CN110244215A - A kind of integrated security distance automaticly inspects the PCB encapsulation design method of function - Google Patents
A kind of integrated security distance automaticly inspects the PCB encapsulation design method of function Download PDFInfo
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- CN110244215A CN110244215A CN201910524276.2A CN201910524276A CN110244215A CN 110244215 A CN110244215 A CN 110244215A CN 201910524276 A CN201910524276 A CN 201910524276A CN 110244215 A CN110244215 A CN 110244215A
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- distance
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- pcb
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
- G01R31/1263—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
Abstract
The PCB for automaticly inspecting function the invention discloses a kind of integrated security distance encapsulates design method, comprising the following steps: S10 establishes the PCB encapsulation of high tension apparatus, and the parameter being provided with includes the body dimension of high tension apparatus;S20, setting electric clearance automaticly inspect, and originally increase the area device Jin Bu in vitro in high tension apparatus in TOP floor;S30, setting creepage distance automaticly inspect;The area cabling Jin Bu is arranged in all floor in plug-in unit device in this way;The area cabling Jin Bu is arranged in TOP floor in surface-mounted device in this way.PCB encapsulation design method of the invention can be realized safe distance and automaticly inspect, and can be called as standard component, significantly improves efficiency, avoids manually checking easy careless omission.
Description
Technical field
The invention belongs to field of electronic devices, it is related to the PCB encapsulation design that a kind of integrated security distance automaticly inspects function
Method.
Background technique
On printed circuit board (Printed Circuit Board, PCB), for high-pressure electronic component (36V and with
Upper voltage), need to meet certain safe distance between All other routes or other electronic components, safe distance includes electrical
Gap and creepage distance.Wherein, electric clearance refers to: two aerial shortest distances of electric conductor;Creepage distance refers to: two
The shortest distance of a electric conductor along insulating materials surface.Existing safe distance inspection is mainly completed by manual measurement, i.e.,
In PCB design, whether the distance between high-pressure electronic component meets safe distance requirement, can only be sentenced by manual measurement
It is disconnected.If high tension apparatus is more, manual measurement is time-consuming and laborious, and is easy to omit.
Although can be automaticly inspected by the way that Rule section realization safe distance is arranged in electronic circuit CAD software, (energy is real
Existing creepage distance automaticly inspects, and can not achieve electric clearance and automaticly inspects), but rule setting method is complicated, and different designs
The setting method of person is all different, not can guarantee regular accuracy, so and be of little use, it is main or by manual measurement method come
It checks.
To sum up, in PCB design link, there is no good automatic check methods, analyze root because having two: (1) PCB design CAD
Tool is two-dimentional software, can not identify the three-dimensional information of component, so electric equipment compartment can not be automaticly inspected by setting rule
Gap.(2) it is automaticly inspected although creepage distance can be realized by setting rule, setting acts only on the rule of high-pressure area, step
It is rapid complicated, and different designer's methods is different, not can guarantee accuracy, and be of little use.
Summary of the invention
To solve the above problems, the three-dimensional information of device is projected to two dimension by the present invention, safe distance is automaticly inspected into collection
It is encapsulated at into PCB, the standard PCB encapsulation that when PCB design calls just has the function of automaticly inspecting safe distance, both avoids people
Work inspection is time-consuming and laborious, and solves the problems, such as rule setting complexity and omit.
To achieve the above object, the technical solution of the present invention is as follows:
A kind of integrated security distance automaticly inspects the PCB encapsulation design method of function, comprising the following steps:
The PCB encapsulation of high tension apparatus is established, the parameter being provided with includes the body dimension of high tension apparatus;
Setting electric clearance automaticly inspects, and originally increases the area device Jin Bu in vitro in high tension apparatus in TOP floor;
Setting creepage distance automaticly inspects, and the area cabling Jin Bu is arranged.
Preferably, high tension apparatus body dimension value is the maximum value considered after tolerance.
Preferably, if electric clearance requires to be first distance, then the area device Jin Bu is that high tension apparatus originally equidistantly extends out in vitro
First distance forms an annular, and does not include high tension apparatus ontology.
It is plug-in unit device in the one aspect of the embodiment of the present invention, such as high tension apparatus, the area cabling Jin Bu is set in all floor;
The area the cabling Jin Bu is arranged at PCB package via;If creepage distance requires to be second distance, then the area cabling Jin Bu is through-hole
Second distance is equidistantly extended out outside, forms a figure being the same as through hole.
It is surface-mounted device in the another aspect of the embodiment of the present invention, such as high tension apparatus, the area cabling Jin Bu is set in TOP floor;
The area the cabling Jin Bu is arranged at PCB pad;If creepage distance requires to be second distance, then the area cabling Jin Bu is the weldering of through-hole
Second distance is equidistantly extended out outside disk, forms a figure identical with pad.
Preferably, the electric clearance, which is automaticly inspected, detects with creepage distance automatically by encapsulating in design software in PCB
Automatic prompt is arranged to realize.
