CN110235030B - 相机模块及其制造方法以及电子装置 - Google Patents

相机模块及其制造方法以及电子装置 Download PDF

Info

Publication number
CN110235030B
CN110235030B CN201880007558.9A CN201880007558A CN110235030B CN 110235030 B CN110235030 B CN 110235030B CN 201880007558 A CN201880007558 A CN 201880007558A CN 110235030 B CN110235030 B CN 110235030B
Authority
CN
China
Prior art keywords
substrate
lens
camera module
lenses
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880007558.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN110235030A (zh
Inventor
山本笃志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Semiconductor Solutions Corp
Original Assignee
Sony Semiconductor Solutions Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Semiconductor Solutions Corp filed Critical Sony Semiconductor Solutions Corp
Publication of CN110235030A publication Critical patent/CN110235030A/zh
Application granted granted Critical
Publication of CN110235030B publication Critical patent/CN110235030B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0043—Inhomogeneous or irregular arrays, e.g. varying shape, size, height
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0075—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means for altering, e.g. increasing, the depth of field or depth of focus
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)
  • Cameras In General (AREA)
  • Blocking Light For Cameras (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Optical Filters (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN201880007558.9A 2017-01-26 2018-01-16 相机模块及其制造方法以及电子装置 Active CN110235030B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-011990 2017-01-26
JP2017011990A JP6918409B2 (ja) 2017-01-26 2017-01-26 カメラモジュールおよびその製造方法、並びに電子機器
PCT/JP2018/000955 WO2018139260A1 (en) 2017-01-26 2018-01-16 Camera module, manufacturing method therefor, and electronic apparatus

Publications (2)

Publication Number Publication Date
CN110235030A CN110235030A (zh) 2019-09-13
CN110235030B true CN110235030B (zh) 2022-03-18

Family

ID=61163770

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880007558.9A Active CN110235030B (zh) 2017-01-26 2018-01-16 相机模块及其制造方法以及电子装置

Country Status (5)

Country Link
US (1) US20190369370A1 (enExample)
JP (1) JP6918409B2 (enExample)
KR (1) KR102511467B1 (enExample)
CN (1) CN110235030B (enExample)
WO (1) WO2018139260A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11128817B2 (en) * 2019-11-26 2021-09-21 Microsoft Technology Licensing, Llc Parallax correction using cameras of different modalities
US11156826B2 (en) * 2019-12-11 2021-10-26 Visera Technologies Company Limited Optical devices
CN113109978B (zh) * 2019-12-25 2025-10-14 舒子轩 一种外置式闪光灯及拍摄系统
WO2021147097A1 (zh) * 2020-01-23 2021-07-29 杭州芯格微电子有限公司 相机模块
CN111447352B (zh) * 2020-05-19 2021-08-31 Oppo广东移动通信有限公司 支架、摄像组件及终端设备
CN214669574U (zh) * 2020-09-14 2021-11-09 神盾股份有限公司 具有杂散光导离结构的tof光学感测模组
KR20220043556A (ko) * 2020-09-29 2022-04-05 에스케이하이닉스 주식회사 이미지 센싱 장치
JP2022060730A (ja) * 2020-10-05 2022-04-15 ソニーグループ株式会社 半導体装置、光学構造物
CN112596068B (zh) * 2020-10-28 2025-01-28 深圳奥锐达科技有限公司 一种采集器、距离测量系统及电子设备
US12216383B2 (en) 2022-09-29 2025-02-04 Nichia Corporation Light emitting module
CN116203657A (zh) * 2023-02-10 2023-06-02 安徽省东超科技有限公司 等效负折射率平板透镜及其制备方法
US12442509B2 (en) 2023-09-20 2025-10-14 Nichia Corporation Light-emitting module with cover member and light-transmissive member having higher hardness than cover member

