CN110246883B - Display back plate, manufacturing method thereof and display device - Google Patents
Display back plate, manufacturing method thereof and display device Download PDFInfo
- Publication number
- CN110246883B CN110246883B CN201910553502.XA CN201910553502A CN110246883B CN 110246883 B CN110246883 B CN 110246883B CN 201910553502 A CN201910553502 A CN 201910553502A CN 110246883 B CN110246883 B CN 110246883B
- Authority
- CN
- China
- Prior art keywords
- sub
- pixel
- pixels
- substrate
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/352—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels the areas of the RGB subpixels being different
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a display back plate, a manufacturing method thereof and a display device. The display back plate includes: a substrate; the multiple sub-pixels are periodically distributed on the first surface of the substrate, each sub-pixel distribution period comprises N sub-pixels distributed in rows or columns, the micro-cavity lengths of the N sub-pixels are not identical, the sub-pixel with the largest micro-cavity length in the N sub-pixels is not adjacent to the sub-pixel with the smallest micro-cavity length in the N sub-pixels, and N is a positive integer greater than or equal to 3. The sub-pixel with the largest microcavity length in the N sub-pixels is not adjacent to the sub-pixel with the smallest microcavity length in the N sub-pixels, so that the microcavity section difference between the microcavity lengths of the two adjacent sub-pixels is small, and the cathode at the joint of the two adjacent sub-pixels cannot be broken due to the large microcavity section difference, so that the display quality and the product yield of the display back plate are improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display back plate, a manufacturing method thereof and a display device.
Background
The OLED device can independently control the RGB three-color light to emit light by independently adjusting the length of the micro cavity of each sub-pixel, so that the efficiency of the device can be obviously improved, and high-brightness and high-color-gamut display can be achieved. In order to realize independent control of RGB three-color light emission, currently, in a feasible OLED micro-cavity structure, an anode of an OLED device adopts a multi-layer metal structure, and dielectric layers with different thicknesses are manufactured between two layers of metals, wherein the thickness of the dielectric layer in a red sub-pixel is greater than that of the dielectric layer in a green sub-pixel, and the thickness of the dielectric layer in a green sub-pixel is greater than that of the dielectric layer in a blue sub-pixel, so that the length of the micro-cavity of the red sub-pixel is greater than that of the micro-cavity of the green sub-pixel, and the length of the micro-cavity of the green sub-pixel is greater than that of the micro-cavity of the blue sub-pixel, thereby realizing independent control of RGB three-color light emission, and achieving the purposes of high brightness and high gamut display.
Therefore, research on the display back sheet is awaited.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, an object of the present invention is to provide a display backplane, which has the advantages of high yield, improved display effect, or simple manufacturing process.
In one aspect of the invention, a display backplane is provided. According to an embodiment of the present invention, a display backplane comprises: a substrate; the plurality of sub-pixels are periodically distributed on the first surface of the substrate, each sub-pixel distribution period comprises N sub-pixels distributed in rows or columns, the micro-cavity lengths of the N sub-pixels are not identical, the sub-pixel with the largest micro-cavity length in the N sub-pixels is not adjacent to the sub-pixel with the smallest micro-cavity length in the N sub-pixels, and N is a positive integer greater than or equal to 3. The sub-pixel with the largest microcavity length in the N sub-pixels is not adjacent to the sub-pixel with the smallest microcavity length in the N sub-pixels, so that the microcavity section difference between the microcavity lengths of the two adjacent sub-pixels is small, and the cathode at the joint of the two adjacent sub-pixels cannot be broken due to the large microcavity section difference, so that the display quality and the product yield of the display back plate are improved.
According to the embodiment of the invention, each sub-pixel distribution period comprises an odd number of sub-pixels, and in the distribution direction of the odd number of sub-pixels, the micro-cavity lengths of the sub-pixels gradually increase or gradually decrease from the middle to two sides.
According to the embodiment of the invention, each sub-pixel distribution period comprises a first sub-pixel, a second sub-pixel, a third sub-pixel, a second sub-pixel and a first sub-pixel which are distributed in sequence, and the colors of the first sub-pixel, the second sub-pixel and the third sub-pixel are different.
According to an embodiment of the present invention, a light emitting area of one of the third sub-pixels is larger than a light emitting area of one of the first sub-pixels, and a light emitting area of one of the third sub-pixels is larger than a light emitting area of one of the second sub-pixels.
According to an embodiment of the present invention, the first sub-pixel is a red sub-pixel, the second sub-pixel is a green sub-pixel, and the third sub-pixel is a blue sub-pixel.
According to an embodiment of the present invention, the first sub-pixel is a blue sub-pixel, the second sub-pixel is a green sub-pixel, and the third sub-pixel is a red sub-pixel.
According to an embodiment of the invention, one of the sub-pixels comprises: a first electrode disposed on the first surface; the reflecting layer is arranged on one side, away from the substrate, of the first electrode; the cavity length adjusting layer is arranged on one side, far away from the substrate, of the reflecting layer, and a through hole is formed in the cavity length adjusting layer; the second electrode is arranged on one side, far away from the substrate, of the cavity length adjusting layer and is electrically connected with the reflecting layer through the through hole; the light-emitting functional layer is arranged on one side, far away from the substrate, of the second electrode; and the third electrode is arranged on one side of the light-emitting function layer far away from the substrate.
