CN110265768B - Antenna module - Google Patents

Antenna module Download PDF

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Publication number
CN110265768B
CN110265768B CN201811338045.4A CN201811338045A CN110265768B CN 110265768 B CN110265768 B CN 110265768B CN 201811338045 A CN201811338045 A CN 201811338045A CN 110265768 B CN110265768 B CN 110265768B
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China
Prior art keywords
wiring layer
antenna
disposed
filter
antenna module
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CN201811338045.4A
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Chinese (zh)
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CN110265768A (en
Inventor
金斗一
郑大权
许荣植
白龙浩
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Publication of CN110265768A publication Critical patent/CN110265768A/en
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Abstract

The present disclosure provides an antenna module, comprising: a connection member including at least one wiring layer and at least one insulating layer; an antenna package including a plurality of antenna members that transmit or receive Radio Frequency (RF) signals and a plurality of feeder vias that are electrically connected at one end to the plurality of antenna members, respectively, and at another end to wires corresponding to the at least one wiring layer, respectively, and the antenna package is located on a first surface of the connection member; an Integrated Circuit (IC) disposed on the second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer to receive an Intermediate Frequency (IF) signal or a baseband signal and transmit an RF signal or receive an RF signal and transmit an IF signal or a baseband signal; and a filter for filtering the IF signal or the baseband signal.

Description

Antenna module
This application claims the benefit of priority of korean patent application No. 10-2018-0028803 filed by the korean intellectual property office at 12.3.2018, the disclosure of which is incorporated herein by reference in its entirety.
Technical Field
The present disclosure relates to an antenna module.
Background
Mobile communication data traffic tends to increase rapidly year by year. Technology development is actively being conducted to support rapidly growing data in real time in a wireless network. For example, receiving and sending data for internet of things (IoT), Augmented Reality (AR), Virtual Reality (VR), live VR/AR in conjunction with Social Networking Services (SNS), autonomous driving, synchronized views (real-time image transmission of user views using compact cameras), applications, etc. requires communications (e.g., 5 th generation (5G) communications, millimeter wave (mmWave) communications, etc.) that support a large data exchange.
Therefore, millimeter wave communication including 5G communication has been actively studied, and research has been actively conducted for allowing commercialization/standardization of an antenna module to smoothly realize millimeter wave communication.
RF signals of high frequency bands (e.g., 24GHz, 28GHz, 36GHz, 39GHz, 60GHz, etc.) are easily absorbed and cause loss during transmission, so that communication quality may be greatly degraded. Therefore, the antenna for high-band communication requires a technical method different from that of the related art antenna technology, and may require development of a special technology, such as a separate power amplifier for securing antenna gain, integrating an antenna and a Radio Frequency Integrated Circuit (RFIC), securing effective isotropic radiated power, and the like.
Conventionally, an antenna module providing a millimeter wave communication environment is a structure in which an IC and an antenna are disposed on a substrate according to high frequency use and connected by a coaxial cable to satisfy high-level antenna performance (e.g., transmission/reception ratio, gain, directivity, and the like). However, such a structure may result in insufficient space for antenna layout, limited freedom of antenna shape, increased interference between the antenna and the IC, and increased size/cost of the antenna module.
Disclosure of Invention
An aspect of the present disclosure may provide an antenna module that may be miniaturized while ensuring high-level antenna performance through a structure in which an antenna, an Integrated Circuit (IC), and a filter are effectively integrated.
According to an aspect of the present disclosure, an antenna module may include: a connection member including at least one wiring layer and at least one insulating layer; an antenna package including a plurality of antenna members that transmit or receive Radio Frequency (RF) signals and a plurality of feeder vias that are electrically connected at one end to the plurality of antenna members, respectively, and at another end to wires corresponding to the at least one wiring layer, respectively, and the antenna package is located on a first surface of the connection member; an Integrated Circuit (IC) disposed on the second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer to receive an Intermediate Frequency (IF) signal or a baseband signal and transmit a Radio Frequency (RF) signal or receive an RF signal and transmit an IF signal or a baseband signal; and a filter provided outside the IC and filtering the IF signal or the baseband signal.
According to another aspect of the present disclosure, an antenna module may include: a connection member including at least one wiring layer and at least one insulating layer; an antenna package including a plurality of antenna members that transmit or receive Radio Frequency (RF) signals and a plurality of feeder vias that are electrically connected at one end to the plurality of antenna members, respectively, and at another end to wires corresponding to the at least one wiring layer, respectively, and the antenna package is located on a first surface of the connection member; an Integrated Circuit (IC) disposed on the second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer to receive an Intermediate Frequency (IF) signal or a baseband signal and transmit a Radio Frequency (RF) signal or receive an RF signal and transmit an IF signal or a baseband signal; a support member disposed on a second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer to allow an IF signal or a baseband signal to pass through the support member; and a filter disposed on the support member.
According to another aspect of the present disclosure, an antenna module may include: an Integrated Circuit (IC) having an active surface on which connection pads are disposed; a connection member provided on the active surface of the integrated circuit, the connection member including a wiring layer and an insulating layer, the wiring layer being electrically connected to the connection pad; an antenna package disposed on the connection member, the antenna package including antenna members configured to transmit and/or receive Radio Frequency (RF) signals and feeder vias each having a first end electrically connected to one of the antenna members and a second end electrically connected to the wiring layer; and a filter disposed external to the integrated circuit, the filter configured to filter an intermediate frequency signal (IF) and/or a baseband signal.
Drawings
The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
fig. 1 is a block diagram illustrating an antenna module according to an exemplary embodiment of the present disclosure;
fig. 2 is a block diagram illustrating a structure in which an antenna module according to an exemplary embodiment of the present disclosure may further include an intermediate frequency integrated circuit (IF IC);
fig. 3 is a side view of an antenna module according to an exemplary embodiment of the present disclosure;
fig. 4 is a side view illustrating a structure in which an antenna module according to an exemplary embodiment of the present disclosure may further include an IF IC;
fig. 5 is a diagram illustrating a structure in which a filter is disposed on a connection member in an antenna module according to an exemplary embodiment of the present disclosure;
fig. 6 is a diagram illustrating a structure in which a filter is disposed on an upper surface of a support member in an antenna module according to an exemplary embodiment of the present disclosure;
fig. 7 is a diagram illustrating a structure in which a filter is disposed in an inner layer of a support member in an antenna module according to an exemplary embodiment of the present disclosure;
fig. 8 is a diagram illustrating a structure in which an IC and an IF IC are provided together in an antenna module according to an exemplary embodiment of the present disclosure;
fig. 9 is a diagram illustrating a filter and an accommodation space in an antenna module according to an exemplary embodiment of the present disclosure;
fig. 10 is a diagram illustrating a filter provided in a second connection member in an antenna module according to an exemplary embodiment of the present disclosure;
fig. 11A to 11D are diagrams illustrating various types of filters provided in an antenna module according to an exemplary embodiment of the present disclosure;
fig. 12 is a top view of an antenna module according to an exemplary embodiment of the present disclosure;
fig. 13A to 13C are perspective views respectively showing an example of a cavity of an antenna package of an antenna module according to an exemplary embodiment of the present disclosure;
fig. 14 is a perspective view of an example of an antenna package of an antenna module according to an example embodiment of the present disclosure;
fig. 15 is a block diagram schematically illustrating an example of an electronic device system;
fig. 16 is a perspective view schematically showing an example of an electronic device;
fig. 17A and 17B are sectional views schematically showing states before and after packaging of a fan-in type semiconductor package;
fig. 18 is a sectional view schematically showing a packaging process of a fan-in type semiconductor package;
fig. 19 is a sectional view schematically showing a case where a fan-in type semiconductor package is mounted on an interposer substrate and finally mounted on a main board of an electronic device;
fig. 20 is a sectional view schematically showing a case where a fan-in type semiconductor package is embedded in an interposer substrate and finally mounted on a main board of an electronic device;
fig. 21 is a schematic cross-sectional view of a fan-out type semiconductor package; and
fig. 22 is a sectional view schematically showing a case where a fan-out type semiconductor package is mounted on a main board of an electronic device.