Beneficial effects of the present invention are as follows: PCB through the invention encapsulates design method, and it is automatic to can be realized safe distance
It checks, including electric clearance and creepage distance;And can be called as standard component, efficiency is significantly improved, avoids manually checking
Readily careless omission.
Detailed description of the invention
Fig. 1 is the step that the integrated security distance of embodiment of the present invention method automaticly inspects the PCB encapsulation design method of function
Rapid flow chart;
Fig. 2 is the S20 that the integrated security distance of embodiment of the present invention method automaticly inspects the PCB encapsulation design method of function
The area device Jin Bu schematic diagram in step;
Fig. 3 is the S20 that the integrated security distance of embodiment of the present invention method automaticly inspects the PCB encapsulation design method of function
Device Jin Bu area's cloth member reminds schematic diagram in step;
Fig. 4 is that the integrated security distance of embodiment of the present invention method automaticly inspects walking for the PCB encapsulation design method of function
The area Xian Jinbu schematic diagram;
Fig. 5 is that the integrated security distance of embodiment of the present invention method automaticly inspects walking for the PCB encapsulation design method of function
The area Xian Jinbu cabling reminds schematic diagram;
Fig. 6 is the knot that the integrated security distance of embodiment of the present invention method automaticly inspects the PCB encapsulation design method of function
Fruit schematic diagram.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
On the contrary, the present invention covers any substitution done on the essence and scope of the present invention being defined by the claims, repairs
Change, equivalent method and scheme.Further, in order to make the public have a better understanding the present invention, below to of the invention thin
It is detailed to describe some specific detail sections in section description.Part without these details for a person skilled in the art
The present invention can also be understood completely in description.
It is the step that the integrated security distance of the embodiment of the present invention automaticly inspects the PCB encapsulation design method of function referring to Fig. 1
Rapid flow chart, comprising the following steps:
S10 establishes the PCB comprising high tension apparatus and encapsulates, and the parameter being provided with includes the body dimension of high tension apparatus;
S20, setting electric clearance automaticly inspect, and originally increase the area device Jin Bu in vitro in high tension apparatus in TOP floor;
S30, setting creepage distance automaticly inspect, and the area cabling Jin Bu is arranged.
Specific implementation is carried out for each step to be described below, referring to fig. 2 to Fig. 6:
In S10,10 size value of device body is the maximum value considered after tolerance, since PCB encapsulation includes pad
30/ through-hole 20, the essential informations such as device body 10, general tolerance is 0.5mm, by taking ontology 10 is having a size of 17mm*8mm as an example,
10 size value of ontology in S10 is 17.5mm*8.5mm.
In S20, if electric clearance requires to be first distance, then the area device Jin Bu 11 is equidistant outside high tension apparatus ontology 10
First distance is extended out, can be Xmm in specific application example, form an annular, and do not include high tension apparatus ontology 10, referring to fig. 2.
In specific application example, if high tension apparatus is plug-in unit device, the area cabling Jin Bu is set in all floor;Cabling prohibits cloth
Area is arranged at PCB package via;If creepage distance requires to be second distance, then the area cabling Jin Bu is that the is equidistantly extended out outside through-hole
Two distances form a figure being the same as through hole.
In other specific application examples, if high tension apparatus is surface-mounted device, the area cabling Jin Bu is set in TOP floor;Institute
The area cabling Jin Bu is stated to be arranged at PCB pad;If creepage distance requires to be second distance, then the area cabling Jin Bu is the pad of through-hole
Second distance is equidistantly extended out outside, forms a figure identical with pad.
Specific example, in S30, the area cabling Jin Bu 31 is arranged at PCB package via 20, if creepage distance requirement is
Second distance, then the area cabling Jin Bu 31 is that the pad 30 of through-hole 20 equidistantly extends out second distance outside, can be in specific application example
Ymm forms a figure identical with pad, referring to fig. 4.
Electric clearance, which automaticly inspects to detect automatically with creepage distance, is arranged automatic prompt by encapsulating in design software in PCB
It realizes.It will be appreciated by persons skilled in the art that at present there are mainly three types of the electronic circuit CAD softwares of industry prevalence:
The PADs of the Allgro of Cadence company, Mentor company, the Altium Designer of Altium company.The specific reality of three
Though existing mode has difference, principle is identical.
Specific example, Fig. 3 is the device for the PCB encapsulation using Allegro software design arc extinguishing capacitor RE1201
After the area Jin Bu 11 is arranged, in PCB layout, if there is other device bodies 10 enter the area device Jin Bu 11, software is automatically reminded to.
The following are a specific application example, Fig. 5 is to be encapsulated using the PCB of Allegro software design arc extinguishing capacitor RE1201
For the area cabling Jin Bu 31 be arranged after, PCB layout when, if there is All other routes enter the area cabling Jin Bu 31, software is automatic
It reminds.
To sum up, PCB encapsulation increases the area device Jin Bu 11 and the area cabling Jin Bu 31 according to the method described above, is able to achieve safe distance
It automaticly inspects, including electric clearance and creepage distance inspection.Finally obtained PCB packaging effect figure is referring to Fig. 6.
