CN110233119A - Substrate board treatment - Google Patents
Substrate board treatment Download PDFInfo
- Publication number
- CN110233119A CN110233119A CN201910117660.0A CN201910117660A CN110233119A CN 110233119 A CN110233119 A CN 110233119A CN 201910117660 A CN201910117660 A CN 201910117660A CN 110233119 A CN110233119 A CN 110233119A
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- Prior art keywords
- top surface
- heater
- unit
- component
- substrate
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention relates to a kind of substrate board treatments.Top surface unit 83 is detachably constituted relative to shell.Unit heater 115 is mounted on top surface unit 83 using bearing part 105 and hook movable part 107, or from 83 removal of top surface unit.Therefore, because can be by the unit heater 115 comprising encapsulation heater and wiring from the easily removal of top surface unit 83, so top surface unit 83 can be made to clean using medical fluid etc..As a result, in maintenance, 91 removal of top surface component that can will be provided with exhaust outlet 49 or internal exhaust tube 113 that sublimate is easiest to accumulation is immersed in medical fluid etc. and is cleaned, so as to make to encapsulate easily cleaning around heater.
Description
Technical field
The present invention relates to a kind of substrate board treatments, show to semiconductor wafer, base-board of liquid crystal display, plasma
Device substrate, organic EL (Electroluminescence, electroluminescence) substrate, FED (Field Emission
Display, Field Emission Display) with substrate, optical display unit substrate, substrate for magnetic disc, magneto-optic base-board for plate, light shield base
The various substrates such as plate, substrate used for solar batteries (hreinafter referred to as substrate) are heat-treated.
Background technique
In the past, as this device, there are following devices, have: heat treatment plate adds placed substrate
Heat；Cover member surrounds the top of heat treatment plate, is configured to go up and down relative to heat treatment plate, be formed by heat treatment plate institute
The heat treatment environment of cause；Shell surrounds heat treatment plate and cover member；Top surface and the heat treatment of cover member is arranged in top plate
Between the upper surface of plate；And position regulating member, adjust the interval (example of the lower surface of top plate and the upper surface of heat treatment plate
Such as, referring to patent document 1).In addition, though it is not shown, but in cover member, exhaust outlet is formed at its position, it will be hot
External exhaust gas of the gas of processing environment from exhaust outlet to shell.
Recently, have for microfabrication processing procedure and forming the feelings for being for example referred to as the lower membrane of coating carbon film on substrate
Condition.In order to generate the lower membrane, to be higher than the high temperature (such as 300 of the heat treatment (for example, 100~180 DEG C) carried out all the time
~500 DEG C) substrate is heat-treated, but the gas comprising sublimate can be generated at this time.Therefore, by non-cohesive with sublimate
The mode of exhaust outlet or cover member the cover member comprising exhaust outlet upper surface install heater, to cover member into
Row heating, to inhibit sublimate to the attachment of exhaust outlet or cover member etc..
[existing technical literature]
[patent document]
[patent document 1]
Japanese Patent Laid-Open 2000-3843 bulletin
Summary of the invention
[problems to be solved by the invention]
However, being had the following problems with the previous example of this composition.
That is, previous device can be described as being heated using heater, sublimate gradually adheres to and is deposited in
Exhaust outlet or cover member.Generating accumulated sublimate reduces exhaust efficiency, or fall substrate during processing and
Pollute the problem of substrate etc..Therefore, it is necessary to regularly safeguarded and clean cover member, but due to pacifying in cover member
It is filled with heater, even if being allowed to clean so medical fluid etc. is also difficult to be utilized from shell removal in cover member.In addition, due to for than
Previous heat treatment at higher temperature, thus be screwed in the heater of cover member due to the ablation of screw and can not easily removal,
The situation also improves difficulty.In addition, this problem is different from being there is the referred to as coating substrate of lower membrane of carbon film
It can also be generated in substrate.
The present invention is in light of this situation and completes, and it is an object of the present invention to provide a kind of can will be around heater in maintenance
The substrate board treatment for easily cleaning.
[technical means to solve problem]
The present invention is constituted to reach this purpose using following.
That is, the invention recorded in technical solution 1 is a kind of substrate board treatment, substrate is heat-treated, and
It is characterized in that having: the substrate for being positioned in upper surface is heated and is heat-treated by heat treatment plate；Shell covers the heat
The top of processing board forms the heat treatment environment caused by heat treatment plate；Top surface unit constitutes the top surface of the shell, is formed
Have the exhaust outlet of the gas discharge of the heat treatment environment；And unit heater, the top surface is heated；The top surface is single
Member is detachably constituted relative to the shell, and the unit heater includes matching for heater and the heater
Line has for installing the unit heater relative to the top surface unit, and from the top surface unit by the heating
The handling part of device unit removal.
