CN110276550A - A method of it is secondary with work to apply to chip industry using laser point cloud scanning technique and BIM technology - Google Patents
A method of it is secondary with work to apply to chip industry using laser point cloud scanning technique and BIM technology Download PDFInfo
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- CN110276550A CN110276550A CN201910541672.6A CN201910541672A CN110276550A CN 110276550 A CN110276550 A CN 110276550A CN 201910541672 A CN201910541672 A CN 201910541672A CN 110276550 A CN110276550 A CN 110276550A
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- Prior art keywords
- point cloud
- laser point
- bim
- design
- scanning technique
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000005516 engineering process Methods 0.000 title claims abstract description 26
- 230000009467 reduction Effects 0.000 claims description 9
- 230000008676 import Effects 0.000 claims description 4
- 238000013461 design Methods 0.000 abstract description 20
- 238000010276 construction Methods 0.000 abstract description 12
- 230000008901 benefit Effects 0.000 description 3
- 238000007726 management method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/10—Geometric CAD
- G06F30/13—Architectural design, e.g. computer-aided architectural design [CAAD] related to design of buildings, bridges, landscapes, production plants or roads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
- G06Q10/063—Operations research, analysis or management
- G06Q10/0631—Resource planning, allocation, distributing or scheduling for enterprises or organisations
- G06Q10/06312—Adjustment or analysis of established resource schedule, e.g. resource or task levelling, or dynamic rescheduling
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q50/00—Systems or methods specially adapted for specific business sectors, e.g. utilities or tourism
- G06Q50/04—Manufacturing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T19/00—Manipulating 3D models or images for computer graphics
- G06T19/20—Editing of 3D images, e.g. changing shapes or colours, aligning objects or positioning parts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2200/00—Indexing scheme for image data processing or generation, in general
- G06T2200/08—Indexing scheme for image data processing or generation, in general involving all processing steps from image acquisition to 3D model generation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
Apply to the secondary method with work of chip industry using laser point cloud scanning technique and BIM technology the invention discloses a kind of；By laser point cloud scanning technique, accurate recording device model and modal position imported into secondary with secondary piping in BIM design software, is reasonably carried out, and improve design accuracy, to guarantee construction quality, and carry out digitlization archive to whole design.The characteristics of present invention is less than 1mm using laser point cloud scanning technique trueness error, achievement device model, modal position are accurate, secondary PIPING DESIGN is carried out by reasonable BIM technology simultaneously, it solves the problems, such as mechanical drawing and physical device disunity, equipment positioning drawing and live physical location is inconsistent, the conventional secondary unordered, no drawings with design piping achieves, improve the continuity of working efficiency, construction quality and engineering information.
Description
Technical field
The invention belongs to the secondary methods with work of chip industry, are specifically exactly a kind of for meeting chip industry two
It is secondary to match design, construct, the method for O&M.
Background technique
As international and domestic jumbo chip workshop is established, secondary design with BIM is a big problem.By actually setting on site
It is standby big with drawing device location error, mechanical drawing inaccuracy, the factors such as limited space.It is secondary to be stepped on substantially using scene with design
It surveys, the mode of scene piping, causes secondary construction piping arrangement of matching unordered, be easy to appear subsequent piping causes without space layout
The problem of the phenomenon that piping is done over again is completed in front and continued, and design and construction are without the data of archive.
Simultaneously because due to not specific secondary PIPING DESIGN drawing, the only arrangement principle of pipeline, not having in traditional design
The spatial information of pipeline, is easy to happen pipeline, pipe fitting collision in the construction process, and BIM technology of the present invention solves pipeline collision
Problem, lifting construction efficiency improve construction quality.And achieved by digitlization, design information is effectively saved, O&M rank is conducive to
The information of section is called and is consulted.
The present invention provide herein it is a kind of for meet chip industry it is secondary with design, construction, O&M method, pass through laser
Point cloud scanning technique, 1:1 reduction apparatus shape and arrangement positioning, imported after processing it is secondary in BIM design software, then rationally
Match with BIM technology progress is secondary, meets space requirement.
Summary of the invention
Therefore, in order to solve above-mentioned deficiency, the present invention provides a kind of utilization laser point cloud scanning technique and BIM technology herein
Apply to the secondary method with work of chip industry；Secondary with BIM design in order to solve the problems, such as, the present invention is swept by a point cloud
Retouch, reduction apparatus model, device context physical location, be then introduced into it is secondary with reasonable utilization BIM technology in BIM design software,
Carried out in three-dimensional space it is secondary with design, make pipeline arrangement it is more reasonable, reduce pipeline collision, lifting construction efficiency, improve work
Cheng Zhiliang, digitized of going forward side by side achieve.
The invention is realized in this way constructing a kind of laser point cloud scanning technique and BIM technology applies to chip manufacturing row
The secondary method with work of industry, it is characterised in that: operation it is as follows, laser point cloud scanning technique precise restoration device model and calmly
Position, 1:1 reduction apparatus model, import it is secondary in BIM design software, by BIM model carry out digitlization archive, management and after
Phase O&M carries out secondary match with BIM technology.
The present invention has the advantage that a kind of utilization laser point cloud scanning technique of the present invention applies to BIM technology
The secondary method with work of chip manufacturing industry.By laser point cloud scanning technique, accurate recording device model and modal position,
Imported into it is secondary improve design accuracy with secondary piping in BIM design software, is reasonably carried out, to guarantee construction quality, and
Digitlization archive is carried out to whole design.The characteristics of present invention is less than 1mm using laser point cloud scanning technique trueness error, achievement
Device model, modal position are accurate, while carrying out secondary PIPING DESIGN by reasonable BIM technology, solve mechanical drawing with
Physical device disunity, equipment positioning drawing and live physical location are inconsistent, conventional secondary with the unordered, no drawings of design piping
The problem of archive, improves the continuity of working efficiency, construction quality and engineering information.Established under BIM system concept one it is good
Good structural concept, by computer, simulating realistic engineering behavior, to assist the project life cycle comprehensive planning, from rule
Meter is delineated, constructs to operate and arrives maintenance management etc., each stage all can reach use by the processing that same model carries out different information
Demand.
