KR102511467B1 - 카메라 모듈 및 그 제조 방법, 및 전자기기 - Google Patents

카메라 모듈 및 그 제조 방법, 및 전자기기 Download PDF

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Publication number
KR102511467B1
KR102511467B1 KR1020197021376A KR20197021376A KR102511467B1 KR 102511467 B1 KR102511467 B1 KR 102511467B1 KR 1020197021376 A KR1020197021376 A KR 1020197021376A KR 20197021376 A KR20197021376 A KR 20197021376A KR 102511467 B1 KR102511467 B1 KR 102511467B1
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South Korea
Prior art keywords
lens
substrate
camera module
light
holes
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Korean (ko)
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KR20190107678A (ko
Inventor
아츠시 야마모토
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소니 세미컨덕터 솔루션즈 가부시키가이샤
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0043—Inhomogeneous or irregular arrays, e.g. varying shape, size, height
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0075—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means for altering, e.g. increasing, the depth of field or depth of focus
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)
  • Cameras In General (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Blocking Light For Cameras (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Optical Filters (AREA)
KR1020197021376A 2017-01-26 2018-01-16 카메라 모듈 및 그 제조 방법, 및 전자기기 Active KR102511467B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017011990A JP6918409B2 (ja) 2017-01-26 2017-01-26 カメラモジュールおよびその製造方法、並びに電子機器
JPJP-P-2017-011990 2017-01-26
PCT/JP2018/000955 WO2018139260A1 (en) 2017-01-26 2018-01-16 Camera module, manufacturing method therefor, and electronic apparatus

Publications (2)

Publication Number Publication Date
KR20190107678A KR20190107678A (ko) 2019-09-20
KR102511467B1 true KR102511467B1 (ko) 2023-03-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197021376A Active KR102511467B1 (ko) 2017-01-26 2018-01-16 카메라 모듈 및 그 제조 방법, 및 전자기기

Country Status (5)

Country Link
US (1) US20190369370A1 (enExample)
JP (1) JP6918409B2 (enExample)
KR (1) KR102511467B1 (enExample)
CN (1) CN110235030B (enExample)
WO (1) WO2018139260A1 (enExample)

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US11128817B2 (en) * 2019-11-26 2021-09-21 Microsoft Technology Licensing, Llc Parallax correction using cameras of different modalities
US11156826B2 (en) * 2019-12-11 2021-10-26 Visera Technologies Company Limited Optical devices
CN113109978B (zh) * 2019-12-25 2025-10-14 舒子轩 一种外置式闪光灯及拍摄系统
WO2021147097A1 (zh) * 2020-01-23 2021-07-29 杭州芯格微电子有限公司 相机模块
CN111447352B (zh) * 2020-05-19 2021-08-31 Oppo广东移动通信有限公司 支架、摄像组件及终端设备
CN214669574U (zh) * 2020-09-14 2021-11-09 神盾股份有限公司 具有杂散光导离结构的tof光学感测模组
KR20220043556A (ko) * 2020-09-29 2022-04-05 에스케이하이닉스 주식회사 이미지 센싱 장치
JP2022060730A (ja) * 2020-10-05 2022-04-15 ソニーグループ株式会社 半導体装置、光学構造物
KR102893059B1 (ko) * 2020-10-15 2025-12-01 삼성전자주식회사 카메라 모듈 및 이를 포함하는 전자 장치
CN112596068B (zh) * 2020-10-28 2025-01-28 深圳奥锐达科技有限公司 一种采集器、距离测量系统及电子设备
US12216383B2 (en) 2022-09-29 2025-02-04 Nichia Corporation Light emitting module
CN116203657A (zh) * 2023-02-10 2023-06-02 安徽省东超科技有限公司 等效负折射率平板透镜及其制备方法
US12442509B2 (en) 2023-09-20 2025-10-14 Nichia Corporation Light-emitting module with cover member and light-transmissive member having higher hardness than cover member

Citations (3)

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JP2013044893A (ja) 2011-08-23 2013-03-04 Ricoh Co Ltd 複眼撮像装置及び距離画像取得装置
JP2015181214A (ja) * 2014-03-07 2015-10-15 キヤノン株式会社 複眼撮像装置
US20150318326A1 (en) * 2014-05-05 2015-11-05 Omnivision Technologies, Inc. Wafer-Level Bonding Method For Camera Fabrication

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JP2009279790A (ja) 2008-05-20 2009-12-03 Sharp Corp レンズ及びその製造方法、並びに、レンズアレイ、カメラモジュール及びその製造方法、電子機器
JP2010204632A (ja) 2009-02-06 2010-09-16 Fujifilm Corp ウェハレベルレンズアレイの製造方法、ウェハレンズアレイ、レンズモジュール及び撮像ユニット
JP2010256563A (ja) 2009-04-23 2010-11-11 Sharp Corp レンズアレイおよび当該レンズアレイの製造方法、並びに、その利用
EP2496052A1 (en) * 2009-10-30 2012-09-05 Nec Corporation Light emitting element, light source device, and projection display device
JP2011138089A (ja) 2010-01-04 2011-07-14 Fujifilm Corp ウェハレベルレンズアレイ、レンズモジュール及び撮像ユニット
FR2963114B1 (fr) * 2010-07-26 2013-05-10 Commissariat Energie Atomique Dispositif optique, boitier a l'echelle d'une tranche pour un tel dispositif optique et procede correspondant.
US8000041B1 (en) * 2010-09-20 2011-08-16 Visera Technologies Company Limited Lens modules and fabrication methods thereof
JP2013001091A (ja) 2011-06-21 2013-01-07 Konica Minolta Advanced Layers Inc 光学素子の製造方法
US9699379B1 (en) * 2012-09-17 2017-07-04 Amazon Technologies, Inc. Camera arrangements for wide-angle imaging
SG11201506393YA (en) * 2013-02-22 2015-09-29 Heptagon Micro Optics Pte Ltd Optical imaging apparatus, in particular for computational imaging, having further functionality
JP6163398B2 (ja) * 2013-09-18 2017-07-12 ソニーセミコンダクタソリューションズ株式会社 撮像素子、製造装置、製造方法
JP6257285B2 (ja) 2013-11-27 2018-01-10 キヤノン株式会社 複眼撮像装置
KR102269599B1 (ko) * 2014-04-23 2021-06-25 삼성전자주식회사 직경이 상이한 렌즈 소자들을 구비하는 촬상 장치
US9774770B2 (en) * 2014-10-31 2017-09-26 Everready Precision Ind. Corp. Optical apparatus
DE102015002536B4 (de) * 2015-02-28 2021-10-28 Schölly Fiberoptic GmbH Optikanordnung, Endoskop und korrespondierendes Verfahren zur Fertigung
CN114363484A (zh) * 2020-10-12 2022-04-15 南昌欧菲光电技术有限公司 摄像头模组及电子产品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013044893A (ja) 2011-08-23 2013-03-04 Ricoh Co Ltd 複眼撮像装置及び距離画像取得装置
JP2015181214A (ja) * 2014-03-07 2015-10-15 キヤノン株式会社 複眼撮像装置
US20150318326A1 (en) * 2014-05-05 2015-11-05 Omnivision Technologies, Inc. Wafer-Level Bonding Method For Camera Fabrication

Also Published As

Publication number Publication date
WO2018139260A1 (en) 2018-08-02
JP6918409B2 (ja) 2021-08-11
KR20190107678A (ko) 2019-09-20
JP2018120113A (ja) 2018-08-02
CN110235030B (zh) 2022-03-18
US20190369370A1 (en) 2019-12-05
CN110235030A (zh) 2019-09-13

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