[effect, effect] is set relative to covering by heat treatment plate according to the invention recorded in technical solution 1, top surface unit
Shell for the heat treatment environment of high temperature is detachably constituted.Unit heater is mounted on top surface unit using handling part, or
From top surface unit removal.Therefore, because the unit heater comprising heater and wiring easily can be unloaded from top surface unit
It removes, so top surface unit can be made to clean using medical fluid etc..As a result, can make to easily clean around heater in maintenance
Change.
In addition, the top surface unit has in the present invention, it is preferred to be: top surface component is formed with the exhaust outlet；Axis
Portion is arranged in the top surface component；And pressing component, an end side Oscillating is dynamic to be mounted on the axle portion freely, by the heating
Device unit is clamped by the upper surface of the top surface component；The handling part is made of fastener, and the fastener has: supporting part
Part, the another side that the pressing component is set and one in the top surface component；And hook movable part, it is arranged described
Another in the another side of pressing component and the top surface component, and there is the hook for being stuck in the bearing part and right
It is described to be hooked into row operation the hook is stuck in the bearing part or bar (technology by the hook from the bearing part removal
Scheme 2).
Unit heater is clamped using pressing component by the top surface component of top surface unit.Pressing component and top surface component utilize
Fastener including bearing part and hook movable part is detachably installed.Therefore, by by the hook of fastener from bearing part
The operation of removal can be discharged unit heater from using the clamping of pressing component.As a result, it is possible to avoid by because spiral shell consolidates institute
The ablation of cause and can not by the state of affairs of heater removal, so as to easily by heater together with unit heater from top surface
Unit removal.
In addition, in the present invention, it is preferred to be to be also equipped with: more supporting pins erect the upper table that the top surface component is arranged in
Face；And cover, have the multiple openings for being formed in position corresponding with the more supporting pins, and be used to cover the top
The top of face component；And the more supporting pins form the perforation parallel relative to the face of the top surface component on top
Mouthful, the cover so that split pin by being inserted through the state phases of the openings of the supporting pin of the opening of the cover
The top surface component is fixed, and covers the unit heater (technical solution 3).
The cover of unit heater is covered by by split pin removal, and from erectting the more branch that top surface component is arranged in
Support pin removal.Therefore, it can be avoided since the ablation caused by spiral shell is solid can not be by the state of affairs of cover removal, so as to hold
Changing places exposes unit heater.
In addition, the top surface component has internal exhaust tube, one end and institute in upper surface in the present invention, it is preferred to be
Exhaust outlet connection connection is stated, the outside of another side towards the shell extends and is arranged, and the unit heater has: heating
Device installing component is installed with the heater；And exhaust pipe storage opening, it is formed in the heater installation portion part, and wrap
Enclose the side from the upper surface of the top surface component internal exhaust tube outstanding；The heater is along than the heater
More outward edge side and the exhaust pipe store the outside of opening and configure (technical solution 4) in the center of installing component.
Heater along the center than heater installation portion part, more outward store the outside of opening with exhaust pipe and match by edge side
It sets.Therefore, the entirety of top surface component and the internal exhaust tube for being formed in top surface component can be heated.It therefore, can be effective
Inhibiting to rate the temperature of exhaust reduces.
In addition, the substrate, which is formed, generates covering for the gas comprising sublimate by heating in the present invention, it is preferred to be
Film (technical solution 5).
Even if by had generate comprising sublimate gas overlay film substrate for process object, also can by safeguard come
It is easy the removal of accumulated sublimate.Therefore, suitable to the heat treatment of this substrate.
[The effect of invention]
Substrate board treatment according to the present invention, top surface unit are set as at the heat of high temperature relative to covering by heat treatment plate
The shell of reason environment is detachably constituted.Unit heater is mounted on top surface unit using handling part, or unloads from top surface unit
It removes.Therefore, because can be by the unit heater comprising heater and wiring from top surface unit easily removal, so being capable of benefit
Top surface unit is cleaned with medical fluid etc..As a result, easily cleaning around heater can be made in maintenance.
Detailed description of the invention
Fig. 1 is the schematic configuration diagram for indicating the overall structure of substrate board treatment of embodiment.
Fig. 2 is the top view of movable top plate.
Fig. 3 is the longitudinal section view indicated near the front end of lifter pin.
Fig. 4 is the perspective view for indicating the state for pulling out top surface unit from shell.
