CN110246950A - A kind of uniformly heated CSP fluorescence diaphragm molding equipment of high resistance to compression and mould pressing method - Google Patents
A kind of uniformly heated CSP fluorescence diaphragm molding equipment of high resistance to compression and mould pressing method Download PDFInfo
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- CN110246950A CN110246950A CN201910592814.1A CN201910592814A CN110246950A CN 110246950 A CN110246950 A CN 110246950A CN 201910592814 A CN201910592814 A CN 201910592814A CN 110246950 A CN110246950 A CN 110246950A
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- 238000000465 moulding Methods 0.000 title claims abstract description 60
- 230000006835 compression Effects 0.000 title claims abstract description 24
- 238000007906 compression Methods 0.000 title claims abstract description 24
- 238000003825 pressing Methods 0.000 title claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 238000005192 partition Methods 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000011159 matrix material Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 230000005674 electromagnetic induction Effects 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 3
- 238000010792 warming Methods 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 2
- 238000011897 real-time detection Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 238000005452 bending Methods 0.000 abstract description 4
- 238000002425 crystallisation Methods 0.000 abstract description 4
- 230000008025 crystallization Effects 0.000 abstract description 4
- 239000010438 granite Substances 0.000 abstract description 4
- 238000005245 sintering Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000002028 premature Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5808—Measuring, controlling or regulating pressure or compressing force
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5816—Measuring, controlling or regulating temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
A kind of uniformly heated CSP fluorescence diaphragm molding equipment of high resistance to compression, the molding equipment, which is mounted on moulding press, to be used, including top board, lower platen, heating module, mold locating module, partition, CSP device substrate, fluorescence diaphragm, upper mold and lower mold, the top board and lower platen are all made of microlite support, the top board and lower platen are respectively arranged on the guide post of moulding press, the heating module is installed on top board, the lower mold is installed on lower platen upper end by mold locating module, the partition is installed on lower mold, the fluorescence matrix is installed in the groove of partition, the CSP device substrate is placed in above the partition, the upper mold is installed on the lower mold upper end.Upper and lower pressing plate by use it is similar with granite formation condition at a high temperature of sintering crystallization form microlite and be made, with preferable resistance to compression, bending resistance, wear-resisting, impact resistance.
Description
Technical field
The present invention relates to LED encapsulation technology field more particularly to a kind of uniformly heated CSP fluorescence diaphragm moldings of high resistance to compression
Equipment and mould pressing method.
Background technique
As LED technology development is compressed with cost, the encapsulation volume of LED component is smaller and smaller, and power density is continuously improved,
Conventional package locks into technical bottleneck.Since CSP device eliminates gold thread, substrate is minimum even without substrate, thus greatly
Packaging cost is reduced while reducing device volume and is up to 20%, and furthermore device thermal resistance also decreases, and the luminous density of CSP obtains
To raising, and small, thin, the light feature of CSP greatly improves the flexibility of its design application, and CSP encapsulation at present is not only passing
System lighting area is used widely, and is particularly subject to the favor of the backlight products such as TV, display screen and mobile phone, the market demand is just
There is rapid growth.
Since CSP device has the characteristics that multifaceted light-emitting, volume are small, fluoresent coating concentration, thickness nuance just
Very big influence can be caused to the consistency of device light color spatial distribution.And the molding plastic packaging equipment of current domestic tradition LED is certainly
Dynamicization degree is lower, and manual operation will cause the problems such as production efficiency is low, homogeneity of product is poor, and equipment is reliable
Property and precision are unable to reach the production standard of CSP device, are unable to satisfy its production requirement.And used in large-scale encapsulation enterprise certainly
Dynamic model compression moulding envelope equipment needs to rely on import, and equipment is not optimized for CSP accordingly in face of tradition LED,
The production requirement of CSP cannot be fully met.
Summary of the invention
The purpose of the invention is to overcome above the shortcomings of the prior art, provides a kind of high resistance to compression and be evenly heated
CSP fluorescence diaphragm be molded equipment, the present invention can solve that molding apparatus pressing plate compressive property is poor, heating is uneven, manually grasps
Make time consumption longer the problem of causing diaphragm to melt in advance.
