CN110164952B - Display substrate, preparation method thereof and display device - Google Patents
Display substrate, preparation method thereof and display device Download PDFInfo
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- CN110164952B CN110164952B CN201910594131.XA CN201910594131A CN110164952B CN 110164952 B CN110164952 B CN 110164952B CN 201910594131 A CN201910594131 A CN 201910594131A CN 110164952 B CN110164952 B CN 110164952B
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- 239000000758 substrate Substances 0.000 title claims abstract description 183
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 230000001154 acute effect Effects 0.000 claims abstract description 17
- 239000011810 insulating material Substances 0.000 claims description 48
- 229920002120 photoresistant polymer Polymers 0.000 claims description 45
- 238000005452 bending Methods 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 11
- 238000000059 patterning Methods 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 5
- 238000001704 evaporation Methods 0.000 claims description 5
- 238000001312 dry etching Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 abstract description 20
- 230000000694 effects Effects 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- -1 Polyethylene terephthalate Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention discloses a display substrate, a preparation method thereof and a display device, relates to the technical field of display, and is used for improving the color cast phenomenon caused by the optical path difference of each light-emitting device in different areas of the display substrate and improving the display effect of the display substrate. The display substrate includes: a base substrate; the insulating layer is arranged on one side of the substrate base plate and comprises an insulating sublayer and a plurality of bulges arranged on the surface of the insulating sublayer, which is far away from the substrate base plate, wherein each bulge corresponds to at least one sub-pixel region of the display base plate, the surface of each bulge, which is far away from the insulating sublayer, is provided with a region surface to be provided with a light-emitting device, and an acute angle is formed between the region surface and the surface, which is far away from the substrate base plate, of the insulating sublayer; the light-emitting devices are arranged on one side, away from the substrate, of the insulating layer, and at least two light-emitting devices in the light-emitting devices are arranged on the surface of the area, where the light-emitting devices are to be arranged, of the bulges. The display substrate provided by the invention is used for image display.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a preparation method thereof and a display device.
Background
Organic Light Emitting Diodes (OLEDs) have been widely used in the display field due to their advantages of high brightness, full viewing angle, and fast response speed. However, in the related art OLED display panel, there is a color shift phenomenon in the display under different viewing angles, which affects the visual perception of the user.
Disclosure of Invention
The embodiment of the invention aims to provide a display substrate, a preparation method thereof and a display device, which are used for improving the color cast phenomenon caused by the optical path difference of each light-emitting device in different areas in the display substrate and improving the display effect of the display substrate.
In order to achieve the above purpose, the embodiment of the present invention provides the following technical solutions:
a first aspect of an embodiment of the present invention provides a display substrate, including: a base substrate; the insulating layer is arranged on one side of the substrate base plate and comprises an insulating sublayer and a plurality of bulges arranged on the surface of the insulating sublayer, which is far away from the substrate base plate, wherein each bulge corresponds to at least one sub-pixel region of the display base plate, the surface of each bulge, which is far away from the insulating sublayer, is provided with a region surface to be provided with a light-emitting device, and an acute angle is formed between the region surface and the surface, which is far away from the substrate base plate, of the insulating sublayer; the light-emitting devices are arranged on one side, away from the substrate base plate, of the insulating layer, and at least two light-emitting devices in the light-emitting devices are arranged on the surfaces of the convex areas where the light-emitting devices are to be arranged.
The display substrate provided by the embodiment of the invention is provided with the insulating layer and the plurality of light-emitting devices positioned on the side, away from the substrate, of the insulating layer, wherein the insulating layer comprises the insulating sublayer and the plurality of protrusions positioned on the surface, away from the substrate, of the insulating sublayer, the surface, away from the insulating sublayer, of each protrusion is provided with the surface of the area to be provided with the light-emitting device, and the surface of the area and the surface, away from the substrate, of the insulating sublayer form an acute angle.
Optionally, the surface of the region of each protrusion, where the light emitting device is to be disposed, is a plane; or the surface of the area of each protrusion, where the light emitting device is to be arranged, is a curved surface which is arched relative to the surface of one side of the insulating sublayer, which is away from the substrate base plate.
Optionally, the substrate includes a main body portion, and two bending portions located at two opposite ends of the main body portion and connected to the main body portion, the two bending portions are bent toward the same side of the main body portion, and a bending angle of each bending portion with respect to the main body portion is an acute angle; the plurality of bulges are respectively arranged in the areas of the two bending parts; in each of the protrusions, a surface of an area where the light emitting device is to be disposed is located on a side of the protrusion close to the main body portion.
Optionally, an included angle between the surface of the region where the light emitting device is to be disposed and the surface of the insulating sublayer facing away from the substrate is smaller than or equal to a bending angle of the corresponding bending portion relative to the main body portion.
Optionally, an included angle between the surface of the region where the light emitting device is to be disposed and the surface of the insulating sublayer away from the substrate base ranges from 30 ° to 60 °.
Optionally, the plurality of protrusions correspond to all sub-pixel regions of the display substrate, and all of the plurality of light emitting devices are disposed on the surface of the region to be provided with the plurality of protrusions.
Optionally, an included angle between the surface of the region where the light emitting device is to be disposed and the surface of the insulating sublayer away from the substrate base ranges from 10 ° to 40 °.
Optionally, the display substrate further includes a plurality of thin film transistors disposed between the substrate and the insulating layer, and the plurality of thin film transistors correspond to the plurality of light emitting devices respectively; the insulating layer is provided with a plurality of through holes, the through holes correspond to the bulges respectively, and each through hole penetrates through the corresponding bulge and the insulating sub-layer corresponding to the bulge; each light-emitting device comprises an anode layer, a light-emitting layer and a cathode layer which are arranged in a stacking mode, and the anode layer of the light-emitting device arranged on the plurality of bulges is electrically connected with the corresponding thin film transistor through the corresponding through hole.
Optionally, each protrusion is block-shaped and corresponds to one sub-pixel region; or each protrusion is in a strip shape and corresponds to a column of sub-pixel regions.
A second aspect of embodiments of the present invention provides a display device, which includes the display substrate provided in the above embodiments.
The beneficial effects that the display device provided by the embodiment of the invention can achieve are the same as those that the display substrate provided by the above technical scheme can achieve, and the details are not repeated herein.
A third aspect of an embodiment of the present invention provides a method for manufacturing a display substrate, including: a base substrate is provided. An insulating material layer is formed on one side of the base substrate. Patterning the insulating material layer to form an insulating layer; the insulating layer comprises an insulating sublayer and a plurality of bulges arranged on the surface of one side, departing from the substrate base plate, of the insulating sublayer, each bulge corresponds to at least one sub-pixel region of the display base plate, the surface, departing from the insulating sublayer, of each bulge is provided with a region surface to be provided with a light-emitting device, and an acute angle is formed between the region surface and the surface, departing from the substrate base plate, of the insulating sublayer. And forming a plurality of light-emitting devices on one side of the insulating layer, which is far away from the substrate base plate, wherein at least two light-emitting devices in the plurality of light-emitting devices are arranged on the surfaces of the plurality of convex areas where the light-emitting devices are to be arranged.
The beneficial effects that can be achieved by the preparation method of the display substrate provided by the embodiment of the invention are the same as those that can be achieved by the display substrate provided by the technical scheme, and are not repeated herein.
Optionally, the insulating layer material layer includes a first setting region, a second setting region and a third setting region, the first setting region corresponds to the top of the protrusion to be formed, the second setting region corresponds to the middle and the bottom of the protrusion to be formed, and the third setting region corresponds to a region where the protrusion is not to be formed. The step of patterning the insulating material layer to form an insulating layer includes: a photoresist layer is formed on a surface of the insulating material layer on a side facing away from the substrate base plate. Exposing and developing the photoresist layer through a half-tone mask plate to form the photoresist layer with patterns of a complete reserved area, a partial reserved area and an unreserved area; the completely reserved area of the photoresist layer with the pattern corresponds to a first set area of the insulating layer material layer, the partially reserved area corresponds to a second set area of the insulating layer material layer, and the unreserved area of the photoresist layer corresponds to a third set area of the insulating layer material layer. And etching the insulating material layer for the first time by taking the photoresist layer with the pattern as a mask to reduce the thickness of the third set area of the insulating material layer. And removing the photoresist layer of the partial reserved area, and carrying out secondary etching on the insulating layer material layer subjected to the primary etching by taking the photoresist layer as a mask so as to reduce the thickness of a second set area of the insulating layer material layer and form a plurality of bulges. And removing the photoresist layer of the completely reserved area to obtain the insulating layer comprising a plurality of projections.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of a display substrate according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of another display substrate according to an embodiment of the present invention;
FIG. 3 isbase:Sub>A schematic cross-sectional view of the display substrate of FIG. 1 along A-A';
FIG. 4 is another schematic cross-sectional view of the display substrate shown in FIG. 1 along A-A';
fig. 5 is a schematic optical path diagram of a light emitting device of a display substrate according to an embodiment of the present invention;
fig. 6 is a schematic optical path diagram of a light emitting device of another display substrate according to an embodiment of the present invention;
FIGS. 7 a-7 b are schematic cross-sectional views illustrating a display substrate according to an embodiment of the invention;
FIG. 8 is a schematic cross-sectional view of another display substrate according to an embodiment of the present invention;
FIG. 9 is a schematic cross-sectional view of another display substrate according to an embodiment of the disclosure;
fig. 10a to 10j are schematic flow charts illustrating a method for manufacturing a display substrate according to an embodiment of the present invention.
Reference numerals are as follows:
1-substrate base plate, 11-main body part, 12-bending part,
2-insulating layer, 21-insulating sublayer, 22-bump,
2 '-a layer of insulating material, 3' -a light emitting device, 31-an anode layer,
32-a light-emitting layer, 33-a cathode layer, 4-a pixel-defining layer,
5-thin film transistor, 6-via hole, 7-photoresist layer with pattern,
a1-the surface of the area where the light emitting device is to be located,
b1-a first set area, B2-a second set area, B3-a third set area,
c1-fully reserved area, C2-partially reserved area, C3-unreserved area.
Detailed Description
For the convenience of understanding, the technical solutions provided by the embodiments of the present invention are described in detail below with reference to the drawings of the specification. It is obvious that the described embodiments are only some, not all embodiments of the proposed solution.
Referring to fig. 1 to 4, an embodiment of the invention provides a display substrate, including: a base substrate 1, an insulating layer 2 arranged on one side of the base substrate 1, and a plurality of light emitting devices 3 arranged on one side of the insulating layer 2 facing away from the base substrate 1. The display substrate has a plurality of sub-pixel regions, and each sub-pixel region is provided with a corresponding light emitting device 3.
In some embodiments, the substrate 1 may be a rigid substrate, such as a glass substrate. In other embodiments, the substrate 1 may also be a flexible substrate, such as a PET (Polyethylene terephthalate) substrate, a PEN (Polyethylene naphthalate) substrate, or a PI (Polyimide) substrate.
Referring to fig. 1 to 2, the insulating layer 2 includes an insulating sublayer 21 and a plurality of protrusions 22. The insulating sublayer 21 is disposed on one side of the substrate base plate 1, and the plurality of protrusions 22 are disposed on a surface of the insulating sublayer 21 facing away from the substrate base plate 1. In the plurality of protrusions 22, each protrusion 22 corresponds to at least one sub-pixel region of the display substrate, that is, each protrusion 22 corresponds to at least one light emitting device 3.