For the specific design requirement of electric clearance and creepage distance, (i.e. above-mentioned first distance X's and second distance Y is taken
Value), it can refer to table 1 (unit mm).
Table 1
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. the PCB encapsulation design method that a kind of integrated security distance automaticly inspects function, which comprises the following steps:
The PCB encapsulation of high tension apparatus is established, the parameter being provided with includes the body dimension of high tension apparatus;
Setting electric clearance automaticly inspects, and originally increases the area device Jin Bu in vitro in high tension apparatus in TOP floor;
Setting creepage distance automaticly inspects, and the area cabling Jin Bu is arranged.
2. integrated security distance according to claim 1 automaticly inspects the PCB encapsulation design method of function, feature exists
In high tension apparatus body dimension value is the maximum value considered after tolerance.
3. integrated security distance according to claim 1 automaticly inspects the PCB encapsulation design method of function, feature exists
In if electric clearance requires to be first distance, then the area device Jin Bu is that high tension apparatus originally equidistantly extends out first distance in vitro, is formed
One annular, and do not include high tension apparatus ontology.
4. integrated security distance according to claim 1 automaticly inspects the PCB encapsulation design method of function, feature exists
In if high tension apparatus is plug-in unit device, in all floor setting area cabling Jin Bu.
5. integrated security distance according to claim 4 automaticly inspects the PCB encapsulation design method of function, feature exists
In the area the cabling Jin Bu is arranged at PCB package via.
6. integrated security distance according to claim 4 automaticly inspects the PCB encapsulation design method of function, feature exists
In if creepage distance requires to be second distance, then the area cabling Jin Bu is equidistantly to extend out second distance outside through-hole, forms one and through-hole
Identical figure.
7. integrated security distance according to claim 1 automaticly inspects the PCB encapsulation design method of function, feature exists
In if high tension apparatus is surface-mounted device, in the TOP floor setting area cabling Jin Bu.
8. integrated security distance according to claim 7 automaticly inspects the PCB encapsulation design method of function, feature exists
In the area the cabling Jin Bu is arranged at PCB encapsulation welding tray.
9. integrated security distance according to claim 7 automaticly inspects the PCB encapsulation design method of function, feature exists
In if creepage distance requires to be second distance, then the area cabling Jin Bu is equidistantly to extend out second distance outside pad, forms one and pad
Identical figure.
10. integrated security distance according to any one of claims 1 to 9 automaticly inspects the PCB encapsulation design method of function,
It is characterized in that, the electric clearance automaticly inspects to detect automatically with creepage distance to be arranged certainly by encapsulating in design software in PCB
Dynamic prompt is realized.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112417806A (en) * | 2020-11-11 | 2021-02-26 | 无锡优波生命科技有限公司 | Design method of TCM component planar circuit diagram |
CN114364135A (en) * | 2022-01-12 | 2022-04-15 | 清能德创电气技术(北京)有限公司 | Method for constructing PCB packaging model |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05267459A (en) * | 1992-03-19 | 1993-10-15 | Fujitsu Ltd | Lsi chip |
CN102637226A (en) * | 2012-03-27 | 2012-08-15 | 中国人民解放军国防科学技术大学 | PCB (printed circuit board) packaging architecture method |
CN107275295A (en) * | 2017-06-05 | 2017-10-20 | 深圳市力生美半导体股份有限公司 | A kind of power IC device, method for packing and supply unit |
CN107391853A (en) * | 2017-07-25 | 2017-11-24 | 奇酷互联网络科技(深圳)有限公司 | PCB encapsulates design method and device |
CN109547220A (en) * | 2018-12-14 | 2019-03-29 | 深圳和而泰智能控制股份有限公司 | Telecommunication circuit is isolated |
-
2019
- 2019-06-17 CN CN201910524276.2A patent/CN110244215A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05267459A (en) * | 1992-03-19 | 1993-10-15 | Fujitsu Ltd | Lsi chip |
CN102637226A (en) * | 2012-03-27 | 2012-08-15 | 中国人民解放军国防科学技术大学 | PCB (printed circuit board) packaging architecture method |
CN107275295A (en) * | 2017-06-05 | 2017-10-20 | 深圳市力生美半导体股份有限公司 | A kind of power IC device, method for packing and supply unit |
CN107391853A (en) * | 2017-07-25 | 2017-11-24 | 奇酷互联网络科技(深圳)有限公司 | PCB encapsulates design method and device |
CN109547220A (en) * | 2018-12-14 | 2019-03-29 | 深圳和而泰智能控制股份有限公司 | Telecommunication circuit is isolated |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112417806A (en) * | 2020-11-11 | 2021-02-26 | 无锡优波生命科技有限公司 | Design method of TCM component planar circuit diagram |
CN112417806B (en) * | 2020-11-11 | 2023-12-19 | 无锡优波生命科技有限公司 | TCM element plane circuit diagram design method |
CN114364135A (en) * | 2022-01-12 | 2022-04-15 | 清能德创电气技术(北京)有限公司 | Method for constructing PCB packaging model |
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