In another aspect of the invention, a method of making a display backplane is provided. According to the embodiment of the invention, the method for manufacturing the display back plate comprises the following steps: forming a plurality of sub-pixels distributed periodically on the first surface of the substrate, wherein each sub-pixel distribution period comprises N sub-pixels distributed in rows or columns, the micro-cavity lengths of the N sub-pixels are not completely the same, the sub-pixel with the largest micro-cavity length in the N sub-pixels is not adjacent to the sub-pixel with the smallest micro-cavity length in the N sub-pixels, and N is a positive integer greater than or equal to 3. In the manufacturing method, the sub-pixel with the largest microcavity length in the N sub-pixels is not adjacent to the sub-pixel with the smallest microcavity length in the N sub-pixels, so that the microcavity section difference between the microcavity lengths of the two adjacent sub-pixels is small, and the cathode at the joint of the two adjacent sub-pixels cannot be broken due to the large microcavity section difference, so that the display quality and the product yield of the display back plate are improved; moreover, the preparation method is simple, easy to operate, convenient for industrial production and free from increasing the production cost.
According to an embodiment of the present invention, the forming of the sub-pixels includes: forming a first electrode on the first surface; forming a reflecting layer on one side of the first electrode far away from the substrate; forming a cavity length adjusting layer on one side of the reflecting layers far away from the substrate; forming a second electrode on one side of the cavity length adjusting layer far away from the substrate, wherein the second electrode is electrically connected with the reflecting layer; forming a light-emitting functional layer on one side of the second electrode far away from the substrate; and forming a third electrode on the side of the light-emitting function layer far away from the substrate.
According to the embodiment of the present invention, in the direction of the row or column where the plurality of sub-pixels are distributed, N sub-pixels distributed in sequence are defined as sub-pixel 1, sub-pixel 2, … …, sub-pixel N-1, and sub-pixel N, respectively, where N is an odd number, and the cavity length adjusting layer in the N sub-pixels is formed by: step 1, forming a whole dielectric layer on one side of N reflecting layers far away from the substrate; step 2, performing first etching on the surface of the dielectric layer, which is far away from the substrate, wherein the orthographic projection of the first etched area on the substrate covers the sub-pixel 1+ i to the orthographic projection of the sub-pixel N-i on the substrate; step 3, performing second etching on the partial surface of the medium layer subjected to the first etching, wherein the orthographic projection of the area subjected to the second etching on the substrate covers the sub-pixel 1+ i to the orthographic projection of the sub-pixel N-i on the substrate; and 4, step 4: and repeating the step 3 until 1+ i is equal to N-i, wherein i is equal to the etching times.
In yet another aspect of the present invention, a display device is provided. According to an embodiment of the present invention, a display device includes the display backplane described above. Therefore, the display device is good in display effect, good in color uniformity and high in product yield. As can be understood by those skilled in the art, the display device has all the features and advantages of the display back plate described above, and thus, the detailed description thereof is omitted.
Drawings
FIG. 1 is a schematic structural diagram of a display backplane according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a display back plate in the prior art.
FIG. 3 is a schematic structural diagram of a display back plate according to another embodiment of the present invention.
FIG. 4 is a schematic structural diagram of a display back plate according to another embodiment of the present invention.
FIG. 5 is a top view of a distribution of a plurality of sub-pixels according to another embodiment of the present invention.
FIG. 6 is a flow chart of a method for fabricating a display backplane according to another embodiment of the present invention.
FIG. 7 is a schematic structural diagram of a display backplane according to another embodiment of the present invention.
FIG. 8 is a schematic structural diagram of a display backplane according to another embodiment of the present invention.
FIG. 9 is a schematic structural diagram of a display backplane according to another embodiment of the present invention.
Detailed Description
The following describes embodiments of the present invention in detail. The following examples are illustrative only and are not to be construed as limiting the invention. The examples, where specific techniques or conditions are not indicated, are to be construed according to the techniques or conditions described in the literature in the art or according to the product specifications.
In one aspect of the invention, a display backplane is provided. According to an embodiment of the present invention, referring to fig. 1, the display back plate includes: a substrate 100; a plurality of sub-pixels 200 periodically distributed on the first surface 110 of the substrate 100, each sub-pixel distribution period including N sub-pixels 200 distributed in a row or a column, the micro-cavity lengths of the N sub-pixels 200 are not identical, and the sub-pixel 200 with the largest micro-cavity length (the micro-cavity length is H1) among the N sub-pixels and the sub-pixel 200 with the smallest micro-cavity length (the micro-cavity length is H3) among the N sub-pixels are not adjacent to each other, N is a positive integer greater than or equal to 3 (for example, one sub-pixel distribution period and N ═ 5 in fig. 1). Because the sub-pixel 200 with the largest microcavity length in the N sub-pixels 200 is not adjacent to the sub-pixel 200 with the smallest microcavity length in the N sub-pixels, the microcavity section difference between the microcavity lengths of two adjacent sub-pixels 200 is small, so that the third electrode 260 at the connection position of two adjacent sub-pixels cannot be broken due to the large microcavity section difference, and the display quality and the product yield of the display back panel are improved.
As is well known to those skilled in the art, referring to fig. 1 and 2, the structure between the surface of the reflective layer 220 away from the substrate and the surface of the third electrode 260 close to the substrate in each sub-pixel forms a micro-cavity structure of one sub-pixel, and the micro-cavity length of the micro-cavity structure refers to the perpendicular distance between the surface of the reflective layer away from the substrate and the surface of the third electrode close to the substrate, where H (H1, H2, and H3 in the figure represent the micro-cavity lengths of sub-pixels of different colors) is an integral multiple of half a wavelength, that is, H ═ m × λ/2(λ is the wavelength of light, and m is a positive integer greater than or equal to 1), so that light of a predetermined color can be effectively emitted, and therefore, the micro-cavity lengths of sub-pixels of different colors are different, for example, RGB, the micro-cavity lengths of sub-pixels such as green sub-pixels, red sub-pixels, and blue sub-pixels are different, and the micro-cavity length of red sub-pixels is greater than that of green sub-pixels, the microcavity length of the green sub-pixel is longer than the microcavity length of the blue sub-pixel.
Therefore, as described above, because the lengths of the micro cavities of the sub-pixels with different colors are different, the surfaces of the micro-cavity structures of the sub-pixels are uneven, and micro-cavity section differences exist between adjacent sub-pixels, when the third electrode 260 is formed, the third electrode has a fracture risk due to a large micro-cavity section difference, so that the third electrode at the fracture cannot load a signal, and a local pixel cannot be lighted, thereby seriously affecting the display effect of the display backplane.
If the sub-pixel 200 with the largest microcavity length and the sub-pixel 200 with the smallest microcavity length among the N sub-pixels are adjacently disposed as shown in fig. 2 (two sub-pixel distribution periods are taken as an example in fig. 2, and each sub-pixel distribution period includes 3 sub-pixels 200 distributed in rows or columns), when the third electrode 260 of the OLED device is formed, since the microcavity section difference Δ H13 between the sub-pixel 200 with the largest microcavity length (the microcavity length H1) and the sub-pixel 200 with the smallest microcavity length (the microcavity length H3) is large, such as when RGB pixels are arranged, the microcavity section difference between a red sub-pixel and a blue sub-pixel can reach 1000 angstroms, and the thickness of the third electrode is thin (for example, about 130 angstroms), the third electrode at the position where the sub-pixel 200 with the largest microcavity length (the microcavity length H1) and the sub-pixel 200 with the smallest microcavity length (the microcavity length H3) are connected easily broken when RGB pixels are arranged, the third electrode at the fracture part can not load signals, and local pixels can not be lightened, so that the display effect of the display backboard is seriously influenced. Therefore, in the application, the sub-pixel 200 with the largest microcavity length in the N sub-pixels and the sub-pixel 200 with the smallest microcavity length in the N sub-pixels are not adjacently arranged, so that the microcavity section difference between the adjacent sub-pixels can be effectively shortened, and the risk of breaking the third electrode is reduced or avoided.
In order to realize the different micro-cavity lengths of the sub-pixels with different colors, the micro-cavity length can be adjusted by the cavity length adjusting layer, and the specific structure of each sub-pixel 200 in the present application is described in detail below according to some specific embodiments of the present invention: referring to fig. 1, one sub-pixel 200 includes: a first electrode 210, the first electrode 210 being disposed on the first surface 110; a reflective layer 220, wherein the reflective layer 220 is disposed on a side of the first electrode 210 away from the substrate 100; the cavity length adjusting layer 230, the cavity length adjusting layer 230 is arranged on one side of the reflecting layer 220 far away from the substrate 100, and a through hole 231 is arranged in the cavity length adjusting layer 230; a second electrode 240, wherein the second electrode 240 is disposed on a side of the cavity length adjusting layer 230 away from the substrate 100, and the second electrode 240 is electrically connected to the reflective layer 220 through a through hole 231; a light emitting function layer 250, wherein the light emitting function layer 250 is arranged on one side of the second electrode 240 far away from the substrate 100; and a third electrode 260, wherein the third electrode 260 is arranged on the side of the light-emitting function layer 250 far away from the substrate 100. Therefore, the light emitting function of the sub-pixels is realized, and the display function of the display back plate is further realized.
Note that the thickness h of the cavity length adjusting layer 230 is equal to the microcavity length, the thickness of the light-emitting functional layer, and the thickness of the second electrode. In some embodiments, the thicknesses of the second electrode and the light-emitting functional layer in different sub-pixels are substantially the same, so that the difference in the microcavity section between adjacent sub-pixels is equal to the difference in the thicknesses of the cavity length adjusting layers in the adjacent sub-pixels. Therefore, a person skilled in the art can flexibly design the thickness of the required cavity length adjusting layer according to the required cavity length of the micro-cavity, the thickness of the second electrode, the thickness of the light-emitting functional layer and the like.
Those skilled in the art will appreciate that the substrate may include a thin film transistor (including a source, a drain, a gate, an active layer, and other structures) and various insulating layers, planarization layers, and other structures disposed in the thin film transistor, and the above-mentioned various specific structures may be disposed according to conventional techniques, and will not be described in detail herein.
The OLED device in the display back plate is of a structure between the first electrode and the third electrode, wherein the reflecting layer is arranged for reflecting light rays in the light-emitting function layer, the utilization rate of the light rays is improved, and the display effect is further improved, wherein the material for forming the reflecting layer has no limitation requirement, and the material is only required to be light-tight and not light-absorbing, such as at least one of materials such as aluminum, silver and the like; the second electrode is electrically connected with the reflecting layer through the through hole, and the reflecting layer is directly contacted and connected with the first electrode, so the first electrode is electrically connected with the second electrode, and the first electrode and the second electrode jointly form an anode of the OLED device, wherein the first electrode and the second electrode are transparent electrodes and can be formed by Indium Tin Oxide (ITO); the light-emitting functional layer comprises a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer and the like; and the third electrode forms a cathode of the OLED device, and cooperates with the anode to apply voltage to the light-emitting functional layer to realize the light-emitting function of the light-emitting functional layer, wherein the material forming the third electrode comprises but is not limited to at least one of magnesium and silver.
In some embodiments, the material for forming the cavity length adjusting layer is not particularly limited, and one skilled in the art can flexibly select the material according to practical situations as long as the normal function of the OLED device is ensured, for example, the material for forming the cavity length adjusting layer includes, but is not limited to, at least one of silicon nitride, silicon oxide, silicon oxynitride, and the like. Therefore, the material source is wide, the cost is low, the light transmittance is good, and the light utilization rate is not influenced.
According to the embodiment of the present invention, referring to fig. 1 and fig. 3, each sub-pixel distribution period includes an odd number of sub-pixels (five sub-pixels are taken as an example in the figure), and in the distribution direction of the odd number of sub-pixels 200, the micro-cavity length H of the sub-pixel gradually increases or gradually decreases from the middle to both sides, specifically: as shown in fig. 1, in the distribution direction of the odd number of sub-pixels 200, the micro-cavity length H of the sub-pixel 200 gradually increases from H3 to H1 from the middle to both sides; or as shown in fig. 3, in the distribution direction of the odd number of sub-pixels 200, the micro-cavities H of the sub-pixels 200 gradually decrease from H1 to H3 from the middle to both sides. Therefore, in each sub-pixel distribution period, the sub-pixel 200 with the largest micro-cavity length (the micro-cavity length is H1) in odd sub-pixels and the sub-pixel 200 with the smallest micro-cavity length (the micro-cavity length is H3) in N sub-pixels are not adjacently arranged, so that the micro-cavity section difference between the adjacent pixels can be effectively shortened, the risk of breaking the third electrode is reduced or avoided, and the display quality and the product yield of the display back panel are finally improved.
According to an embodiment of the present invention, referring to fig. 3 and 4, each sub-pixel 200 distribution period includes a first sub-pixel 201, a second sub-pixel 202, a third sub-pixel 203, a second sub-pixel 202, and a first sub-pixel 201, which are distributed in sequence, and the first sub-pixel, the second sub-pixel, and the third sub-pixel have different colors. Therefore, the normal display function of the display back plate is realized. As shown in fig. 4, the microcavity length H1 of the first sub-pixel is greater than the microcavity length H2 of the second sub-pixel, the microcavity length H2 of the second sub-pixel is greater than the microcavity length H3 of the third sub-pixel, and the first sub-pixel with the maximum microcavity length H1 is not adjacent to the third sub-pixel with the minimum microcavity length H3; alternatively, as shown in fig. 3, the microcavity length H1 of the first sub-pixel is less than the microcavity length H2 of the second sub-pixel, and the microcavity length H2 of the second sub-pixel is less than the microcavity length H3 of the third sub-pixel, in both cases, the third sub-pixel of the maximum microcavity length H3 is not disposed adjacent to the first sub-pixel of the minimum microcavity length H1. The microcavity section difference between the adjacent sub-pixels can be reduced under the two conditions, so that the risk of breakage of the third electrode is reduced or avoided, and finally the display quality and the product yield of the display back plate are improved.
According to the embodiment of the present invention, as shown in fig. 4, the first sub-pixel 201 is a red sub-pixel, the second sub-pixel 202 is a green sub-pixel, and the third sub-pixel 203 is a blue sub-pixel. Therefore, the display effect of three primary colors can be effectively realized, in red light, green light and blue light, the wavelength of the red light is maximum, the wavelength of the blue light is minimum, namely the length of the micro cavity of the red sub-pixel is maximum, the length of the micro cavity of the blue sub-pixel is minimum, the red light and the blue light are arranged at intervals, the green sub-pixel is arranged between the red light and the blue light, the existence of large micro cavity section difference between the red sub-pixel and the blue sub-pixel is avoided, the risk of breakage of a third electrode is reduced or avoided, and the display quality and the product yield of the display back plate are finally improved.
