CN110246950B - High-compression-resistance uniform-heating CSP fluorescent membrane molding equipment and molding method - Google Patents
High-compression-resistance uniform-heating CSP fluorescent membrane molding equipment and molding method Download PDFInfo
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- CN110246950B CN110246950B CN201910592814.1A CN201910592814A CN110246950B CN 110246950 B CN110246950 B CN 110246950B CN 201910592814 A CN201910592814 A CN 201910592814A CN 110246950 B CN110246950 B CN 110246950B
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 36
- 238000000465 moulding Methods 0.000 title claims description 44
- 239000012528 membrane Substances 0.000 title claims description 22
- 238000000034 method Methods 0.000 title claims description 8
- 238000003825 pressing Methods 0.000 claims abstract description 65
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 238000005192 partition Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 11
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 230000005674 electromagnetic induction Effects 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 2
- 230000006835 compression Effects 0.000 abstract description 8
- 238000007906 compression Methods 0.000 abstract description 8
- 239000004575 stone Substances 0.000 abstract description 5
- 238000005452 bending Methods 0.000 abstract description 4
- 239000010438 granite Substances 0.000 abstract description 4
- 238000005245 sintering Methods 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007723 die pressing method Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000002028 premature Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5808—Measuring, controlling or regulating pressure or compressing force
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5816—Measuring, controlling or regulating temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model provides a CSP fluorescence diaphragm mould pressing equipment of even heating of high resistance to compression, mould pressing equipment installs and uses on the mould press, including top board, holding down plate, heating module, mould positioning module, baffle, CSP device base plate, fluorescence diaphragm, top mould and bed die, top board and holding down plate all adopt the microlite to support, top board and holding down plate are installed respectively on the guide pillar of mould press, heating module installs in the top board, the bed die passes through mould positioning module and installs in the holding down plate upper end, the baffle is installed in the bed die, fluorescence diaphragm is installed in the recess of baffle, CSP device base plate place in above the baffle, the top mould install in the bed die upper end. The upper and lower pressing plates are made of microcrystalline stone formed by sintering and crystallizing at high temperature similar to granite forming conditions, and have better compression resistance, bending resistance, wear resistance and impact resistance.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to high-pressure-resistance and uniform-heating CSP fluorescent membrane molding equipment and a molding method.
Background
With the development of the LED technology and the compression of the cost, the packaging volume of the LED device is smaller and smaller, the power density is continuously improved, and the traditional packaging is trapped in technical bottlenecks. The CSP device omits gold wires, and the substrate is extremely small or even does not need to be used, so that the packaging cost is reduced by 20% while the size of the device is greatly reduced, in addition, the thermal resistance of the device is also reduced, the luminous density of the CSP is improved, the design and application flexibility of the CSP is greatly improved due to the characteristics of small, thin and light CSP, the CSP packaging is widely applied in the traditional lighting field at present, and particularly, the CSP packaging is favored by backlight products such as televisions, display screens and mobile phones, and the market demand is rapidly growing.
As CSP devices have the characteristics of multi-surface luminescence and tiny volume, the consistency of the light color space distribution of the devices can be greatly influenced by the tiny difference of the concentration and the thickness of fluorescent coatings. The traditional LED molding and packaging equipment in China is low in automation degree, manual operation can cause the problems of low production efficiency, poor product consistency and the like, and the equipment reliability and precision can not reach the production standard of CSP devices and can not meet the production requirements. The automatic molding and sealing equipment used in large-scale packaging enterprises needs to rely on import, and the equipment faces to the traditional LEDs, is not correspondingly optimized for CSP, and cannot completely meet the production requirements of CSP.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides the CSP fluorescent membrane mould pressing equipment with high pressure resistance and uniform heating.
The invention also provides a molding method of the CSP fluorescent membrane molding equipment with high compression resistance and uniform heating;
the aim of the invention can be achieved by the following technical scheme:
the utility model provides a CSP fluorescence diaphragm mould pressing equipment of even heating of high resistance to compression, mould pressing equipment installs and uses on the mould press, including top board, holding down plate, heating module, mould positioning module, baffle, CSP device base plate, fluorescence diaphragm, top mould and bed die, top board and holding down plate all adopt the microlite to make, top board and holding down plate are installed respectively on the guide pillar of mould press, heating module installs in the top board, the bed die passes through mould positioning module and installs in the holding down plate upper end, the baffle is installed in the bed die, fluorescence diaphragm is installed in the recess of baffle, CSP device base plate place in above the baffle, the top mould install in the bed die upper end. The upper pressing plate and the lower pressing plate are made of microcrystalline stone formed by sintering and crystallizing at high temperature under the conditions similar to those of granite, and have better compression resistance, bending resistance, wear resistance and impact resistance, and the lower pressing plate is controlled to move on the guide post by a feeding device of the molding press so as to realize accurate positioning or separation; when the die is not closed, the upper pressing plate and the lower pressing plate are in a separated state.
Preferably, the heating module is a heating coil, the heating coil is mounted at the upper end of the upper pressing plate, the upper die and the lower die are made of die steel, the heating coil is electrified with alternating current to generate a magnetic field with the direction changing continuously, and electromagnetic induction is generated with the die to generate eddy current in the die, so that the die is uniformly heated.
Preferably, the die positioning module comprises at least 1 group of die positioning units, the die positioning units are mounted in the mounting grooves of the lower pressing plate, and the top ends of the die positioning units are connected with the lower die.
Preferably, the die positioning unit comprises a spring and a metal boss, one end of the spring is fixed in the mounting groove, the other end of the spring is connected with the bottom of the metal boss, a protruding portion of the metal boss is connected with a positioning hole in the bottom of the lower die, and the protruding portion is spherical and is convenient to be matched with the positioning hole in the bottom of the die for positioning.
Preferably, a thermocouple for measuring temperature is fixed at the lower end of the metal boss, and the temperature of the die is monitored in real time.
Preferably, the metal boss is made of a metal material having a thermal conductivity greater than (230) W/(mK).
Preferably, the rigidity of the spring perpendicular to the molding direction is more than 1000N/cm, the rigidity along the molding direction is 10-25N/cm, and the variation value of the rigidity in two directions when the temperature variation range is less than 120 ℃ is 0-5%. The mold is ensured not to shake easily during working.
Preferably, the separator is made of die steel. The fluorescent membrane is arranged in the groove of the baffle plate, so that the uniformity of the fluorescent membrane is prevented from being deteriorated due to the fact that the fluorescent membrane melts and flows too early.
A molding method of high-pressure-resistance uniformly-heated CSP fluorescent membrane molding equipment comprises the following steps:
1) The upper pressing plate and the lower pressing plate are respectively arranged on a guide post of the molding press;
2) Aligning a positioning hole at the bottom of the lower die with a convex part of the metal boss, and mounting the lower die on the lower partition plate;
3) And mounting the fluorescent membrane in the groove of the partition board, and inverting the CSP device substrate onto the partition board to enable one side of the CSP chip in the CSP device substrate to be in contact with the fluorescent membrane.
4) The lower pressing plate is controlled to move upwards through the molding press, and meanwhile, a heating coil is started, and electromagnetic induction is generated between the upper die and the lower die to generate heat to preheat the die to 78-82 ℃ and maintain the die;
5) After the die is measured to reach the preheating temperature by the thermocouple, the die press controls the lower pressing plate to continuously move upwards, so that the upper pressing plate starts to extrude the upper die, the heating device continuously heats the die to be heated to 118-122 ℃, the thermocouple detects the temperature of the die in real time, the pressing plate continuously pressurizes the die to 1000-2000 pa, and the die is kept for Wen Baoya-3 min;
6) And controlling the upper pressing plate and the lower pressing plate to be separated through a molding press, taking off the molded CSP chip after taking off the upper die, and finishing the molding.
Compared with the prior art, the invention has the following advantages and beneficial effects:
1. the upper pressing plate and the lower pressing plate are made of microcrystalline stone formed by sintering and crystallizing at high temperature under the conditions similar to those of granite, and have better compression resistance, bending resistance, wear resistance and impact resistance.
2. The invention uses the heating coil electromagnetic induction to heat the die, and the thermocouple is used for detecting the temperature of the die in real time, so that the die is heated more uniformly, and the yield of the die pressing process is improved.
3. According to the invention, the fluorescent membrane is limited by the die steel partition plate, so that the phenomenon that the uniformity of the fluorescent membrane is poor due to premature melting and flowing of the fluorescent membrane can be avoided.
4. According to the invention, the die is positioned by the die positioning module, so that the die pressing precision can be improved, the assembly is simple, and the working efficiency can be improved.
Drawings
FIG. 1 is a schematic diagram of a high pressure resistant uniformly heated CSP fluorescent membrane molding apparatus of the present invention;
FIG. 2 is a schematic view of the installation of the upper and lower molds of the present invention;
wherein, 1 is the holding down plate, 2 is the spring, 3 is the metal boss, 4 is the bed die, 5 is the baffle, 6 is the fluorescence diaphragm, 7 is CSP device base plate, 8 is the cope mold, 9 is the guide pillar, 10 is the top board, 11 is heating coil, 12 is the thermocouple.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but embodiments of the present invention are not limited thereto.
As shown in fig. 1 and 2, the molding equipment is installed on a molding press for use, and comprises an upper pressing plate 10, a lower pressing plate 1, a heating module, a mold positioning module, a partition plate 5, a CSP device substrate 7, a fluorescent film 6, an upper mold 8 and a lower mold 4, wherein the upper pressing plate 10 and the lower pressing plate 1 are made of microcrystal stone, the upper pressing plate 10 and the lower pressing plate 1 are respectively installed on a guide post 9 of the molding press, the heating module is installed on the upper pressing plate 10, the lower mold 4 is installed at the upper end of the lower pressing plate 1 through the mold positioning module, the partition plate 5 is installed on the lower mold 4, the fluorescent film 6 is installed in a groove of the partition plate 5, the CSP device substrate 7 is placed on the partition plate 5, and the upper mold is installed at the upper end of the lower mold, and the lower mold 4 is provided with a positioning post to be matched with a positioning hole of the upper mold 8, so that the mold can be accurately clamped. The upper pressing plate and the lower pressing plate are made of microcrystalline stone formed by sintering and crystallizing at high temperature under the conditions similar to those of granite, and have better compression resistance, bending resistance, wear resistance and impact resistance, and the lower pressing plate is controlled to move on the guide post by a feeding device of the molding press so as to realize accurate positioning or separation; when the die is not closed, the upper pressing plate and the lower pressing plate are in a separated state.
The heating module comprises a heating coil 11, the heating coil 11 is installed at the upper end of the upper pressing plate 10, the upper die 8 and the lower die 4 are made of die steel, the heating coil 11 is electrified with alternating current to generate a magnetic field with the direction changing continuously, and electromagnetic induction is generated with the die to generate eddy current in the die, so that the die is uniformly heated.
The die positioning module comprises 2 groups of die positioning units, the die positioning units are installed in the installation grooves of the lower pressing plate 1, and the top ends of the die positioning units are connected with the lower die 4.
The die positioning unit comprises a spring 2 and a metal boss 3, one end of the spring 2 is fixed in the mounting groove, the other end of the spring 2 is connected with the bottom of the metal boss 3, a protruding portion of the metal boss 3 is connected with a positioning hole in the bottom of the lower die 4, and the protruding portion is spherical and is convenient to be matched with the positioning hole in the bottom of the lower die 4 for positioning.
The lower end of the metal boss 3 is glued with a thermocouple 12 for measuring temperature through AB glue, and the temperature of the die is monitored in real time.
The metal boss 3 is made of an aluminum alloy material with a thermal conductivity of more than 230W/(mK).
The rigidity of the spring 2 perpendicular to the molding direction is more than 1000N/cm, the rigidity along the molding direction is 10-25N/cm, and the variation value of the rigidity in two directions when the temperature variation range is less than 120 ℃ is 0-5%. The mold is ensured not to shake easily during working.
The partition 5 is made of die steel. The fluorescent film sheet 6 is arranged in the groove of the partition board 5, so that the deterioration of consistency caused by premature melting and flowing of the fluorescent film sheet can be avoided.
A molding method of high-pressure-resistance uniformly-heated CSP fluorescent membrane molding equipment comprises the following steps:
1) The upper pressing plate 10 and the lower pressing plate 1 are respectively arranged on a guide post 6 of the molding press;
2) Aligning a positioning hole at the bottom of the lower die 4 with a convex part of the metal boss 3, and mounting the lower die 4 on a lower partition plate;
3) The fluorescent film 6 is mounted in the groove of the spacer 5, and the CSP device substrate 7 is inverted on the spacer so that the CSP chip side in the CSP device substrate 7 is in contact with the fluorescent film 6.
4) The lower pressing plate 1 is controlled to move upwards through a molding press, and meanwhile, the heating coil 11 is started, and electromagnetic induction preheating is carried out on the upper die 8 and the lower die 4 to 78-82 ℃ and maintained;
5) After the die is measured to reach the preheating temperature by the thermocouple 12, the die press controls the lower pressing plate 1 to continuously move upwards, so that the upper pressing plate 10 starts to extrude the upper die 8, the heating device continuously heats the die to the temperature of 118-122 ℃, the thermocouple 12 detects the die temperature in real time, the upper pressing plate 10 continuously pressurizes the die to 1000-2000 pa, and the die is protected for Wen Baoya-3 min;
6) The upper pressing plate 10 and the lower pressing plate 1 are controlled to be separated through a molding machine, and after the upper die 8 is taken away, the molded CSP chip is taken down, so that the molding is completed.
The above embodiments are preferred examples of the present invention, and the present invention is not limited thereto, and any other modifications or equivalent substitutions made without departing from the technical aspects of the present invention are included in the scope of the present invention.
Claims (5)
1. The CSP fluorescent membrane mould pressing equipment with high pressure resistance and uniform heating is installed on a mould press for use and is characterized by comprising an upper pressing plate, a lower pressing plate, a heating module, a mould positioning module, a partition plate, a CSP device substrate, a fluorescent membrane, an upper mould and a lower mould, wherein the upper pressing plate and the lower pressing plate are made of microlite, the upper pressing plate and the lower pressing plate are respectively installed on a guide post of the mould press, the heating module is installed on the upper pressing plate, the lower mould is installed at the upper end of the lower pressing plate through the mould positioning module, the partition plate is installed on the lower mould, the fluorescent membrane is installed on the partition plate, the CSP device substrate is placed on the partition plate, and the upper mould is installed at the upper end of the lower mould;
the die positioning module comprises at least 1 group of die positioning units, the die positioning units are arranged in the mounting grooves of the lower pressing plate, and the top ends of the die positioning units are connected with the lower die; the die positioning unit comprises a spring and a metal boss, one end of the spring is fixed to the mounting groove, the other end of the spring is connected with the bottom of the metal boss, and the protruding part of the metal boss is connected with the positioning hole at the bottom of the lower die;
the heating module comprises a heating coil, the heating coil is arranged at the upper end of the upper pressing plate, the upper die and the lower die are made of die steel, the heating coil generates a magnetic field with the direction being changed continuously, and the magnetic field and the upper die and the lower die generate electromagnetic induction to generate heat;
and a thermocouple for measuring temperature is fixed at the lower end of the metal boss.
2. The high pressure resistant and uniformly heated CSP fluorescent film molding equipment of claim 1, wherein the metal boss is made of a metal material with a thermal conductivity greater than 230W/(m-K).