Fig. 5 is the perspective view for indicating top surface unit.
Fig. 6 is indicated the perspective view of the state of cover removal from top surface unit.
Fig. 7 is indicated the perspective view of the state of unit heater removal from top surface unit.
Fig. 8 is the top view for indicating the installation condition of the heater in unit heater.
Specific embodiment
Hereinafter, being illustrated referring to attached drawing to one embodiment of the invention.
Fig. 1 is the schematic configuration diagram for indicating the overall structure of substrate board treatment of embodiment, and Fig. 2 is bowing for movable top plate
View, Fig. 3 are the longitudinal section views indicated near the front end of lifter pin.
The substrate board treatment 1 of embodiment is to implement heat-treating apparatus to substrate W.Specifically, for microfabrication
Processing procedure, for example, heat treatment when being formed the lower membrane for being referred to as coated with carbon film.In order to generate the lower membrane, with 300~
500 DEG C or so of high temperature is heat-treated.
Substrate board treatment 1 has lower raft 3, water-cooled bottom plate 5, heat treatment plate 7, movable top plate unit 9, lifter pin
Unit 11, shell 13 and baffle plate unit 15.
The substrate board treatment 1 moves in substrate W from the carrying arm 17 for being adjacent to configuration, after implementing heat treatment, will handle
The substrate W finished is moved out using carrying arm 17.
Lower raft 3 is erect in upper surface and is provided with pillar 19, configures water-cooled bottom plate 5 on the top of the pillar 19.
Water-cooled bottom plate 5 inhibits the heat of heat treatment plate 7 to transmit downwards.Specifically, water-cooled bottom plate 5 is for example in inside throughout whole
It is formed with the refrigerant flow path 21 for the refrigerant that can circulate.In the refrigerant flow path 21, such as circulates and cool down as refrigerant
Water.The cooling water such as temperature is adjusted to 20 DEG C.
Heat treatment plate 7 is overlooked in rounded shape.Its diameter is slightly bigger than the diameter of substrate W.Heat treatment plate 7 it is built-in it is not shown
The heating devices such as heater, for example, being heated in such a way that surface temperature becomes 400 DEG C.Heat treatment plate 7 is existed by setting
Pillar 23 between its lower surface and the upper surface of water-cooled bottom plate 5, is matched with the state left upwards from water-cooled bottom plate 5
It sets.Heat treatment plate 7 forms openings 25 in the position with each vertex correspondence of equilateral triangle under vertical view.
Movable top plate unit 9 is set up in heat treatment plate 7.Movable top plate unit 9 has lifting bottom plate 27, elevating mechanism
29, pillar 31 and movable top plate 33.
Lifting bottom plate 27 has the opening avoided with the interference of pillar 23 or following lifter pins 41.Elevating mechanism 29 is for example
It is made of cylinder.Elevating mechanism 29 is so that the posture contiguity for being partially toward top with action shaft is mounted on water-cooled bottom plate 5.
The elevating mechanism 29 can be fixed at an arbitrary position by the height of the front end of action shaft.The action shaft of elevating mechanism 29 is linked to
Go up and down the bottom surface of bottom plate 27.If going up and down the action shaft of elevating mechanism 29, the height position of lifting bottom plate 27 can be changed
It sets.The surface on it of bottom plate 27 is gone up and down, such as erects and 4 pillars 31 is set.Movable top is installed in the upper end of 4 pillars 31
Plate 33.
As shown in Fig. 2, movable top plate 33, which is formed under overlooking in central portion, is open 35.Opening 35 forms get Bi Ji under overlooking
The diameter of plate W is small.The movable top plate 33 is by 29 actuation of elevating mechanism, with lifting 27 1 lifting of bottom plate.Movable top plate 33
Lifting position bridgees across down position when being heat-treated to substrate W, moves with lifting position when moving in substrate W.This
Outside, the upper surface of down position preferable substrate W is about 10mm at a distance from the lower surface of movable top plate 33.The reason is that logical
The experiment for crossing inventor et al. learns, the inner evenness of the Temperature Distribution on surface in order to improve substrate W, preferably should be away from
From.
Movable top plate 33 in its diagonal length formed longer than the diameter of heat treatment plate 7 it is rectangular-shaped.4 pillars 31 are each
From upper end be linked to movable top plate 33 lower surface in quadrangle.The quadrangle of movable top plate 33 is in far from bowing as heat source
Depending on the position of the heat treatment plate 7 of round.Therefore, movable top plate 33 is heated even by the radiant heat of heat treatment plate 7, it can also
Heat is set to be difficult to be transferred to pillar 31.Therefore, elevating mechanism 29 is not easily susceptible to the influence of heat, is able to suppress the generation of failure.