The present invention also provides a kind of mould pressing methods of high uniformly heated CSP fluorescence diaphragm molding equipment of resistance to compression simultaneously；
The purpose of the present invention can be achieved through the following technical solutions:
A kind of uniformly heated CSP fluorescence diaphragm molding equipment of high resistance to compression, the molding equipment, which is mounted on moulding press, to be made
With, including top board, lower platen, heating module, mold locating module, partition, CSP device substrate, fluorescence diaphragm, upper mold and
Lower mold, the top board and lower platen are all made of microlite and are made, and the top board and lower platen are respectively arranged in moulding press
Guide post on, the heating module is installed on top board, and the lower mold is installed on lower platen upper end by mold locating module,
The partition is installed on lower mold, and the fluorescence matrix is installed in the groove of partition, and the CSP device substrate is placed in described
Above partition, the upper mold is installed on the lower mold upper end.Upper and lower pressing plate is similar with granite formation condition by using
Be sintered crystallization under high temperature and form microlite and be made, there is preferable resistance to compression, bending resistance, wear-resisting, impact resistance, by moulding press into
Precise positioning or separation are moved and realized on guide post to device control lower platen；When not molding, top board and lower platen are in
Discrete state.
Preferably, the heating module is heating coil, and the heating coil is installed on the top board upper end, it is described on
Mold and lower mold are all made of mould steel and are made, heating coil indirect current, generate the changing magnetic field in direction, send out with mold
It gives birth to electromagnetic induction and generates eddy current in mold, make to be evenly heated in mold.
Preferably, the mold locating module includes at least 1 group of mold positioning unit, and the mold positioning unit is installed on
The mounting groove of the lower platen, the top of the mold positioning unit are connect with the lower mold.
Preferably, the mold positioning unit includes spring and metal bosses, and the peace is fixed in one end of the spring
The other end of tankage, the spring is connect with metal bosses bottom, the lug boss of the metal bosses and the lower mold bottom
Location hole connection, the lug boss be it is spherical, positioned convenient for being matched with the location hole of mold bottom.
Preferably, the metal bosses lower end is fixed with the thermocouple of measurement temperature, carries out real-time monitoring to mold temperature.
Preferably, metal material of the metal bosses by thermal conductivity coefficient greater than (230) W/ (mK) is made.
Preferably, the spring perpendicular to molding direction rigidity be greater than 1000N/cm, along molding directional stiffness be 10~
25N/cm, changing value of the rigidity of both direction when range of temperature is less than 120 DEG C are 0~5%.Guarantee that mold is working
Shi Buhui shakes easily.
Preferably, the partition is made of mould steel.The fluorescence matrix is installed in the groove of partition, can be to avoid glimmering
Light diaphragm it is premature melting flowing and cause its consistency to be deteriorated.
A kind of mould pressing method of the uniformly heated CSP fluorescence diaphragm molding equipment of high resistance to compression, comprising the following steps:
1) top board and lower platen are respectively arranged on the guide post of moulding press；
2) so that the location hole of lower mold bottom is directed at the lug boss of metal bosses, lower mold is installed on lower clapboard；
3) fluorescence diaphragm is installed in the groove of partition, CSP device substrate is inverted on partition, CSP device base is made
CSP chip-side and fluorescence film contact in plate.
4) lower platen is controlled by moulding press to move upwards, while starting heating coil, with the upper mold and lower mold
Electromagnetic induction generation heat occurs to be preheated to 78~82 DEG C to mold and maintain；
5) after going out mold arrival preheating temperature by thermocouple measurement, moulding press control lower platen is continued up, and is made
Top board starts to squeeze upper mold, and heating device, which continues heating, makes mold be warming up to 118~122 DEG C, and thermocouple is to mold temperature
It is measured in real time, pressing plate continues to mould pressurizing to 1000~2000pa, and to 2~3min of mold heat-insulation pressure keeping；
6) top board is controlled by moulding press and lower platen separates, after taking upper mold away, remove the CSP chip being molded,
Complete molding.
