CN110253363B

CN110253363B - Printed circuit board edge polishing equipment capable of automatically feeding and discharging

Info

Publication number: CN110253363B
Application number: CN201910504313.3A
Authority: CN
Inventors: 胡露露
Original assignee: Boluo Xinruixing Electronics Co ltd
Current assignee: Boluo Xinruixing Electronics Co ltd
Priority date: 2019-06-12
Filing date: 2019-06-12
Publication date: 2021-03-12
Anticipated expiration: 2039-06-12
Also published as: CN110253363A

Abstract

The invention discloses printed circuit board edge polishing equipment capable of automatically feeding and discharging, wherein a driving motor is in driving connection with a plurality of driving shafts, the driving shafts are in rotating connection with two sides of a supporting frame, the driving motor is connected with the supporting frame, a lifting cylinder is connected with the supporting frame and arranged below the driving shafts, and the lifting cylinder drives each supporting plate to pass through a gap to move up and down through a lifting plate; the two clamping cylinders are symmetrically arranged on two sides of the plurality of driving shafts and connected with the supporting frame, each clamping cylinder is in driving connection with one clamping pushing frame, and two adjacent penetrating seams are respectively penetrated by one driving shaft and one supporting plate; the two driving cylinders are symmetrically arranged above the plurality of driving shafts and are connected with the supporting frame, the polishing motor is in driving connection with the polishing roller, the dustproof cover is arranged at the wide-mouth end of the dust collection funnel to form a dust removal cavity, and the dust collector is communicated with the narrow-mouth end of the dust collection funnel through a dust collection pipe; the grinding mechanism, the lifting mechanism, part of the clamping mechanism and part of the driving mechanism are contained in the dust removing cavity.

Description

Printed circuit board edge polishing equipment capable of automatically feeding and discharging

Technical Field

The invention relates to the field of PCB polishing, in particular to printed circuit board edge polishing equipment capable of automatically feeding and discharging.

Background

The printed circuit board manufacturing technology is a very complex and comprehensive processing technology. Especially, in the wet processing process, a large amount of water is needed, so that various heavy metal wastewater and organic wastewater are discharged, the components are complex, and the treatment difficulty is high. The utilization rate of the copper foil of the printed circuit board is 30-40%, so that the copper content in waste liquid and waste water is considerable. Calculated according to ten thousand square meters of double-sided boards (the thickness of each copper foil is 35 microns), the copper content in the waste liquid and the waste water is about 4500 kilograms, and other heavy metals and noble metals are contained. The metal in the waste liquid and the waste water is discharged without being treated, which causes waste and pollutes the environment. Therefore, wastewater treatment and recovery of metals such as copper in the process of producing printed boards are significant and are indispensable parts in the production of printed boards.

During the process of the production line processing of the printed circuit board, the PCB board is often cut for various reasons. The condition of overlap, feather can appear in the corner of the printed circuit board of tailorring the completion, is unfavorable for the processing of printed circuit board later stage. The traditional equipment for polishing the edges of the printed circuit board adopts manual work to place and recycle the printed circuit board. However, the manner of manually placing and retrieving the printed circuit board to fit the edge polishing apparatus is inefficient and costly.

Disclosure of Invention

Therefore, the printed circuit board edge polishing equipment capable of automatically feeding and discharging is needed to be provided for solving the problems of low efficiency and high cost of a mode of manually placing and recovering the printed circuit board to match with the printed circuit board edge polishing equipment.

The utility model provides an automatic printed circuit board who goes up unloading throws limit equipment, this automatic printed circuit board who goes up unloading throws limit equipment and includes: the device comprises a conveying mechanism, a driving mechanism, a lifting mechanism, a clamping mechanism, two polishing mechanisms, a dust collection mechanism and a bearing mechanism;

the driving mechanism comprises a driving motor, a plurality of driving shafts and a supporting frame, the driving motor is in driving connection with the driving shafts, the driving shafts are rotatably connected with two sides of the supporting frame, the driving motor is connected with the supporting frame, and a plurality of driving wheels are arranged on the driving shafts;

the lifting mechanism comprises a lifting cylinder, a lifting plate and a plurality of supporting plates, the lifting cylinder is connected with the supporting frame and arranged below the plurality of driving shafts, the lifting cylinder is in driving connection with the lifting plate, the supporting plates are vertically connected with one surface, far away from the lifting cylinder, of the lifting plate, the plurality of supporting plates are mutually parallel and arranged at intervals, a gap between every two adjacent driving shafts is an axle gap, and the lifting cylinder drives each supporting plate to pass through one axle gap to move up and down through the lifting plate;

the clamping mechanism comprises two clamping cylinders and two clamping pushing frames, the two clamping cylinders are symmetrically arranged on two sides of a plurality of driving shafts and connected with the supporting frame, each clamping cylinder is in driving connection with one clamping pushing frame, each clamping pushing frame comprises a connecting rod and a plurality of limiting rods, the limiting rods are parallel to each other and arranged at intervals, the limiting rods are respectively and vertically connected with one side of the connecting rod, a penetrating seam is formed between every two adjacent limiting rods, the size of the penetrating seam is larger than that of the driving wheel and the supporting plate, and the two adjacent penetrating seams are respectively penetrated by one driving shaft and one supporting plate;

the polishing mechanism comprises two driving cylinders and two polishing assemblies, the two driving cylinders are symmetrically arranged above the driving shafts and are connected with the supporting frame, each polishing assembly comprises a [ -shaped polishing supporting plate, a polishing motor and a polishing roller, the polishing motors are in driving connection with the polishing rollers, the polishing rollers are in rotating connection with two ends of the [ -shaped polishing supporting plate, each driving cylinder is in driving connection with one [ -shaped polishing supporting plate, and the movement direction of the driving cylinders for driving the polishing assemblies is perpendicular to the movement direction of the clamping cylinders for driving the clamping pushing frames;

the dust collection mechanism comprises a dust cover, a dust collection funnel, a dust collection pipe and a dust collector; the dust cover is arranged at the wide-mouth end of the dust collecting funnel to form a dust removing cavity, and the dust collector is communicated with the narrow-mouth end of the dust collecting funnel through the dust collecting pipe; the polishing mechanism, the lifting mechanism, part of the clamping mechanism and part of the driving mechanism are all accommodated in the dust removing cavity; translation type light beam induction doors are symmetrically arranged on two sides of the dust cover;

the conveying mechanism and the bearing mechanism are respectively positioned at two sides of the driving mechanism;

the conveying mechanism comprises a conveying motor and a conveying belt, the conveying motor is in driving connection with the conveying belt, the conveying belt is in sliding connection with the supporting frame, the conveying motor is connected with the supporting frame, and a plurality of accommodating grooves are formed in one surface, far away from the supporting frame, of the conveying belt;

the supporting mechanism comprises two pushing cylinders, two supporting bent plates and a bearing plate, the cross section of each supporting bent plate is L-shaped, each pushing cylinder is connected with one side of each supporting bent plate in a driving mode, the bending portion of each supporting bent plate is connected with the support frame in a rotating mode, the two pushing cylinders and the two supporting bent plates are symmetrically arranged on two sides of the support frame, the supporting space is formed between the supporting bent plates, the bearing plate is connected with the support frame, and the bearing plate is arranged under the supporting space.

In one embodiment, each of the pushing cylinders is in driving connection with a middle portion of one face of the receiving bending plate.

In one embodiment, the supporting mechanism further includes two fixing plates and a plurality of fixing rods, the two fixing plates are symmetrically disposed on two sides of the supporting frame respectively, the fixing rods penetrate through the two fixing plates and are connected with two ends of the two supporting frames respectively, a push rod of each push cylinder penetrates through one fixing plate and is in driving connection with one surface of the supporting bent plate, and a bending portion of the supporting bent plate is rotatably connected with the fixing plates.

In one embodiment, the fixing rods are uniformly spaced.

In one embodiment, the fixing rods respectively penetrate through the two fixing plates to be slidably connected with the two fixing plates.

In one embodiment, two sides of the bearing plate are provided with limiting edges.

In one embodiment, the periphery of the bearing plate is provided with a limiting edge.

In one embodiment, the receiving mechanism further includes a lifting driving member, the lifting driving member is disposed on a surface of the bearing plate away from the receiving space and connected to the supporting frame, the lifting driving member is drivingly connected to the bearing plate, and the lifting driving member drives the bearing plate to move close to or away from the receiving space.

In one embodiment, the lifting driving member is a telescopic cylinder.

In one embodiment, the lifting drive is a lead screw motor.

In the working process of the automatic feeding and discharging printed circuit board edge polishing equipment, the conveying motor in the conveying mechanism drives the conveying belt to drive the PCB to be polished to the driving shafts in the driving mechanism, the driving motor in the driving mechanism drives the driving shafts to rotate so as to drive the driving wheels to rotate, and the driving wheels rotate to drive the PCB to be polished to reach a specific polishing position. After the PCB to be polished reaches a specific polishing position, the lifting cylinder drives the supporting plates to penetrate through the shaft gaps through the lifting plate, and the PCB to be polished is jacked to a specific height. The clamping cylinders symmetrically arranged on two sides of the driving shafts push the clamping pushing frame to clamp and fix the lifted PCB to be polished. Drive actuating cylinder and will polish the subassembly drive to the both sides of waiting to polish PCB, polish motor drive in the subassembly and polish the roller and rotate and treat the both sides of polishing PCB and polish. A dust collector in the dust collection mechanism sucks away dust in the dust collection cavity through a dust collection pipe. After polishing, the polishing assembly is driven by the driving cylinder to be away from the PCB to be polished. The clamping cylinder drives the clamping pushing frame to be far away from the PCB to be polished. The lifting cylinder drives the lifting plate to move downwards, so that the height of the supporting plate is lower than that of the driving shafts, and the ground PCBs are placed on the driving shafts. The driving motor drives the driving shafts to rotate, and the polished PCBs are conveyed into the bearing space formed between the two bearing bent plates from the specific area, so that the two ends of the polished PCBs are placed on the two bearing bent plates. The pushing cylinder pushes one surface of the bearing bent plate to drive the bearing bent plate to rotate, so that the polished PCB slides onto the bearing plate from the two bearing bent plates. The PCB polishing device capable of automatically feeding and discharging is high in PCB polishing speed, high in efficiency and low in error rate, and is beneficial to large-scale production of PCBs.