The plurality of protrusions 22 may have various shapes such as a block shape, a bar shape, a column shape, or the like.
In some embodiments, each protrusion 22 may have a block shape, and referring to fig. 1, the planar shape of each protrusion 22, i.e., the shape of the orthographic projection of each protrusion 22 on the substrate base 1, may be a rectangle, a square, a trapezoid, a circle, or the like, and each protrusion 22 may correspond to one sub-pixel region, i.e., each protrusion 22 may correspond to one light emitting device 3.
In other embodiments, each protrusion 22 may be a bar, and referring to fig. 2, the planar shape of each protrusion 22 may be a bar, in which case each protrusion 22 may correspond to a column of sub-pixels, that is, each protrusion 22 may correspond to a column of light emitting devices 3. Each protrusion 22 corresponds to one row of light emitting devices 3, so that the number of the protrusions 22 can be reduced, the manufacturing process of the protrusions 22 is simplified, and the efficiency of manufacturing the display substrate is improved.
It should be noted that, in some embodiments, the column direction of the "one column of sub-pixels" is consistent with the column direction of the display substrate displaying the image.
In addition, the insulating layer 2 includes the insulating sub-layer 21 and the plurality of protrusions 22, and the insulating sub-layer 21 and the plurality of protrusions 22 are merely divided for explaining the structure of the insulating layer 2. In some embodiments, the structural relationship between the insulating sub-layer 21 and the plurality of protrusions 22 may be that the insulating sub-layer 21 and the plurality of protrusions 22 are in a split structure, that is, the insulating sub-layer 21 is formed first, and then the plurality of protrusions 22 are formed on the insulating sub-layer 21. In other embodiments, the insulating sub-layer 21 and the plurality of protrusions 22 may be a unitary structure, i.e., the insulating sub-layer 21 and the plurality of protrusions 22 are formed by etching the insulating material layer.
In some embodiments, an area surface A1 on which the light emitting device is to be disposed is provided in a surface of each protrusion 22 facing away from the insulating sub-layer 21, an acute angle is formed between the area surface A1 on which the light emitting device is to be disposed and a surface of the insulating sub-layer 21 facing away from the substrate base plate 1, that is, an included angle θ between the area surface A1 and a surface of the insulating sub-layer 21 facing away from the substrate base plate 1 is an acute angle, so that an included angle θ is provided between a light emitting surface of each light emitting device 3 disposed on the area surface A1 and a surface of the insulating sub-layer 21 facing away from the substrate base plate 1, and the included angle θ is an acute angle.
It should be noted that each light emitting device 3 includes an anode layer 31, a light emitting layer 32, and a cathode layer 33, which are stacked, the anode layer 31 may be a total reflection electrode layer, the cathode layer 33 may be a semi-reflection electrode layer, and in some examples, the reflectivity of the semi-reflection electrode layer may be about 95%. A microcavity is formed between the anode layer 31 and the cathode layer 33 of the light emitting device 3, and light emitted from the light emitting layer 32 is reflected and resonated between the anode layer 31 and the cathode layer 33 before being emitted out of the light emitting device 3, so that the wavelength of the emitted light is increased to a certain extent.
Among the light emitting devices 3, at least two light emitting devices 3 are disposed on the surface of the region of the plurality of protrusions 22 where the light emitting devices are to be disposed, that is, among the light emitting devices 3, an included angle θ is formed between at least two light emitting devices 3 and the surface of the insulating sub-layer 21 away from the substrate base 1.
Referring to fig. 5, an included angle θ is formed between the light emitting device 3 and the surface of the insulating sublayer 21 departing from the substrate base 1, the light emitting device 3 'is parallel to the surface of the insulating sublayer 21 departing from the substrate base 1, and the included angle θ is formed between the light emitting device 3 and the light emitting device 3'. As can be seen from fig. 5, the optical path length L1 of the outgoing light Q1 in the light emitting device 3 is smaller than the optical path length L2 of the outgoing light Q2 in the light emitting device 3 ', so that the light emitting device 3 increases the wavelength of the outgoing light Q1 to a smaller extent than the light emitting device 3' increases the wavelength of the outgoing light Q2, which is beneficial to making the light emitting device 3 and the rest of the light emitting devices consistent or nearly consistent with each other in terms of the increase of the wavelength of the outgoing light, thereby effectively improving the color shift phenomenon.
The display substrate provided by the embodiment of the invention is provided with the insulating layer 2 and the plurality of light emitting devices 3 positioned on the side, away from the substrate 1, of the insulating layer 2, wherein the insulating layer 2 comprises the insulator 21 and the plurality of protrusions 22 positioned on the surface, away from the substrate 1, of the insulating sublayer 21, the surface, away from the insulating sublayer 21, of each protrusion 22 is provided with the area surface A1 on which the light emitting device is to be arranged, and an acute angle is formed between the area surface A1 and the surface, away from the substrate 1, of the insulating sublayer 21, so that the light emitting surface of each light emitting device 3 arranged on the area surface A1 can form an acute angle with the surface, away from the substrate 1, of the insulating sublayer 21, an included angle between a perpendicular line of the light emitting surface of each light emitting device 3 and a line of a user watching the display substrate is reduced, further, the optical path difference of each light ray emitted from each light emitting device 3 to the user in the corresponding light emitting device 3 can be reduced, the difference of the wavelength increase degree of the light wave resonance in each light emitting device 3 is weakened, the light wave resonance in each light emitting device 3 is consistent or consistent with the wavelength increase degree, so that the color shift phenomenon of the display substrate can be effectively improved, and the display effect of the display substrate is improved.
