CN207619266U - A kind of novel hot bending die - Google Patents

Abstract

The utility model discloses a kind of novel hot bending dies, including cover board, ceramic wafer, lower template and thermocouple temperature measurement instrument, the upper end outer surface of the cover board is installed with diaphragm, and ceramic wafer is mounted on the upper end outer surface of diaphragm, the upper end outer surface of the lower template is installed with No. two arc ranks and No.1 arc rank, and No.1 arc rank is fixedly mounted on the side of No. two arc ranks, thermode is equipped between the thermocouple temperature measurement instrument and lower template, and thermocouple temperature measurement instrument is fixedly mounted on the leading exterior surface of lower template by thermode.A kind of novel hot bending die described in the utility model, equipped with No.1 arc rank, No. two arc ranks, ceramic wafer and thermocouple temperature measurement instrument, the cost of hot bending die material can be reduced while reducing the contact area of hot bending die and glass, and heat conduction loss rate can be reduced and accelerate the heating rate of hot bending die, personnel can also be conveniently operated and understand the temperature that mold reaches, bring better prospect of the application.

Description

A kind of novel hot bending die

Technical field

The utility model is related to hot bending die field, more particularly to a kind of novel hot bending die.

Background technology

With horizontal very high of people’s lives, heat-bending glass build and civilian occasion in use it is also more and more, Heat-bending glass be heated and softened plate glass be molded in a mold after through bend glass made of annealing, and hot bending die is excellent The bad aesthetics for determining heat-bending glass, therefore, the performance of hot bending die are constantly being improved by researchers；It is existing Hot bending die there are certain drawbacks when in use, first, the contact area of mold and glass cannot be reduced, increase hot bending Secondly the cost of mold materials cannot reduce heat conduction loss rate, affect the promotion of the temperature of hot bending die, finally, cannot It is conveniently operated personnel and understands the temperature that mold reaches, easily cause the loss of heat, operation is cumbersome, gives the use process of people Certain influence is brought, for this purpose, it is proposed that a kind of novel hot bending die.

Utility model content

The main purpose of the utility model is to provide a kind of novel hot bending dies, can effectively solve in background technology The problem of.

To achieve the above object, the technical solution that the utility model is taken is：

A kind of novel hot bending die, including cover board, ceramic wafer, glass, lower template and thermocouple temperature measurement instrument, the cover board Upper end outer surface be installed with diaphragm, and ceramic wafer is mounted on the upper end outer surface of diaphragm, the lower end appearance of the cover board Face is installed with cope plate and pressure head, and pressure head is fixedly mounted on the side of cope plate, the upper end outer surface of the ceramic wafer It is installed with bolt, the lower end outer surface of the cope plate is installed with convex briquetting, and glass is fixedly mounted on convex briquetting Lower end outer surface, the upper end outer surface of the lower template is installed with No. two arc ranks and No.1 arc rank, and No.1 arc Shape rank is fixedly mounted on the side of No. two arc ranks, and the lower end outer surface of the lower template is installed with bottom plate, and lower template Side be installed with location hole, thermode, and thermocouple temperature measurement instrument are equipped between the thermocouple temperature measurement instrument and lower template The leading exterior surface of lower template is fixedly mounted on by thermode.

Preferably, the ceramic wafer is fixedly connected by bolt with diaphragm, and the quantity of the bolt is four groups.

Preferably, the quantity of the pressure head is two groups, and the lower end outer surface of pressure head is equipped with antiskid thread.

Preferably, No. two arc ranks and No.1 arc rank are internally provided with brass tube, and No. two arc ranks compare No.1 Arc rank is wide, and the quantity of the No.1 arc rank is two groups.

Preferably, the thermocouple temperature measurement instrument is internally provided with temperature element, and thermocouple temperature measurement instrument highest can measure two The shape of 1800 degree of high temperature, the thermode is cylinder, and the angle of inclination of thermode and lower template is 15 degree.

Preferably, the inside of the bottom plate is installed with heat block, and the lower end outer surface of bottom plate is equipped with beam.

Compared with prior art, the utility model has the advantages that：The novel hot bending die passes through setting Ceramic wafer can reduce heat conduction loss rate and accelerate the heating rate of mold, ensure that the quality of product, pass through the one of setting Number arc rank and No. two arc ranks can reduce the cost of mold materials while reducing the contact area of mold and glass, Play the role of energy-efficient, improves the utilization rate of mold, by the thermocouple temperature measurement instrument of setting, personnel can be conveniently operated The temperature that reaches of solution mold prevents thermal loss and causes the reduction of the production efficiency of product, practical, whole device structure Simply, easy to operate, the effect used is more preferable relative to traditional approach.

Description of the drawings

Fig. 1 is a kind of overall structure diagram of novel hot bending die of the utility model.

Fig. 2 is a kind of partial view of novel hot bending die of the utility model.

Fig. 3 is the enlarged drawing of A in a kind of novel hot bending die Fig. 2 of the utility model.

Fig. 4 is a kind of floor structure figure of novel hot bending die of the utility model.

In figure：1, cover board；2, diaphragm；3, ceramic wafer；4, cope plate；5, pressure head；6, bolt；7, convex briquetting；8, glass； 9, lower template；10, No. two arc ranks；11, No.1 arc rank；12, bottom plate；13, location hole；14, thermocouple temperature measurement instrument；15, hot Electrode；16, heat block.

Specific implementation mode

To make the technical means, creative features, achievement of purpose, and effectiveness of the utility model be easy to understand, below In conjunction with specific implementation mode, the utility model is expanded on further.

As shown in Figs 1-4, a kind of novel hot bending die, including cover board 1, ceramic wafer 3, glass 8, lower template 9 and thermoelectricity The upper end outer surface of even temperature measurer 14, cover board 1 is installed with diaphragm 2, and ceramic wafer 3 is mounted on the upper end outer surface of diaphragm 2, Ceramic wafer 3 can reduce heat conduction loss rate and accelerate the heating rate of mold, ensure that the quality of product, the lower end of cover board 1 Outer surface is installed with cope plate 4 and pressure head 5, and pressure head 5 is fixedly mounted on the side of cope plate 4, outside the upper end of ceramic wafer 3 Surface is installed with bolt 6, and the lower end outer surface of cope plate 4 is installed with convex briquetting 7, and glass 8 be fixedly mounted on it is convex The lower end outer surface of briquetting 7, the upper end outer surface of lower template 9 are installed with No. two arc ranks 10 and No.1 arc rank 11, and two Number arc rank 10 and No.1 arc rank 11 can be reduced while reducing the contact area of mold and glass mold materials at This, plays the role of energy-efficient, improves the utilization rate of mold, and No.1 arc rank 11 is fixedly mounted on No. two arc ranks 10 The lower end outer surface of side, lower template 9 is installed with bottom plate 12, and the side of lower template 9 is installed with location hole 13, Thermode 15 is equipped between thermocouple temperature measurement instrument 14 and lower template 9, thermocouple temperature measurement instrument 14 can be conveniently operated personnel and understand mould Have the temperature that reaches, prevents thermal loss and cause the reduction of the production efficiency of product, and thermocouple temperature measurement instrument 14 passes through thermoelectricity Pole 15 is fixedly mounted on the leading exterior surface of lower template 9.

Ceramic wafer 3 is fixedly connected by bolt 6 with diaphragm 2, and the quantity of bolt 6 is four groups；The quantity of pressure head 5 is two groups, And the lower end outer surface of pressure head 5 is equipped with antiskid thread；The brass tube that is internally provided with of No. two arc ranks 10 and No.1 arc rank 11, and No. two arc ranks 10 are wider than No.1 arc rank 11, and the quantity of No.1 arc rank 11 is two groups；The inside of thermocouple temperature measurement instrument 14 is set There is temperature element, and 14 highest of thermocouple temperature measurement instrument can measure 2,800 degree of high temperature, the shape of thermode 15 is cylinder, and The angle of inclination of thermode 15 and lower template 9 is 15 degree；The inside of bottom plate 12 is installed with heat block 16, and bottom plate 12 Lower end outer surface be equipped with beam.

First, glass 8 is placed when in use it should be noted that the utility model is a kind of novel hot bending die The upper end of No. two arc ranks 10 and No.1 arc rank 11 of setting, No. two arc ranks 10 and No.1 in 9 upper end outer surface of lower template The setting of arc rank 11 can reduce the contact area between mold and glass, then, by the convex pressure of 4 lower end outer surface of cope plate Block 7 is placed on the upper end outer surface of glass 8, after the completion of preparation, 12 energy of bottom plate of the lower end outer surface setting of lower template 9 The heat transfer that enough heat blocks 16 that 12 inside of bottom plate is arranged generate is to lower template 9 to pass to No. two 10 Hes of arc rank No.1 arc rank 11, the then raising of temperature can be such that glass 8 softens, and the glass 8 after softening can be in convex briquetting 7 and lid It is processed to curve form, the upper end outer surface of the diaphragm 2 of setting under the pressure effect of the pressure head 5 of 1 lower end outer surface of plate setting Ceramic wafer 3 can prevent the heat in hot bending die from dissipating when hot bending die is processed, ensure that the temperature of mold can be fast The raising of speed, and can to ensure that ceramic wafer 3 is connect by diaphragm 2 with cover board 1 tight for the bolt 6 of the outer surface of ceramic wafer 3 setting Lower template 9 can be securely attached to by bottom plate 12 on external equipment by close property, the location hole 13 on bottom plate 12, be avoided because even Connect quality that is unstable and affecting product to be processed, when mold reach can processing temperature when, lower die is mounted on by thermode 15 The thermocouple temperature measurement instrument 14 of the leading exterior surface of plate 9 can measure the temperature of mold, the type of the thermocouple temperature measurement instrument 14 Number be W330, prevent because not in time operation due to cause mold heat the matter for distributing to affect hot bending die converted products Amount and production efficiency, it is more practical.

The advantages of basic principles and main features and the utility model of the utility model have been shown and described above.One's own profession The technical staff of industry is it should be appreciated that the present utility model is not limited to the above embodiments, described in above embodiments and description Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model Claimed range is defined by the appending claims and its equivalent thereof.

Claims (6)

1. a kind of novel hot bending die, including cover board (1), ceramic wafer (3), glass (8), lower template (9) and thermocouple temperature measurement Instrument (14), it is characterised in that：The upper end outer surface of the cover board (1) is installed with diaphragm (2), and ceramic wafer (3) is mounted on The lower end outer surface of the upper end outer surface of diaphragm (2), the cover board (1) is installed with cope plate (4) and pressure head (5), and presses Head (5) is fixedly mounted on the side of cope plate (4), and the upper end outer surface of the ceramic wafer (3) is installed with bolt (6), institute The lower end outer surface for stating cope plate (4) is installed with convex briquetting (7), and glass (8) is fixedly mounted on the lower end of convex briquetting (7) The upper end outer surface of outer surface, the lower template (9) is installed with No. two arc ranks (10) and No.1 arc rank (11), and one Number arc rank (11) is fixedly mounted on the side of No. two arc ranks (10), and the lower end outer surface of the lower template (9) is fixedly mounted There is bottom plate (12), and the side of lower template (9) is installed with location hole (13), the thermocouple temperature measurement instrument (14) and lower template (9) thermode (15) is equipped between, and before thermocouple temperature measurement instrument (14) is fixedly mounted on lower template (9) by thermode (15) Hold outer surface.

2. a kind of novel hot bending die according to claim 1, it is characterised in that：The ceramic wafer (3) passes through bolt (6) it is fixedly connected with diaphragm (2), the quantity of the bolt (6) is four groups.

3. a kind of novel hot bending die according to claim 1, it is characterised in that：The quantity of the pressure head (5) is two Group, and the lower end outer surface of pressure head (5) is equipped with antiskid thread.

4. a kind of novel hot bending die according to claim 1, it is characterised in that：No. two arc ranks (10) and one Number arc rank (11) is internally provided with brass tube, and No. two arc ranks (10) are than No.1 arc rank (11) width, the No.1 arc The quantity of rank (11) is two groups.

5. a kind of novel hot bending die according to claim 1, it is characterised in that：The thermocouple temperature measurement instrument (14) It is internally provided with temperature element, and thermocouple temperature measurement instrument (14) highest can measure 2,800 degree of high temperature, the thermode (15) Shape is cylinder, and the angle of inclination of thermode (15) and lower template (9) is 15 degree.

6. a kind of novel hot bending die according to claim 1, it is characterised in that：The inside of the bottom plate (12) is fixed Heat block (16) is installed, and the lower end outer surface of bottom plate (12) is equipped with beam.