According to the embodiment of the present invention, as shown in fig. 3, the first sub-pixel 201 is a blue sub-pixel, the second sub-pixel 202 is a green sub-pixel, and the third sub-pixel 203 is a red sub-pixel. Therefore, the display effect of three primary colors can be effectively realized, in red light, green light and blue light, the wavelength of the red light is maximum, the wavelength of the blue light is minimum, namely the length of the micro cavity of the red sub-pixel is maximum, the length of the micro cavity of the blue sub-pixel is minimum, the red light and the blue light are arranged at intervals, the green sub-pixel is arranged between the red light and the blue light, the existence of large micro cavity section difference between the red sub-pixel and the blue sub-pixel is avoided, the risk of breakage of a third electrode is reduced or avoided, and the display quality and the product yield of the display back plate are finally improved.
According to an embodiment of the present invention, referring to fig. 5 (two sub-pixel distribution periods are listed in fig. 5), the light emitting area c of one third sub-pixel 203 is larger than the light emitting area a of one first sub-pixel 201, and the light emitting area c of one third sub-pixel 203 is larger than the light emitting area b of one second sub-pixel 202 (i.e., c > a, c > b). Therefore, the display quality and the pixel resolution of the display back plate are improved by matching different light-emitting areas with the light-emitting efficiency of different sub-pixels. The size relationship between the light-emitting area of the first sub-pixel and the light-emitting area of the second sub-pixel has no special limitation requirement, and a person skilled in the art can flexibly set the size relationship according to actual requirements such as pixel resolution, light-emitting efficiency and the like; in addition, specific light-emitting areas of the first sub-pixel, the second sub-pixel and the third sub-pixel have no special requirement, and a person skilled in the art can flexibly set the specific light-emitting areas according to actual requirements such as pixel resolution, light-emitting efficiency and the like.
In another aspect of the invention, a method of making a display backplane is provided. According to the embodiment of the invention, the method for manufacturing the display back plate comprises the following steps: a plurality of sub-pixels 200 are formed on the first surface 110 of the substrate 100 in a periodic distribution, wherein, referring to fig. 1 and 3, each sub-pixel distribution period includes N sub-pixels 200 distributed in rows or columns, the lengths H of the micro-cavities of the N sub-pixels 200 are not identical, and the sub-pixel with the largest length of the micro-cavity in the N sub-pixels 200 is not adjacent to the sub-pixel with the smallest length of the micro-cavity in the N sub-pixels 200, and N is a positive integer greater than or equal to 3. In the manufacturing method, the sub-pixel with the largest microcavity length in the N sub-pixels is not adjacent to the sub-pixel with the smallest microcavity length in the N sub-pixels, so that the microcavity section difference between the two adjacent sub-pixels is small, and the third electrode at the joint of the two adjacent sub-pixels cannot be broken due to the large microcavity section difference, so that the display quality and the product yield of the display back plate are improved; moreover, the preparation method is simple, easy to operate, convenient for industrial production and free from increasing the production cost.
According to an embodiment of the present invention, referring to fig. 6 and 1, the sub-pixel 200 is formed by:
s100: a first electrode 210 is formed on the first surface 110.
S200: a reflective layer 220 is formed on the first electrode 210 on a side away from the substrate 100.
S300: a cavity length adjusting layer 230 is formed on the side of the reflective layer 220 away from the substrate 100.
As will be understood by those skilled in the art, when the display backplane is manufactured, the cavity length adjustment layer of each sub-pixel in the display backplane is formed at one time in a one-time patterning process, and according to some embodiments, a specific stroke step of the cavity length adjustment layer is described below by taking one sub-pixel distribution period as an example.
In the direction of the distribution row or column of the plurality of sub-pixels, N sub-pixels distributed in sequence are defined as sub-pixel 1, sub-pixel 2, … …, sub-pixel N-1 and sub-pixel N, wherein N is an odd number, and the cavity length adjusting layer in the N sub-pixels is formed by the following steps:
step 1, forming a whole dielectric layer on one side of the N reflecting layers far away from the substrate.
And 2, carrying out primary etching on the surface of the dielectric layer far away from the substrate, wherein the orthographic projection of the primary etched area on the substrate covers the orthographic projection of the pixel 1+ i (namely the sub-pixel 2) to the sub-pixel N-i (namely the sub-pixel N-1) on the substrate. In the step, the orthographic projection of the non-etched dielectric layer on the substrate covers the orthographic projection of the pixel 1 and the sub-pixel N on the substrate, and the non-etched dielectric layers respectively form cavity length adjusting layers of the sub-pixel 1 and the sub-pixel N; after the first etching, the dielectric layers of the sub-pixel 2 and the sub-pixel N-1 are covered by the orthographic projection on the substrate to form cavity length adjusting layers of the sub-pixel 2 and the sub-pixel N-1.
And 3, performing secondary etching on part of the surface of the medium layer subjected to the primary etching, wherein the orthographic projection of the area subjected to the secondary etching on the substrate covers the orthographic projection of the pixel 1+ i (namely the sub-pixel 3) to the sub-pixel N-i (namely the sub-pixel N-2) on the substrate. After this step, the cavity length dielectric layers for sub-pixel 3 and sub-pixel N-2 are obtained.