The present invention uses laser point cloud scanning technique, perfect reduction apparatus model, and positioning device physical location imports two
It is secondary to match in BIM design software, secondary piping reasonable utilization BIM technology of the present invention is carried out, secondary with secondary in BIM design software
Piping, design effect direct-view it is considerable, and can be permanently effective carry out digitlization archive.The present invention provides a kind of cloud and BIM
Technology application has the advantages that in the secondary method with work of chip industry
First, precisely reduction apparatus shape, precise positioning device location, error are less than 1mm.
Second, the secondary piping of reasonable utilization BIM technology, avoids pipeline from colliding, the duration is saved, improves working efficiency and engineering
Quality.
Third, carry out digitlization archive with BIM model, work progress can be managed and later period O&M, be realized
Digital factory, the big data that integrates with application.
Detailed description of the invention
Fig. 1 is laser point cloud scanning device model
Fig. 2 is to imported into the secondary model in BIM design software
Fig. 3 is to carry out secondary piping with BIM technology.
Specific embodiment
Below in conjunction with attached drawing 1- Fig. 3, the present invention is described in detail, technical solution in the embodiment of the present invention into
Row clearly and completely describes, it is clear that described embodiments are only a part of the embodiments of the present invention, rather than whole realities
Apply example.Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without making creative work
Every other embodiment, shall fall within the protection scope of the present invention.
The present invention provides a kind of laser point cloud scanning technique herein with BIM technology to apply to chip industry secondary by improving
Method with work, as shown in Figure 1-Figure 3, laser point cloud scanning technique (1), BIM technology (2)；
The present invention uses laser point cloud scanning technique, and 1:1 reduction apparatus model, importing is secondary in BIM design software, uses
BIM technology carries out secondary match.
Wherein, laser point cloud scanning device model accuracy is high, and error is less than 1mm.
Wherein, BIM technology carries out secondary considerable with looking at straight.
Wherein, BIM model carries out digitlization archive, consults convenient for O&M.
The present invention guarantees that model meets reality by laser point cloud scanning technique precise restoration device model and positioning, closes
The utilization BIM technology of reason, reduces pipeline collision, carries out digitlization archive, management and later period O&M by BIM model, promotes work
Make efficiency, improves construction quality.
The present invention uses laser point cloud scanning technique, perfect reduction apparatus model, and positioning device physical location imports two
It is secondary to match in BIM design software, secondary piping reasonable utilization BIM technology of the present invention is carried out, secondary with secondary in BIM design software
Piping, design effect direct-view it is considerable, and can be permanently effective carry out digitlization archive.The present invention provides a kind of cloud and BIM
Technology application has the following advantages that in the secondary method with work of chip industry；
First, precisely reduction apparatus shape, precise positioning device location, error are less than 1mm.
Second, the secondary piping of reasonable utilization BIM technology, avoids pipeline from colliding, the duration is saved, improves working efficiency and engineering
Quality.
Third, carry out digitlization archive with BIM model, work progress can be managed and later period O&M, be realized
Digital factory, the big data that integrates with application.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (1)
1. a kind of apply to the secondary method with work of chip industry, feature using laser point cloud scanning technique and BIM technology
It is: operates as follows, laser point cloud scanning technique precise restoration device model and positioning, 1:1 reduction apparatus model imports secondary
With in BIM design software, digitlization archive, management and later period O&M are carried out by BIM model, carried out with BIM technology secondary
Match.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910541672.6A CN110276550A (en) | 2019-06-21 | 2019-06-21 | A method of it is secondary with work to apply to chip industry using laser point cloud scanning technique and BIM technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910541672.6A CN110276550A (en) | 2019-06-21 | 2019-06-21 | A method of it is secondary with work to apply to chip industry using laser point cloud scanning technique and BIM technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110276550A true CN110276550A (en) | 2019-09-24 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910541672.6A Pending CN110276550A (en) | 2019-06-21 | 2019-06-21 | A method of it is secondary with work to apply to chip industry using laser point cloud scanning technique and BIM technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110276550A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204595138U (en) * | 2015-03-27 | 2015-08-26 | 江苏峰工电气科技有限公司 | Hyperchannel line scanning instrument |
| CN106777680A (en) * | 2016-12-14 | 2017-05-31 | 华中科技大学 | A kind of existing bridge fast B IM modelings and method |
| CN109101709A (en) * | 2018-07-25 | 2018-12-28 | 中国十七冶集团有限公司 | The site construction management system that 3D laser scanner technique is combined with BIM technology |
-
2019
- 2019-06-21 CN CN201910541672.6A patent/CN110276550A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204595138U (en) * | 2015-03-27 | 2015-08-26 | 江苏峰工电气科技有限公司 | Hyperchannel line scanning instrument |
| CN106777680A (en) * | 2016-12-14 | 2017-05-31 | 华中科技大学 | A kind of existing bridge fast B IM modelings and method |
| CN109101709A (en) * | 2018-07-25 | 2018-12-28 | 中国十七冶集团有限公司 | The site construction management system that 3D laser scanner technique is combined with BIM technology |
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Application publication date: 20190924 |