Compared with the prior art, the invention has the following advantages and beneficial effects:
1, upper and lower pressing plate of the invention using sintering crystallization formation at a high temperature of similar with granite formation condition crystallite
It is made of stones at, have preferable resistance to compression, bending resistance, wear-resisting, impact resistance.
2, the present invention heats mold using heating coil electromagnetic induction, and has thermocouple to carry out mold temperature
Real-time detection keeps mold heating more uniform, improves the yields of mould pressing process.
3, the present invention limits fluorescence diaphragm by mold steel diaphragm, can be to avoid the premature melting flowing of fluorescent film piece
And its consistency is caused to be deteriorated.
4, the present invention positions mold by mold locating module, molding precision not only can be improved, but also assemble
Simply, working efficiency can be improved.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of high uniformly heated CSP fluorescence diaphragm molding equipment of resistance to compression of the invention；
Fig. 2 is the scheme of installation of upper and lower mold of the invention；
Wherein, 1 is lower platen, and 2 be spring, and 3 be metal bosses, and 4 be lower mold, and 5 be partition, and 6 be fluorescence diaphragm, and 7 are
CSP device substrate, 8 be upper mold, and 9 be guide post, and 10 be top board, and 11 be heating coil, and 12 be thermocouple.
Specific embodiment
Present invention will now be described in further detail with reference to the embodiments and the accompanying drawings, but embodiments of the present invention are unlimited
In this.
As shown in Figure 1 and Figure 2, the uniformly heated CSP fluorescence diaphragm molding equipment of a kind of high resistance to compression, the molding equipment peace
It is used on moulding press, including top board 10, lower platen 1, heating module, mold locating module, partition 5, CSP device substrate
7, fluorescence diaphragm 6, upper mold 8 and lower mold 4, the top board 10 and lower platen 1 are all made of microlite and are made, the top board
10 and lower platen 1 be respectively arranged on the guide post 9 of moulding press, the heating module is installed on top board 10, and the lower mold 4 is logical
Cross mold locating module and be installed on 1 upper end of lower platen, the partition 5 is installed on lower mold 4, the fluorescence matrix 6 be installed on every
In the groove of plate 5, the CSP device substrate 7 is placed in above the partition 5, and the upper mold is installed on the lower mold
End, lower mold 4 have positioning column and the location hole of upper mold 8 to match, mold are made to can be carried out accurate molding.Upper and lower pressing plate is by making
Microlite is formed with sintering crystallization at a high temperature of similar with granite formation condition to be made, and there is preferable resistance to compression, bending resistance, resistance to
Mill, impact resistance control lower platen by the feed arrangement of moulding press and precise positioning or separation are moved and realized on guide post；Not
When molding, top board and lower platen are in discrete state.
The heating module includes heating coil 11, and the heating coil 11 is installed on 10 upper end of top board, described
Upper mold 8 and lower mold 4 are all made of mould steel and are made, 11 indirect current of heating coil, generate the changing magnetic field in direction, with
Mold occurs electromagnetic induction and generates eddy current in mold, makes to be evenly heated in mold.
The mold locating module includes 2 groups of mold positioning units, and the mold positioning unit is installed on the lower platen 1
Mounting groove in, the top of the mold positioning unit is connect with the lower mold 4.
The mold positioning unit includes spring 2 and metal bosses 3, and the mounting groove is fixed in one end of the spring 2,
The other end of the spring 2 is connect with 3 bottom of metal bosses, the lug boss of the metal bosses 3 and lower 4 bottom of mold
Location hole connection, the lug boss be it is spherical, positioned convenient for being matched with the location hole of lower 4 bottom of mold.
3 lower end of metal bosses is stained with the thermocouple 12 of measurement temperature by AB glue, is supervised in real time to mold temperature
It surveys.
Aluminum alloy materials of the metal bosses 3 by thermal conductivity coefficient greater than 230W/ (mK) are made.