And 4, step 4: and repeating the step 3 until 1+ i is equal to N-i, wherein i is equal to the etching times, and further obtaining the cavity length adjusting layer of the sub-pixel N-i.
In the method for forming the cavity length adjusting layer, the cavity length adjusting layers in each sub-pixel are formed in a matched mode, namely, the dielectric layers corresponding to the sub-pixels 2 to N-1 are etched for the first time in a large area, then the dielectric layers corresponding to the sub-pixels 3 to N-2 and etched for the first time are etched for the second time, the steps are repeated until 1+ i is equal to N-i, and the cavity length adjusting layers of all the sub-pixels are obtained, so that the area of the etched dielectric layers is gradually reduced from the first etching to the ith etching (the minimum etching area is the light emitting area of the middle sub-pixel in the N sub-pixels), and compared with the method for forming the cavity length adjusting layer in the graph 2 (the cavity length adjusting layer of each sub-pixel is obtained through an independent etching process, the etching area is small, and the surface appearance is poor), the etched area of each time is larger, so that the etched surface appearance is more uniform and smoother, namely, the surface of the cavity length adjusting layer is more uniform and smoother, the micro-cavity length of the sub-pixel meets H ═ m ×. lambda/2, the requirement that the micro-cavity length at a certain position in the micro-cavity structure of the factor pixel does not meet H ═ m ×. lambda/2 due to the fact that the surface of the cavity length adjusting layer is uneven is reduced or avoided, the uniformity of the displayed color is further improved, and the display quality and the display effect are further improved.
According to some embodiments of the present invention, referring to fig. 1, 4 and 7, N is 5, i is 3, and in a direction of a row or a column in which a plurality of sub-pixels are distributed, a cavity length adjusting layer in the 5 sub-pixels including 5 sub-pixels distributed in sequence is formed by:
step 1, forming a whole dielectric layer 2300 on the side of the 5 reflecting layers far away from the substrate, wherein the structural schematic diagram refers to fig. 7.
And 2, performing first etching on the surface of the dielectric layer 2300 away from the substrate, wherein the orthographic projection of the area D1 etched for the first time on the substrate covers the orthographic projections of the two second sub-pixels 202 and the third sub-pixel 203 on the substrate. In this step, the orthographic projection of the unetched dielectric layer 2300 on the substrate covers the orthographic projection of the two first sub-pixels 201 on the substrate 100, and the unetched dielectric layers respectively form the cavity length adjusting layers 230 of the two first sub-pixels 201; after the first etching, the dielectric layers covering the two second sub-pixels 202 in the orthographic projection on the substrate respectively form the cavity length adjusting layers 230 of the two second sub-pixels 202, and the structural schematic diagram refers to fig. 8.
And 3, performing second etching on the partial surface of the medium layer subjected to the first etching, wherein the orthographic projection of the area D2 subjected to the second etching on the substrate 100 covers the orthographic projection of the third sub-pixel 203 on the substrate 100. After this step, the cavity length dielectric layer 230 of the third sub-pixel is obtained, and the structural schematic diagram refers to fig. 9.
In the method for forming the cavity length adjusting layer, the cavity length adjusting layers in each sub-pixel are formed in a matched mode, namely, the dielectric layers corresponding to the two second sub-pixels 202 and the third sub-pixels 203 are etched for the first time in a large area, then the dielectric layers corresponding to the third sub-pixels 203 which are etched for the second time, and further the cavity length adjusting layers of 5 sub-pixels are obtained, so that the area of the etched dielectric layers is gradually reduced from the first etching to the 2 nd etching, and compared with the method for forming the cavity length adjusting layer in the figure 2 (the cavity length adjusting layer of each sub-pixel is obtained through an independent etching process, the etching area is small, and the surface appearance is poor), the etched surface appearance is more uniform and smoother each time, namely, the surface of the cavity length adjusting layer is more uniform and smoother, the micro-cavity length of the sub-pixel can meet H-m-lambda/2, the requirement that the micro-cavity length at a certain position in the micro-cavity structure of the factor pixel cannot meet H-m-lambda/2 due to the fact that the surface of the cavity length adjusting layer is uneven is reduced or avoided, uniformity of displayed colors is improved, and display quality and effect are improved.
The etching methods of the first etching, the second etching and the like comprise steps of coating photoresist (positive photoresist or negative photoresist), utilizing a mask plate for exposure, developing, stripping and the like, and specific operation steps have no special requirements, so that a person skilled in the art can flexibly select the etching methods according to actual conditions, and the steps are not described too much.
S400: a second electrode 240 is formed on a side of the cavity length adjusting layer 230 away from the substrate 100, and the second electrode 240 is electrically connected to the reflective layer 220.
In the above steps, the specific manner of electrically connecting the second electrode and the reflective layer is not particularly required, for example, a through hole 231 may be formed in the cavity length adjusting layer 230 in each sub-pixel, and the second electrode 240 and the reflective layer 220 may be electrically connected through the through hole.
S500: a light emitting function layer 250 is formed on the second electrode 240 on the side away from the substrate 100.
In this step, the step of forming the light emitting functional layer includes the step of forming structures such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer, and the specific method thereof has no special requirement, and a person skilled in the art can flexibly select a manufacturing method in the conventional art according to actual requirements, and will not be described in detail herein.
S600: a third electrode 260 is formed on the side of the light emitting function layer 250 away from the substrate 100.
In the above steps, methods for forming the first electrode, the reflective layer, the second electrode, the third electrode, and the like include, but are not limited to, physical vapor deposition (such as evaporation, sputtering, and the like) and chemical vapor deposition.
The method for manufacturing the display back plate can be used for manufacturing the display back plate, wherein the requirements on the substrate, the first electrode, the second electrode, the third electrode, the microcavity structure, the microcavity length and other structures are consistent with those described above, and are not described in detail herein.
In yet another aspect of the present invention, a display device is provided. According to an embodiment of the present invention, a display device includes the display backplane described above. Therefore, the display device is good in display effect, good in color uniformity and high in product yield. As can be understood by those skilled in the art, the display device has all the features and advantages of the display back plate described above, and thus, the detailed description thereof is omitted.
According to the embodiment of the present invention, the specific type of the display device is not limited, and those skilled in the art can flexibly select the display device according to actual requirements. In some embodiments of the present invention, the display device includes, but is not limited to, any device having a display function, such as a mobile phone, a tablet computer, a kindle, a game machine, and the like.
It can be understood by those skilled in the art that the display device includes the display back plate and the necessary structures or components of a conventional display device, and for example, a mobile phone includes the display back plate, and further includes structures or components such as a housing, a cover plate, a touch module, an audio module, and a camera module.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (7)
1. A method of making a display backplane, the display backplane comprising:
a substrate;
a plurality of sub-pixels periodically distributed on the first surface of the substrate, wherein each sub-pixel distribution period comprises N sub-pixels distributed in rows or columns, the micro-cavity lengths of the N sub-pixels are not identical, the sub-pixel with the largest micro-cavity length in the N sub-pixels is not adjacent to the sub-pixel with the smallest micro-cavity length in the N sub-pixels, and N is a positive integer greater than or equal to 3,
one of the sub-pixels includes:
a first electrode disposed on the first surface;
the reflecting layer is arranged on one side, away from the substrate, of the first electrode;
the cavity length adjusting layer is arranged on one side, far away from the substrate, of the reflecting layer, and a through hole is formed in the cavity length adjusting layer;
the second electrode is arranged on one side, far away from the substrate, of the cavity length adjusting layer and is electrically connected with the reflecting layer through the through hole;
the light-emitting functional layer is arranged on one side, far away from the substrate, of the second electrode;
a third electrode provided on a side of the light emission function layer away from the substrate,
the method for manufacturing the display back plate comprises the following steps: forming a plurality of the sub-pixels in a periodic distribution on the first surface of the substrate, wherein the forming of the sub-pixels comprises:
forming the first electrode on the first surface;
forming the reflecting layer on one side of the first electrode far away from the substrate;
forming the cavity length adjusting layer on one side of the reflecting layer far away from the substrate;
forming the second electrode on one side of the cavity length adjusting layer far away from the substrate, wherein the second electrode is electrically connected with the reflecting layer;
forming the light-emitting function layer on one side of the second electrode far away from the substrate;
forming the third electrode on a side of the light-emitting function layer away from the substrate,
wherein, in the direction of the row or column of the plurality of sub-pixels, N sub-pixels distributed in sequence are defined as sub-pixel 1, sub-pixel 2, … …, sub-pixel N-1, and sub-pixel N, where N is an odd number, and the cavity length adjusting layer in the N sub-pixels is formed by:
step 1, forming a whole dielectric layer on one side of N reflecting layers far away from the substrate;
step 2, performing first etching on the surface of the dielectric layer, which is far away from the substrate, wherein the orthographic projection of the first etched area on the substrate covers the sub-pixel 1+ i to the orthographic projection of the sub-pixel N-i on the substrate;
step 3, performing second etching on the partial surface of the medium layer subjected to the first etching, wherein the orthographic projection of the area subjected to the second etching on the substrate covers the sub-pixel 1+ i to the orthographic projection of the sub-pixel N-i on the substrate;
and 4, step 4: repeating the step 3 until 1+ i is equal to N-i,
where i is equal to the number of etches.
2. The method according to claim 1, wherein each of the sub-pixel distribution periods includes an odd number of the sub-pixels, and in a distribution direction of the odd number of the sub-pixels, the micro-cavity lengths of the sub-pixels gradually increase or gradually decrease from the middle to both sides.
3. The method according to claim 2, wherein each of the sub-pixel distribution periods comprises a first sub-pixel, a second sub-pixel, a third sub-pixel, a second sub-pixel and a first sub-pixel which are distributed in sequence, and the first sub-pixel, the second sub-pixel and the third sub-pixel have different colors.
4. The method of claim 3, wherein a light emitting area of one of the third sub-pixels is larger than a light emitting area of one of the first sub-pixels, and a light emitting area of one of the third sub-pixels is larger than a light emitting area of one of the second sub-pixels.