Detailed Description
Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. In the drawings, the shape, size, and the like of elements may be exaggerated or stylized for clarity.
The present disclosure may, however, be embodied in different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The term "exemplary embodiment" as used herein does not refer to the same exemplary embodiment, but is provided to emphasize a particular feature or characteristic that is different from a particular feature or characteristic of another exemplary embodiment. However, the exemplary embodiments provided herein are considered to be capable of being implemented in whole or in part with each other. For example, unless an opposite or contradictory description is provided herein, an element described in a particular exemplary embodiment may be understood as a description relating to another exemplary embodiment even if it is not described in another exemplary embodiment.
In the specification, the meaning of "connected" of a component to another component includes indirect connection through a third component and direct connection between two components. Further, "electrically connected" is intended to include the concept of physical connection and physical disconnection. It will be understood that when reference is made to an element using "first" and "second," the element is not limited to "first" and "second. "first" and "second" may be used merely for the purpose of distinguishing elements from other elements, and may not limit the order or importance of the elements. In some instances, a first element may be termed a second element without departing from the scope of the claims set forth herein. Similarly, a second element may also be referred to as a first element.
Here, upper, lower, upper surface, lower surface, and the like are defined in the drawings. For example, the first connection member is arranged on a level above the redistribution layer. However, the claims are not so limited. Further, the vertical direction refers to the above-described upward direction and downward direction, and the horizontal direction refers to a direction perpendicular to the above-described upward direction and downward direction. In this case, a vertical section refers to a case where it is taken along a plane in the vertical direction, and an example thereof may be a sectional view shown in the drawings. Further, the horizontal section refers to a case where it is taken along a plane in the horizontal direction, and an example thereof may be a plan view shown in the drawings.
The terminology used herein is for the purpose of describing example embodiments only and is not intended to be limiting of the disclosure. In this case, the singular form includes the plural form unless the context otherwise explains.
Fig. 1 is a block diagram illustrating an antenna module according to an exemplary embodiment of the present disclosure.
Referring to fig. 1, an antenna module (module 1) according to an exemplary embodiment of the present disclosure may have a structure in which an antenna 10a, an IC 20a, and a filter 30a are integrated.
Antenna 10a may remotely receive or transmit Radio Frequency (RF) signals and may transmit received RF signals to IC 20a or receive RF signals for transmission from IC 20 a. The antenna 10a may include multiple antenna members to further improve antenna performance.
The IC 20a may convert the received RF signal into an Intermediate Frequency (IF) signal or a baseband signal, and may transmit the converted IF signal or baseband signal to an IF IC, a baseband IC, or a communication modem provided outside the antenna module (module 1). The IC 20a may convert an IF signal or a baseband signal received from an IF IC, a baseband IC, or a communication modem provided outside the antenna module (module 1) into an RF signal, and may transmit the converted RF signal to the antenna 10 a. Here, the frequency of the RF signal (e.g., 24GHz, 28GHz, 36GHz, 39GHz, and 60GHz) may be higher than the frequency of the IF signal (e.g., 2GHz, 5GHz, and 10 GHz). Meanwhile, IC 20a may perform at least some of frequency conversion, amplification, filtering, phase control, and power generation to produce a converted signal.
Filter 30a may filter the converted IF signal or baseband signal from IC 20a and may be disposed external to IC 20 a. For example, the filter 30a may be a band pass filter having a predetermined pass band (e.g., 800MHz and 2.4GHz) or a high pass filter or a low pass filter having a predetermined cutoff frequency (e.g., 12GHz and 15 GHz).
According to the filtering at the filter 30a, noise included in the IF signal or the baseband signal can be reduced. Since the noise contained in the RF signal depends on the noise contained in the IF signal or the baseband signal, the noise contained in the RF signal can be reduced together with the reduction of the noise contained in the IF signal or the baseband signal.
Therefore, the antenna module (module 1) can easily satisfy the required specification of the noise characteristic even without using an additional filter for filtering the RF signal. Thus, the antenna module (module 1) can be reduced in size as much as the space occupied by the additional filter for filtering the RF signal.
Furthermore, when the antenna 10a includes a plurality of antenna members for antenna performance (e.g., transmission/reception ratio, gain, linearity, etc.), it may be necessary to increase the amount of additional filters for filtering the RF signal, where the use of the filter 30a in the antenna module (module 1) may remove additional filters respectively corresponding to the plurality of antenna members. Therefore, the size of the antenna module (module 1) can be reduced by reducing the size of the space occupied by the plurality of filters while ensuring antenna performance.
Fig. 2 is a block diagram illustrating a structure in which an antenna module according to an exemplary embodiment of the present disclosure may further include an IF IC.
Referring to fig. 2, an antenna module (module 2) according to an exemplary embodiment of the present disclosure may have a structure in which an antenna 10b, an IC 20b, an IF IC 25b, and a filter 30b are integrated.
Antenna 10b may receive or transmit RF signals remotely and may transmit received RF signals to IC 20b or receive RF signals for transmission from IC 20 b. The antenna 10b can further improve antenna performance by including a plurality of antenna members.
IC 20b may convert the received RF signal to an IF signal and may transmit the converted IF signal to IF IC 25 b. IC 20b may convert the IF signal received from IF IC 25b to an RF signal and may transmit the converted RF signal to antenna 10 b. Here, the frequency of the RF signal (e.g., 24GHz, 28GHz, 36GHz, 39GHz, and 60GHz) is higher than the frequency of the IF signal (e.g., 2GHz, 5GHz, and 10 GHz).
The IF IC 25b may convert the received IF signal into a baseband signal, and may transmit the converted baseband signal to the baseband IC or a communication modem located outside the antenna module (module 2). The IF IC 25b may convert a baseband signal received from the baseband IC or a communication modem located outside the antenna module (module 2) into an IF signal, and may transmit the converted IF signal to the IC 20 b.
Filter 30b may filter the converted IF signal from IC 20b and may be located external to IC 20 b. For example, the filter 30b may be a band pass filter having a predetermined pass band (e.g., 800MHz, 2.4GHz) or a high pass filter or a low pass filter having a predetermined cutoff frequency (e.g., 12GHz, 15 GHz).
According to the filtering at the filter 30b, noise included in the IF signal can be reduced. Since the noise contained in the RF signal depends on the noise contained in the IF signal, the noise contained in the RF signal can be reduced together with the reduction of the noise contained in the IF signal.
Therefore, the antenna module (module 2) can easily satisfy the required specification of the noise characteristic even without using an additional filter for filtering the RF signal. Thus, the antenna module (module 2) can be reduced in size as much as the space occupied by the additional filter for filtering the RF signal.
Furthermore, when the antenna 10b includes a plurality of antenna elements for antenna performance (e.g., transmission/reception ratio, gain, linearity, etc.), it may be necessary to increase the amount of additional filters used to filter the RF signal, where the use of the filter 30b in the antenna module (module 2) may remove additional filters corresponding to the plurality of antenna elements, respectively. Therefore, the size of the antenna module (module 2) can be reduced by reducing the size of the space occupied by the plurality of filters while ensuring antenna performance.
Fig. 3 is a side view illustrating an antenna module according to an exemplary embodiment of the present disclosure.
Referring to fig. 3, an antenna module according to an exemplary embodiment of the present disclosure may include an antenna 10c, a second directional antenna 15c, an IC 20c, a filter 30c, a passive component 40c, a substrate 50c, and a sub-substrate 60 c.
The substrate 50c may include at least one wiring layer 51c and at least one insulating layer 52c, and may include at least one via penetrating the insulating layer to electrically connect the plurality of wiring layers. For example, the substrate 50c may be implemented as a Printed Circuit Board (PCB), and may have a structure in which an upper antenna package and a lower connection member are combined. For example, the antenna package may be designed according to transmission and reception efficiency of RF signals, and the connection member may be designed according to wiring efficiency.
The antenna 10c may be disposed on top of the substrate 50c to transmit and receive RF signals in an upper surface direction, and may be implemented using a plurality of antenna members. For example, the antenna 10c having the structure of a patch antenna may be disposed adjacent to the upper surface of the substrate 50 c.
The second directional antenna 15c may be disposed adjacent to a side surface of the substrate 50c to transmit and receive RF signals in a lateral direction. For example, the second directional antenna 15c may have a dipole antenna or a microstrip antenna structure.
An antenna module according to an exemplary embodiment of the present disclosure may include both the antenna 10c and the second directional antenna 15c to form an omnidirectional radiation pattern.
The IC 20c and the passive component 40c may be disposed against a lower surface of the substrate 50 c. Passive components 40c may include capacitors (e.g., multilayer ceramic capacitors (MLCCs)), inductors, or chip resistors to provide the necessary impedance to IC 20 c.
The submount 60c may be disposed on the lower surface of the substrate 50c and provide a path for IF signals or baseband signals. The sub substrate 60c may be implemented as a support member mounted on the outside of the antenna module and used to support the antenna module.
The filter 30c may be disposed on the sub-substrate 60 c. Accordingly, the filter 30c may be adjacent to a path of the IF signal or the baseband signal to filter the IF signal or the baseband signal, thereby improving filtering performance, and the substrate 50c may secure an additional space corresponding to the filter 30c to reduce a size or further improve wiring efficiency.
Fig. 4 is a side view illustrating a structure in which an antenna module according to an exemplary embodiment of the present disclosure may further include an IF IC.
Referring to fig. 4, an antenna module according to an exemplary embodiment of the present disclosure may include an antenna 10d, a second directional antenna 15d, an IC 20d, an IF IC 25d, a filter 30d, a substrate 50d, and a sub-substrate 60 d.
The substrate 50d may include at least one wiring layer 51d and at least one insulating layer 52d, and may include at least one via penetrating the insulating layer to electrically connect the plurality of wiring layers.
The second directional antenna 15d may be disposed on the upper surface of the substrate 50d and abut the side surface of the substrate 50d to transmit and receive RF signals in a lateral direction and/or an upper surface direction, and may have a three-dimensional structure such as a chip antenna.
The IC 20d, IF IC 25d, and filter 30d may be disposed on the lower surface of the substrate 50 d. For example, filter 30d may be disposed adjacent to IF IC 25d, adjacent to IC 20d, or between IC 20d and IF IC 25 d. Accordingly, the filter 30d may filter the IF signal near the path of the IF signal to improve filtering performance.
Fig. 5 is a diagram illustrating a structure in which a filter is located at a connection member in an antenna module according to an exemplary embodiment of the present disclosure.
Referring to fig. 5, an antenna module according to an exemplary embodiment of the present disclosure may include a substrate having a structure in which an antenna package 100a and a connection member 200a are combined.
The antenna package 100a may include: a plurality of antenna members 115a configured to transmit or receive an RF signal; a plurality of feeder vias 120a electrically connected to the plurality of antenna members 115a at one end thereof and electrically connected to a wiring corresponding to the at least one wiring layer 210a of the connection member 200a at the other end, respectively; and a dielectric layer 140a thicker than the at least one insulation layer 220a of the connection member 200a, and the antenna package 100a may be located on the top of the connection member 200 a. Accordingly, the antenna module according to the exemplary embodiment of the present disclosure may form a radiation pattern in an upper surface direction to transmit and receive an RF signal.
Due to the length of the feeder via 120a and the thickness of the dielectric layer 140a, boundary conditions for RF signal transmission and reception operations of the plurality of antenna members 115a may be freely designed, and unnecessary boundary conditions (e.g., interlayer spacing, interlayer interposition, etc.) may be removed. Accordingly, since the feeder via 120a and the dielectric layer 140a provide boundary conditions (e.g., small manufacturing tolerances, short electrical length, smooth surface, large additional space, adjustment of dielectric constant, etc.) advantageous for the transmission and reception operations of the RF signals of the plurality of antenna members 115a, the antenna performance of the plurality of antenna members 115a may be improved.
The dielectric layer 140a may be formed using a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin (e.g., prepreg, ABF (Ajinomoto build-up film), FR-4, Bismaleimide Triazine (BT), etc.) impregnated with a core material such as glass fiber (glass cloth or glass cloth) and an inorganic filler, and may be formed using a photosensitive insulating resin (photosensitive medium (PID)) according to design. For example, the dielectric layer 140a may be formed using a general Copper Clad Laminate (CCL) or a glass or ceramic based insulating material according to desired material properties. According to design, the dielectric layer 140a may be formed using a material having a dielectric constant Dk higher than that of the at least one insulating layer 220a of the connection member 200 a.
Depending on the design, the antenna package 100a may also include a plurality of director members 110a disposed on the plurality of antenna members 115a and transmitting or receiving the first RF signal with the plurality of antenna members 115 a. The amount of the layer in which the plurality of director members 110a are formed may be determined according to design conditions of the gain and height of the antenna module. Therefore, the amount of the layer is not limited to one.
According to design, the antenna package 100a may include a plating member 160a, the plating member 160a being disposed to surround a side surface of each of the feeder vias 120a to form a plurality of cavities. The multiple cavities may provide boundary conditions (e.g., small manufacturing tolerances, short electrical length, smooth surface, large additional space, dielectric constant control, etc.) that are favorable for forming the radiation pattern of the multiple antenna members 115a, and may improve isolation between the multiple antenna members 115 a.
The antenna package 100a may further include a cavity ground layer 165a disposed adjacent to the connection member 200a according to design. The cavity ground layer 165a may improve the isolation between the antenna package 100a and the connection member 200 a.
Depending on design, the antenna package 100a may further include an encapsulation member 150a disposed on the plurality of antenna members 115 a. In a state where the encapsulation member 150a in a liquid state penetrates downward, it may be changed from a liquid state to a solid state. Therefore, the structural stability of the antenna package 100a may be improved. In addition, the encapsulating member 150a may be formed together with the plurality of guide members 110a in the forming process. The encapsulation member 150a may be formed using a photosensitive encapsulant (PIE), ABF (Ajinomoto build-up film), Epoxy Molding Compound (EMC), and the like, but is not limited thereto.
The director member 110a, the antenna member 115a, the feed line via 120a, the plating member 160a, and the cavity ground layer 165a may be formed using a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof, and may be formed by a plating method such as Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), sputtering, a subtractive method, an additive method, a semi-additive process (SAP), a modified SAP (msap), or the like, but is not limited thereto.
Referring to fig. 5, the connection member 200a may include at least one wiring layer 210a, at least one insulating layer 220a, a wiring via 230a, a connection pad 240a, a passivation layer 250a, and an electrical connection structure 290a, and may have a structure similar to that of a copper redistribution layer (RDL).
For example, some and other of each of the at least one wiring layer 210a, the at least one insulating layer 220a, and the wiring via 230a included in the connection member 200a may be independently manufactured and may be then connected to each other through the connection pad 240a, the passivation layer 250a, and the electrical connection structure 290 a. According to design, the at least one wiring layer 210a, the at least one insulating layer 220a, and the wiring via 230a may be integrally manufactured, so that the connection pad 240a, the passivation layer 250a, and the electrical connection structure 290a may be omitted.
Referring to fig. 5, the antenna module according to an exemplary embodiment of the present disclosure may further include an IC 300a, a passive component 350a, and a sub-member 400 a.
The IC 300a may have: an active surface (e.g., an upper surface) electrically connected to the at least one wiring layer 210 a; and an inactive surface (e.g., a lower surface) disposed on an opposite side of the active surface. The IC 300a may transmit RF signals to the antenna package 100a and may receive RF signals from the antenna package 100 a.
The sub-component 400a may receive an IF signal or a baseband signal from the outside of the antenna module or may transmit the IF signal or the baseband signal to the outside. For example, the sub-member 400a may be implemented as a support member or may be implemented as a coaxial cable connector or receptacle, depending on the design.
Referring to fig. 5, the antenna module according to an exemplary embodiment of the present disclosure may further include a filter 280a disposed in the connection member 200. For example, the filter 280a may be disposed on the same layer as that of the at least one wiring layer 210a, and may be electrically connected to a wiring corresponding to the at least one wiring layer 210 a.
Fig. 6 is a diagram illustrating a structure in which a filter is disposed on an upper surface of a support member in an antenna module according to an exemplary embodiment of the present disclosure.
Referring to fig. 6, an antenna module according to an exemplary embodiment of the present disclosure may include an antenna package 100a, a connection member 200a, an IC 300b, an encapsulant 305b, an upper wiring layer 310b, a lower wiring layer 320b, an electrical connection structure 340b, a support member 355b, a core insulating layer 356b, a core via hole 360b, and a core plating member 365 b.
The IC 300b may have: an active surface (e.g., an upper surface) electrically connected to the at least one wiring layer 210 a; and an inactive surface (e.g., a lower surface) disposed on an opposite side of the active surface. The IC 300b may transmit RF signals to the antenna package 100a and may receive RF signals from the antenna package 100 a.
Encapsulant 305b may encapsulate at least a portion of IC 300 b. The encapsulant 305b may protect the IC 300b from external electrical/physical/chemical shock and may be formed using PIE, ABF, EMC, etc., but is not limited thereto.
The upper routing layer 310b may be disposed on top of the support member 355b or adjacent to the connection member 200a and electrically connect the active surface of the IC 300b and the core via 360 b. Therefore, the IC 300b can secure a transmission path of the IF signal or the baseband signal.
The lower wiring layer 320b may be disposed on the bottom of the support member 355b, and may be electrically connected to the core via 360 b.
The electrical connection structure 340b may electrically connect the core via 360b to the outside of the antenna module on the bottom of the support member 355 b. For example, the electrical connection structure 340b may have a structure such as a structure of a solder ball, a pin, and a pad.
The support member 355b may include at least one core wiring layer, at least one core insulation layer 356b, and a core via 360 b. The core via 360b may be a path for passing the IF signal or the baseband signal.
That is, the IF signal or the baseband signal may sequentially pass through the electrical connection structure 340b, the core via 360b, the upper wiring layer 310b, and the IC 300 b.
The core plating member 365b may be disposed on a side surface of the support member 355b in a direction toward the IC 300 b. The core plating member 365b may improve the isolation between the IC 300b and the support member 355b to reduce noise of the IF signal or the baseband signal. In addition, the core plating member 365b can effectively radiate heat generated in the IC 300b to the outside of the antenna module.
Referring to fig. 6, the antenna module according to an exemplary embodiment of the present disclosure may further include a filter 280b disposed on the top of the support member 355 b. Filter 280b may be electrically connected to core via 360b or IC 300b through upper routing layer 310 b.
In some embodiments, a passivation layer 357b may be disposed on lower wiring layer 320b to physically and chemically protect lower wiring layer 320 b. Passivation layer 357b may include openings for electrical connection structure 340 b. The passivation layer 357b may be formed using a suitable insulating material such as polyimide.
Fig. 7 is a diagram illustrating a structure in which a filter is disposed in an inner layer of a support member in an antenna module according to an exemplary embodiment of the present disclosure.
Referring to fig. 7, an antenna module according to an exemplary embodiment of the present disclosure may include a filter 380b disposed inside a support member 355 b. That is, the filter 380b may be disposed in the core wiring layer of the support member 355 b. For example, the filter 380b may have a three-dimensional structure using a plurality of core wiring layers, and thus may have a waveguide structure or a wafer-based structure. That is, the antenna module according to the exemplary embodiments of the present disclosure may include filters having various structures.
Meanwhile, an antenna module according to an exemplary embodiment of the present disclosure may include: an upper ground pattern (not shown) provided in the upper wiring layer 310b and overlapping the filter 380b at an upper end thereof; and a lower ground pattern provided in the lower wiring layer 320b and overlapping the filter 380b at a lower end. Accordingly, noise provided to the filter 380b from outside the antenna module or in the antenna package 100a may be reduced.
Fig. 8 is a diagram illustrating a structure in which an IC and an IF IC are provided together in an antenna module according to an exemplary embodiment of the present disclosure.
Referring to fig. 8, an antenna module according to an exemplary embodiment of the present disclosure may include an IC 301b and an IF IC 302b disposed on a lower surface of a connection member 200 a.
The IC 301b and the IF IC 302b may be electrically connected through the upper wiring layer 310b or at least one wiring layer 210a of the connection member 200 a. The support member 355b may be disposed to surround each of the IC 301b and the IF IC 302 b. A portion of support member 355b may be disposed between IC 301b and IF IC 302 b. Since the core plating member 365b is disposed on the side surface of the support member 355b, the IC 301b and the IF IC 302b can reduce negative effects (e.g., electromagnetic noise, heat) exerted on each other.
Here, a filter 380b may be disposed in the support member 355b and may be electrically coupled to the IF IC 302b to filter the IF signal.
Meanwhile, the filter 380b may be electrically connected to the core wiring layer of the support member 355b, the upper wiring layer 310b, or the lower wiring layer 320b through the core via hole 360b of the support member 355 b.
Fig. 9 is a diagram illustrating a filter and an accommodation space in an antenna module according to an exemplary embodiment of the present disclosure.
Referring to fig. 9, the antenna module according to an exemplary embodiment of the present disclosure may include a filter 280c disposed on a lower surface of the connection member 200a and in the receiving space 307c of the support member 355 b.
That is, when the filter 280c is bulky, the support member 355b may provide a space for arranging the filter 280c using the accommodation space 307 c. Accordingly, the antenna module according to the exemplary embodiment of the present disclosure may use various types/sizes of the filter 280 c. In addition, the support member 355b may further have a second receiving space surrounding the passive component.
Fig. 10 is a diagram illustrating a filter provided at a second connection member in an antenna module according to an exemplary embodiment of the present disclosure.
Referring to fig. 10, an antenna module according to an exemplary embodiment of the present disclosure may include: a second connection member 390d provided on the lower surface of the connection member 200 a; and an IC 300b disposed on a lower surface of the second connecting member 390 d.
The second connection member 390d may include at least one second wiring layer 391d and at least one second insulating layer 392d, and may have upper and lower surfaces having areas smaller than those of the upper and lower surfaces of the connection member 200 a.
The connection member 200a may be sequentially formed in units of layers from the lower surface of the antenna package 100a, and the second connection member 390d may be sequentially formed in units of layers from the upper surface of the IC 300 b. Thereafter, the lower surface of the connection member 200a and the upper surface of the second connection member 390d may be engaged with each other. Accordingly, the antenna module according to the exemplary embodiment of the present disclosure may secure a large number of wiring layers and insulating layers, thereby providing more ground to the IC 300b to more effectively assist the operation of the IC 300b or improve the wiring efficiency between the IC 300b and the antenna package 100 a.
Further, the antenna module according to the exemplary embodiment of the present disclosure may further include a filter 380d, the filter 380d being disposed in the at least one second wiring layer 391d of the second connection member 390 d. Since a greater number of wiring layers and insulating layers are secured due to the connection member 200a and the second connection member 390d, the antenna module can stably provide a space for arranging the filter 380 d.
The antenna module according to an exemplary embodiment of the present disclosure may further include a second support member 385d disposed on a lower surface of the second connection member 390d, a second core insulating layer 386d, and a second core plating member 387 d. Accordingly, the isolation between the IC 300b and the core via 360b or the filter 380d may be improved.
Fig. 11A to 11D are diagrams illustrating various forms of filters provided in an antenna module according to an exemplary embodiment of the present disclosure.
Referring to fig. 11A through 11D, the filters 280e, 280f, 280g, and 280h provided in the antenna module according to the exemplary embodiment of the present disclosure may be implemented as various types of conductor patterns having impedances corresponding to the frequency of the IF signal, and may be provided in the insulating layers 220e, 220f, 220g, and 220h of the connection member and the support member, respectively.
Meanwhile, an antenna module according to an exemplary embodiment of the present disclosure may include: a first filter disposed outside the IC and having a pass band of a reference frequency to filter the IF signal or the baseband signal; a second filter disposed outside the IC and having a pass band with a frequency lower than the reference frequency to filter the IF signal or the baseband signal; and a third filter provided outside the IC and having a pass band with a frequency higher than the reference frequency to filter the IF signal or the baseband signal. That is, since the antenna module according to the exemplary embodiment of the present disclosure can separately filter various IF signals, it can be optimized for various communication standards to operate.
Fig. 12 is a top view of an antenna module according to an exemplary embodiment of the present disclosure.
Referring to fig. 12, each of the plurality of director members 110-1, 110-2, 110-3, 110-4, 110-5, 110-6, 110-7, 110-8, and 110-9 may be surrounded by at least one of its corresponding plating member 160-1, 160-2, 160-3, 160-4, 160-6, 160-7, 160-8, and 160-9 and a plurality of shielded vias 190-1, 190-2, 190-3, 190-4, 190-5, 190-6, 190-7, 190-8, and 190-9. If the antenna module does not include multiple director members, the multiple director members 110-1, 110-2, 110-3, 110-4, 110-5, 110-6, 110-7, 110-8, and 110-9 may be replaced with multiple antenna members.
Meanwhile, the number, arrangement, and shape of the plurality of guide members or the plurality of antenna members shown in fig. 12 are not limited. For example, the number of the plurality of guide members shown in fig. 12 may be 4 or 16.
Meanwhile, the plurality of shielded vias shown in fig. 12 may be replaced with a plating member, and the plating member shown in fig. 12 may be replaced with a plurality of shielded vias.
Fig. 13A to 13C are perspective views each showing an example of a cavity of the antenna package of the present disclosure.
Referring to fig. 13A, the cavity may include at least some of the director member 110e, the antenna member 115e, the feed line vias, the electrical connection structures, the dielectric layer 130e, and the plating member 160 e. Here, the plating member 160e may be disposed to surround a side surface of the cavity. That is, the lower surface of the cavity may be covered by the ground pattern provided on the upper surface of the connection member.
Referring to fig. 13B, the cavity may include at least some of the director member 110f, the antenna member 115f, the feed line via 120f, the electrical connection structure 125f, the dielectric layer 130f, and the plating member 160 f. Here, the plating member 160f may be disposed to cover a portion of the lower surface of the cavity. That is, the side surface of the cavity may be surrounded by the plating member. Therefore, the isolation of the antenna package with respect to the connection member and the IC can be improved.
Referring to fig. 13C, the cavity may include at least some of the antenna member 110g, the feed line via 120g, the electrical connection structure 125g, and the dielectric layer 130 g. That is, the side surface of the cavity may be surrounded by the side surface of the dielectric layer, and the lower surface of the cavity may be covered by the ground pattern disposed on the upper surface of the connection member.
Meanwhile, when the antenna package and the connection member are combined, the electrical connection structures 125f and 125g may be connected to corresponding wirings in at least one wiring layer of the connection member. For example, the electrical connection structures 125f and 125g may be implemented as electrodes, pins, solder balls, pads, and the like.
Fig. 14 is a perspective view illustrating an example of an antenna package 100d according to the present disclosure.
Referring to fig. 14, the antenna package may include a plurality of director members 110d, a cavity 130d, a dielectric layer 140d, a plating member 160d, a plurality of second directional antenna members 170c and 170d, and a plurality of dipole antennas 175c and 175d, so that the antenna module according to an exemplary embodiment of the present disclosure may form an omnidirectional radiation pattern.
The plurality of director members 110d may transmit and receive RF signals with corresponding antenna members in the z-axis direction.
A plurality of second directional antenna members 170c and 170d may be provided to be erected adjacent to the edge of the antenna package in the z-axis direction. One of the plurality of second directional antenna members 170c and 170d may transmit and receive a second RF signal in the x-axis direction, and the other may transmit and receive a second RF signal in the y-axis direction.
A plurality of dipole antennas 175c and 175d may be disposed between the dielectric layer 140d and the encapsulation member adjacent to the edge of the antenna package. One of the dipole antennas 175c and 175d may transmit and receive a third RF signal in the x-axis direction, and the other may transmit and receive a third RF signal in the y-axis direction. At least some of the plurality of dipole antennas 175c and 175d may be replaced with monopole antennas according to design.
Meanwhile, the connection member, the support member, the core via, the IC, and the IF IC discussed in the present disclosure may be implemented according to a fan-out type semiconductor package described below. The fan-out type semiconductor package will be described in detail with reference to fig. 15 to 22 to help understand the fan-out type semiconductor package.
Fig. 15 is a block diagram schematically illustrating an example of the electronic device system.
Referring to fig. 15, an electronic device 1000 houses a main board (or motherboard) 1010. Motherboard 1010 is physically and/or electrically connected to chip-related components 1020, network-related components 1030, and other components 1040. The components may also be connected with any other electronic components (to be described later) through various signal lines 1090.
The chip related component 1020 includes: a memory chip such as a volatile memory (e.g., DRAM), a nonvolatile memory (e.g., ROM), a flash memory, or the like; application processor chips such as central processing units (e.g., CPUs), graphics processors (e.g., GPUs), digital signal processors, cryptographic processors, microprocessors, microcontrollers, etc.; and logic chips such as analog-to-digital converters, Application Specific Integrated Circuits (ASICs), and the like, but the chip-related components 1020 are not so limited and may include any other type of chip-related electronic components. Further, these chip related components 1020 may be combined with each other.
Network-related components 1030 may include: Wi-Fi (institute of Electrical and electronics Engineers (IEEE) family 802.11, etc.), WiMAX (IEEE family 802.16, etc.), IEEE 802.20, Long Term Evolution (LTE), Ev-DO, HSPA +, HSDPA +, HSUPA +, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and any other wireless and wired protocols specified after the above protocols. However, network-related component 1030 is not so limited and may include any other of a number of wireless standards or protocols or wired standards or protocols. Further, network-related components 1030 may be combined with chip-related components 1020.
Other components 1040 include high frequency inductors, ferrite inductors, power inductors, ferrite beads, low temperature co-fired ceramics (LTCC), electromagnetic interference (EMI) filters, multilayer ceramic capacitors (MLCC), and the like, but other components 1040 are not limited thereto and may include passive components for various other purposes. It should also be understood that other components 1040 may be combined with each other in conjunction with chip-related components 1020 and/or network-related components 1030.
Depending on the type of electronic device 1000, the electronic device 1000 may include other electronic components that may or may not be physically and/or electrically connected to the motherboard 1010. Including, for example, a camera 1050, an antenna 1060, a display 1070, a battery 1080, an audio codec (not shown), a video codec (not shown), a power amplifier (not shown), a compass (not shown), an accelerometer (not shown), a gyroscope (not shown), a speaker (not shown), a mass storage device (e.g., a hard drive) (not shown), a Compact Disc (CD) (not shown), a Digital Versatile Disc (DVD) (not shown), and so forth. However, these other electronic components are not limited thereto, and may include other electronic components for various purposes according to the type of the electronic device 1000.
The electronic device 1000 may be a smart phone, a Personal Digital Assistant (PDA), a digital video camera, a digital camera, a network system, a computer, a monitor, a tablet computer, a laptop computer, a netbook, a television, a video game machine, a smart watch, an automobile, etc. However, the electronic device 1000 is not limited thereto, and may be any other electronic device that processes data.
Fig. 16 is a perspective view schematically showing an example of the electronic device.
Referring to fig. 16, the electronic device may be, for example, a smart phone 1100. A radio frequency integrated circuit (RF IC) may be applied to the smart phone 1100 in the form of a semiconductor package, and an antenna may be applied in the form of a substrate or a module. Since the RF IC and the antenna are electrically connected in the smart phone 1100, the antenna signal may be radiated in various directions (R). The semiconductor package including the RF IC and the substrate or module including the antenna may be applied to an electronic device such as a smart phone in various forms.
In general, a semiconductor chip has many microelectronic circuits integrated therein, but the semiconductor chip itself may not be used as a finished semiconductor product and has a possibility of being damaged by external physical or chemical impacts. Therefore, the semiconductor chip itself is not used as it is but packaged, so that the semiconductor chip in a packaged state is used in an electronic device.
The reason why the semiconductor package is required from the viewpoint of electrical connection is because there is a difference in circuit width between the semiconductor chip and the main board of the electronic device. In particular, in the case of a semiconductor chip, the size of the connection pads and the pitch between the connection pads are very small. Meanwhile, in the case of a main board used in an electronic device, the size of electronic component mounting pads and the pitch between the electronic component mounting pads are much larger than the size of a semiconductor chip. Therefore, it may be difficult to directly mount the semiconductor chip on such a main board, and a packaging technique that can alleviate the difference in circuit width between the semiconductor chip and the main board is required.
Semiconductor packages manufactured by such a packaging technique may be classified into a fan-in type semiconductor package and a fan-out type semiconductor package according to the structure and purpose.
Hereinafter, a fan-in type semiconductor package and a fan-out type semiconductor package will be described in detail with reference to the accompanying drawings.
Fig. 17A and 17B are sectional views schematically showing states before and after packaging of the fan-in type semiconductor package.
Fig. 18 is a sectional view schematically showing a packaging process of a fan-in type semiconductor package.
Referring to fig. 17A, 17B, and 18, the semiconductor chip 2220 may be, for example, an Integrated Circuit (IC) in a bare state, including: a body 2221 including silicon (Si), germanium (Ge), gallium arsenide (GaAs), or the like; a connection pad 2222 formed on one surface of the body 2221 and including a conductive material such as aluminum (Al); and a passivation layer 2223 (such as an oxide film or a nitride film) formed on one surface of the body 2221 and covering at least a portion of the connection pad 2222. Here, since the connection pads 2222 are very small, it is difficult to mount an IC even on a medium-sized class PCB, let alone on a main board of an electronic device or the like.
In order to reroute the connection pads 2222, connection members 2240 are formed on the semiconductor chip 2220 according to the size of the semiconductor chip 2220. The connection member 2240 may be formed by: an insulating layer 2241 is formed on the semiconductor chip 2220 using an insulating material such as a photosensitive insulating (photosensitive medium, PID) resin, via holes 2243h that open the connection pads 2222 are formed, and then wiring patterns 2242 and vias 2243 are formed. Thereafter, a passivation layer 2250 for protecting the connection member 2240 is formed, an opening 2251 is formed, and then an under bump metal layer 2260 and the like are formed. That is, the fan-in type semiconductor package 2200 including, for example, the semiconductor chip 2220, the connection member 2240, the passivation layer 2250, and the under bump metal layer 2260 is manufactured through a series of processes.