The movable top plate 33 preferably comprises the alloy of ceramics or metal and ceramics.Even if carrying out the heat of high temperature as a result,
Processing, the deformation caused by capable of also preventing because of heat.
Lifter pin unit 11 has driving mechanism 37, lifting ring 39 and 3 lifter pins 41.In addition, lifter pin 41 is because of figure
The relationship shown only describes 2.
Driving mechanism 37 is for example made of cylinder.Driving mechanism 37 so that with its action shaft be partially toward lower section, and
Opposite side is set to be close contact in the state installation of the lower surface of water-cooled bottom plate 5.In the lower part of action shaft, link lifting ring 39.?
3 lifter pins 41 are arranged in the upper surface of lifting ring 39, setting.Driving mechanism 39 can bridge across 3 lifter pins 41 from heat treatment
The upper surface of plate 7 upwards delivery position (double dot dash line in Fig. 1) outstanding, with 3 lifter pins 41 from the upper of heat treatment plate 7
Two positions of the processing position (solid line in Fig. 1) that surface is sunk to downwards adjust the height and position of its action shaft.3 liftings
Pin 41 is inserted through the openings 25 for being formed in 3 positions of heat treatment plate 7.
Lifter pin 41 is preferably constituted in the manner shown in fig. 3.Lifter pin 41 has core 41a, outer cylinder 41b, Yi Jishi
English ball 41c.Core 41a is that the front end 41e on the top in main part 41d forms smaller than main part 41d diameter.Outer cylinder
41b is to be formed as the internal diameter slightly bigger than the outer diameter of quartz ball 41c other than front end.The front end of outer cylinder 41b is formed as comparing stone
The small internal diameter of the diameter of English ball 41c.Quartz ball 41c is that its diameter forms slightly smaller than front end 41e.Therefore, will be quartzy
Ball 41c is positioned in the state of the upper surface of front end 41e, if covering outer cylinder 41b, 1/3 as quartz ball 41c is left
The right side is from outer cylinder 41b state outstanding.In this state, by being pressed into engagement pin 41g to perforation core 41d's and outer cylinder 41b
Openings 41f, and outer cylinder 41b is fixed on to core 41a together with quartz ball 41c and constitutes lifter pin 41.In addition, quartz ball 41c
Component in addition is made of metal.
Although preferably quartzy as the material for being resistant to hot environment, if it is considered that intensity or cost, then being difficult to make
The generally quartz system of lifter pin 41.Therefore, as described above, by only making the quartz ball 41c quartz system of front end then can
Inhibit cost.In addition, it is quartzy due to highly slightly low compared with as the monocrystalline silicon of the material of substrate W, so wounded substrate W
A possibility that lower surface, is lower, moreover, because being spherical so can make contact area minimum limit.
Shell 13 covers the top of heat treatment plate 7, forms the heat treatment environment caused by heat treatment plate 7.Shell 13 is at it
Carrying-in/carrying-out mouth 43 is formed on one side.Carrying-in/carrying-out mouth 43 is from the height and position upward opening near the upper surface of heat treatment plate 7.
Carrying arm 17 carries out the carrying-in/carrying-out of substrate W by the carrying-in/carrying-out mouth 43.
Baffle plate unit 15 is set up in carrying-in/carrying-out mouth 43.Baffle plate unit 15 has driving mechanism 45 and baffle main body
47.Driving mechanism 45 is installed on water-cooled bottom plate 5 with the posture for being partially toward top of its action shaft, by a part contiguity.?
The top of action shaft links baffle main body 47.If driving mechanism 45 makes actuation elongate axis, baffle main body 47 rise and
Carrying-in/carrying-out mouth 43 is closed (solid line shown in FIG. 1), if driving mechanism 45 shrinks action shaft, under baffle main body 47
It drops and the opening of carrying-in/carrying-out mouth 43 (double dot dash line shown in FIG. 1).
Shell 13 forms exhaust outlet 49 in its top surface.Exhaust outlet 49 is connected to exhaust pipe 51.The exhaust of shell 13
Mouth 49 and the interval of the upper surface of heat treatment plate 7 are, for example, 30mm or so.Exhaust pipe 51 is connected to exhaust equipment 52.Exhaust
Equipment 52 by can by from external instruction adjustment extraction flow in a manner of constituted.In a part of exhaust pipe 51 via taking
Sample port 51a configures pressure sensing cell 53.The pressure sensing cell 53 detects the pressure at expulsion in exhaust pipe 51.
Encapsulation heater 55 is arranged in the upper surface of top surface in shell 13.The encapsulation heater 55 is to shell 13 or exhaust pipe
51 are heated, and when the gas comprising sublimate is contacted with shell 13, prevent gas cooling and sublimate is attached to shell 13
Inner wall.
In addition, the encapsulation heater 55 is equivalent to " heater " in the present invention.
The not shown CPU of control unit 61 (Central Processing Unit, central processing unit) or memory structure
At.Control unit 61 carries out temperature control, the driving of the elevating control of movable top plate unit 9, lifter pin unit 11 of heat treatment plate 7
Control, the open and close control of baffle plate unit 15, the temperature control for encapsulating heater 55, the gas exhaust inspecting based on pressure sensing cell 53
Deng.In addition, control unit 61 can the down position in the elevating control to movable top plate unit 9 various behaviour are carried out according to substrate W
Make.For example, the down position of the prespecified movable top plate 33 of formula to the treatment conditions or sequence for providing each substrate W, right
Instruction unit (not shown) is operated, and is equivalent to the ginseng of the distance on movable surface of the top plate 33 away from substrate W to formula instruction in advance
Number.Control unit 61 is for example when handling substrate W, referring to the formula corresponding with substrate W indicated by device operator, root
Elevating mechanism 29 is operated according to the parameter.Thereby, it is possible to the down position of movable top plate 33 is adjusted for each substrate W.
Next, being illustrated referring to Fig. 4~Fig. 8 to the details of the shell 13.
Fig. 4 is the perspective view for indicating the state for pulling out top surface unit from shell, and Fig. 5 is the solid for indicating top surface unit
Figure, Fig. 6 is to indicate from top surface unit by the perspective view of the state of cover removal, and Fig. 7 is indicated heater from top surface unit
The perspective view of the state of unit removal, Fig. 8 are the top views for indicating the installation condition of the heater in unit heater.In addition,
In these figures, in Fig. 4, the movable top plate 33 or pillar 31 etc. is omitted.
Shell 13 has housing body 81 and top surface unit 83.Housing body 81 surrounds the tripartite of the side of heat treatment plate 7
And it configures.In the one side (upper left side of Fig. 4) of housing body 81, is formed and move in outlet 43.Housing body 81 is being moved in out
The medial surface of the two sides of mouth 43, forms guide rail 85.It is installed in the guide rail 85 from the top that the one side of housing body 81 plugs
Face unit 83.The top surface unit 83 is detachably installed such as using pulling buckle (not shown) relative to housing body 81.
The lower surface of top surface unit 83 constitutes the top surface of shell 13.Top surface unit 83 is formed in its lower surface will be using heat
The exhaust outlet 49 of the gas discharge for the heat treatment environment that processing board 7 is formed.Top surface unit 83 covers upper surface using housing 87.Lid
Cover 87 is open 89 as shown in figure 5, being formed in the quadrangle of upper surface.
In addition, the housing 87 is equivalent to " cover " in the present invention.
As shown in fig. 6, top surface unit 83 has top surface component 91, axle portion 93 and pressing component 95.Top surface component 91 exists
Substantially central portion when vertical view forms exhaust outlet 49.Around exhaust outlet 49, such as erects and 4 supporting pins 97 are set.
In other words, these each supporting pins 97 erect the quadrangle that top surface component 91 is arranged in.Supporting pin 97, which has to be formed in, compares front end side
Top slightly depend on the supporting surface 97a of lower part, and be formed in than supporting surface 97a lean on front end side openings 97b.Openings 97b
Face for its central spindle relative to top surface component 91 is formed substantially in parallel.Split pin 99 is installed (also referred to as in each openings 97b
Bayonet lock).Housing 87 is formed in 89 positions corresponding with each supporting pin 97 of each opening.Housing 87 is each by the way that each opening 89 to be inserted through
Supporting pin 97, construction opening pin 99, and the supporting surface 97a of each supporting pin 97 is utilized to abut support.Housing 87 is fixed on top as a result,
Face component 91.
In addition, the housing 87 is equivalent to " cover " in the present invention.
As shown in fig. 6, forming the direction for moving in outlet 43 in top surface component 91, axle portion 93 is installed.The axle portion 93
Such as be made of hinge, rotary shaft P is installed towards horizontal direction.One end of pressing component 95 is installed in the axle portion 93
Side.Pressing component 95 is made of plate-shaped member, in order to improve mechanical strength, and is by the edge bending machining of its length direction
Top.In the another side of pressing component 95, handle portion 103 is formed across elastic portion 101.Elastic portion 101 is added by bending
Work makes pressing component 95 have elastic force, exerts a force in clamping.Handle portion 103 makes 95 Oscillating of pressing component centered on axle portion 93
Fabrication process person's benefit part dominated by hand when dynamic.In the side of handle portion 103, bearing part 105 is installed.Bearing part
105 longitudinal section is in J shape.