In some embodiments, the area surface A1 of each protrusion 22 where the light emitting device is to be disposed may be a plane, and referring to fig. 3, each film layer in the light emitting device 3 formed on the area surface A1 may also be a plane, so that the light emitting device 3 may be formed in a structure in a shape of a rectangular parallelepiped, a cube, or the like.
In other embodiments, the area surface A1 of each protrusion 22 where the light emitting device is to be disposed may be a curved surface that is arched with respect to a side surface of the insulating sublayer 21 facing away from the substrate base plate 1. Referring to fig. 5, the layers of the light emitting device 3 formed on the area surface A1 are also arched toward the surface of the insulating sublayer 21 on the side away from the substrate base plate 1, so that the light emitting device 3 can be formed into an arc, semi-cylindrical, or semicircular structure, and the whole of the light emitting device 3 is arched away from the substrate base plate 1, not toward the substrate base plate 1.
It should be noted that, when the area surface A1 of each protrusion 22, on which the light emitting device is to be disposed, may be a curved surface, an included angle between the area surface A1, on which the light emitting device is to be disposed, and a surface of the insulating sub-layer 21, which is away from the substrate base plate 1, is an included angle between a plane defined by one end of the curved surface close to the insulating sub-layer 21 and one end of the curved surface far from the insulating sub-layer 21, and a surface of the insulating sub-layer 21, which is away from the substrate base plate 1.
Referring to fig. 6, the figure includes two light emitting devices 3, one light emitting device 3 is a rectangular light emitting device, the other light emitting device 3 is an arc light emitting device, and the included angles between the two light emitting devices 3 and the surface of the insulating sublayer 21 departing from the substrate base plate 1 are both θ. As can be seen from the figure, in the two light emitting devices 3, the optical paths of the light ray Q3 emitted from the same position in the rectangular light emitting device and the arc light emitting device are different, and the optical path L3 in the rectangular light emitting device is greater than the optical path L4 in the arc light emitting device, that is, the optical path of the emitted light ray in the arc light emitting device can be further reduced by using the arc light emitting device, so that the color cast phenomenon can be further improved.
It should be noted that, in different design requirements, the substrate base 1 may have multiple structures, for example, two opposite ends of the substrate base 1 have bent structures, or the substrate base 1 is a planar structure, and has no bent or concave-convex structure, and the substrate base 1 may also have other multiple structures, which may be specifically determined according to actual needs.
In some embodiments, referring to fig. 7b, the substrate base plate 1 includes a main body portion 11, and two bending portions 12 located at two opposite ends of the main body portion 11, the two bending portions 12 are respectively connected to the main body portion 11 and bent toward the same side of the main body portion 11, and a bending angle β of each bending portion 12 relative to the main body portion 11 is an acute angle. The plurality of protrusions 22 are respectively disposed in the areas of the two bending portions 12, and in each protrusion 22, the surface of the area where the light emitting device is to be disposed is located on one side of the protrusion 22 close to the main body portion 11.
In the related art, referring to fig. 7a, when the substrate base 1 has the bending portions 12 at two opposite ends, the display base including the substrate base 1 can be applied to an electronic product having a display screen with two bent sides, such as a mobile phone having a curved screen. When observing the image information displayed on the display screen of the electronic product, a user is used to view the image information displayed on the display screen from an angle perpendicular to the display screen, that is, the sight line of the user is parallel to the perpendicular line of the display screen, so that the included angle between the perpendicular line of the light-emitting surface of the different light-emitting devices 3 in the bending portions 12 at the two ends and the sight line of the user has a larger difference with the included angle between the perpendicular line of the light-emitting surface of the different light-emitting devices 3 in the main body portion 11 and the sight line of the user, and further, the increase degree of the light wavelength of the light emitted to the user by the different light-emitting devices 3 in the bending portions 12 and the increase degree of the light wavelength of the light emitted to the user by the different light-emitting devices 11 in the main body portion 11 in the corresponding light-emitting devices 3 have a larger difference, resulting in that the image information displayed corresponding to the bending portions at the two ends has a color cast phenomenon.
With reference to fig. 7b, the insulating sub-layer 21 disposed on one side of the substrate base plate 1 includes a portion of the insulating sub-layer located at the main portion 11 and a portion of the insulating sub-layer located at the bending portion 12, and the plurality of protrusions 22 are respectively disposed on a surface of the portion of the insulating sub-layer located at the bending portion 12, which is away from the substrate base plate 1. The plurality of light emitting devices 3 disposed on the side of the insulating layer 2 departing from the substrate 1 include the portion of the light emitting device 3 disposed on the main body 11 and the portion of the light emitting device 3 disposed on the bending portion 12, the light emitting device 3 disposed on the main body 11 can be directly disposed on the side surface of the insulating sub-layer located on the main body 11 departing from the substrate 1, and the light emitting device 3 disposed on the bending portion 12 can be disposed on the area surface A1 of the corresponding protrusion 22 where the light emitting device is to be disposed.
By respectively arranging the plurality of protrusions 22 in the areas of the two bending portions 12 and arranging the area surface A1 to be provided with the light emitting device on one side of the protrusion 22 close to the main body portion 11, the light emitting device 3 arranged on the area surface A1 can have a certain included angle with the surface of the partial insulating sublayer 21 located on the bending portion 12, which is away from the substrate 1, and the opening direction of the included angle is back to the main body portion 11, so that the angle between the light emitting device 3 located on the bending portion 12 and the light emitting device 3 located on the main body portion 11 can be reduced, the optical path of the emergent light in the light emitting device 3 located on the bending portion 12 is reduced, the difference between the optical path of the emergent light in the light emitting device 3 located on the main body portion 11 is reduced, and the color cast phenomenon formed on the bending portion 12 of the display substrate can be avoided or weakened.
It should be noted that, an included angle θ between the area surface A1 where the light emitting device is to be disposed and the surface of the insulating sublayer 21 away from the substrate 1 is smaller than or equal to a bending angle β of the corresponding bending portion 12 relative to the main body portion 11, please refer to fig. 7b, that is, an included angle between the light emitting device 3 located at the bending portion 12 and the surface of the insulating sublayer 21 away from the substrate 1 is smaller than or equal to an included angle between the light emitting device 3 located at the main body portion 11 and the surface of the insulating sublayer 21 away from the substrate 1, and a light emitting surface of the light emitting device 3 located at the bending portion 12 and a light emitting surface of the light emitting device 3 located at the main body portion 11 are parallel or approximately parallel, so that an optical path length of the light emitted from the light emitting device 3 located at the bending portion 12 in the light emitting device 3 is consistent or approximately consistent with an optical path of the light emitted from the light emitting device 3 located at the main body portion 11 in the light emitting device 3, and a difference between optical paths of the emitted light from the light emitting devices 3 is further reduced, so that a degree of wavelength of the light emitted from each light emitting device 3 is consistent or approximately consistent with each other, and a color shift phenomenon is effectively improved.
It should be noted that an included angle θ between the surface of the region where the light emitting device is to be disposed and the surface of the insulating sublayer 21 away from the substrate base plate 1 ranges from 30 ° to 60 °. Therefore, the color cast formed by the bending part 12 can be effectively improved, and bubbles can be prevented from being generated between the light-emitting device 3 and subsequent films such as a polarizer and the like formed on the light-emitting device 3, so that the display substrate has good display effect and yield.
It should be noted that, in the display panel, an included angle θ between the surface of each region where the light emitting device is to be disposed and the surface of the insulating sub-layer 21 away from the substrate base plate 1 may be the same angle, or may also be a gradually changing angle, for example, the included angle θ gradually increases or gradually decreases from one end of the bending portion 12 close to the main body portion 11 to one end of the bending portion 12 away from the main body portion 11. The specific adopted numerical value of the included angle theta can be set according to actual needs.
In other embodiments, referring to fig. 8, the substrate base 1 has a planar structure, the insulating sub-layer 21 is tiled on one side of the substrate base 1, the plurality of protrusions 22 on the surface of the insulating sub-layer 21 away from the substrate base 1 may correspond to all sub-pixel regions of the display base, and all of the light emitting devices 3 in the plurality of light emitting devices 3 are disposed on the surface of the region to be provided with the light emitting device, of the plurality of protrusions 22. For example, please refer to fig. 9, the area surface A1 of each protrusion 22 to be provided with a light emitting device is located on the left side of the corresponding protrusion 22, so that the wavelength increase degree consistency of the light emitted from each light emitting device 3 to the left side can be effectively improved, the color cast phenomenon generated when the display substrate is observed from the left side can be effectively improved, and the experience of a user who is used to observe the display substrate from the left side can be improved.
It should be noted that, when the substrate 1 has a planar structure, the display substrate including the substrate 1 may be applied to an electronic product having a planar display screen, such as a smart watch. When observing the image information displayed on the display screen of the electronic product, a user is used to watch the display screen from an inclined angle, that is, a certain angle range is usually formed between the sight line of the user and the perpendicular line of the display screen, so that a larger difference exists between the perpendicular lines of the light emitting surfaces of different light emitting devices 3 in the display substrate and the sight line of the user, and further, the light emitting devices 3 have a larger difference on the increasing degrees of the light wave wavelengths of the light emitted to the user in the corresponding light emitting devices 3, so that the image information observed by the user has a color cast phenomenon.
In order to enable the display substrate to have a better display effect and avoid the color shift phenomenon, in some embodiments, an included angle between the surface A1 of the region where the light emitting device is to be disposed and a surface of the insulating sublayer 21 away from the substrate 1 ranges from 10 ° to 40 °. Thus, when a user observes the displayed image information from one side of the display substrate, the included angle between the sight line of the user and the perpendicular line of the area surface A1 of each to-be-arranged light-emitting device can be consistent or approximately consistent, and the included angle between the sight line of the user and the perpendicular line of the light-emitting surface of each light-emitting device 3 can be consistent or approximately consistent, so that the optical paths of the light emitted to the user in each light-emitting device 3 can be consistent or approximately consistent, the growth degree of each light-emitting device 3 to the light wave wavelength of the emitted light is consistent or approximately consistent, and the phenomenon of color cast can be avoided being formed or weakened.
In the above embodiment, the included angle θ between the surface of each region of the display panel where the light emitting device is to be disposed and the surface of the insulating sublayer 21 away from the substrate base 1 may be the same angle, or may also be a gradual change angle, for example, from the left end to the right end of the substrate base 1, the included angle θ gradually becomes larger or smaller. The specific adopted numerical value of the included angle theta can be set according to actual needs.
Please refer to fig. 9, the display substrate further includes a plurality of thin film transistors 5, and the plurality of thin film transistors 5 are disposed between the substrate 1 and the insulating layer 2 and correspond to the plurality of light emitting devices 3, respectively.
In some embodiments, the plurality of light emitting devices 3 includes light emitting devices 3 correspondingly disposed on the surface of the plurality of protrusions 22 on which the light emitting devices are to be disposed. In further embodiments, the plurality of light emitting devices 3 further includes the light emitting device 3 provided on a surface of the insulating sub-layer 21 on a side facing away from the substrate base plate 1.