Drawings

FIG. 1 is a schematic diagram of an embodiment of an apparatus for edge polishing of a printed circuit board with automatic loading and unloading;

FIG. 2 is a schematic diagram illustrating a partial structure of an apparatus for edge polishing of a printed circuit board with automatic loading and unloading in one embodiment;

FIG. 3 is a schematic diagram of an embodiment of an apparatus for edge polishing of a PCB with automatic loading and unloading;

FIG. 4 is a schematic partial structural view of a drive mechanism in one embodiment;

FIG. 5 is a schematic view of a part of the construction of the lifting mechanism in one embodiment;

FIG. 6 is a schematic view of an embodiment of a clamping and pushing frame;

FIG. 7 is a schematic diagram of an embodiment of an apparatus for edge polishing of a PCB with automatic loading and unloading;

FIG. 8 is a schematic view of the construction of a dust collection funnel in one embodiment;

FIG. 9 is a schematic diagram of the structure of the transport mechanism and the drive mechanism in one embodiment;

FIG. 10 is a schematic diagram illustrating a partial structure of an apparatus for edge polishing of a printed circuit board with automatic loading and unloading in one embodiment;

FIG. 11 is a schematic view of the receiving mechanism in one embodiment;

FIG. 12 is a schematic view of the receiving mechanism in one embodiment;

fig. 13 is a partial schematic structural view of a printed circuit board edge polishing apparatus with automatic loading and unloading in one embodiment.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1 to 3 together, the present invention provides an automatic loading and unloading edge polishing apparatus 10 for a printed circuit board, wherein the automatic loading and unloading edge polishing apparatus 10 for a printed circuit board includes: a drive mechanism 100, a lift mechanism 200, a clamping mechanism 300, and two grinding mechanisms 400. The driving mechanism 100 is used for driving the PCB to be polished to a specific position to lift and clamp the PCB to be polished by cooperating with the lifting mechanism 200 and the clamping mechanism 300. The lifting mechanism 200 is used for lifting the PCB to be polished at a specific position to a preset height. The clamping mechanism 300 is used for clamping and fixing the PCB to be polished, which is jacked to a preset height. The two polishing mechanisms 400 are used for polishing both sides of the PCB to be polished.

Specifically, referring to fig. 1, fig. 2 and fig. 4, the driving mechanism 100 includes a driving motor 110, a plurality of driving shafts 120 and a supporting frame 130, wherein the driving motor 110 is respectively connected to the driving shafts 120 in a driving manner. Further, the driving motor 110 is drivingly connected to each driving shaft 120 through a triangular belt 140. The driving shafts 120 are rotatably connected with the supporting frame 130, the driving shafts 120 are arranged on the supporting frame 130 in parallel, the driving motor 110 is connected with the supporting frame 130, and the driving shafts 120 are provided with a plurality of driving wheels 121. The driving motor 110 is used for driving each driving shaft 120 to rotate, and each driving wheel 121 arranged on the driving shaft 120 is used for receiving and driving the PCB to be polished to move. Further, each driving shaft 120 is uniformly arranged on the supporting frame 130, and the plurality of driving wheels 121 are uniformly arranged on the driving shafts 120, so that the PCB is uniformly stressed in the operation process, and the phenomenon that the PCB to be polished deviates in the operation track due to nonuniform stress is avoided.

Referring to fig. 1, 2 and 5, the lifting mechanism 200 includes a lifting cylinder 210, a lifting plate 220 and a plurality of supporting plates 230. The lifting cylinder 210 is used for driving the lifting plate 220 to move up and down, thereby driving the plurality of supporting plates 230 to move up and down. The lifting cylinder 210 is connected with the supporting frame 130 and arranged below the plurality of driving shafts 120, the lifting cylinder 210 is in driving connection with the lifting plate 220, the supporting plates 230 are vertically connected with one surface of the lifting plate 220 far away from the lifting cylinder 210, the plurality of supporting plates 230 are parallel to each other and arranged at intervals, a gap between every two adjacent driving shafts 120 is an axle gap 150, and the lifting cylinder 210 drives each supporting plate 230 to pass through the axle gap 150 to move up and down through the lifting plate 220.

Referring to fig. 2, 3 and 6, the clamping mechanism 300 includes two clamping cylinders 310 and two clamping pushing frames 320, the two clamping cylinders 310 are symmetrically disposed on two sides of the driving shafts 120 and respectively connected to the supporting frame 130, and each clamping cylinder 310 is drivingly connected to one clamping pushing frame 320. The clamping pushing frame 320 comprises a connecting rod 321 and a plurality of limiting rods 322, the limiting rods 322 are parallel to each other and are arranged at intervals, each limiting rod 322 is vertically connected with one side of the connecting rod 321, a penetrating seam 301 is formed between every two adjacent limiting rods 322, the size of the penetrating seam 301 is larger than that of the driving wheel 121 and the supporting plate 230, and the two adjacent penetrating seams 301 are penetrated by a driving shaft 120 and a supporting plate 230 respectively. Each of the clamping cylinders 310 disposed at both sides of the driving shaft 120 drives a clamping push frame 320 to clamp and fix the PCB to be polished, which is lifted to a predetermined height.

Referring to fig. 3, the grinding mechanism 400 includes two driving cylinders 410 and two grinding assemblies 420, and each driving cylinder 410 is used for driving a grinding assembly 420 to move close to or away from the PCB to be ground. Two drive actuating cylinders 410 symmetry settings in the top of a plurality of drive shafts 120 and all be connected with support frame 130, the subassembly 420 of polishing includes "[" type and polishes extension board 421, grinding motor 422 and the grinding roller 423, grinding motor 422 and the roller 423 drive of polishing are connected, and grinding motor 422's output and the roller 423 of polishing rotate to be connected promptly, and grinding motor 422 is connected with "[" type and polishes extension board 421, and grinding roller 423 and "[" type both ends of polishing extension board 421 rotate to be connected. Grinding motor 422 is used for driving grinding roller 423 to rotate, and grinding roller 423 is used for grinding the PCB to be ground. Each drive cylinder 410 is drivingly connected to a "[" shaped sanding plate 421. The driving cylinder 410 drives the grinding assembly 420 to move in a direction perpendicular to the direction in which the clamping cylinder 310 drives the clamping pushing frame 320.

In the working process of the automatic loading and unloading printed circuit board edge polishing device 10, the driving motor 110 in the driving mechanism 100 drives the driving shafts 120 to rotate so as to drive the driving wheels 121 to rotate, and the driving wheels 121 rotate so as to drive the PCBs to be polished, which are placed on the driving shafts 120, to reach specific polishing positions. After the PCB to be polished reaches a specific polishing position, the lifting cylinder 210 drives the plurality of supporting plates 230 to pass through the plurality of shaft gaps 150 through the lifting plate 220, and lifts the PCB to be polished to a preset height. The clamping cylinders 310 symmetrically disposed at both sides of the plurality of driving shafts 120 push the clamping push frame 320 to clamp and fix the PCB to be polished, which is lifted to a predetermined height. The driving cylinder 410 drives the grinding assembly 420 to both sides of the PCB to be ground, and the grinding motor 422 in the grinding assembly 420 drives the grinding roller 423 to rotate to grind both sides of the PCB to be ground. After the PCB to be polished is polished by the polishing assembly 420, the driving cylinder 410 drives the polishing assembly 420 to be away from the PCB to be polished. The clamping cylinder 310 drives the clamping pusher 320 away from the PCB to be polished. The elevating cylinder 210 drives the elevating plate 220 to move downward such that the supporting plate 230 has a height lower than that of the driving shafts 120 to place the ground PCBs on the plurality of driving shafts 120. The driving motor 110 drives the plurality of driving shafts 120 to rotate through the V-belt 140, and the PCB which is polished is transmitted out from a specific area, so that the next PCB to be polished is polished. The PCB polishing device 10 capable of automatically feeding and discharging is high in PCB polishing speed, high in efficiency and low in error rate, and is beneficial to large-scale production of PCBs.

In order to increase the working stability of the grinding mechanism 400, in one embodiment, referring to fig. 3, the grinding mechanism 400 further includes two transverse driving cylinders 430 and two transverse pushing plates 440, each transverse driving cylinder 430 is drivingly connected to one transverse pushing plate 440, each transverse pushing plate 430 is connected to one driving cylinder 410, the two transverse driving cylinders 430 are symmetrically disposed above the plurality of driving shafts 120 and are both connected to the supporting frame 130, and the moving direction of the transverse driving cylinder 430 driving the transverse pushing plate 440 is perpendicular to the moving direction of the grinding assembly 420 driven by the driving cylinder 410. When the grinding mechanism 400 grinds the PCB to be ground, a transverse driving cylinder 430 drives a grinding assembly 420 to move back and forth through a transverse push plate 440 to precisely grind the corner of the PCB to be ground. Therefore, the transverse driving cylinder 430 and the transverse push plate 440 realize the left-right movement of the polishing assembly 420, the polishing flexibility of the polishing mechanism 400 is improved, and the working stability of the polishing mechanism 400 is improved.

In order to improve the working stability of the lifting mechanism 200, in one embodiment, referring to fig. 5, a supporting anti-slip layer 231 is disposed on a surface of the supporting plate 230 opposite to the lifting plate 220. Further, the support anti-slip layer 231 is anti-slip rubber, and anti-slip lines are arranged on the anti-slip rubber. Non-slip rubber is softer than metal and tougher than soft plastic. And the anti-slip rubber has better wear resistance, increases the durability of the support plate 230 in the long-time conveying process, and prolongs the service life of the support plate 230. On the other hand, the anti-slip rubber prevents the support plate 230 from directly contacting the PCB to be polished, and increases the protection performance of the PCB to be polished. Support skid resistant course 231 has increased the frictional force of treating PCB and lifter plate 220 of polishing for elevating system 200 treats that the PCB of polishing carries out the in-process of jacking and fixture 300 treats that the PCB of polishing carries out the centre gripping fixed in-process, treats that the PCB of polishing is difficult for taking place to slide in backup pad 230, has improved elevating system 200's job stabilization nature.

In order to improve the safety of the clamping mechanism 300, referring to fig. 6, in one embodiment, the clamping buffer layer 323 is disposed on the side where the two clamping pushing frames 320 are close to each other. Further, the clamping buffer layer is made of buffer rubber. When centre gripping cylinder 310 drive centre gripping pushes away frame 320 and treats the PCB centre gripping of polishing fixedly, cushion rubber takes place elastic deformation shaping recess, treats that the PCB of polishing is absorbed in the recess, has increased the area of contact between PCB and the cushion rubber of treating polishing to increase the frictional force of treating between PCB and the cushion rubber of polishing, and then increased fixture 300 and treated the PCB's of polishing centre gripping stability. In one embodiment, the clamping buffer layer is a buffer sponge. The clamping buffer layer 323 prevents the clamping push frame 320 from being in hard contact with the PCB to be polished, and the protection performance of the clamping mechanism 300 on the PCB to be polished is improved.

In order to improve the anti-skid performance of the driving wheel 121, in one embodiment, an anti-skid rubber layer is provided on the outer side of the driving wheel 121. In this embodiment, the anti-slip rubber layer is a soft rubber sleeve. The soft rubber sleeve is softer than metal and tougher than soft plastic. And the wear resistance of the soft rubber belt is better, the durability of the driving wheel 121 is increased in a long-time conveying process, the service life of the driving wheel 121 is prolonged, and the protective performance of the PCB to be polished is improved by the soft rubber sleeve. The friction coefficient of the soft rubber sleeve is large, the friction force between the PCB to be polished and the driving wheel 121 in the conveying process is large, and the anti-skid performance of the driving wheel 121 is improved. Further, in the present embodiment, the outer side of the soft rubber sleeve is provided with anti-slip threads to further increase the anti-slip performance of the driving wheel 121. In one embodiment, the outside of the drive wheel is provided with anti-slip threads. So, improved the non-slip property of drive wheel 121, increased drive wheel 121 and waited to polish the frictional force between the PCB to the job stabilization nature of the printed circuit board edge polishing equipment of unloading has been increased automatically.

In order to improve the environmental performance of the pcb edge polishing apparatus with automatic loading and unloading, in one embodiment, referring to fig. 7, the pcb edge polishing apparatus with automatic loading and unloading further includes a dust suction mechanism 500, and the dust suction mechanism 500 includes a dust cover 510, a dust collection funnel 520, a dust suction pipe 530, and a dust collector 540. The dust cover 510 covers the wide-mouth end of the dust collection funnel 520 to form the dust removal chamber 501, and the dust collector 540 is communicated with the narrow-mouth end of the dust collection funnel 520 through the dust collection pipe 530. The dust cover 510 and the dust collection funnel 520 are connected to the support frame 130. The polishing mechanism 400, the lifting mechanism 200, a part of the clamping mechanism 300 and a part of the driving mechanism 100 are all accommodated in the dust removing chamber 501. In the present embodiment, the dust cover 510 is a transparent glass cover, and further, the dust cover 510 is a transparent tempered glass cover, so that a user can conveniently observe the working conditions of the driving mechanism 100, the lifting mechanism 200, a part of the clamping mechanism 300 and the grinding mechanism 400. In another embodiment, the dust cap 510 is a clear plastic. It should be noted that, the process of polishing the PCB to be polished in the polishing mechanism 400 can generate a large amount of dust, and the dust cover 510 covers the dust removal cavity 501 formed by the dust collection funnel 520 to prevent the dust from being emitted to the outside during the polishing process, so as to prevent the pollution of the large amount of dust to the external environment of the printed circuit board edge polishing device for automatic loading and unloading. The dust collector 540 is used for absorbing a large amount of dust generated in the polishing process through the dust collection pipe 530, and the polishing work of the polishing mechanism 400 is prevented from being affected by the large amount of dust.

In order to prevent large particle debris generated during the polishing process from entering the dust collector 540 to damage the dust collector 540, please refer to fig. 7 and 8, in one embodiment, a first filter net 521 is disposed at a wide end of the dust collecting funnel 520, a lifting through hole 502 is formed in the first filter net 521, and a push rod of the lifting cylinder 210 pushes the lifting plate 220 to move through the lifting through hole 502. Further, the first filter 521 is a coarse filter. The coarse filter screen is used for filtering fine slag and coarse powder generated in the polishing process. In another embodiment, the first filter is a ventilation filter. The ventilation filter screen has strong acid and alkali resistance, good corrosion resistance and low resistance, can be repeatedly cleaned, and has relatively high economical efficiency. In addition, long and short fibers and dust particles captured by the ventilation filter screen are easy to clean, the filtering efficiency is not influenced by cleaning, and the impact strength is very good. To further improve the protection of the cleaner 540, in one embodiment, the narrow end of the dust collection funnel 520 is provided with a second filter (not shown). The second filter screen is a metal rubber filter screen. The metal rubber filter screen is made of stainless steel wires, has a capillary loose structure, and is suitable for filtering gas and liquid in environments of high and low temperature, large temperature difference, high pressure, high vacuum, strong radiation, severe vibration, corrosion and the like. The metal rubber filter screen has the characteristics of corrosion resistance, high strength and impact resistance. Meanwhile, the metal rubber filter screen can adjust the filtering precision of the filter screen by adopting the thickness of the wires, the density of the metal rubber and the thickness of the filter screen. When the cleaning agent is used for cleaning, the original density is easy to recover, and the cleaning is convenient. Thus, the first filter net 521 disposed at the wide-mouth end of the dust collecting funnel 520 can effectively prevent large particles generated during the polishing process from entering the dust collector 540 to damage the dust collector 540.

In order to reduce the influence of noise generated by the printed circuit board edge polishing device capable of automatically feeding and discharging on the surrounding environment in the working process, in one embodiment, the dust suction mechanism 500 further comprises silencing cotton, a silencing cavity is formed in the side cover wall of the dust cover, and the silencing cotton is arranged in the silencing cavity. In one embodiment, the sound absorption cotton is centrifugal glass cotton, fibers in the centrifugal glass cotton are fluffy and staggered, a large number of tiny pores exist, and the sound absorption cotton is a typical porous sound absorption material and has good sound absorption characteristics. In one embodiment, the sound-absorbing cotton is polyester sound-absorbing cotton. The polyester sound-absorbing cotton has the excellent characteristics of good sound-absorbing performance, good heat-insulating performance, good flame retardance, high environmental protection performance, light weight, easy processing, strong impact resistance and the like, and is suitable for special carving operation environments. Therefore, the noise reduction cotton effectively reduces the noise generated in the working process of the printed circuit board edge polishing equipment for automatic feeding and discharging and improves the safety performance of the dust cover.

In order to improve the dust removing effect of the printed circuit board edge polishing device with automatic loading and unloading, referring to fig. 13, in one embodiment, translational beam sensing doors 511 are symmetrically arranged on two sides of the dust cover 510. When the driving mechanism 100 transmits the PCB to be polished to the dust removing cavity 501, the translational beam induction door 511 on one side of the dust cover 510 is opened after sensing the PCB to be polished, and when the PCB to be polished is transmitted to the dust removing cavity 501, the translational beam induction door 511 on the side of the dust cover 510 is closed. After the grinding mechanism 400 finishes grinding the PCB to be ground, the driving mechanism 100 drives the PCB which finishes grinding away from the dust removing cavity 501, the translational beam induction door 511 on the other side of the dust cover 510 is opened after sensing the PCB which finishes grinding, and after the PCB which finishes grinding away from the dust removing cavity 501, the translational beam induction door 511 on the side of the dust cover 510 is closed. Therefore, the translational beam induction doors 511 are symmetrically arranged on two sides of the dust cover 510, so that the dust removal cavity 501 can be timely sealed while the grinding mechanism 400 is ensured to uninterruptedly grind the PCB to be ground, and the dust removal effect of the printed circuit board edge polishing device capable of automatically feeding and discharging is further improved.