Top surface component 91 is installed with hook movable part 107 in the side of 103 side of handle portion of pressing component 95.Hook movable part
107 have: hook 109 can be locked on bearing part 105；And bar 111, hook 109 is operated, hook 109 is stuck in bearing
Component 105, or by hook 109 from 105 removal of bearing part.
The bearing part 105 is equivalent to " fastener " in the present invention with hook movable part 107.In addition, bearing part 105
It is also referred to as pulling buckle or zipper altogether with hook movable part 107.
The top surface component 91 of top surface unit 83 is constituted as shown in fig. 7, one end is connected to connection with exhaust outlet 49, in the other end
The internal exhaust tube 113 that the outside of side towards shell 13 extends is configured in upper surface.The internal exhaust tube 113 be connected to as
Fig. 1 and exhaust pipe shown in Fig. 4 51.Top surface unit 83 has unit heater 115 in the upper surface of top surface component 91.Heater
Unit 115 heats top surface component 91, and by shell 13 top surface and exhaust outlet 49 heat.
Unit heater 115 has bottom plate 117 and heater housing 119.As shown in figure 8, bottom plate 117 with internal exhaust tube
113 corresponding positions form notch 121.Notch 121 is to cut bottom plate 117 along the lateral surface of internal exhaust tube 113
It opens and constitutes.Heater housing 119 forms opening portion 122 in position corresponding with internal exhaust tube 113, and to cover bottom plate
The mode of 117 upper surface is installed.
Bottom plate 117 is as shown in figure 8, surface is installed with encapsulation heater 55 on it.Heater 55 is encapsulated along than bottom plate
More outward edge side and the outside of the namely internal exhaust tube 113 of notch 121 configure in 117 center.Encapsulation heater 55 is electrically connected
It is connected to the connection terminal 135 at a position of one jiao of bottom plate 117 of the configuration in the quadrangle in top surface component 91.Bottom plate
117 have along bottom plate 117 extend on one side with spool 137, connection terminal 135 and configuration are in the wiring 139 for matching spool 137
One end electrical connection.Has connector 141 in lower part with spool 137, connector 141 and the another side of wiring 139 are electrically connected
It connects.Connector 141 is detachably constituted relative to the connector of device (not shown), if connection so electrical ties.
Unit heater 115 is clamped using pressing component 95 by the top surface component 91 of top surface unit 83.Pressing component 95 with
Top surface component 91 is detachably installed using including bearing part 105 and the fastener of hook movable part 107.Therefore, pass through by
The hook 109 of hook movable part 107, can be by unit heater 115 from utilizing pressing component 95 from the operation of 105 removal of bearing part
Clamping release.As a result, it is possible to the state of affairs since 55 removal of heater can not will be encapsulated due to ablation caused by spiral shell is solid is avoided, from
And heater 55 can will be easily encapsulated with unit heater 115 together from 83 removal of top surface unit.
In addition, the bottom plate 117 is equivalent to " heater installation portion part " in the present invention, notch 121 is equivalent to this hair
" internal exhaust tube storage opening " in bright.
In the substrate board treatment 1 of the composition, top surface unit 83 is set as high temperature by heat treatment plate 7 relative to covering
The shell 13 of heat treatment environment detachably constitute.Unit heater 115 utilizes bearing part 105 and hook movable part 107
It is mounted on top surface unit 83, or from 83 removal of top surface unit.Therefore, because encapsulation heater 55 and wiring 139 can will be included
Unit heater 115 from the easily removal of top surface unit 83, so top surface unit 83 can be made to clean using medical fluid etc..Knot
Fruit, in maintenance, the top surface component 91 that can will be provided with exhaust outlet 49 or internal exhaust tube 113 that sublimate is easiest to accumulation is unloaded
Carried out in removing and be immersed in medical fluid etc. it is clean, so as to make to encapsulate easily cleaning around heater 55.
In addition, housing 87 is by by 99 removal of split pin, and unloaded from 4 supporting pins 97 that top surface component 91 is arranged in are erect
It removes.Therefore, it can be avoided since the ablation caused by spiral shell is solid can not be by the state of affairs of 87 removal of housing, so as to easily make
Unit heater 115 exposes.
In turn, unit heater 115 is due to being set as the composition, thus can by the entirety of top surface component 91 be formed in
The internal exhaust tube 113 of top surface component 91 heats.Therefore, can efficiently inhibit the temperature of exhaust reduces.
It, being capable of change in the following manner the present invention is not limited to the embodiment.
(1) in the described embodiment, have movable top plate unit 9, but the present invention and nonessential this composition.
(2) in the described embodiment, it is with the substrate W for forming the overlay film for generating the gas comprising sublimate by heating
Process object, but the present invention is not limited to this substrate W.As long as that is, to carry out as being accumulated around exhaust outlet 49
The case where dirt the same heat treatment, just can be applied.
(3) in the described embodiment, as the bearing part of fastener 105 by longitudinal section be J shape component for into
Explanation is gone, but the bearing part 105 in the present invention is not limited to the component of this shape.As long as that is, to utilize
The shape that hook 109 can engage then can also be any shape.
(4) in the described embodiment, encapsulation heater 55 is instantiated as heater, but heater of the invention and unlimited
It can also be the heater of other types due to encapsulation heater 55.
(5) in the described embodiment, encapsulation heater 55 is along central more outward edge side and the exhaust gas inside than bottom plate 117
The outside of pipe 113 and configure, but the present invention is not limited to this configurations.For example, it is also possible to make to encapsulate heater 55 in bottom plate
The mode meticulously wriggled and configured in the outside of internal exhaust tube 113 on 117 is constituted.
(6) in the described embodiment, housing 87 is detachably installed using split pin 99, but can also be used as supporting part
Fastener of the part 105 as hook movable part 107 is installed.
(7) in the described embodiment, bearing part 105 is mounted on pressing component 95, and hook movable part 107 is mounted on top part
Part 91, but the present invention is not limited to this modes.That is, can also be the mode for being replaced mutually these installation sites.
[explanation of symbol]
1 substrate board treatment
W substrate
3 lower rafts
5 water-cooled bottom plates
7 heat treatment plates
9 movable top plate units
11 lifter pin units
13 shells
15 baffle plate units
29 elevating mechanisms
33 movable top plates
35 openings
37 driving mechanisms
41 lifter pins
43 move in outlet
47 baffle main bodys
51 exhaust pipes
61 control units
81 housing bodies
83 top surface units
87 housings
89 openings
91 top surface components
93 axle portions
95 pressing components
97 supporting pins
99 split pins
107 hook movable parts
109 hooks
111 bars
113 internal exhaust tubes
115 unit heaters
121 notch
122 opening portions
Claims (5)
1. a kind of substrate board treatment, is heat-treated substrate, and it is characterized in that having:
The substrate for being positioned in upper surface is heated and is heat-treated by heat treatment plate；
Shell covers the top of the heat treatment plate, forms the heat treatment environment caused by heat treatment plate；
Top surface unit constitutes the top surface of the shell, is formed with the exhaust outlet of the gas discharge of the heat treatment environment；And
Unit heater heats the top surface；
The top surface unit is detachably constituted relative to the shell, and
The unit heater includes the wiring of heater and the heater,
Have for installing the unit heater relative to the top surface unit, and from the top surface unit by the heating
The handling part of device unit removal.
2. substrate board treatment according to claim 1, which is characterized in that
The top surface unit has:
Top surface component is formed with the exhaust outlet；
Axle portion is arranged in the top surface component；And
Pressing component moves in the axis portion Oscillating and is installed with one end freely, by the unit heater by the top surface component
Upper surface clamping；And
The handling part is made of fastener,
The fastener has:
Bearing part, the another side that the pressing component is set and one in the top surface component；And
Hook movable part, be arranged in the pressing component another side and the top surface component in another, and have be stuck in
It the hook of the bearing part and is hooked into row operation to described the hook is stuck in the bearing part or by the hook from institute
State the bar of bearing part removal.
3. substrate board treatment according to claim 2, which is characterized in that
It is also equipped with:
More supporting pins erect the upper surface that the top surface component is arranged in；And
Cover has the multiple openings for being formed in position corresponding with the more supporting pins, and is used to cover the top surface
The top of component；And
The more supporting pins form the openings parallel relative to the face of the top surface component on top,
The cover so that split pin by being inserted through the states of the openings of the supporting pin of the opening of the cover
It is fixed relative to the top surface component, and covers the unit heater.
4. substrate board treatment according to claim 2 or 3, which is characterized in that
The top surface component has internal exhaust tube in upper surface, and one end is connected to connection, another side court with the exhaust outlet
It extends and is arranged to the outside of the shell,
The unit heater has:
Heater installation portion part is installed with the heater；And
Exhaust pipe storage opening, is formed in the heater installation portion part, and surrounds prominent from the upper surface of the top surface component
The internal exhaust tube side；
Along the center than the heater installation portion part, more outward edge side and the exhaust pipe store opening to the heater
Outside and configure.
5. substrate board treatment according to claim 1, which is characterized in that
The substrate forms the overlay film that the gas comprising sublimate is generated by heating.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-039545 | 2018-03-06 | ||
| JP2018039545A JP7092522B2 (en) | 2018-03-06 | 2018-03-06 | Board processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110233119A true CN110233119A (en) | 2019-09-13 |
| CN110233119B CN110233119B (en) | 2023-07-11 |
Family
ID=67860325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910117660.0A Active CN110233119B (en) | 2018-03-06 | 2019-02-15 | Substrate processing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7092522B2 (en) |
| KR (1) | KR102181631B1 (en) |
| CN (1) | CN110233119B (en) |
| TW (1) | TWI739066B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04142027A (en) * | 1990-10-02 | 1992-05-15 | Dainippon Screen Mfg Co Ltd | Heat treatment apparatus for substrate |
| WO2004105103A1 (en) * | 2003-05-23 | 2004-12-02 | Eagle Industry Co., Ltd. | Semiconductor manufacturing device and its heating unit |
| JP2005183638A (en) * | 2003-12-18 | 2005-07-07 | Dainippon Screen Mfg Co Ltd | Substrate heat treatment apparatus |
| JP2008166604A (en) * | 2006-12-28 | 2008-07-17 | Tokyo Electron Ltd | Heater, coating and developing device and heating method |
| JP2008186934A (en) * | 2007-01-29 | 2008-08-14 | Dainippon Screen Mfg Co Ltd | Heat treatment apparatus and heat treatment method |
| CN106409670A (en) * | 2015-07-29 | 2017-02-15 | 东京毅力科创株式会社 | Substrate processing apparatus, substrate processing method and maintenance method of substrate processing apparatus |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09148422A (en) * | 1995-11-24 | 1997-06-06 | Mitsubishi Materials Shilicon Corp | Locking structure for wafer housing container |
| KR0181908B1 (en) * | 1996-06-13 | 1999-04-15 | 김광호 | Baking apparatus for semiconductor device |
| JP2000003843A (en) | 1998-06-12 | 2000-01-07 | Dainippon Screen Mfg Co Ltd | Wafer heat treatment device |
| JP3589929B2 (en) * | 2000-02-22 | 2004-11-17 | 東京エレクトロン株式会社 | Heat treatment equipment |
| JP6846964B2 (en) * | 2017-03-16 | 2021-03-24 | 株式会社Ｓｃｒｅｅｎホールディングス | Board processing equipment |
-
2018
- 2018-03-06 JP JP2018039545A patent/JP7092522B2/en active Active
-
2019
- 2019-02-13 TW TW108104753A patent/TWI739066B/en active
- 2019-02-15 CN CN201910117660.0A patent/CN110233119B/en active Active
- 2019-02-26 KR KR1020190022439A patent/KR102181631B1/en active IP Right Grant
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04142027A (en) * | 1990-10-02 | 1992-05-15 | Dainippon Screen Mfg Co Ltd | Heat treatment apparatus for substrate |
| WO2004105103A1 (en) * | 2003-05-23 | 2004-12-02 | Eagle Industry Co., Ltd. | Semiconductor manufacturing device and its heating unit |
| JP2005183638A (en) * | 2003-12-18 | 2005-07-07 | Dainippon Screen Mfg Co Ltd | Substrate heat treatment apparatus |
| JP2008166604A (en) * | 2006-12-28 | 2008-07-17 | Tokyo Electron Ltd | Heater, coating and developing device and heating method |
| JP2008186934A (en) * | 2007-01-29 | 2008-08-14 | Dainippon Screen Mfg Co Ltd | Heat treatment apparatus and heat treatment method |
| CN106409670A (en) * | 2015-07-29 | 2017-02-15 | 东京毅力科创株式会社 | Substrate processing apparatus, substrate processing method and maintenance method of substrate processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102181631B1 (en) | 2020-11-23 |
| TW201939640A (en) | 2019-10-01 |
| JP2019153739A (en) | 2019-09-12 |
| CN110233119B (en) | 2023-07-11 |
| JP7092522B2 (en) | 2022-06-28 |
| TWI739066B (en) | 2021-09-11 |
| KR20190106705A (en) | 2019-09-18 |
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