Alternatively, the plurality of light emitting devices 3 include the light emitting devices 3 correspondingly disposed on the area surfaces A1 of the plurality of protrusions 22 where the light emitting devices are to be disposed. Referring to fig. 9, the area of the insulating layer 2 corresponding to the light emitting device 3 has a plurality of via holes 6, the via holes 6 correspond to the protrusions 22, and each via hole 6 penetrates through the corresponding protrusion 22 and the insulating sub-layer 21 corresponding to the protrusion 22, so that the anode layer 31 of the light emitting device 3 disposed on the protrusion 22 can be electrically connected to the corresponding tft 4 through the corresponding via hole 6.
Optionally, the plurality of light emitting devices 3 further include a light emitting device 3 disposed on a surface of the insulating sub-layer 21 facing away from the substrate 1, the plurality of via holes in the insulating layer 2 further include a plurality of first via holes, the first via holes penetrate through a region of the insulating sub-layer 21 corresponding to the light emitting device 3, and the light emitting device 3 disposed on the insulating sub-layer 21 can be electrically connected to the anode layer 31 and the corresponding thin film transistor 4 through the first via holes.
It is to be understood that the light emitting devices in each sub-pixel region are generally driven to emit light by a pixel driving circuit, which may generally adopt a structure of "2T1C", "6T1C", "7T1C", "6T2C", or "7T2C", and the like, and which generally includes a plurality of driving transistors for driving the light emitting devices 3. The thin film transistor 4 disposed between the insulating layer 2 and the substrate 1 in this embodiment is specifically a driving transistor directly electrically connected to the anode layer 31 in a pixel driving circuit corresponding to the light emitting device 3.
An embodiment of the present invention further provides a method for manufacturing a display substrate, please refer to fig. 10a to 10j, the method includes:
s1: a base substrate 1 is provided.
Optionally, the substrate base plate 1 may be a glass substrate base plate, a metal substrate base plate, a PET substrate base plate, a PEN substrate base plate, or a PI substrate base plate.
S2: referring to fig. 10a, an insulating material layer 2' is formed on one side of the substrate base plate 1.
The insulating material layer 2' may be formed of a Polyimide Film (PI Film for short) or other resin Film. When the insulating material layer 2' is formed, it can be formed by a Plasma Enhanced Chemical Vapor Deposition (PECVD) process or a Vapor Deposition process.
S3: referring to fig. 10b to 10f, the insulating material layer 2' is patterned to form an insulating layer 2.
The patterned insulating layer 2 includes an insulating sub-layer 21 and a plurality of protrusions 22 on a surface of the insulating sub-layer 21 facing away from the substrate base plate 1. Each protrusion 22 corresponds to at least one sub-pixel region of the display substrate, an area surface A1 on which a light emitting device is to be disposed is provided on a surface of each protrusion 22 facing away from the insulating sublayer 21, and a certain included angle is provided between the area surface A1 and a surface of the insulating sublayer 21 facing away from the substrate 1, and the included angle is an acute angle.
In patterning the insulating-material layer 2 ', the insulating-material layer 2' may be patterned using a half-tone mask process. Before the patterning, the insulating material layer 2 'may be partitioned according to a pattern to be formed, that is, the insulating material layer 2' may be partitioned into a first set region B1 corresponding to the top of the protrusion to be formed, a second set region B2 corresponding to the middle and bottom of the protrusion to be formed, and a third set region B3 corresponding to a region where the protrusion is not to be formed. The top of the protrusion to be formed specifically refers to a position of the protrusion to be formed, which is farthest away from the substrate 1; the middle part and the bottom part of the bulge to be formed specifically refer to the part of the bulge to be formed except the top part.
In some embodiments, the insulating material layer 2' is patterned, and the step of forming the insulating layer 2 comprises:
s31: a photoresist layer is formed on the surface of the insulating-material layer 2' on the side facing away from the substrate base plate 1.
The photoresist layer can be a positive photoresist layer or a negative photoresist layer, and the embodiment takes the photoresist layer as the positive photoresist layer as an example.
S32: referring to fig. 10b, the photoresist layer is exposed and developed through a half-tone mask to form a photoresist layer 7 having a pattern of a completely reserved region C1, a partially reserved region C2, and an unreserved region C3.
The completely remaining area C1 in the patterned photoresist layer 7 means that the photoresist in this area is not removed and still covers the surface of the area of the insulating-material layer 2' corresponding to the completely remaining area C1. The partial remaining region C2 means that the photoresist in this region is partially removed in the thickness direction, i.e. the planar area of the photoresist in this region is unchanged and the thickness is reduced, and the photoresist layer in this region still covers the surface of the region of the insulating material layer 2' corresponding to the partial remaining region. The unreserved region C3 means that the photoresist in this region is completely removed, exposing the surface of the insulating-material layer 2' on the side facing away from the substrate base 1.
Different regions of the patterned photoresist layer 7 correspond to different regions of the insulating material layer 2 ', that is, a completely reserved region C1 of the patterned photoresist layer 7 corresponds to a first set region B1 of the insulating material layer 2 ', a partially reserved region C2 corresponds to a second set region B2 of the insulating material layer 2 ', and an unreserved region C3 of the patterned photoresist layer corresponds to a third set region B3 of the insulating material layer.
S33: referring to fig. 10c, the insulating material layer 2 'is first etched using the patterned photoresist layer 7 as a mask to reduce the thickness of the third predetermined region B3 of the insulating material layer 2'.
The completely remaining region C1 and the partially remaining region C2 of the photoresist layer 7 having the pattern protect the first set region B1 and the second set region B2 of the insulating material layer 2 'and expose the third set region B3, so that only the third set region B3 of the insulating material layer 2' can be etched to reduce the thickness of the insulating material layer 2 'when the insulating material layer 2' is first etched. During the etching, the insulating material layer 2' can be etched by a dry etching process,
s34: referring to fig. 10d and 10e, the photoresist layer in the remaining region C2 is removed, and the insulating material layer subjected to the first etching is etched for the second time by using the photoresist layer as a mask, so that the thickness of the second setting region B2 of the insulating material layer is reduced, and a plurality of protrusions are formed.
After the insulating material layer 2' is etched for the first time, the photoresist layer in the partial reserved area C2 in the photoresist layer can be removed, and the insulating material layer which is etched for the first time is etched for the second time by using the photoresist layer in the complete reserved area C1 as a mask, that is, the second set area B2 of the insulating material layer is etched.
In the process of etching the second setting area B2 of the insulating material layer, the etching rate can be correspondingly adjusted according to the height required by the middle part and the bottom part of the protrusion to be formed, so that the thicknesses of different positions of the second setting area B2 of the insulating material layer are thinned to different degrees, and then the protrusion is formed.
S35: referring to fig. 10f, the photoresist layer in the completely remained area C1 is removed to obtain the insulating layer 2 including the plurality of protrusions 22.
After the insulating material layer is etched for the second time, the photoresist layer in the complete remaining region C1 may be removed, and the insulating layer 2 including the plurality of protrusions 22 is obtained, the insulating layer 2 further includes an insulating sub-layer 21 except the plurality of protrusions 22, and the insulating sub-layer 21 is located between the substrate base plate 1 and the plurality of protrusions 22. The surface of each protrusion 22 facing away from the insulating sublayer 21 has an area surface A1 on which a light emitting device is to be disposed, and a certain included angle is formed between the area surface A1 and the surface of the insulating sublayer 21 facing away from the substrate base plate 1, where the included angle is an acute angle.
S4: referring to fig. 10g to 10j, a plurality of light emitting devices 3 are formed on a side of the insulating layer 2 away from the substrate 1, and at least two light emitting devices 3 of the plurality of light emitting devices 3 are disposed on the surface A1 of the region of the plurality of protrusions 22 where the light emitting devices are to be disposed.
After the insulating layer 2 is formed, a plurality of light emitting devices 3 may be formed on a side of the insulating layer 2 facing away from the substrate base 1, at least two light emitting devices 3 of the plurality of light emitting devices 3 may be disposed on the surface A1 of the area of the plurality of protrusions 22 where the light emitting devices are to be disposed, that is, the plurality of light emitting devices 3 may be partially disposed on the surface A1 of the area of the plurality of protrusions 22 where the light emitting devices are to be disposed, and partially disposed on a side surface of the insulating sublayer 21 facing away from the substrate base 1, and the plurality of light emitting devices 3 may also be entirely disposed on the surface A1 of the area of the plurality of protrusions 22 where the light emitting devices are to be disposed.
Because an acute angle is formed between the surface A1 of the region to be provided with the light emitting device in the protrusion 22 and the surface of the insulating sublayer 21 departing from the substrate 1, and the light emitting device 3 arranged on the surface A1 of the region and the surface of the insulating sublayer 21 departing from the substrate 1 are also acute angles, an included angle between a perpendicular line of each light emitting device 3 and a line of sight of a user watching the display substrate can be reduced, and further, optical path differences of each light ray emitted to the user in the corresponding light emitting device 3 can be reduced, differences of the optical wave resonance in each light emitting device 3 on the wavelength growth degree are weakened, so that the optical wave resonance in each light emitting device 3 on the wavelength growth degree is consistent or close to consistent, the color cast phenomenon of the display substrate prepared and formed in the embodiment can be effectively improved, and the display effect of the display substrate is improved.
Taking as an example that the plurality of light emitting devices 3 are all disposed on the area surface A1 of the plurality of projections 22 where the light emitting devices are to be disposed, the step of forming the light emitting devices 3 includes:
s41: referring to fig. 10g, an anode electrode layer is formed on a surface of the insulating layer 2 facing away from the substrate 1, and the anode electrode layer is patterned to form a plurality of anode layers 31, where each anode layer 31 is correspondingly disposed on a surface A1 of an area of each protrusion 22 where a light emitting device is to be disposed. When the anode electrode layer is formed, an ion sputtering process or an evaporation process may be used.
S42: referring to fig. 10h, an insulating film is formed on a surface of the anode layer 31 away from the substrate 1, and the insulating film is patterned to form a pixel defining layer 4. The pixel defining layer 4 has a plurality of opening areas, each opening area corresponding to each anode layer 31. When the insulating film layer is formed, evaporation or PECVD process may be used.
S43: referring to fig. 10i, a light emitting material layer is formed on a side of the anode layer 31 away from the substrate 1, and the light emitting material layer is patterned to form a light emitting layer 32. The light emitting layer 32 is located in the opening area of the pixel defining layer. When the light emitting material layer is formed, an ion sputtering process or an evaporation process may be used.
S44: referring to fig. 10j, a cathode electrode layer is formed on the side of the light-emitting layer 32 away from the substrate 1, and the cathode electrode layer is patterned to form a cathode layer 33. The cathode layer 33 is located within or covers the open area of the pixel defining layer. When the cathode electrode layer is formed, an ion sputtering process or an evaporation process can be used for forming the cathode electrode layer.
In some embodiments, a hole transport layer is further formed between the anode layer 31 and the light emitting layer 32, and an electron transport layer is further formed between the light emitting layer 32 and the cathode layer 33.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and shall cover the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (8)
1. A method for manufacturing a display substrate, comprising:
providing a substrate base plate;
forming an insulating material layer on one side of the substrate by adopting an evaporation process;
patterning the insulating material layer to form an insulating layer; the insulating layer comprises an insulating sublayer and a plurality of bulges arranged on the surface of one side, away from the substrate, of the insulating sublayer, each bulge corresponds to at least one sub-pixel region of the display substrate, the surface, away from the insulating sublayer, of each bulge is provided with a region surface to be provided with a light-emitting device, and an acute angle is formed between the region surface and the surface, away from the substrate, of the insulating sublayer;
forming a plurality of light-emitting devices on one side of the insulating layer, which is far away from the substrate base plate, wherein at least two light-emitting devices in the plurality of light-emitting devices are arranged on the surface of the area, where the light-emitting devices are to be arranged, of the plurality of bulges;
forming a plurality of thin film transistors between the base substrate and the insulating layer, the plurality of thin film transistors corresponding to the plurality of light emitting devices, respectively; the insulating layer is provided with a plurality of through holes, the through holes correspond to the bulges respectively, and each through hole penetrates through the corresponding bulge and the insulating sub-layer corresponding to the bulge and is positioned in the bottom area of the bulge; each light-emitting device comprises an anode layer, a light-emitting layer and a cathode layer which are arranged in a stacked mode, and the anode layers of the light-emitting devices arranged on the plurality of bulges are electrically connected with the corresponding thin film transistors through the corresponding through holes;
the insulating layer material layer comprises a first setting area, a second setting area and a third setting area, the first setting area corresponds to the top of a protrusion to be formed, the second setting area corresponds to the middle and the bottom of the protrusion to be formed, and the third setting area corresponds to an area where the protrusion is not to be formed;
the step of patterning the insulating material layer to form an insulating layer includes:
forming a photoresist layer on the surface of one side of the insulating material layer, which is far away from the substrate;
exposing and developing the photoresist layer through a half-tone mask plate to form the photoresist layer with patterns of a complete reserved area, a partial reserved area and an unreserved area; the completely reserved area of the photoresist layer with the pattern corresponds to a first set area of the insulating layer material layer, the partially reserved area corresponds to a second set area of the insulating layer material layer, and the unreserved area of the photoresist layer corresponds to a third set area of the insulating layer material layer;
performing first etching on the insulating material layer by using the photoresist layer with the pattern as a mask by adopting a dry etching process to reduce the thickness of a third set area of the insulating material layer;
removing the photoresist layer of the partial reserved area, and carrying out second etching on the insulating layer material layer subjected to the first etching by taking the photoresist layer with the pattern of the complete reserved area as a mask, so that the thickness of a second set area of the insulating layer material layer is reduced, and a plurality of bulges are formed; in the process of etching the second set area of the insulating material layer, correspondingly adjusting the etching rate according to the heights required by the middle part and the bottom part of the protrusion to be formed, so that the thicknesses of different positions of the second set area of the insulating material layer are reduced to different degrees, and the plurality of protrusions are formed;
and removing the photoresist layer of the complete reserved area to obtain the insulating layer comprising the plurality of bulges.
2. The method for manufacturing a display substrate according to claim 1, wherein a surface of a region of each of the protrusions on which the light emitting device is to be disposed is a flat surface; or,
the surface of each raised area where the light-emitting device is to be arranged is a curved surface, and the curved surface is arched relative to the surface of one side of the insulating sublayer, which is far away from the substrate base plate.
3. The method for manufacturing a display substrate according to claim 1, wherein the substrate includes a main body portion, and two bending portions located at two opposite ends of the main body portion and connected to the main body portion, the two bending portions are bent toward a same side of the main body portion, and a bending angle of each bending portion with respect to the main body portion is an acute angle;
the plurality of bulges are respectively arranged in the areas of the two bending parts;
in each of the protrusions, the surface of the region where the light emitting device is to be disposed is located on a side of the protrusion close to the main body portion.
4. The method according to claim 3, wherein an included angle between the surface of the region where the light emitting device is to be disposed and the surface of the insulating sub-layer away from the substrate base is smaller than or equal to a bending angle of the corresponding bending portion relative to the main body portion.
5. The method for manufacturing the display substrate according to claim 4, wherein an included angle between the surface of the region where the light emitting device is to be disposed and the surface of the insulating sub-layer away from the substrate is in a range of 30 ° to 60 °.
6. The method of claim 1, wherein the plurality of protrusions correspond to all sub-pixel regions of the display substrate, and all of the plurality of light emitting devices are disposed on the surface of the regions of the plurality of protrusions where the light emitting devices are to be disposed.
7. The method for manufacturing the display substrate according to claim 1, wherein an included angle between the surface of the region where the light emitting device is to be disposed and the surface of the insulating sub-layer away from the substrate is in a range of 10 ° to 40 °.
8. The method of manufacturing a display substrate according to claim 1, wherein each of the protrusions has a block shape corresponding to one of the sub-pixel regions; or,
each protrusion is strip-shaped and corresponds to one column of the sub-pixel regions.
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| CN110492014B (en) | 2019-08-30 | 2022-04-15 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| CN111129098A (en) * | 2019-12-30 | 2020-05-08 | 武汉天马微电子有限公司 | Organic light-emitting display panel and device |
| CN112038493B (en) * | 2020-08-17 | 2022-05-31 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN112420960B (en) * | 2020-11-19 | 2022-09-13 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN112542500B (en) * | 2020-12-03 | 2022-11-01 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN114695793A (en) * | 2022-03-24 | 2022-07-01 | 广州华星光电半导体显示技术有限公司 | Display panel |
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| KR102095910B1 (en) * | 2017-12-13 | 2020-04-01 | 엘지디스플레이 주식회사 | Curved display device and method for fabricating the same |
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| CN104282721A (en) * | 2013-07-01 | 2015-01-14 | 三星显示有限公司 | Organic light emitting diode display and pixel |
| CN108461526A (en) * | 2018-03-22 | 2018-08-28 | 上海天马有机发光显示技术有限公司 | Organic light emitting display panel and preparation method thereof, organic light-emitting display device |
| CN108598122A (en) * | 2018-04-28 | 2018-09-28 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof, display device |
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