CN110278662A - The manufacturing method and its LED light source of three line soft board circuits - Google Patents
The manufacturing method and its LED light source of three line soft board circuits Download PDFInfo
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- CN110278662A CN110278662A CN201910653381.6A CN201910653381A CN110278662A CN 110278662 A CN110278662 A CN 110278662A CN 201910653381 A CN201910653381 A CN 201910653381A CN 110278662 A CN110278662 A CN 110278662A
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- copper
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- contact
- led light
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
Abstract
The invention belongs to LED lamp technical fields, disclose the manufacturing method of three line soft board circuits, by using FDC laminating machine, by copper foil, hot melt adhesive it is laminating with high temperature film together with so that layers of copper is by hot melt adhesive layer overlay film on high temperature resistant pet layer;Using FDC molding machine, by roll die, rolling processing is carried out to layers of copper, forms first layers of copper, Article 2 layers of copper and the Article 3 layers of copper being set side by side, wherein Article 2 layers of copper is made of the multistage layers of copper mutually separated, and erects isolation strip in vertical horizontal between adjacent segment layers of copper;Surface layer film or welding resistance oil reservoir are fitted in first layers of copper, Article 2 layers of copper and Article 3 layers of copper upper surface;Aperture processing is carried out to surface layer film or welding resistance oil reservoir.LED light source, including LED light, according to three line soft boards circuit, resistance, anode plug, cathode plug and power panel obtained by the above method.The present invention, which realizes, can simplify processing and save the cost.
Description
Technical field
The invention belongs to LED lamp technical field more particularly to the manufacturing methods and its LED light of three line soft board circuits
Source.
Background technique
At present use aluminum substrate/glass-fiber-plate/FPC soft board circuit, complex process, production efficiency is low, material and manually at
This height, and circuit fabrication needs pickling etching, via hole plating etc., it is very big to environmental hazard.Aluminum substrate/glass-fiber-plate/FPC is soft at present
The basic technological process of plate circuit and light source are as follows:
Press (being pressed together on layers of copper on aluminium/glass substrate by insulating cement) -- " photosensitive oil is coated (in the painting of layers of copper upper surface
Cover photosensitive oil) -- " exposed photosensitive oil (egative film being set in photosensitive oil reservoir upper surface, be exposed to it) -- " development-" etching-"
Move back film-" printing welding resistance oil-" welding lamp bead formation light source.
Wherein, process development is using Na2CO3The photosensitive route oil that unexposed photosensitive route oil is dissolved, and is exposed
It has occurred that polymerization reaction and is retained on copper face, beneath copper is protected not to be etched liquid medicine dissolution.
Wherein, process etching is using ferric trichloride FeCl3Addition hydrochloric acid, will using the redox of copper as etching solution
Exposed copper removes.
Wherein, it is that the photosensitive route oil of copper wire surface will be protected to remove using NaOH that process, which moves back film,.
Acidity used in the above process and alkaline solution to human body, have sizable harm to environment, and generate
The recovery processing of dangerous waste object is not easy, and is more increased manufacturing cost.
Currently used LED light, as shown in Figure 1, including LED light chip 1, fluorescent glue 2, LED light belt supporting frame 3, metal fever
Heavy 4, pin 5 and crystal-bonding adhesive 6, volume is big, at high cost, and always exists heat dissipation problem.
Summary of the invention
The manufacturing method and its LED light source for being designed to provide three line soft board circuits of the embodiment of the present invention, Neng Goujian
Change processing and save the cost.
The embodiments of the present invention are implemented as follows:
The manufacturing method of three line soft board circuits, comprising:
By using FDC laminating machine, by copper foil, hot melt adhesive it is laminating with high temperature film together with so that layers of copper passes through hot melt
Glue-line overlay film is on high temperature resistant pet layer;
Using FDC molding machine, by roll die, rolling processing is carried out to layers of copper, forms first copper being set side by side
Layer, Article 2 layers of copper and Article 3 layers of copper, wherein Article 2 layers of copper is made of the multistage layers of copper mutually separated, adjacent segment layers of copper it
Between in vertical horizontal erect isolation strip;
Surface layer film or welding resistance oil reservoir are fitted in first layers of copper, Article 2 layers of copper and Article 3 layers of copper upper surface;
Aperture processing is carried out to surface layer film or welding resistance oil reservoir, it will be in first layers of copper, Article 2 layers of copper and Article 3 layers of copper
Surface portion exposure forms circuit junction, wherein one end in first layers of copper is equipped with power panel negative contacts, and the other end is set
There is the first contact of resistance, one end of Article 2 layers of copper is equipped with the second contact of resistance, first contact and the second contact
Position is corresponding, and the other end of Article 2 layers of copper is equipped with power panel positive contact, and the upper crosspiece of odd number section layers of copper is equipped with LED light contact
And the lower crosspiece of even number section layers of copper is equipped with LED light contact or the lower crosspiece of odd number section layers of copper is equipped with LED light contact and even number section
The upper crosspiece of layers of copper is equipped with LED light contact, and the spacing between the upper crosspiece of adjacent segment layers of copper and lower crosspiece is 0.1~0.2mm, the
One end of three layers of copper is equipped with negative contacts, and the other end is equipped with power panel negative contacts.
LED light source, including LED light, three line soft board circuits, resistance, anode plug, cathode plug and power panel, three
Line soft board circuit includes surface layer film or welding resistance oil reservoir, high temperature resistant pet layer, hot melt adhesive layer, first article of layers of copper, Article 2 layers of copper and
Three layers of copper, first layers of copper, Article 2 layers of copper and Article 3 layers of copper are set side by side through hot melt adhesive layer overlay film in high temperature resistant PET
Layer upper surface, Article 2 layers of copper are made of the multistage layers of copper mutually separated, and erect isolation strip, surface layer in vertical horizontal between adjacent segment layers of copper
Film or welding resistance oil reservoir are fitted in first layers of copper, Article 2 layers of copper and Article 3 layers of copper upper surface, the surface layer film or welding resistance oil
The exposure of first layers of copper, Article 2 layers of copper and Article 3 layers of copper upper surface portion is formed circuit junction by layer aperture, wherein the
One end in one layers of copper is equipped with power panel negative contacts, and the other end is equipped with the first contact of resistance, and the one of Article 2 layers of copper
The position of second contact of the end equipped with resistance, first contact and the second contact is corresponding, and the other end of Article 2 layers of copper is equipped with
Power panel positive contact, the upper crosspiece of odd number section layers of copper is equipped with LED light contact and the lower crosspiece of even number section layers of copper connects equipped with LED light
Point or the lower crosspiece of odd number section layers of copper are equipped with LED light contact and the upper crosspiece of even number section layers of copper is equipped with LED light contact, adjacent
Spacing between the upper crosspiece and lower crosspiece of section layers of copper is 0.1~0.2mm, and one end of Article 3 layers of copper is equipped with negative contacts, separately
One end is equipped with power panel negative contacts, and the anode plug is electrically connected with power panel, the cathode of cathode plug and Article 3 layers of copper
Contact connection, the power panel negative contacts of Article 3 layers of copper are electrically connected with power panel, and power panel is powered on first layers of copper respectively
Source plate negative contacts are connected with the power panel positive contact of Article 2 layers of copper, and resistance both ends are connected to first contact and second
On contact, the LED light is only made of LED light chip and fluorescent glue, and LED light chip is entrenched in fluorescent glue, and the LED light connects
It connects on LED light contact.
The embodiment of the present invention is by mainly using rolling mode to form three line soft board circuits, so that environmental friendly, cost
It is low, remove LED lamp holder and metal heat sink structure, so that LED light heat dissipation effect is more preferable, the performance of light source is more excellent.
Detailed description of the invention
Fig. 1 is LED lamp structure figure in the prior art;
Fig. 2 is LED lamp structure figure in the present invention;
Fig. 3 is the manufacturing method procedure chart of three line soft board circuits of the invention;
Fig. 4 is three line soft board circuit finished figures of the invention;
Fig. 5 is the light-source structure schematic diagram containing three line soft board circuits of the invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Specific implementation of the invention is described in detail below in conjunction with specific embodiment:
The manufacturing method of three line soft board circuits, comprising:
By using FDC laminating machine, by copper foil, hot melt adhesive it is laminating with high temperature film together with so that layers of copper passes through hot melt
Glue-line overlay film is on high temperature resistant pet layer;
Using FDC molding machine, by roll die, rolling processing is carried out to layers of copper, forms first copper being set side by side
Layer, Article 2 layers of copper and Article 3 layers of copper, wherein Article 2 layers of copper is made of the multistage layers of copper mutually separated, adjacent segment layers of copper it
Between in vertical horizontal erect isolation strip;
Surface layer film or welding resistance oil reservoir are fitted in first layers of copper, Article 2 layers of copper and Article 3 layers of copper upper surface;
Aperture processing is carried out to surface layer film or welding resistance oil reservoir, it will be in first layers of copper, Article 2 layers of copper and Article 3 layers of copper
Surface portion exposure forms circuit junction, wherein one end in first layers of copper is equipped with power panel negative contacts, and the other end is set
There is the first contact of resistance, one end of Article 2 layers of copper is equipped with the second contact of resistance, first contact and the second contact
Position is corresponding, and the other end of Article 2 layers of copper is equipped with power panel positive contact, and the upper crosspiece of odd number section layers of copper is equipped with LED light contact
And the lower crosspiece of even number section layers of copper is equipped with LED light contact or the lower crosspiece of odd number section layers of copper is equipped with LED light contact and even number section
The upper crosspiece of layers of copper is equipped with LED light contact, and the spacing between the upper crosspiece of adjacent segment layers of copper and lower crosspiece is 0.1~0.2mm, the
One end of three layers of copper is equipped with negative contacts, and the other end is equipped with power panel negative contacts.
LED light source, including LED light, three line soft board circuits, resistance, anode plug, cathode plug and power panel, three
Line soft board circuit includes surface layer film or welding resistance oil reservoir, high temperature resistant pet layer, hot melt adhesive layer, first article of layers of copper, Article 2 layers of copper and
Three layers of copper, first layers of copper, Article 2 layers of copper and Article 3 layers of copper are set side by side through hot melt adhesive layer overlay film in high temperature resistant PET
Layer upper surface, Article 2 layers of copper are made of the multistage layers of copper mutually separated, and erect isolation strip, surface layer in vertical horizontal between adjacent segment layers of copper
Film or welding resistance oil reservoir are fitted in first layers of copper, Article 2 layers of copper and Article 3 layers of copper upper surface, the surface layer film or welding resistance oil
The exposure of first layers of copper, Article 2 layers of copper and Article 3 layers of copper upper surface portion is formed circuit junction by layer aperture, wherein the
One end in one layers of copper is equipped with power panel negative contacts, and the other end is equipped with the first contact of resistance, and the one of Article 2 layers of copper
The position of second contact of the end equipped with resistance, first contact and the second contact is corresponding, and the other end of Article 2 layers of copper is equipped with
Power panel positive contact, the upper crosspiece of odd number section layers of copper is equipped with LED light contact and the lower crosspiece of even number section layers of copper connects equipped with LED light
Point or the lower crosspiece of odd number section layers of copper are equipped with LED light contact and the upper crosspiece of even number section layers of copper is equipped with LED light contact, adjacent
Spacing between the upper crosspiece and lower crosspiece of section layers of copper is 0.1~0.2mm, and one end of Article 3 layers of copper is equipped with negative contacts, separately
One end is equipped with power panel negative contacts, and the anode plug is electrically connected with power panel, the cathode of cathode plug and Article 3 layers of copper
Contact connection, the power panel negative contacts of Article 3 layers of copper are electrically connected with power panel, and power panel is powered on first layers of copper respectively
Source plate negative contacts are connected with the power panel positive contact of Article 2 layers of copper, and resistance both ends are connected to first contact and second
On contact, the LED light is only made of LED light chip and fluorescent glue, and LED light chip is entrenched in fluorescent glue, and the LED light connects
It connects on LED light contact.
As shown in figure 3, the present invention using novel soft board circuit (FDC circuit Flexible Die cutting Circuit,
Flexibility cross cutting circuit) substitute traditional aluminum substrate/glass-fiber-plate/FPC soft board.Soft board circuit of the invention is by high-temperature insulation film+electricity
(insulation welding resistance oil substitution also can be used) in road floor+high-temperature insulation film composition, and entire light source technique forms as follows:
By 9 overlay film of layers of copper 7, hot melt adhesive layer 8 and high temperature resistant pet layer, rolling carves out route, is then bonded surface layer film or print
Welding resistance oil reservoir 10 processed, welding LED light 11 form light source, specifically, using FDC laminating machine, by copper foil and high temperature film it is laminating
Together, the semi-finished product of circuit are formed by roll die using FDC molding machine, the circuit layer (source region) through rolling makes copper
Foil gap is 0.1~0.2mm, i.e., the empty size up and down between copper is 0.1~0.2mm;Surface layer film passes through roll die aperture
(exposing circuit position to weld as elements such as LED light, resistance), this process can also directly print welding resistance oil;Then it will open
The surface layer film and the route after rolling in hole pass through heating roller assembly.
After the above method, semi-finished product and finished product as shown in Figure 4 and Figure 5 are obtained, three line soft board circuits include table
Tunic or welding resistance oil reservoir 10, high temperature resistant pet layer 9,8, first layers of copper 12 of hot melt adhesive layer, Article 2 layers of copper 13 and Article 3 layers of copper
19, first layers of copper 12, Article 2 layers of copper 13 and Article 3 layers of copper 19 are set side by side through 8 overlay film of hot melt adhesive layer in high temperature resistant
9 upper surface of pet layer, surface layer film or welding resistance oil reservoir 10 are fitted in first layers of copper 12, Article 2 layers of copper 13 and Article 3 layers of copper 19
Upper surface, 10 aperture of the surface layer film or welding resistance oil reservoir will be in first layers of copper 12, Article 2 layers of copper 13 and Article 3 layers of copper 19
Surface portion exposure forms circuit junction, wherein one end in first layers of copper 12 is equipped with power panel negative contacts 14, another
End is equipped with the first contact 16 of resistance 18, and one end of Article 2 layers of copper 13 is equipped with the second contact 16 of resistance 18, and described first connects
Point is corresponding with the position of the second contact, and the other end of Article 2 layers of copper 13 is equipped with power panel positive contact 15, the Article 2 copper
13 middle section of layer are made of the multistage layers of copper mutually separated, and erect isolation strip, odd number section layers of copper in vertical horizontal between adjacent segment layers of copper
Upper crosspiece be equipped with the lower crosspiece of LED light contact 17 and even number section layers of copper and be equipped under LED light contact 17 or odd number section layers of copper
Crosspiece is equipped with LED light contact 17 and the upper crosspiece of even number section layers of copper is equipped with LED light contact 17, and the upper crosspiece of adjacent segment layers of copper is under
Spacing between crosspiece is 0.1~0.2mm, and LED light 11 is welded between the upper crosspiece of adjacent segment layers of copper and lower crosspiece, Article 3
One end of layers of copper 19 is equipped with negative contacts 21, and the other end is equipped with power panel negative contacts 22, the anode plug and power panel electricity
Connection, cathode plug are connect with the negative contacts of Article 3 layers of copper 19, the power panel negative contacts 22 and electricity of Article 3 layers of copper 19
Source plate electrical connection, power panel respectively with the power panel of power panel negative contacts 14 and Article 2 layers of copper 13 in first layers of copper 12 just
Polar contact 15 connects, and resistance both ends are connected on first contact and the second contact, and the LED light is only by 1 He of LED light chip
Fluorescent glue 2 forms, and LED light chip 1 is entrenched in fluorescent glue 2, and the LED light is connected on LED light contact, forms LED light source.
Fig. 2 is the structure chart of LED of the present invention, and LED light is only made of LED light chip 1 and fluorescent glue 2, and LED light chip is chimeric
In fluorescent glue.
LED light of the invention removes LED lamp holder, and small volume, cost is lower, and heat dissipation performance is more preferable, more because of LED light
Small, so smaller to the size requirement of circuit gap in welding, of the invention is environmental friendly, at low cost, and LED light radiates
Effect is more preferable, and performance is more excellent.
In the embodiment of the present invention, polyethylene terephthalate chemical formula is-OCH2-CH2OCOC6H4CO- English
Name: polyethyleneterephthalate, abbreviation PET.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to restrict the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (2)
1. the manufacturing method of three line soft board circuits characterized by comprising
By using FDC laminating machine, by copper foil, hot melt adhesive it is laminating with high temperature film together with so that layers of copper passes through hot melt adhesive layer
Overlay film is on high temperature resistant pet layer;
Using FDC molding machine, by roll die, rolling processing is carried out to layers of copper, forms first article of layers of copper being set side by side,
Two layers of copper and Article 3 layers of copper, wherein Article 2 layers of copper is made of the multistage layers of copper mutually separated, and is between adjacent segment layers of copper
Vertical horizontal erects isolation strip;
Surface layer film or welding resistance oil reservoir are fitted in first layers of copper, Article 2 layers of copper and Article 3 layers of copper upper surface;
Aperture processing is carried out to surface layer film or welding resistance oil reservoir, by first layers of copper, Article 2 layers of copper and Article 3 layers of copper upper surface
Part exposure forms circuit junction, wherein one end in first layers of copper is equipped with power panel negative contacts, and the other end is equipped with electricity
First contact of resistance, one end of Article 2 layers of copper are equipped with the second contact of resistance, the position of first contact and the second contact
Accordingly, the other end of Article 2 layers of copper is equipped with power panel positive contact, and the upper crosspiece of odd number section layers of copper is equipped with LED light contact and idol
The lower crosspiece of several sections of layers of copper is equipped with LED light contact or the lower crosspiece of odd number section layers of copper is equipped with LED light contact and even number section layers of copper
Upper crosspiece be equipped with LED light contact, spacing between the upper crosspiece of adjacent segment layers of copper and lower crosspiece is 0.1~0.2mm, Article 3
One end of layers of copper is equipped with negative contacts, and the other end is equipped with power panel negative contacts.
2.LED light source, it is characterised in that: including LED light, three line soft board circuits, resistance, anode plug, cathode plug and electricity
Source plate, three line soft board circuits include surface layer film or welding resistance oil reservoir, high temperature resistant pet layer, hot melt adhesive layer, first layers of copper, second
Layers of copper and Article 3 layers of copper, first layers of copper, Article 2 layers of copper and Article 3 layers of copper are set side by side through hot melt adhesive layer overlay film
In high temperature resistant pet layer upper surface, Article 2 layers of copper is made of the multistage layers of copper mutually separated, perpendicular in vertical horizontal between adjacent segment layers of copper
Isolation strip, surface layer film or welding resistance oil reservoir are fitted in first layers of copper, Article 2 layers of copper and Article 3 layers of copper upper surface, the surface layer
The exposure of first layers of copper, Article 2 layers of copper and Article 3 layers of copper upper surface portion is formed circuit and connect by film or welding resistance oil reservoir aperture
Point, wherein one end in first layers of copper is equipped with power panel negative contacts, and the other end is equipped with the first contact of resistance, and second
One end of layers of copper is equipped with the second contact of resistance, and the position of first contact and the second contact is corresponding, Article 2 layers of copper
The other end is equipped with power panel positive contact, and the upper crosspiece of odd number section layers of copper is equipped with the lower crosspiece of LED light contact and even number section layers of copper
Lower crosspiece equipped with LED light contact or odd number section layers of copper is equipped with LED light contact and the upper crosspiece of even number section layers of copper is equipped with LED
Lamp contact, the spacing between the upper crosspiece of adjacent segment layers of copper and lower crosspiece is 0.1~0.2mm, and one end of Article 3 layers of copper is equipped with
Negative contacts, the other end are equipped with power panel negative contacts, and the anode plug is electrically connected with power panel, cathode plug and Article 3
The negative contacts of layers of copper connect, and the power panel negative contacts of Article 3 layers of copper are electrically connected with power panel, and power panel is respectively with first
Power panel negative contacts are connected with the power panel positive contact of Article 2 layers of copper in layers of copper, and resistance both ends are connected to described first
On contact and the second contact, the LED light is only made of LED light chip and fluorescent glue, and LED light chip is entrenched in fluorescent glue,
The LED light is connected on LED light contact.
Priority Applications (1)
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CN201910653381.6A CN110278662A (en) | 2019-07-17 | 2019-07-17 | The manufacturing method and its LED light source of three line soft board circuits |
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CN201910653381.6A CN110278662A (en) | 2019-07-17 | 2019-07-17 | The manufacturing method and its LED light source of three line soft board circuits |
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