | Automatic mounting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110289223A (en) | 2019-09-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106793747B (en) | Automatic FPC laminating machine and plate laminating method | |
| CN110289223B (en) | Pressure automatic control device for electronic packaging | |
| TW201445610A (en) | Deviation rectifying device capable of adjusting tension in vacuum plasma environment and method thereof | |
| CN212684711U (en) | Surface mounting device | |
| JP2001068840A (en) | Device and method for mounting ball | |
| KR100773170B1 (en) | Method and apparatus for the mounting of semiconductor chips | |
| CN106586548B (en) | Combined type mixing sucker | |
| JP6404683B2 (en) | Impact sensor and component mounting device | |
| CN113561610A (en) | Automatic laminating device of touch pad | |
| CN205891369U (en) | Tectorial membrane product shifts transport mechanism | |
| CN102091685B (en) | Glass powder blower | |
| CN205256733U (en) | Detect installation mechanism | |
| CN217145293U (en) | Automatic printing device | |
| WO2015122449A1 (en) | Component mounting device and detection device | |
| CN215784585U (en) | Gluing mechanism of plate edge bonding machine with buffering performance | |
| CN114572673A (en) | Intelligent heat insulation plate combined machining device with offset compensation mechanism | |
| CN110797289B (en) | Semiconductor copper substrate feed mechanism | |
| CN209266279U (en) | Keyboard spare part automatic assembly equipment | |
| CN213694349U (en) | SMT paster production line detection device | |
| CN211860699U (en) | High-precision mounting head | |
| CN104369913A (en) | Vacuum paging machine | |
| CN110126247A (en) | A kind of material conveying platform, the full-automatic abutted equipment and automatic attaching method for having it | |
| CN204324476U (en) | Maila paper conveyer | |
| CN103770457A (en) | Pump type scraper head matched device | |
| CN209382956U (en) | A kind of feeding machanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210525 Address after: No.62, Tingshan Road, tingpang Town, Sanmen County, Taizhou City, Zhejiang Province, 317103 Applicant after: Wan Jinfen Address before: 413000 Huanglong village, yangjiaotang Town, Anhua County, Yiyang City, Hunan Province Applicant before: Zhang Fan |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221114 Address after: 271000 Taishan science and Technology Industrial Park, north of yitianmen street, Tai'an high tech Zone, Tai'an City, Shandong Province Patentee after: Taian wisdom Valley Industrial Park Operation Management Co.,Ltd. Address before: No.62, Tingshan Road, tingpang Town, Sanmen County, Taizhou City, Zhejiang Province, 317103 Patentee before: Wan Jinfen |
|
| TR01 | Transfer of patent right |