The spring 2 is greater than 1000N/cm perpendicular to the rigidity in molding direction, is 10~25N/cm along molding directional stiffness,
Changing value of the rigidity of both direction when range of temperature is less than 120 DEG C is 0~5%.Guarantee that mold at work will not
It shakes easily.
The partition 5 is made of mould steel.The fluorescence matrix 6 is installed in the groove of partition 5, can be to avoid fluorescent film
Piece it is premature melting flowing and cause its consistency to be deteriorated.
A kind of mould pressing method of the uniformly heated CSP fluorescence diaphragm molding equipment of high resistance to compression, comprising the following steps:
1) top board 10 and lower platen 1 are respectively arranged on the guide post 6 of moulding press；
2) so that the location hole of lower 4 bottom of mold is directed at the lug boss of metal bosses 3, lower mold 4 is installed on lower clapboard；
3) fluorescence diaphragm 6 is installed in the groove of partition 5, CSP device substrate 7 is inverted on partition, make CSP device
CSP chip-side is contacted with fluorescence diaphragm 6 in substrate 7.
4) control lower platen 1 by moulding press to move upwards, while starting heating coil 11, with the upper mold 8 and under
Mold 4 occurs electromagnetic induction and is preheated to 78~82 DEG C and maintains；
5) after measuring mold arrival preheating temperature by thermocouple survey 12, moulding press control lower platen 1 is continued up,
Top board 10 is set to start to squeeze upper mold 8, heating device, which continues heating, makes mold be warming up to 118~122 DEG C, and thermocouple 12 is to mould
Tool temperature be measured in real time, top board 10 continues to mould pressurizing to 1000~2000pa, and to mold heat-insulation pressure keeping 2~
3min；
6) top board 10 is controlled by moulding press and lower platen 1 separates, after taking upper mold 8 away, remove the CSP core being molded
Piece completes molding.
Above-mentioned specific embodiment is the preferred embodiment of the present invention, can not be limited the invention, and others are appointed
The change or other equivalent substitute modes what is made without departing from technical solution of the present invention, are included in protection of the invention
Within the scope of.
Claims (9)
1. a kind of uniformly heated CSP fluorescence diaphragm molding equipment of high resistance to compression, the molding equipment, which is mounted on moulding press, to be used,
It is characterised in that it includes top board, lower platen, heating module, mold locating module, partition, CSP device substrate, fluorescence diaphragm,
Upper mold and lower mold, the top board and lower platen are all made of microlite and are made, and the top board and lower platen are installed respectively
In on the guide post of moulding press, the heating module is installed on top board, and the lower mold is installed on down by mold locating module
Pressing plate upper end, the partition are installed on lower mold, and the fluorescence matrix is installed on partition, and the CSP device substrate is placed in institute
It states above partition, the upper mold is installed on the lower mold upper end.
2. a kind of high uniformly heated CSP fluorescence diaphragm molding equipment of resistance to compression according to claim 1, which is characterized in that
The heating module includes heating coil, and the heating coil is installed on the top board upper end, the upper mold and lower mold
It is all made of mould steel to be made, the heating coil generates the changing magnetic field in direction, magnetic field and the upper mold and lower mold
Electromagnetic induction occurs and generates heat.
3. a kind of high uniformly heated CSP fluorescence diaphragm molding equipment of resistance to compression according to claim 1, which is characterized in that
The mold locating module includes that at least 1 group of mold positioning unit, the mold positioning unit is installed on the peace of the lower platen
Tankage, the top of the mold positioning unit are connect with the lower mold.
4. a kind of high uniformly heated CSP fluorescence diaphragm molding equipment of resistance to compression according to claim 3, which is characterized in that
The mold positioning unit includes spring and metal bosses, and the mounting groove is fixed in one end of the spring, the spring
The other end is connect with metal bosses bottom, and the lug boss of the metal bosses is connect with the location hole of the lower mold bottom.
5. a kind of high uniformly heated CSP fluorescence diaphragm molding equipment of resistance to compression according to claim 4, which is characterized in that
The metal bosses lower end is fixed with the thermocouple of measurement temperature.
6. a kind of high uniformly heated CSP fluorescence diaphragm molding equipment of resistance to compression according to claim 4, which is characterized in that
Metal material of the metal bosses by thermal conductivity coefficient greater than 230W/ (mK) is made.
7. a kind of high uniformly heated CSP fluorescence diaphragm molding equipment of resistance to compression according to claim 4, which is characterized in that
The spring is greater than 1000N/cm perpendicular to the rigidity in molding direction, is 10~25N/cm, both direction along molding directional stiffness
Changing value of the rigidity when range of temperature is less than 120 DEG C be 0~5%.
8. according to right want 1 described in a kind of uniformly heated CSP fluorescence diaphragm molding equipment of high resistance to compression, which is characterized in that institute
It states partition to be made of mould steel, the fluorescence matrix is installed in the groove of partition.
9. a kind of mould pressing method of the uniformly heated CSP fluorescence diaphragm molding equipment of high resistance to compression, which is characterized in that including following step
It is rapid:
1) top board and lower platen are respectively arranged on the guide post of moulding press；
2) so that the location hole of lower mold bottom is directed at the lug boss of metal bosses, lower mold is installed on lower clapboard；
3) fluorescence diaphragm is installed in the groove of partition, CSP device substrate is inverted on partition, is made in CSP device substrate
CSP chip-side and fluorescence film contact.
4) lower platen is controlled by moulding press to move upwards, while starting heating coil, occur with the upper mold and lower mold
Electromagnetic induction generates heat and is preheated to 78~82 DEG C to mold and maintains；
5) after going out mold arrival preheating temperature by thermocouple measurement, moulding press control lower platen is continued up, and makes pressure
Plate starts to squeeze upper mold, and heating device, which continues heating, makes mold be warming up to 118~122 DEG C, and thermocouple carries out mold temperature
Real-time detection, pressing plate continue to mould pressurizing to 1000~2000pa, and to 2~3min of mold heat-insulation pressure keeping；
6) top board is controlled by moulding press and lower platen separates, after taking upper mold away, remove the CSP chip being molded, completed
Molding.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910592814.1A CN110246950B (en) | 2019-07-03 | 2019-07-03 | High-compression-resistance uniform-heating CSP fluorescent membrane molding equipment and molding method |
| PCT/CN2020/099924 WO2021000913A1 (en) | 2019-07-03 | 2020-07-02 | Mould pressing device with high pressure resistance and uniform heating for csp fluorescent diaphragm, and mould pressing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910592814.1A CN110246950B (en) | 2019-07-03 | 2019-07-03 | High-compression-resistance uniform-heating CSP fluorescent membrane molding equipment and molding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110246950A true CN110246950A (en) | 2019-09-17 |
| CN110246950B CN110246950B (en) | 2024-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910592814.1A Active CN110246950B (en) | 2019-07-03 | 2019-07-03 | High-compression-resistance uniform-heating CSP fluorescent membrane molding equipment and molding method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110246950B (en) |
| WO (1) | WO2021000913A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021000913A1 (en) * | 2019-07-03 | 2021-01-07 | 华南理工大学 | Mould pressing device with high pressure resistance and uniform heating for csp fluorescent diaphragm, and mould pressing method |
| CN114603252A (en) * | 2022-03-29 | 2022-06-10 | 江苏大学 | Method and device for assisting laser shock micro-forming by medium-frequency electromagnetic induction heating |
Citations (7)
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| CN114603252A (en) * | 2022-03-29 | 2022-06-10 | 江苏大学 | Method and device for assisting laser shock micro-forming by medium-frequency electromagnetic induction heating |
| CN114603252B (en) * | 2022-03-29 | 2024-04-09 | 江苏大学 | Method and device for auxiliary laser shock micro-forming by medium-frequency electromagnetic induction heating |
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| CN110246950B (en) | 2024-04-16 |
| WO2021000913A1 (en) | 2021-01-07 |
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