CN201791643U - Die head adjusting mechanism for polymide (PI) gluing - Google Patents

Die head adjusting mechanism for polymide (PI) gluing Download PDF

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Publication number
CN201791643U
CN201791643U CN2010205370892U CN201020537089U CN201791643U CN 201791643 U CN201791643 U CN 201791643U CN 2010205370892 U CN2010205370892 U CN 2010205370892U CN 201020537089 U CN201020537089 U CN 201020537089U CN 201791643 U CN201791643 U CN 201791643U
Authority
CN
China
Prior art keywords
die head
mould bases
gluing
fine tuning
adjustment component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010205370892U
Other languages
Chinese (zh)
Inventor
曾炜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHUHAI YATAI ELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
ZHUHAI YATAI ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHUHAI YATAI ELECTRONIC TECHNOLOGY Co Ltd filed Critical ZHUHAI YATAI ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN2010205370892U priority Critical patent/CN201791643U/en
Application granted granted Critical
Publication of CN201791643U publication Critical patent/CN201791643U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a die head adjusting mechanism for polymide (PI) gluing, which comprises a die holder and a fine adjustment component. The fine adjustment component is used for adjusting spacing between a die head and a gluing roller and is arranged at the bottom of the die head, the die head is arranged on the die holder, a coarse adjustment component used for adjusting the height of the die head is also arranged below the die holder and comprises at least one cylinder, the top of the cylinder is contacted with the bottom of the die holder, the bottom of the cylinder is fixed on a fixed plate, and the two ends of the fixed plate are respectively fixedly connected with side plates on the two sides of the die holder. The die head adjusting mechanism is provided with the coarse adjustment component and the fine adjustment component, and the height of the die head can be adjusted rapidly through the coarse adjustment component so as to save time and improve the production efficiency, and particularly when emergency occurs to a gluing device (such as a PI connector, a PI mark, impurities and the like), the die head can be rapidly adjusted to be away from the gluing roller so as to prevent PI abruption and production disruption and ensure normal production; and the fine adjustment component can realize high-precision adjustment of relative positions of the die head and the gluing roller, so that the PI gluing is stable and uniform.

Description

The die head governor motion that is used for the PI gluing
Technical field
The utility model relates to flexible circuit plate substrate manufacture field, particularly a kind of die head governor motion that is used for the PI gluing.
Background technology
In the process of flexible circuit plate substrate, the gluing of PI (polyimides) is an important technology, and in PI gluing process, the relative position between die head and the upper glue roller is regulated also just quite important, is directly connected to the gluing quality of PI.In present PI sizer, as shown in Figure 1, the relative position between die head and the upper glue roller is regulated by the adjusting screw(rod) of being located at the die head below and is realized.Yet, because this adjusting screw(rod) is a fine adjustment mechanism, so, if in the time of need carrying out adjusting by a relatively large margin to the relative position of die head and upper glue roller, this will waste the working time greatly, and especially when sizer ran into emergency case (as: PI joint, PI sign, impurity etc.), this adjusting screw(rod) can make that die head can not be by quick adjustment, cause PI to break, produce the phenomenon of interruption easily, what influence was produced normally carries out.
The utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, and a kind of die head governor motion that is used for the PI gluing that can carry out coarse adjustment or fine tuning according to actual needs to sizer is provided.
The technical solution of the utility model is: the die head governor motion that is used for the PI gluing, comprise mould bases and be used to regulate the fine tuning assembly of die head and upper glue roller spacing, the fine tuning assembly is located at the die head bottom, die head is located on the mould bases, described mould bases below also is provided with the rough adjustment feature that is used to regulate the die head height, and rough adjustment feature comprises at least one cylinder, and cylinder head and mould bases bottom connection touch, cylinder bottom is fixed on the fixed head, fixedlys connected with the side plate of mould bases both sides respectively in the fixed head two ends.
As a kind of preferred version, described rough adjustment feature comprises two cylinders, and two cylinders are located at the mould bases below respectively, and two cylinders are symmetrical arranged about the vertical center line of mould bases, can guarantee preferably steadily to rise in the mould bases height adjustment process or descend.
Be respectively equipped with on the side plate of described mould bases both sides and be used for fixing the lock screw that mould bases is used, each lock screw passes corresponding side plate and is threaded with mould bases.
Described fine tuning assembly comprises two fine tuning screw rods, and the die head below is slidingly connected by two guide rails and mould bases, and two fine tuning screw rods are located at the outside of two guide rails respectively.
When originally being used for the die head governor motion use of PI gluing, but rising or descend, thereby drive the die head rising or drop to required height, by the lock screw of side plate both sides it is fixed then by rough adjustment feature quick adjustment mould bases; On mould bases, advance or retreat by fine tuning assembly adjustable die head, thereby regulate the spacing between die head and the upper glue roller.
The utility model has following beneficial effect with respect to prior art:
Originally the die head governor motion that is used for the PI gluing is provided with rough adjustment feature and fine tuning assembly, but height by rough adjustment feature quick adjustment die head, save time, enhance productivity, especially when sizer runs into emergency case (as: PI joint, PI sign, impurity etc.), adjustable die head avoids PI to break, produce the phenomenon of interruption fast away from upper glue roller, guarantees normally carrying out of production; Can realize that by the fine tuning assembly degree of precision of die head and upper glue roller relative position regulates, make the gluing stable and uniform of PI.
Originally the die head governor motion that is used for the PI gluing is simple in structure, and except being applicable to the production line of PI gluing, also applicable to all kinds of coating machines, it is easy to use, and the scope of application is wider.
Description of drawings
Fig. 1 is the existing structural representation that is used for the die head governor motion of PI gluing.
Fig. 2 is used for the structural representation of the die head governor motion of PI gluing for the utility model.
The specific embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but embodiment of the present utility model is not limited thereto.
Embodiment
A kind of die head governor motion that is used for the PI gluing of present embodiment, its structure as shown in Figure 2, comprise mould bases 1 and be used to regulate the fine tuning assembly 4 of the spacing of die head 2 and upper glue roller 3, fine tuning assembly 4 is located at die head 2 bottoms, die head 2 is located on the mould bases 1, mould bases 1 below also is provided with the rough adjustment feature 5 of the height that is used to regulate die head 2, rough adjustment feature 5 comprises at least one cylinder, cylinder head and mould bases 1 bottom connection touch, cylinder bottom is fixed on the fixed head 6, fixedlys connected with the side plate 7 of mould bases 1 both sides respectively in fixed head 6 two ends.
As a kind of preferred version, rough adjustment feature 5 can comprise two cylinders, and two cylinders are located at mould bases 1 below respectively, and two cylinders are symmetrical arranged about the vertical center line of mould bases 1, can guarantee preferably that mould bases 1 steadily rises or descends in its height adjustment process.
Be respectively equipped with the lock screw 8 that is used for fixing mould bases 1 usefulness on the side plate 7 of mould bases 1 both sides, each lock screw 8 passes corresponding side plate 7 and is threaded with mould bases 1.
Fine tuning assembly 4 comprises two fine tuning screw rods, and die head 2 belows are slidingly connected by two guide rails and mould bases 1, and two fine tuning screw rods are located at the outside of two guide rails respectively.
When the die head governor motion that originally is used for the PI gluing uses, but rise or descend by rough adjustment feature 5 quick adjustment mould bases 1, rise or drop to required height thereby drive die head 2, the lock screw by side plate 7 both sides 8 is fixed it then; On mould bases 1, advance or retreat by fine tuning assembly 4 adjustable die head 2, thereby regulate the spacing between die head 2 and the upper glue roller 3.
As mentioned above, just can realize the utility model preferably, the foregoing description is preferred embodiment of the present utility model only, is not to be used for limiting practical range of the present utility model; Be that all equalizations of being done according to the utility model content change and modification, all contained by the utility model claim scope required for protection.

Claims (4)

1. the die head governor motion that is used for the PI gluing, comprise mould bases and be used to regulate the fine tuning assembly of die head and upper glue roller spacing, the fine tuning assembly is located at the die head bottom, die head is located on the mould bases, it is characterized in that, described mould bases below also is provided with the rough adjustment feature that is used to regulate the die head height, rough adjustment feature comprises at least one cylinder, cylinder head and mould bases bottom connection touch, and cylinder bottom is fixed on the fixed head, fixedly connected with the side plate of mould bases both sides respectively in the fixed head two ends.
2. according to the described die head governor motion that is used for the PI gluing of claim 1, it is characterized in that described rough adjustment feature comprises two cylinders, two cylinders are located at the mould bases below respectively, and two cylinders are symmetrical arranged about the vertical center line of mould bases.
3. according to the described die head governor motion that is used for the PI gluing of claim 1, it is characterized in that be respectively equipped with on the side plate of described mould bases both sides and be used for fixing the lock screw that mould bases is used, each lock screw passes corresponding side plate and is threaded with mould bases.
4. according to the described die head governor motion that is used for the PI gluing of claim 1, it is characterized in that described fine tuning assembly comprises two fine tuning screw rods, the die head below is slidingly connected by two guide rails and mould bases, and two fine tuning screw rods are located at the outside of two guide rails respectively.
CN2010205370892U 2010-09-17 2010-09-17 Die head adjusting mechanism for polymide (PI) gluing Expired - Fee Related CN201791643U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010205370892U CN201791643U (en) 2010-09-17 2010-09-17 Die head adjusting mechanism for polymide (PI) gluing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010205370892U CN201791643U (en) 2010-09-17 2010-09-17 Die head adjusting mechanism for polymide (PI) gluing

Publications (1)

Publication Number Publication Date
CN201791643U true CN201791643U (en) 2011-04-13

Family

ID=43846563

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010205370892U Expired - Fee Related CN201791643U (en) 2010-09-17 2010-09-17 Die head adjusting mechanism for polymide (PI) gluing

Country Status (1)

Country Link
CN (1) CN201791643U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102773200A (en) * 2012-08-09 2012-11-14 深圳市浩能科技有限公司 Extrusion die head adjusting device
CN110302936A (en) * 2019-07-30 2019-10-08 山东九章膜技术有限公司 A kind of coating apparatus and coating process of ultrafiltration diaphragm

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102773200A (en) * 2012-08-09 2012-11-14 深圳市浩能科技有限公司 Extrusion die head adjusting device
CN110302936A (en) * 2019-07-30 2019-10-08 山东九章膜技术有限公司 A kind of coating apparatus and coating process of ultrafiltration diaphragm

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110413

Termination date: 20170917

CF01 Termination of patent right due to non-payment of annual fee