As described above, the fan-in type semiconductor package may have a package form in which connection pads (e.g., input/output (I/O) terminals) of a semiconductor chip are all disposed inside a device, may have good electrical characteristics, and may be produced at low cost. Therefore, many devices to be provided in the smart phone are manufactured in the form of a fan-in type semiconductor package, and are being developed toward realizing a small size and a fast signal transmission.
However, in the fan-in type semiconductor package, all the I/O terminals must be disposed inside the semiconductor chip, so that there are many space limitations. Therefore, it is difficult to apply such a structure to a semiconductor chip having a large number of I/O terminals or a semiconductor chip having a small size. Further, due to this weakness, it may not be possible to mount the fan-in type semiconductor package directly on the main board of the electronic device. Although the size and pitch of the I/O terminals on the semiconductor chip are increased by the rewiring process, the I/O terminals may not yet have a size and pitch sufficient to be directly mounted on the main board of the electronic device.
Fig. 19 is a sectional view schematically showing a case where a fan-in type semiconductor package is mounted on an interposer substrate and finally mounted on a main board of an electronic device.
Fig. 20 is a sectional view schematically showing a case where a fan-in type semiconductor package is embedded in an interposer substrate and finally mounted on a main board of an electronic device.
Referring to fig. 19 and 20, the connection pads 2222 (i.e., I/O terminals) of the semiconductor chip 2220 of the fan-in type semiconductor package 2200 are re-routed through the interposer 2301 again, and the fan-in type semiconductor package 2200 mounted on the interposer 2301 may be finally mounted on the main board 2500 of the electronic device. Here, the electrical connection structure 2270 and the like may be fixed by the underfill resin 2280 and the like, and the outside of the semiconductor chip 2220 may be covered with the molding material 2290 and the like. Alternatively, the fan-in type semiconductor package 2200 may be embedded in a separate interposer substrate 2302, the connection pads 2222 (i.e., I/O terminals) of the semiconductor chip 2220 may be re-routed through the interposer substrate 2302 again in an embedded state, and the fan-in type semiconductor package 2200 may be finally mounted on the main board 2500 of the electronic device.
In this way, since it is difficult for the fan-in type semiconductor package to be directly mounted on the main board of the electronic device, the fan-in type semiconductor package may be mounted on a separate interposer and then mounted again on the main board of the electronic device through a packaging process, or may be embedded in the interposer and then mounted on the main board of the electronic device.
Fig. 21 is a sectional view showing a fan-out type semiconductor package.
Referring to fig. 21, in the fan-out type semiconductor package 2100, for example, the outside of a semiconductor chip 2120 is protected by an encapsulant 2130, and connection pads 2122 of the semiconductor chip 2120 are re-routed to the outside of the semiconductor chip 2120 through connection members 2140. Here, a passivation layer 2150 may also be formed on the connection member 2140, and an under bump metal layer 2160 may also be formed in the opening of the passivation layer 2150. Electrical connection structure 2170 may also be formed on underbump metallization layer 2160. The semiconductor chip 2120 may be an IC including a body 2121, a connection pad 2122, a passivation film (not shown), and the like. The connecting member 2140 may include: an insulating layer 2141; a rewiring layer 2142 formed on the insulating layer 2141; and a via 2143 electrically connecting the connection pad 2122 and the re-wiring layer 2142.
As described above, the fan-out type semiconductor package has a form in which the I/O terminals are rewired by the connection member formed on the semiconductor chip and are even disposed outside the semiconductor chip. As described above, in the fan-in type semiconductor package, all the I/O terminals of the semiconductor chip must be disposed inside the semiconductor chip, and therefore, if the device size is reduced, the solder ball size and the pitch must be reduced, and as a result, it may be impossible to use a standardized solder ball layout. In contrast, in the fan-out type semiconductor package, since the I/O terminals are re-wired by the connection members formed on the semiconductor chip and are even disposed outside the semiconductor chip, a standardized solder ball layout can be used as it is although the size of the semiconductor chip is reduced. Therefore, even without using a separate interposer substrate described below, the fan-out type semiconductor package can be mounted on the main board of the electronic device.
Fig. 22 is a sectional view schematically showing a case where a fan-out type semiconductor package is mounted on a main board of an electronic device.
Referring to fig. 22, the fan-out type semiconductor package 2100 may be mounted on the main board 2500 of the electronic device through an electrical connection structure 2170 or the like. That is, as described above, the fan-out type semiconductor package 2100 may include the connection member 2140, the connection member 2140 may re-route the connection pads 2122 on the semiconductor chip 2120 to a fan-out area beyond the size of the semiconductor chip 2120, a standardized solder ball layout may be used as it is, and as a result, the fan-out type semiconductor package 2100 may be mounted on the main board 2500 of an electronic device even without using a separate interposer or the like.
In this way, since the fan-out type semiconductor package can be mounted on the main board of the electronic device even without using a separate interposer, the thickness of the fan-out type semiconductor package can be smaller than that of the fan-in type semiconductor package using the interposer to achieve a small size and a small thickness. In addition, since the fan-out type semiconductor package has excellent thermal and electrical characteristics, it is particularly suitable for mobile products. In addition, the fan-out type semiconductor package may be implemented to be more compact than a general Package On Package (POP) type using a PCB, and may solve problems due to a bending phenomenon.
Meanwhile, the fan-out type semiconductor package refers to a packaging technology for mounting a semiconductor chip on a main board of an electronic device and for protecting the semiconductor chip from external impact, and has a concept different from that of a PCB such as an interposer substrate, which is different in size, use, and the like, and has a fan-in type semiconductor package embedded therein.
As described above, since the antenna module according to the exemplary embodiment of the present disclosure has a structure in which an antenna, an IC, and a filter are effectively integrated, the antenna module has a high level of antenna performance and can be easily miniaturized.
In the antenna module according to the exemplary embodiment of the present disclosure, since the structure of the space in which the filter is disposed may be diversified, the antenna module may have various forms/numbers of filters.
In the antenna module according to the exemplary embodiment of the present disclosure, since the electromagnetic shielding performance of the space where the filter is disposed is improved, the filtering performance of the filter may be improved.
In the antenna module according to the exemplary embodiment of the present disclosure, since the filter may be adjacent to a path of the IF signal or the baseband signal, filtering efficiency of the filter may be improved.
Since the necessity of a filter for an RF signal corresponding to each of the plurality of antenna members is reduced, the antenna module according to the exemplary embodiment of the present disclosure can be miniaturized while ensuring the performance of the reference antenna.
While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the disclosure as defined by the appended claims.

Claims (23)

1. An antenna module, comprising:
a connection member including at least one wiring layer and at least one insulating layer;
an antenna package comprising a plurality of antenna members configured to transmit or receive radio frequency signals and a plurality of feeder vias electrically connected at first ends to the plurality of antenna members, respectively, and at second ends to wires corresponding to the at least one wiring layer, respectively, and the antenna package is located on a first surface of the connection member;
an integrated circuit disposed on the second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer, the integrated circuit being configured to: receiving an intermediate frequency signal or a baseband signal and transmitting a radio frequency signal, or receiving a radio frequency signal and transmitting an intermediate frequency signal or a baseband signal;
a support member disposed on a second surface of the connection member and including a core wiring layer and an upper wiring layer; and
a filter disposed outside the integrated circuit and included in at least one of the core wiring layer and the upper wiring layer, the filter configured to filter an intermediate frequency signal or a baseband signal.
2. The antenna module of claim 1,
the support member is electrically connected to the wiring corresponding to the at least one wiring layer to allow an intermediate frequency signal or a baseband signal to pass through the support member.
3. The antenna module of claim 2,
the support member includes a core via electrically connected at one end to the wiring corresponding to the at least one wiring layer, the core wiring layer, and at least one core insulating layer.
4. The antenna module of claim 3,
the support member includes: the core wiring layer; the upper wiring layer disposed on top of the core wiring layer; and a lower wiring layer disposed on a bottom of the core wiring layer,
the filter is included in the core wiring layer,
the upper wiring layer includes an upper ground pattern overlapping the filter, and
the lower wiring layer includes a lower ground pattern overlapping the filter.
5. The antenna module of claim 2,
the support member further includes a core plating member provided on a side surface of the support member in a direction toward the integrated circuit.
6. The antenna module of claim 1, further comprising:
an intermediate frequency integrated circuit disposed on the second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer, the intermediate frequency integrated circuit being configured to: receiving a baseband signal to transmit an intermediate frequency signal, or receiving an intermediate frequency signal to transmit a baseband signal.
7. The antenna module of claim 6,
the support member has at least a portion disposed between the integrated circuit and the intermediate frequency integrated circuit.
8. The antenna module of claim 1, further comprising:
a second connection member including at least one second wiring layer and at least one second insulating layer and disposed between the connection member and the integrated circuit,
wherein an area of a surface of the second connection member facing the connection member is smaller than an area of the second surface of the connection member, and
the filter is also provided in the at least one second wiring layer of the second connection member.
9. The antenna module of claim 1, further comprising:
an encapsulant encapsulating at least a portion of the integrated circuit and at least a portion of the support member,
wherein the integrated circuit has an active surface in contact with the connection member and an inactive surface exposed to the encapsulant.
10. The antenna module of claim 1,
the antenna package further includes a dielectric layer disposed around each of the plurality of feed line vias and having a thickness greater than a thickness of the at least one insulating layer.
11. The antenna module of claim 1,
the antenna package also includes a plating member disposed around each of the plurality of feed line vias.
12. The antenna module of claim 1, further comprising:
a second filter disposed outside the integrated circuit and having a passband at a frequency lower than a frequency of the passband of the filter; and
a third filter disposed external to the integrated circuit and having a passband with a frequency higher than the passband of the filter.
13. An antenna module, comprising:
a connection member including at least one wiring layer and at least one insulating layer;
an antenna package comprising a plurality of antenna members configured to transmit or receive radio frequency signals and a plurality of feeder vias electrically connected at one end to the plurality of antenna members, respectively, and at another end to wires corresponding to the at least one wiring layer, respectively, and located on a first surface of the connection member;
an integrated circuit disposed on the second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer, the integrated circuit being configured to: receiving an intermediate frequency signal or a baseband signal and transmitting a radio frequency signal, or receiving a radio frequency signal and transmitting an intermediate frequency signal or a baseband signal;
a support member disposed on a second surface of the connection member and including a core wiring layer and an upper wiring layer, and electrically connected to the wiring corresponding to the at least one wiring layer to allow an intermediate frequency signal or a baseband signal to pass through the support member; and
a filter included in at least one of the core wiring layer and the upper wiring layer.
14. The antenna module of claim 13,
the support member further includes: a core via electrically connected at one end to the wiring corresponding to the at least one wiring layer; at least one core insulation layer; the upper wiring layer disposed on top of the core wiring layer; and a lower wiring layer disposed on a bottom of the core wiring layer,
the filter is included in the core wiring layer,
the upper wiring layer includes an upper ground pattern overlapping the filter, and
the lower wiring layer includes a lower ground pattern overlapping the filter.
15. An antenna module, comprising:
an integrated circuit having an active surface on which connection pads are disposed;
a connection member provided on the active surface of the integrated circuit, the connection member including a wiring layer and an insulating layer, the wiring layer being electrically connected to the connection pad;
an antenna package disposed on the connection member, the antenna package including antenna members configured to transmit and/or receive radio frequency signals and feeder vias each having a first end electrically connected to one of the antenna members and a second end electrically connected to the wiring layer;
a filter disposed external to the integrated circuit, the filter configured to filter an intermediate frequency signal and/or a baseband signal; and
a support member surrounding the integrated circuit and including a core wiring layer and an upper wiring layer, the connection member being disposed on the support member,
wherein the filter is included in at least one of the core wiring layer and the upper wiring layer.
16. The antenna module of claim 15, wherein the integrated circuit is configured to receive an intermediate frequency signal or a baseband signal and transmit a radio frequency signal, or receive a radio frequency signal and transmit an intermediate frequency signal or a baseband signal.
17. The antenna module of claim 15, wherein the support member comprises a cavity in which the integrated circuit is disposed and a core plating member disposed on a sidewall of the cavity.
18. The antenna module of claim 15, further comprising:
an intermediate frequency integrated circuit disposed in the support member and including an effective surface having a connection pad thereon, the connection pad of the intermediate frequency integrated circuit being electrically connected to the wiring layer of the connection member, wherein the intermediate frequency integrated circuit is configured to: receiving a baseband signal to transmit an intermediate frequency signal, or receiving an intermediate frequency signal to transmit a baseband signal.
19. The antenna module of claim 18, wherein the support member includes a cavity in which the integrated circuit is disposed and a core plating member disposed on a sidewall of the cavity.
20. The antenna module of claim 15, further comprising:
a second connection member disposed on the active surface of the integrated circuit and electrically connecting the connection pad of the integrated circuit to the wiring layer of the connection member, wherein
An area of a surface of the second connecting member facing the connecting member is smaller than an area of a surface of the connecting member facing the second connecting member, and
the filter is also provided in at least one second wiring layer of the second connection member.
21. The antenna module of claim 15, further comprising:
a passive component disposed in the support member and electrically connected to the wiring layer of the connection member.
22. The antenna module of claim 15, wherein the antenna package further comprises a dielectric layer disposed around each of the feed line vias and having a thickness greater than a thickness of the insulating layer of the connection member.
23. The antenna module of claim 15, wherein the antenna package further comprises a plating member disposed around each of the feed line vias.
CN201811338045.4A 2018-03-12 2018-11-12 Antenna module Active CN110265768B (en)

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US11469193B2 (en) 2022-10-11
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CN110265768A (en) 2019-09-20

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