5. The method of claim 3, wherein the first sub-pixel is a red sub-pixel, the second sub-pixel is a green sub-pixel, and the third sub-pixel is a blue sub-pixel.
6. The method of claim 3, wherein the first sub-pixel is a blue sub-pixel, the second sub-pixel is a green sub-pixel, and the third sub-pixel is a red sub-pixel.
7. A display device comprising the display back plate manufactured by the method of any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910553502.XA CN110246883B (en) | 2019-06-25 | 2019-06-25 | Display back plate, manufacturing method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910553502.XA CN110246883B (en) | 2019-06-25 | 2019-06-25 | Display back plate, manufacturing method thereof and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110246883A CN110246883A (en) | 2019-09-17 |
| CN110246883B true CN110246883B (en) | 2021-11-23 |
Family
ID=67889278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910553502.XA Active CN110246883B (en) | 2019-06-25 | 2019-06-25 | Display back plate, manufacturing method thereof and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110246883B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110610975B (en) * | 2019-09-23 | 2022-04-08 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| CN110649075B (en) * | 2019-09-27 | 2022-01-28 | 京东方科技集团股份有限公司 | Microcavity anode structure, display substrate and manufacturing method thereof |
| CN112116872B (en) * | 2020-09-23 | 2022-12-06 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
| CN115210880A (en) * | 2021-02-09 | 2022-10-18 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof and display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170243930A1 (en) * | 2014-10-20 | 2017-08-24 | Joled Inc. | Display panel |
| CN107195584A (en) * | 2017-05-27 | 2017-09-22 | 广州新视界光电科技有限公司 | A kind of preparation method of display panel, display panel and display device |
| CN107359283A (en) * | 2017-07-18 | 2017-11-17 | 广州新视界光电科技有限公司 | Preparation method, array base palte, display panel and the display device of array base palte |
| CN109148725A (en) * | 2018-08-30 | 2019-01-04 | 京东方科技集团股份有限公司 | The preparation method and display device of luminescent device, pixel unit, pixel unit |
-
2019
- 2019-06-25 CN CN201910553502.XA patent/CN110246883B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170243930A1 (en) * | 2014-10-20 | 2017-08-24 | Joled Inc. | Display panel |
| CN107195584A (en) * | 2017-05-27 | 2017-09-22 | 广州新视界光电科技有限公司 | A kind of preparation method of display panel, display panel and display device |
| CN107359283A (en) * | 2017-07-18 | 2017-11-17 | 广州新视界光电科技有限公司 | Preparation method, array base palte, display panel and the display device of array base palte |
| CN109148725A (en) * | 2018-08-30 | 2019-01-04 | 京东方科技集团股份有限公司 | The preparation method and display device of luminescent device, pixel unit, pixel unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110246883A (en) | 2019-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110246883B (en) | Display back plate, manufacturing method thereof and display device | |
| US11296160B2 (en) | Display substrate, display apparatus, and method of fabricating the display substrate | |
| CN107579102B (en) | Display panel and display device | |
| US9337249B2 (en) | OLED display panel and method of manufacturing the same and display apparatus | |
| US10811475B2 (en) | Array substrate, manufacturing method thereof and display device | |
| WO2020063291A1 (en) | Organic light-emitting display substrate, display device, and manufacturing method therefor | |
| KR101404546B1 (en) | Organic light emitting diode display and method for manufacturing the same | |
| WO2019179371A1 (en) | Organic electroluminescence display panel, manufacturing method therefor, and display device | |
| CN109004006B (en) | Organic light-emitting display substrate, manufacturing method thereof and display device | |
| US20090206733A1 (en) | Organic light emitting diode display and method of manufacturing the same | |
| WO2016065756A1 (en) | Display substrate, display device thereof, and manufacturing method therefor | |
| CN110911463A (en) | OLED display back plate, manufacturing method thereof and OLED display device | |
| US11374070B2 (en) | Organic light emitting diode display panel and apparatus having a connecting electrode in an electrode connecting region | |
| CN110164952B (en) | Display substrate, preparation method thereof and display device | |
| US11723234B2 (en) | Display backplane, manufacturing method thereof, and display device | |
| US9490301B2 (en) | OLED structure and manufacturing method thereof | |
| CN110582850B (en) | Organic light emitting diode display panel, method of manufacturing the same, and organic light emitting diode counter substrate | |
| US11309513B2 (en) | Anode, light emitting device, display substrate and method of manufacturing the same, and display device | |
| CN105493288A (en) | Organic light emitting pixel unit and manufacturing method, display panel and display device | |
| US11189816B2 (en) | Display substrate having a unitary cathode layer connected to a plurality of light emitting blocks, display apparatus, and method of fabricating display having the same | |
| CN109742266B (en) | Method for manufacturing OLED microcavity structure | |
| JP2010272447A (en) | Organic el device, manufacturing method of organic el device and electronic equipment | |
| CN110199402B (en) | Light emitting diode, manufacturing method thereof, display substrate and display device | |
| KR100354319B1 (en) | Organic electroluminescence device and method for fabricating thereof | |
| US20230165098A1 (en) | Display substrate, manufacturing method thereof and three-dimensional display apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |