CN110248520A - A kind of radiator and its method for high power module - Google Patents
A kind of radiator and its method for high power module Download PDFInfo
- Publication number
- CN110248520A CN110248520A CN201910435636.1A CN201910435636A CN110248520A CN 110248520 A CN110248520 A CN 110248520A CN 201910435636 A CN201910435636 A CN 201910435636A CN 110248520 A CN110248520 A CN 110248520A
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- CN
- China
- Prior art keywords
- reserve tank
- liquid reserve
- power module
- high power
- cover board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
The invention discloses a kind of radiators and its method for high power module, and liquid reserve tank side is fixedly connected with high power module；The other side of liquid reserve tank and the side of cover board connect, and the other side of cover board is connect with substrate；Cover board is provided with upper runner；The liquid feeding end of upper runner is provided with inlet opening, and the drain side of upper runner is provided with drainage hole；Cover board is connected to liquid reserve tank, is equipped with check valve in inlet opening and drainage hole；Substrate is provided with lower flow channel；The liquid feeding end of lower flow channel and drain side are provided with feed liquor location hole and drain location hole；Substrate is connected to cover board and liquid reserve tank.It is vaporized and is absorbed heat by liquid reserve tank inner refrigerant, and the refrigerant liquefaction after vaporization is back flowed back into liquid reserve tank, achievees the purpose that circulation heat absorption by cooling fin, solve the problems, such as that heat flow density is excessively concentrated and causes heat dissipation difficult.
Description
Technical field
The present invention relates to heat abstractor technical field, particularly a kind of radiator for high power module and high-power
The heat dissipating method of module heat radiator.
Background technique
With the continuous development of science and technology, electronic product volume is smaller and smaller, and power density and heat flow density are also more next
Bigger, module hot-fluid small in size and high-power is excessively concentrated, and big diffusion thermal resistance makes heat be difficult to expand in spreader surface
It scatters and, heat flow density is excessively concentrated and causes heat dissipation difficult, and existing radiator mostly uses surface inserting heat pipe to expand heat
It dissipates to reach heat dissipation purpose, but heat can only also be made to spread apart to come in subrange, heat dissipation effect is bad.
Summary of the invention
The present invention provides a kind of radiator and its method for high power module, is vaporized by liquid reserve tank inner refrigerant
Heat absorption, and the refrigerant liquefaction after vaporization is back flowed back into liquid reserve tank, achievees the purpose that circulation heat absorption by cooling fin, it solves
Certainly the problem of heat dissipation difficulty is excessively concentrated and caused to heat flow density.
In order to achieve the above object, the present invention provides a kind of radiator for high power module, including liquid reserve tank, liquid reserve tank
Side is provided with multiple threaded holes, and high power module is fixedly connected by bolt with liquid reserve tank side；The other side of liquid reserve tank and lid
The side of plate connects, and the other side of cover board is connect with substrate；The side connecting on cover board with substrate is provided with upper runner；Upper runner
Liquid feeding end be provided with inlet opening, the drain side of upper runner is provided with drainage hole；Cover board is connected by inlet opening and drainage hole and liquid reserve tank
It is logical, check valve is also separately installed in inlet opening and drainage hole；The side connecting on substrate with cover board is provided with and upper runner phase
The lower flow channel matched；The liquid feeding end of lower flow channel and drain side have feed liquor positioning corresponding with inlet opening and drain hole site
Hole and drain location hole.
Further, liquid reserve tank side connects 1~6 high power module.
Further, the other side parallel interval connecting on substrate with cover board is disposed with multiple rows of cooling fin.
Further, the volume of upper runner and lower flow channel and be the 30%~50% of liquid reserve tank volume.
Further, upper runner and lower flow channel are serpentine runner.
Further, feed liquor location hole and drain location hole are blind hole.
Further, liquid reserve tank and cover board are welded to connect, and cover board and substrate are welded to connect.
A kind of heat dissipating method of high power module radiator, comprising the following steps:
Step 1: liquid reserve tank inner refrigerant absorbs the heat vaporization that high power module work generates, the refrigerant after vaporization
Volume expansion is entered in upper runner and lower flow channel by the check valve in inlet opening；
Step 2: cooling fin and air carry out heat exchange and the gasified refrigerant in upper runner and lower flow channel are made to liquefy；
Step 3: subsequent gasified refrigerant pushes the liquefied refrigerant in upper runner and lower flow channel through the list in drainage hole
Liquid reserve tank is re-entered into valve, forms cooling cycle.
The beneficial effects of the present invention are: by liquid reserve tank inner refrigerant vaporize absorb heat, and by cooling fin to vaporization after
Refrigerant liquefaction, back flow back into liquid reserve tank, achieve the purpose that circulation heat absorption, solve heat flow density and excessively concentrate and cause
Radiate difficult problem；By arranging check valve at inlet opening and drainage hole, the one-way circulation of refrigerant ensure that, effectively
Anti- backflow.
Detailed description of the invention
Fig. 1 is the overall structure diagram of high power module radiator of the present invention；
Fig. 2 is the exploded view of high power module radiator of the present invention；
Fig. 3 is the structural schematic diagram of high power module radiator check valve of the present invention；
In figure: 1. drain location holes, 2. drainage holes, 3. high power modules, 4. upper runners, 5. liquid reserve tanks, 6. inlet openings, 7.
Cover board, 8. lower flow channels, 9. check valves, 9-1. feed liquor check valve, 9-2. drain check valve, 10. feed liquor location holes, 11. substrates,
12. cooling fin.
Specific embodiment
With reference to embodiment, the embodiment of the present invention is furthur described in detail.Following embodiment is used for
The present invention is illustrated, but is not intended to limit the scope of the invention.
As shown in Figure 1-3, a kind of radiator for high power module, the liquid reserve tank 5 including being equipped with refrigerant is described
5 side of liquid reserve tank is provided with multiple threaded holes, and high power module 3 is fixedly connected by bolt with 5 side of liquid reserve tank；High-power mould
Block 3 is mainly used for inverter, small size, high thermal resistance, the IGBT rate module of high loss on frequency converter, and liquid reserve tank 5 can connect more
A high power module 3, the refrigerant in liquid reserve tank 5 absorb heat vaporization, reduce the temperature of high power module 3；The liquid reserve tank 5
The other side is connect with the side of cover board 7, and the other side of cover board 7 is connect with substrate 11, and both 7 side of cover board connected liquid reserve tank 5, separately
Side connecting substrate 11 optimizes the structure of radiator, reduces the volume of radiator；The side being connect on the cover board 7 with substrate 11
Face is provided with upper runner 4, provides the circulation canal of refrigerant；One end of the upper runner 4 is liquid feeding end, and the other end is drain side；
The liquid feeding end of the upper runner 4 is provided with inlet opening 6, and the drain side of upper runner 4 is provided with drainage hole 2；The cover board 7 passes through feed liquor
Hole 6 and drainage hole 2 are connected to liquid reserve tank 5, and feed liquor check valve 9-1 is equipped in inlet opening 6, is equipped with drain in drainage hole 2
Check valve 9-2；Feed liquor check valve 9-1 and drain check valve 9-2 ensure that the one-way flow of refrigerant, both the refrigerant of steam state
Upper runner 4 is entered by feed liquor check valve 9-1, the refrigerant after liquefaction enters liquid reserve tank 5 by drain check valve 9-2；It is described
The side connecting on substrate 11 with cover board 7 is provided with the lower flow channel 8 to match with 4 shape of upper runner and position, both 4 He of upper runner
A complete refrigerant flow path is formed after the corresponding split of lower flow channel 8；One end of same lower flow channel 8 is liquid feeding end, the other end
For drain side；The liquid feeding end of the lower flow channel 8 and drain side have it is corresponding with inlet opening 6 and 2 position of drainage hole into
Liquid location hole 10 and drain location hole 1, feed liquor location hole 10 and drain location hole 1 are blind hole, to feed liquor check valve 9-1 and row
Liquid check valve 9-2 is positioned；The cover board 7 on substrate 11 upper runner 4 and the corresponding split of lower flow channel 8 after form one
Complete refrigerant flow path, and be connected by inlet opening 6 and drainage hole 2 with liquid reserve tank 5, form circulation loop.
5 side of liquid reserve tank connects 1~6 high power module 3, connects one in this example.
The other side parallel interval that the substrate 11 is connect with cover board 7 is disposed with multiple rows of cooling fin 12, passes through multiple rows of heat dissipation
Piece 12 makes substrate 11 and outside air convective heat transfer take away heat.
The volume of the upper runner 4 and lower flow channel 8 and be the 30%~50% of 5 volume of liquid reserve tank, guarantees the height of refrigerant
Effect circulation.
The upper runner 4 and lower flow channel 8 are serpentine runner, keep coolant liquid dynamic from shunting in cover board 7 and substrate 11, mention
High cooling efficiency.
The liquid reserve tank 5 is welded to connect with cover board 7, and cover board 7 and substrate 11 had both been guaranteed whole close by being welded to connect
Feng Xing in turn simplifies manufacturing process.
A kind of heat dissipating method of high power module radiator, comprising the following steps:
Step 1: 5 inner refrigerant of liquid reserve tank absorbs the heat vaporization that the work of high power module 3 generates, the refrigeration after vaporization
Agent volume expansion is entered in upper runner 4 and lower flow channel 8 by the feed liquor check valve 9-1 in inlet opening 6；
Step 2: cooling fin 12 and air carry out heat exchange and the gasified refrigerant in upper runner 4 and lower flow channel 8 are made to liquefy；
Step 3: subsequent gasified refrigerant pushes the liquefied refrigerant in upper runner 4 and lower flow channel 8 through in drainage hole 2
Drain check valve 9-2 re-enter into liquid reserve tank 5, formed cooling cycle.
Working principle of the present invention is as follows:
The refrigerant easily to gasify that is heated in liquid reserve tank 5 passes through vapour after the heat absorption that heat exchange generates high power module 3
Change, the refrigerant of vaporization is entered by feed liquor check valve 9-1 in the space of upper runner 4 and the formation of lower flow channel 8, and upstream is passed through
Road 4 and lower flow channel 8 transfer heat to cooling fin 12, after cooling fin 12 and outside air convective heat transfer take away heat, refrigeration
Agent is liquefied again, and enters liquid storage from new by drain check valve 9-2 again under the promotion of the refrigerant gas of follow-up expansion
In case 5, overcomes and cause diffusion thermal resistance is excessive heat concentration is caused to be difficult to radiate since contact area is small, especially to corpusculum
Local temperature excessively high phenomenon occurs when using full aluminum profile heat radiator in the high power module 3 that long-pending, high thermal resistance, height are lost to be had
Be obviously improved.
Electrolyte filling method:
Extract the air in liquid reserve tank 5, while the drain list at drainage hole 2 out at the feed liquor check valve 9-1 of inlet opening 6
Refrigerant is injected to valve 9-2, is sealed after the completion of injection refrigerant.
Claims (7)
1. a kind of radiator for high power module, which is characterized in that including liquid reserve tank (5), liquid reserve tank (5) side is opened
There is the groove to match with high power module (3) side, high power module (3) is fixed in liquid reserve tank (5) groove；The liquid storage
The other side of case (5) is connect with the side of cover board (7), and the other side of cover board (7) is connect with substrate (11)；On the cover board (7)
Side, which is connect, with substrate (11) is provided with upper runner (4)；The liquid feeding end of the upper runner (4) is provided with inlet opening (6), upper runner (4)
Drain side be provided with drainage hole (2)；The cover board (7) is connected to by inlet opening (6) and drainage hole (2) with liquid reserve tank (5), feed liquor
Hole (6 and drainage hole (2) in be also separately installed with check valve (9)；The side connecting on the substrate (11) with cover board (7) is provided with
The lower flow channel (8) to match with upper runner (4)；The liquid feeding end of the lower flow channel (8) and drain side have and inlet opening (6)
Feed liquor location hole (10) corresponding with drainage hole (2) position and drain location hole (1).
2. a kind of radiator for high power module according to claim 1, liquid reserve tank (5) the side connection 1~6
A high power module (3).
3. a kind of radiator for high power module according to claim 1, which is characterized in that the substrate (11) with
The other side parallel interval of cover board (7) connection is disposed with multiple rows of cooling fin (12).
4. a kind of radiator for high power module according to claim 1, which is characterized in that the upper runner (4)
With the volume of lower flow channel (8) and be the 30%~50% of liquid reserve tank (5) volume.
5. a kind of radiator for high power module according to claim 1, which is characterized in that the upper runner (4)
It is serpentine runner with lower flow channel (8).
6. a kind of radiator for high power module according to claim 1, which is characterized in that the liquid reserve tank (5)
It is welded to connect with cover board (7), cover board (7) and substrate (11) pass through welded connecting.
7. a kind of heat dissipating method of high power module radiator, comprising the following steps:
Step 1: liquid reserve tank (5) inner refrigerant absorbs the heat vaporization that high power module (3) work generates, the refrigerant after vaporization
Volume expansion is entered in upper runner (4) and lower flow channel (8) by the check valve (9) in inlet opening (6)；
Step 2: cooling fin (12) and air carry out heat exchange and the gasified refrigerant in upper runner (4) and lower flow channel (8) are made to liquefy；
Step 3: subsequent gasified refrigerant pushes the liquefied refrigerant in upper runner (4) and lower flow channel (8) in drainage hole (2)
Check valve (9) re-enter into liquid reserve tank (5), formed cooling cycle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910435636.1A CN110248520A (en) | 2019-05-23 | 2019-05-23 | A kind of radiator and its method for high power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910435636.1A CN110248520A (en) | 2019-05-23 | 2019-05-23 | A kind of radiator and its method for high power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110248520A true CN110248520A (en) | 2019-09-17 |
Family
ID=67884917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910435636.1A Pending CN110248520A (en) | 2019-05-23 | 2019-05-23 | A kind of radiator and its method for high power module |
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| CN (1) | CN110248520A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201475757U (en) * | 2009-09-24 | 2010-05-19 | 汪纯燕 | High power LED lamp |
| CN106535564A (en) * | 2016-10-21 | 2017-03-22 | 华中科技大学 | Liquid cooling type heat radiator |
| CN206134671U (en) * | 2016-09-10 | 2017-04-26 | 奇鋐科技股份有限公司 | Structure is arranged to water -cooling |
| CN107414080A (en) * | 2016-05-23 | 2017-12-01 | 中国科学院理化技术研究所 | Liquid metal 3D printing ejecting device and the 3D printer provided with the device |
| CN207066184U (en) * | 2017-07-19 | 2018-03-02 | 昆山昌禾精密电子有限公司 | A kind of fin |
| CN207265198U (en) * | 2017-10-10 | 2018-04-20 | 华霆（合肥）动力技术有限公司 | Heat management system and power supply unit |
| CN108232359A (en) * | 2017-12-11 | 2018-06-29 | 深圳市海梁科技有限公司 | Based on gas-liquid two-phase heat dissipation and the recoverable electrokinetic cell system of heat |
-
2019
- 2019-05-23 CN CN201910435636.1A patent/CN110248520A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201475757U (en) * | 2009-09-24 | 2010-05-19 | 汪纯燕 | High power LED lamp |
| CN107414080A (en) * | 2016-05-23 | 2017-12-01 | 中国科学院理化技术研究所 | Liquid metal 3D printing ejecting device and the 3D printer provided with the device |
| CN206134671U (en) * | 2016-09-10 | 2017-04-26 | 奇鋐科技股份有限公司 | Structure is arranged to water -cooling |
| CN106535564A (en) * | 2016-10-21 | 2017-03-22 | 华中科技大学 | Liquid cooling type heat radiator |
| CN207066184U (en) * | 2017-07-19 | 2018-03-02 | 昆山昌禾精密电子有限公司 | A kind of fin |
| CN207265198U (en) * | 2017-10-10 | 2018-04-20 | 华霆（合肥）动力技术有限公司 | Heat management system and power supply unit |
| CN108232359A (en) * | 2017-12-11 | 2018-06-29 | 深圳市海梁科技有限公司 | Based on gas-liquid two-phase heat dissipation and the recoverable electrokinetic cell system of heat |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190917 |