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012014155A1 (fr) * 2010-07-26 2012-02-02 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif optique, boitier a l'echelle d'une tranche pour un tel dispositif optique et procede correspondant
CN102411185A (zh) * 2010-09-20 2012-04-11 采钰科技股份有限公司 透镜模块及其形成方法
CN102598852A (zh) * 2009-10-30 2012-07-18 日本电气株式会社 发光元件、光源装置和投影显示装置
CN105612619A (zh) * 2013-09-18 2016-05-25 索尼公司 成像器件、制造装置、制造方法以及电子装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009279790A (ja) 2008-05-20 2009-12-03 Sharp Corp レンズ及びその製造方法、並びに、レンズアレイ、カメラモジュール及びその製造方法、電子機器
JP2010204632A (ja) 2009-02-06 2010-09-16 Fujifilm Corp ウェハレベルレンズアレイの製造方法、ウェハレンズアレイ、レンズモジュール及び撮像ユニット
JP2010256563A (ja) 2009-04-23 2010-11-11 Sharp Corp レンズアレイおよび当該レンズアレイの製造方法、並びに、その利用
JP2011138089A (ja) 2010-01-04 2011-07-14 Fujifilm Corp ウェハレベルレンズアレイ、レンズモジュール及び撮像ユニット
JP2013001091A (ja) 2011-06-21 2013-01-07 Konica Minolta Advanced Layers Inc 光学素子の製造方法
JP2013044893A (ja) * 2011-08-23 2013-03-04 Ricoh Co Ltd 複眼撮像装置及び距離画像取得装置
US9699379B1 (en) * 2012-09-17 2017-07-04 Amazon Technologies, Inc. Camera arrangements for wide-angle imaging
SG11201506393YA (en) * 2013-02-22 2015-09-29 Heptagon Micro Optics Pte Ltd Optical imaging apparatus, in particular for computational imaging, having further functionality
JP6257285B2 (ja) 2013-11-27 2018-01-10 キヤノン株式会社 複眼撮像装置
JP6376920B2 (ja) * 2014-03-07 2018-08-22 キヤノン株式会社 複眼撮像装置
KR102269599B1 (ko) * 2014-04-23 2021-06-25 삼성전자주식회사 직경이 상이한 렌즈 소자들을 구비하는 촬상 장치
US9553126B2 (en) * 2014-05-05 2017-01-24 Omnivision Technologies, Inc. Wafer-level bonding method for camera fabrication
US9774770B2 (en) * 2014-10-31 2017-09-26 Everready Precision Ind. Corp. Optical apparatus
DE102015002536B4 (de) * 2015-02-28 2021-10-28 Schölly Fiberoptic GmbH Optikanordnung, Endoskop und korrespondierendes Verfahren zur Fertigung
CN114363484A (zh) * 2020-10-12 2022-04-15 南昌欧菲光电技术有限公司 摄像头模组及电子产品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102598852A (zh) * 2009-10-30 2012-07-18 日本电气株式会社 发光元件、光源装置和投影显示装置
WO2012014155A1 (fr) * 2010-07-26 2012-02-02 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif optique, boitier a l'echelle d'une tranche pour un tel dispositif optique et procede correspondant
CN102411185A (zh) * 2010-09-20 2012-04-11 采钰科技股份有限公司 透镜模块及其形成方法
CN105612619A (zh) * 2013-09-18 2016-05-25 索尼公司 成像器件、制造装置、制造方法以及电子装置

Also Published As

Publication number Publication date
JP6918409B2 (ja) 2021-08-11
KR102511467B1 (ko) 2023-03-16
KR20190107678A (ko) 2019-09-20
JP2018120113A (ja) 2018-08-02
US20190369370A1 (en) 2019-12-05
CN110235030A (zh) 2019-09-13
WO2018139260A1 (en) 2018-08-02

Similar Documents

Publication Publication Date Title
CN110235030B (zh) 相机模块及其制造方法以及电子装置
CN110431666B (zh) 相机模块及其制造方法以及电子装置
CN110235041B (zh) 相机模块和电子装置
CN110192128B (zh) 相机模块、其制造方法和电子设备
CN110199215B (zh) 堆叠透镜结构、相机模块和电子装置
CN110431460A (zh) 层叠透镜结构、层叠透镜结构的制造方法和电子设备
TWI741108B (zh) 透鏡模組，生產透鏡模組之方法，成像裝置及電子裝置
US20200004039A1 (en) Camera module, method of manufacturing the same, and electronic apparatus
WO2019193965A1 (ja) 積層レンズ構造体およびその製造方法、並びに、電子機器
CN110087870B (zh) 层叠透镜结构、其制造方法和电子设备

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant