CN210247183U

CN210247183U - LED light source of four-wire flexible printed circuit board

Info

Publication number: CN210247183U
Application number: CN201921126128.7U
Authority: CN
Inventors: Lixia Tang; 唐丽霞
Original assignee: Heshan Zhongsheng Technology Co ltd
Current assignee: Jiangmen Yamin Electronic Technology Co ltd
Priority date: 2019-07-17
Filing date: 2019-07-17
Publication date: 2020-04-03
Anticipated expiration: 2029-07-17

Abstract

The utility model belongs to the technical field of LED lamps and lanterns, a LED light source of a four-wire flexible circuit is disclosed, comprising an LED lamp, a four-wire flexible circuit, a resistor, an anode plug, a cathode plug and a power panel; the four-line flexible printed circuit board comprises a first copper layer, a second copper layer, a third copper layer and a fourth copper layer, wherein the distance between the second copper layer and the third copper layer is 0.1-0.2 mm, the second copper layer is punched into a plurality of sections of independent copper layers, the third copper layer is punched into a plurality of sections of independent copper layers, and the punching position of the second copper layer and the punching position of the third copper layer are arranged in a staggered mode. The utility model discloses a can simplify processing and practice thrift the cost.

Description

LED light source of four-wire flexible printed circuit board

Technical Field

The utility model belongs to the technical field of the LED lamps and lanterns, especially, relate to a LED light source of four line soft board circuits.

Background

At present, the circuit using the aluminum substrate/glass fiber board/FPC flexible board has the disadvantages of complex process, low production efficiency, high material and labor cost, and great environmental harm due to the fact that the circuit processing needs pickling etching, via hole electroplating and the like. The basic processing procedures of the current aluminum substrate/glass fiber board/FPC soft board circuit and light source are as follows:

pressing (pressing a copper layer on an aluminum/glass fiber substrate through insulating glue) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -.

Wherein the step of development is carried out using Na₂CO₃The unexposed photosensitive circuit oil is dissolved away, and the exposed photosensitive circuit oil is subjected to polymerization reaction and remains on the copper surface, so that the copper below is protected from being dissolved by the etching solution.

Wherein the etching process is ferric chloride FeCl₃Hydrochloric acid is added as an etching solution, and the copper is oxidized and reduced to remove the exposed copper.

Wherein, the film removing in the working procedure is to remove photosensitive line oil for protecting the surface of the copper line by using NaOH.

The acidic and alkaline solutions used in the above procedures are harmful to human body and environment, and the generated hazardous wastes are not easy to be recycled, so that the manufacturing cost is increased.

The LED lamp that adopts at present, as shown in fig. 1, including LED lamp chip 1, fluorescent glue 2, LED lamp area support 3, metal heat sink 4, pin 5 and solid brilliant glue 6, bulky, with high costs, and have the heat dissipation problem always.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the utility model is to provide a LED light source of four line soft board circuits can simplify processing and practice thrift the cost.

The embodiment of the utility model provides a realize like this:

the LED light source of the four-wire flexible printed circuit comprises an LED lamp, four-wire flexible printed circuit, a resistor, an anode plug, a cathode plug and a power panel, wherein the four-wire flexible printed circuit comprises a surface layer film or a solder resisting oil layer, a high-temperature resistant PET layer, a hot melt adhesive layer, a first copper layer, a second copper layer, a third copper layer and a fourth copper layer, the first copper layer, the second copper layer, the third copper layer and the fourth copper layer are arranged in parallel on the upper surface of the high-temperature resistant PET layer through a hot melt adhesive layer coating film, the second copper layer is broken into multiple sections of independent copper layers, the third copper layer is broken into multiple sections of independent copper layers, the breaking position of the second copper layer is staggered with the breaking position of the third copper layer, the surface layer film or the solder resisting oil layer is attached to the upper surfaces of the first copper layer film, the second copper layer, the third copper layer and the fourth copper layer, the surface layer film or, The upper surfaces of a second copper layer, a third copper layer and a fourth copper layer are partially exposed to form circuit contacts, wherein one end of the first copper layer is provided with a power panel negative electrode contact, the other end of the first copper layer is provided with a first resistor contact, one end of the second copper layer is provided with a second resistor contact, the positions of the first contact and the second contact are corresponding, the other end of the second copper layer is provided with a power panel positive electrode contact, two ends of the same section of independent copper layer of the second copper layer 13 are respectively provided with an LED lamp contact, two ends of the same section of independent copper layer of the third copper layer are respectively provided with an LED lamp contact, one end of the fourth copper layer is provided with a negative electrode contact, the other end of the fourth copper layer is provided with a power panel negative electrode contact, the positive electrode plug is electrically connected with the power panel, the negative electrode plug is connected with the negative electrode, the power panel is respectively connected with the negative electrode contact of the power panel on the first copper layer and the positive electrode contact of the power panel on the second copper layer, two ends of the resistor are connected to the first contact and the second contact, the LED lamp only comprises an LED lamp chip and fluorescent glue, the LED lamp chip is embedded in the fluorescent glue, and the LED lamp is connected with the corresponding LED lamp contacts of the second copper layer and the third copper layer in a bridging manner.

The embodiment of the utility model provides a form four line soft board circuits through mainly adopting the roll extrusion mode for technology environmental protection, with low costs remove LED lamp support and metal heat sink structure, make LED lamp radiating effect better, the performance of light source is more excellent.

Drawings

FIG. 1 is a prior art LED lamp construction;

FIG. 2 is a diagram of the structure of the LED lamp of the present invention;

FIG. 3 is a process diagram of a method of manufacturing a four wire flex circuit according to the present invention;

FIG. 4 is a diagram of a four-wire flexible printed circuit board of the present invention;

fig. 5 is a schematic diagram of a light source structure including four-wire flexible printed circuit according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The following detailed description is given to specific implementations of the present invention with reference to specific embodiments:

a manufacturing method of a four-wire flexible printed circuit board comprises the following steps:

by adopting an FDC forming machine, the copper foil, the hot melt adhesive and the high-temperature film are laminated together, so that the copper layer is laminated on the high-temperature resistant PET layer through the hot melt adhesive layer;

punching the circuit layer by using an automatic punching machine to form a first copper layer, a second copper layer, a third copper layer and a fourth copper layer which are arranged in parallel, wherein the distance between the second copper layer and the third copper layer is 0.1-0.2 mm, the second copper layer is punched into a plurality of sections of independent copper layers, the third copper layer is punched into a plurality of sections of independent copper layers, and the punching position of the second copper layer and the punching position of the third copper layer are arranged in a staggered manner;

attaching a surface layer film or a solder resist oil layer to the upper surfaces of the first copper layer, the second copper layer, the third copper layer and the fourth copper layer;

the surface film or the solder resist oil layer is subjected to hole opening treatment, the upper surface parts of a first copper layer, a second copper layer, a third copper layer and a fourth copper layer are exposed to form circuit contacts, wherein one end of the first copper layer is provided with a power panel negative electrode contact, the other end of the first copper layer is provided with a first resistance contact, one end of the second copper layer is provided with a second resistance contact, the positions of the first contact and the second contact are corresponding, the other end of the second copper layer is provided with a power panel positive electrode contact, two ends of the same section of independent copper layer of the second copper layer are respectively provided with an LED lamp contact, two ends of the same section of independent copper layer of the third copper layer are respectively provided with an LED lamp contact, one end of the fourth copper layer is provided with a negative electrode contact, and.

An LED light source comprises an LED lamp, four line soft board circuits obtained according to the method, a resistor, an anode plug, a cathode plug and a power panel, wherein the anode plug is electrically connected with the power panel, the cathode plug is connected with a cathode connecting point of a fourth copper layer, the cathode connecting point of the power panel of the fourth copper layer is electrically connected with the power panel, the power panel is respectively connected with the cathode connecting point of the power panel on the first copper layer and the anode connecting point of the power panel on the second copper layer, two ends of the resistor are connected onto the first connecting point and the second connecting point, the LED lamp only comprises an LED lamp chip and fluorescent glue, the LED lamp chip is embedded in the fluorescent glue, and the LED lamp is connected with the LED lamp connecting points corresponding to the second copper layer and the third copper layer in a bridging manner.

As shown in fig. 3, the present invention adopts a novel Flexible circuit board (FDC circuit Flexible Die cutting circuit) to replace the conventional aluminum substrate/glass fiber board/FPC Flexible board. The utility model discloses a soft board circuit comprises high temperature resistant insulating film + circuit layer + high temperature resistant insulating film (also can use insulating solder mask oil to replace), and whole light source technology forms as follows:

coating a copper layer 7, a hot melt adhesive layer 8 and a high temperature resistant PET layer 9, punching out a circuit, then attaching a surface layer film or printing a solder resist oil layer 10, welding an LED lamp 11 to form a light source, specifically, adopting an FDC (fully drawn copper) film coating machine to coat a copper foil and a high temperature film together, adopting an automatic die stamping machine to form a semi-finished product of a circuit, and enabling the blank size between a second copper layer and a third copper layer to be 0.1-0.2 mm; the surface film is perforated by a rolling die (the exposed circuit position is used for welding elements such as an LED lamp, a resistor and the like), and solder resist oil can be directly printed in the process; and then laminating the surface film with the opening and the rolled line through a heating roller.

After the above method, the semi-finished product and the finished product shown in fig. 4 and 5 are obtained, the four-wire flexible printed circuit board comprises a surface layer film or solder resist layer 10, a high temperature resistant PET layer 9, a hot melt adhesive layer 8, a first copper layer 12, a second copper layer 13, a third copper layer 19 and a fourth copper layer 20, the first copper layer 12, the second copper layer 13, the third copper layer 19 and the fourth copper layer 20 are arranged in parallel and coated on the upper surface of the high temperature resistant PET layer 9 through the hot melt adhesive layer 8, the second copper layer 13 is punched into a plurality of independent copper layers, the third copper layer 19 is punched into a plurality of independent copper layers, the punching position of the second copper layer 13 is staggered with the punching position of the third copper layer 19, the surface layer film or solder resist layer 10 is attached to the upper surfaces of the first copper layer 12, the second copper layer 13, the third copper layer 19 and the fourth copper layer 20, the surface layer film or solder resist layer 10 is provided with an opening, the upper surfaces of a second copper layer 13, a third copper layer 19 and a fourth copper layer 20 are partially exposed to form circuit contacts, wherein one end of the first copper layer 12 is provided with a power panel negative electrode contact 14, the other end of the first copper layer is provided with a first contact 16 of a resistor 18, one end of the second copper layer 13 is provided with a second contact 16 of the resistor 18, the first contact and the second contact are corresponding in position, the other end of the second copper layer 13 is provided with a power panel positive electrode contact 15, two ends of the same section of independent copper layer of the second copper layer 13 are respectively provided with an LED lamp contact 17, two ends of the same section of independent copper layer of the third copper layer 19 are respectively provided with an LED lamp contact 17, one end of the fourth copper layer 20 is provided with a negative electrode contact 21, and the other end.

The LED lamp 11 is connected with the corresponding LED lamp contact 17 of the second copper layer 13 and the third copper layer 19 in a bridging manner, the positive plug is electrically connected with the power panel, the negative plug is connected with the negative connection point 21 of the fourth copper layer 20, the power panel negative connection point 22 of the fourth copper layer 20 is electrically connected with the power panel, and the power panel is respectively connected with the power panel negative connection point 14 on the first copper layer 12 and the power panel positive connection point 15 of the second copper layer 13 to form an LED light source.

Fig. 2 is the utility model discloses LED's block diagram, LED lamp only comprise LED lamp chip 1 and fluorescent glue 2, and LED lamp chip gomphosis is in the fluorescent glue.

The utility model discloses a LED lamp removes LED lamp support, and the volume is less, and the cost is lower, and heat dispersion is better, because of the LED lamp is littleer, so the dimensional requirement to the circuit clearance when the welding is littleer, the utility model discloses a technology environmental protection, with low costs, and LED lamp radiating effect is better, and the performance is more excellent.

In the embodiment of the utility model, the chemical formula of the polyethylene glycol terephthalate is-OCH 2-CH2OCOC6H4 CO-English name: polyethylene terephthalate, abbreviated as PET.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a LED light source of four line soft board circuits which characterized in that: the LED lamp comprises an LED lamp, four-wire soft board circuit, a resistor, an anode plug, a cathode plug and a power panel, wherein the four-wire soft board circuit comprises a surface film or a solder resist oil layer, a high-temperature resistant PET layer, a hot melt adhesive layer, a first copper layer, a second copper layer, a third copper layer and a fourth copper layer, the first copper layer, the second copper layer, the third copper layer and the fourth copper layer are arranged in parallel and coated on the upper surface of the high-temperature resistant PET layer through the hot melt adhesive layer, the second copper layer is punched into a plurality of sections of independent copper layers, the third copper layer is punched into a plurality of sections of independent copper layers, the punching position of the second copper layer and the punching position of the third copper layer are staggered, the surface film or the solder resist oil layer is attached to the upper surfaces of the first copper layer, the second copper layer, the third copper layer and the fourth copper layer, the surface film or the oil layer is subjected to solder resist opening, and the upper surfaces of the first, wherein, one end of the first copper layer is provided with a power panel negative electrode contact, the other end of the first copper layer is provided with a first resistance contact, one end of the second copper layer is provided with a second resistance contact, the positions of the first contact and the second contact are corresponding, the other end of the second copper layer is provided with a power panel positive electrode contact, both ends of the same independent copper layer of the second copper layer 13 are respectively provided with an LED lamp contact, both ends of the same independent copper layer of the third copper layer are respectively provided with an LED lamp contact, one end of the fourth copper layer is provided with a negative electrode contact, the other end of the fourth copper layer is provided with a power panel negative electrode contact, the positive electrode plug is electrically connected with the power panel, the negative electrode plug is connected with the negative electrode contact of the fourth copper layer, the power panel negative electrode contact of the first copper layer is electrically connected with the power panel positive electrode contact of the second copper layer, the LED lamp is characterized in that two ends of the resistor are connected to the first contact and the second contact, the LED lamp only comprises an LED lamp chip and fluorescent glue, the LED lamp chip is embedded in the fluorescent glue, and the LED lamp is connected to the corresponding LED lamp contact of the second copper layer and the third copper layer in a cross-over mode.