In order to increase the working efficiency of the pcb edge polishing apparatus with automatic loading and unloading, in one embodiment, referring to fig. 9 and 10, the conveying mechanism 600 and the receiving mechanism 700 are respectively located at two sides of the driving mechanism 100. The conveying mechanism 600 is used for conveying the PCB to be polished and pushing the PCB to be polished to the driving mechanism 100. The receiving mechanism 700 is used for recycling the polished PCB. The transfer mechanism 600 includes a transfer motor 610 and a transfer belt 620. The conveying motor 610 is in driving connection with the conveying belt 620, the conveying belt 620 is in sliding connection with the supporting frame 130, and the conveying motor 610 is connected with the supporting frame 130. The conveying motor 610 is used for driving the conveying belt 620 to transmit along the supporting frame 130, the conveying belt 620 is used for placing the PCB to be polished, and the supporting frame 130 is used for receiving the conveying motor 610 and the conveying belt 620. The conveyor belt 620 has a plurality of receiving slots 601 formed on a surface thereof away from the supporting frame 130. The size of the PCB to be polished is matched with the size of the accommodating grooves 601, and each accommodating groove 601 accommodates one PCB to be polished so as to avoid the sliding of the PCB to be polished on the conveying belt 620 and the mutual collision and abrasion of the PCBs to be polished, thereby improving the yield of PCB processing production. In this embodiment, the plurality of receiving grooves 601 are uniformly formed on the conveyor belt 620, so as to increase the utilization rate of the conveyor belt 620 and increase the carrying capacity of the PCB to be polished. In the working process of the automatic feeding and discharging edge polishing device for the printed circuit board, the conveying motor 610 in the conveying mechanism 600 drives the conveying belt 620 to move, the accommodating groove 601 formed in the conveying belt 620 is used for accommodating the PCB to be polished, and the PCB is pushed to the driving shafts 120 in the driving mechanism 100 under the pushing action of the conveying belt 620. Therefore, the conveying mechanism 600 can uninterruptedly provide the PCB to be polished for the driving mechanism 100, and the working efficiency of the printed circuit board edge polishing equipment for automatic feeding and discharging is improved.

Referring to fig. 9, in order to improve the protection performance and the rust prevention performance of the conveyor belt 620 for the PCB, in one embodiment, a buffer sponge 621 is disposed on the inner side surface of the receiving groove 601 of the conveyor belt 620. The buffer sponge 621 plays a role of buffering and decompressing the PCB accommodated in the accommodating groove 601. Specifically, the buffer sponge 621 is a polyvinyl alcohol sponge. That is, the material of the buffer sponge 621 is polyvinyl alcohol. The buffering sponge 621 made of polyvinyl alcohol has high water absorption performance, can absorb water drops attached to the PCB in the PCB processing process of the assembly line, realizes further drying treatment on the PCB, and avoids metal parts on the PCB from being rusted rapidly. Thus, the buffer sponge 621 disposed on the inner side of the receiving slot 601 of the conveyor belt 620 improves the protection performance and the anti-rust performance of the PCB.

In order to better receive the ground PCB, please refer to fig. 11 to 13, in one embodiment, the receiving mechanism 700 includes two pushing cylinders 710, two receiving bending plates 720 and a bearing plate 730, the cross section of the receiving bending plate 720 is L-shaped, and each pushing cylinder 710 is in driving connection with one side of one receiving bending plate 720. Further, each push cylinder 710 is drivingly connected to a central portion of one face of a receiving flexural plate 720. The bent part of the receiving bent plate 720 is rotatably connected with the support frame 130, the two pushing cylinders 710 and the two receiving bent plates 720 are symmetrically arranged at two sides of the support frame 130, a receiving space 701 is formed between the two receiving bent plates 720, the bearing plate 730 is connected with the support frame 130, and the bearing plate 730 is arranged right below the receiving space 701. After the grinding mechanism 400 finishes grinding the PCB to be ground, the driving cylinder 410 drives the grinding assembly 420 to be away from the ground PCB. The clamping cylinder 310 drives the clamping pusher 320 away from the ground PCB. The elevating cylinder 210 drives the elevating plate 220 to move downward such that the supporting plate 230 has a height lower than that of the driving shafts 120 to place the ground PCBs on the plurality of driving shafts 120. The driving motor 110 drives the driving shafts 120 to rotate, and the polished PCBs are transferred from a specific area to the receiving space 701 formed between the two receiving bent plates 720, so that both ends of the polished PCBs are placed on the two receiving bent plates 720. The pushing cylinder 710 pushes one surface of the receiving bent plate 720 to drive the receiving bent plate 720 to rotate, so that the polished PCB slides down from the two receiving bent plates 720 onto the bearing plate 730. Therefore, the supporting mechanism 700 effectively supports the polished PCBs, so that the polished PCBs can be conveniently collected and transported by a user in a unified manner.

In order to expand the application range of the receiving mechanism 700, please refer to fig. 11 to 13 together, in one embodiment, the receiving mechanism 700 further includes two fixing plates 740 and a plurality of fixing rods 750, the two fixing plates 740 are symmetrically disposed on two sides of the supporting frame 130, the plurality of fixing rods 750 pass through the two fixing plates 740 to be connected to two ends of the two supporting frames 130, a push rod of each push cylinder 710 passes through one fixing plate 740 to be drivingly connected to one side of one receiving curved plate 720, and a bent portion of the receiving curved plate 720 is rotatably connected to the fixing plate 740. That is, the push cylinder 710 and the receiving bent plate 720 are more firmly combined with the supporting bracket 130 by the fixing plate 740 and the fixing rod 750. Further, the fixing rods 750 are uniformly spaced, so that each fixing rod 750 is uniformly stressed, and the service life of the supporting mechanism 700 is prolonged. In one embodiment, the fixing bars 750 are slidably connected to the two fixing plates 740 through the two fixing plates 740, respectively. The width of the receiving space 701 is adjusted by adjusting the relative position of the fixing plate 740 and the fixing bar 750 to fit PCBs of different sizes. Thus, the application range of the receiving mechanism 700 is expanded.

In order to avoid the damage of the polished PCB sliding off the carrier plate 730 when sliding off the two receiving bent plates 720 to the carrier plate 730, in one embodiment, two sides of the carrier plate are provided with limiting ribs. Furthermore, the periphery of the bearing plate is provided with limiting edges. The inner side wall of the limiting edge is provided with a buffer layer, the buffer layer is made of soft rubber, and in another embodiment, the buffer layer is made of sponge. Thus, the limiting edge limits the sliding space of the polished PCB on the bearing plate 730, and avoids the damage of sliding from the bearing plate 730 caused by sliding when the polished PCB slides to the bearing plate 730 from the two bearing bent plates 720.

Referring to fig. 11, in order to improve the protection performance of the receiving mechanism 700 for the grinded PCB, in one embodiment, the receiving mechanism 700 further includes a lifting driving member 760, the lifting driving member 760 is disposed on a side of the bearing plate 730 away from the receiving space 701 and connected to the supporting frame 130, the lifting driving member 760 is drivingly connected to the bearing plate 730, and the lifting driving member 760 drives the bearing plate 730 to move closer to or away from the receiving space 701. In one embodiment, the lifting drive member is a telescopic cylinder. In one embodiment, the lift drive is a lead screw motor. When the polished PCB slides down from the two receiving bent plates 720 to the loading plate 730, the lifting driving member 760 drives the loading plate 730 to move close to the receiving space 701, so as to reduce the height between the receiving bent plates 720 and the loading plate 730. So, reduced the gravitational potential energy of the PCB who polishes, avoided the PCB who polishes to drop on two take over bent plate 720 to the loading board 730 when the PCB that polishes breaks, improved the protective properties of receiving mechanism 700 to the PCB that polishes.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides an automatic go up printed circuit board of unloading equipment of polishing limit which characterized in that includes: the device comprises a conveying mechanism, a driving mechanism, a lifting mechanism, a clamping mechanism, two polishing mechanisms, a dust collection mechanism and a bearing mechanism;

2. The apparatus of claim 1, wherein each of the plurality of pushing cylinders is drivingly connected to a central portion of a side of the receiving flexural plate.

3. The PCB edge polishing device with automatic loading and unloading function as claimed in claim 1, wherein the supporting mechanism further comprises two fixing plates and a plurality of fixing rods, the two fixing plates are symmetrically arranged on two sides of the supporting frame respectively, the fixing rods penetrate through the two fixing plates respectively and are connected with two ends of the two supporting frames, a push rod of each push cylinder penetrates through one fixing plate and is in driving connection with one surface of one supporting bent plate, and a bent part of the supporting bent plate is rotatably connected with the fixing plate.

4. The apparatus of claim 3, wherein the fixing bars are uniformly spaced.

5. The apparatus of claim 3, wherein the fixing bars are slidably coupled to the two fixing plates through the two fixing plates, respectively.

6. The PCB edge polishing device with automatic loading and unloading function as claimed in claim 1, wherein two sides of the loading plate are provided with limiting edges.

7. The PCB edge polishing device with automatic loading and unloading function as claimed in claim 1, wherein the bearing plate is provided with a limiting edge at the periphery.

8. The PCB edge polishing device with automatic loading and unloading function as claimed in any one of claims 1 to 7, wherein the receiving mechanism further comprises a lifting driving member, the lifting driving member is arranged on one surface of the bearing plate far away from the receiving space and connected with the supporting frame, the lifting driving member is in driving connection with the bearing plate, and the lifting driving member drives the bearing plate to move close to or far away from the receiving space.

9. The apparatus of claim 8, wherein the lifting driving member is a telescopic cylinder.

10. The apparatus of claim 8, wherein the lifting driving member is a lead screw motor.