3. The high-compression-resistance uniformly-heated CSP fluorescent membrane molding equipment according to claim 1, wherein the rigidity of the spring perpendicular to the molding direction is greater than 1000N/cm, the rigidity along the molding direction is 10-25N/cm, and the change value of the rigidity in two directions when the temperature change range is smaller than 120 ℃ is 0-5%.
4. The high pressure resistant and uniformly heated CSP fluorescent film molding apparatus of claim 1 wherein said spacer is made of die steel and said fluorescent film is mounted in a recess in the spacer.
5. A molding method of high pressure resistant and uniformly heated CSP fluorescent film molding equipment, which adopts the high pressure resistant and uniformly heated CSP fluorescent film molding equipment as claimed in any one of claims 1 to 4, comprising the steps of:
1) The upper pressing plate and the lower pressing plate are respectively arranged on a guide post of the molding press;
2) Aligning a positioning hole at the bottom of the lower die with a convex part of the metal boss, and mounting the lower die on the lower partition plate;
3) Mounting the fluorescent membrane in a groove of the partition board, and inverting the CSP device substrate on the partition board to enable one side of a CSP chip in the CSP device substrate to be in contact with the fluorescent membrane;
4) The lower pressing plate is controlled to move upwards through the molding press, meanwhile, a heating coil is started, electromagnetic induction is generated between the upper die and the lower die, heat is generated to preheat the die to 78-82 ℃, and the temperature is maintained;
5) After the die is measured to reach the preheating temperature by the thermocouple, the die press controls the lower pressing plate to continuously move upwards, so that the upper pressing plate starts to extrude the upper die, the heating device continuously heats the die to be heated to 118-122 ℃, the thermocouple detects the temperature of the die in real time, the pressing plate continuously presses the die to 1000-2000 pa, and the die is kept for Wen Baoya-3 min;
6) And controlling the upper pressing plate and the lower pressing plate to be separated through a molding press, taking off the molded CSP chip after taking off the upper die, and finishing the molding.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910592814.1A CN110246950B (en) | 2019-07-03 | 2019-07-03 | High-compression-resistance uniform-heating CSP fluorescent membrane molding equipment and molding method |
| PCT/CN2020/099924 WO2021000913A1 (en) | 2019-07-03 | 2020-07-02 | Mould pressing device with high pressure resistance and uniform heating for csp fluorescent diaphragm, and mould pressing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910592814.1A CN110246950B (en) | 2019-07-03 | 2019-07-03 | High-compression-resistance uniform-heating CSP fluorescent membrane molding equipment and molding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110246950A CN110246950A (en) | 2019-09-17 |
| CN110246950B true CN110246950B (en) | 2024-04-16 |
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|---|---|---|---|
| CN201910592814.1A Active CN110246950B (en) | 2019-07-03 | 2019-07-03 | High-compression-resistance uniform-heating CSP fluorescent membrane molding equipment and molding method |
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| Country | Link |
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| CN (1) | CN110246950B (en) |
| WO (1) | WO2021000913A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246950B (en) * | 2019-07-03 | 2024-04-16 | 华南理工大学 | High-compression-resistance uniform-heating CSP fluorescent membrane molding equipment and molding method |
| CN114603252B (en) * | 2022-03-29 | 2024-04-09 | 江苏大学 | Method and device for auxiliary laser shock micro-forming by medium-frequency electromagnetic induction heating |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05251488A (en) * | 1992-03-09 | 1993-09-28 | Mitsubishi Electric Corp | Method and device for sealing semiconductor device with resin |
| JPH06155510A (en) * | 1992-11-26 | 1994-06-03 | Toshiba Corp | Resin sealer |
| JP2012111202A (en) * | 2010-11-26 | 2012-06-14 | Apic Yamada Corp | Resin encapsulating device |
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| CN110246950B (en) * | 2019-07-03 | 2024-04-16 | 华南理工大学 | High-compression-resistance uniform-heating CSP fluorescent membrane molding equipment and molding method |
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