CN110223964A - A kind of heat sinking type chip fan-out structure and cooling scheme - Google Patents
A kind of heat sinking type chip fan-out structure and cooling scheme Download PDFInfo
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- CN110223964A CN110223964A CN201910471245.5A CN201910471245A CN110223964A CN 110223964 A CN110223964 A CN 110223964A CN 201910471245 A CN201910471245 A CN 201910471245A CN 110223964 A CN110223964 A CN 110223964A
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- out structure
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- 238000001816 cooling Methods 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000004020 conductor Substances 0.000 claims abstract description 25
- 239000002826 coolant Substances 0.000 claims abstract description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 229910021389 graphene Inorganic materials 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 238000010041 electrostatic spinning Methods 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 238000003672 processing method Methods 0.000 claims description 4
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 238000000608 laser ablation Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 3
- 238000011049 filling Methods 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000012546 transfer Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 206010055670 Necrotising ulcerative gingivostomatitis Diseases 0.000 description 2
- 208000006595 Necrotizing Ulcerative Gingivitis Diseases 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- -1 graphite alkene Chemical class 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000000520 microinjection Methods 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to chip package fields, more particularly to a kind of heat sinking type chip fan-out structure and cooling scheme, the heat sinking type chip fan-out structure includes chip lower substrate, chip body, chip upper substrate, the surface of the chip lower substrate offers chip slot and groove, the fixed chip body inside the chip slot, the groove is including being filled up completely groove and/or being partially filled with groove, at least one described groove is partially filled with groove described in being, it is described to be filled up completely in groove whole space filling conductive materials, fill the conductive materials in the trench interiors point space that is partially filled with.Conductive materials are partially filled in the groove of heat sinking type chip fan-out structure of the invention, the space of cooling medium flowing is reserved above conductive materials in the trench, the heat transfer of chip interior component is come out using circuitry trenches self structure, to increase radiating efficiency, solves chip heating problem.
Description
Technical field
The present invention relates to chip package fields, and in particular to a kind of heat sinking type chip fan-out structure and cooling scheme.
Background technique
In recent years, with the continuous progress of science and technology, microelectronic chip using ubiquitous, from various smart phones,
For wearable device to the national treasure such as guided missile, satellite, supercomputer, the application of chip has run through production and living, science and techniques of defence
Every aspect, chip will become the indispensable device of human survival progress.Current chip increasingly refines, operation
Speed is getting faster, volume is also smaller and smaller, it is clear that this higher integrated level is advantageously to the application of chip.However
Thus bring chip cooling problem is increasingly prominent, more integrated transistors bring can also be generated while powerful calculating power it is huge
Big heat, if excessively high heat can not exclude chip exterior in time, it will leading to the job stability of chip reduces, error
Rate increases, while the thermal stress that chip module and external environment are formed by can directly contribute chip electrical property, working frequency, machine
The disorder of tool intensity and reliability.
Therefore, how the timely dissipation of a large amount of heat to be fallen, so that chip temperature, which is kept low, has become one
A urgent problem.In the various thermal resistances of chip, chip and it is extraneous it is heat sink between the thermal resistance that introduces of boundary material be control
One key of entire thermal resistance processed also becomes the target that thermal resistance research nearly all so far is concerned about.One in previous research
The thermal contact resistance for directly making every effort to reduce chip and external environment strengthens cooling technology by the external world to reduce temperature internal component
Temperature.However ignored one the fact is that, the root generated heat in chip is the electronic component of chip interior, rather than component
Except multilayer encapsulation structure, therefore, if the heat of chip interior device directly can be excluded by fan-out structure, in chip
A quantum jump is obtained on heat dissipation problem, will reduce the thermic load of heater element or even chip to the maximum extent.Knot is fanned out in chip
In structure, the prior art often only focuses on how being fanned out to I/O, has ignored chip cooling problem.Fan-out circuit and encapsulation raw material
It completely attaches to, after chip interior core conducts heat to fan-out circuit, needs by the biggish encapsulation raw material ability of thermal resistance
Heat is shed.In addition, it is all often I/O mouthfuls to be fanned out to using copper wire or gold thread that the mode being fanned out to, which is, it is multiple to be fanned out to technique
Miscellaneous, yields is low, and encapsulation risk is uncontrollable.
Summary of the invention
To solve the above problems, the present invention provides a kind of heat sinking type chip fan-out structure and cooling scheme, particular technique side
Case is as follows:
A kind of heat sinking type chip fan-out structure, including chip lower substrate, chip body, chip upper substrate, under the chip
The surface of substrate offers chip slot and groove, and the fixed chip body inside the chip slot, the groove includes complete
It fills groove and/or is partially filled with groove, at least one described groove is partially filled with groove to be described；It is described to be filled up completely groove
Conductive materials are filled in interior whole space, and the conductive materials, the groove packet are filled in the trench interiors point space that is partially filled with
It includes fan-in groove and is fanned out to groove, the fan-in groove connects and is fanned out to groove, the fan-in interconnected described at least one
Groove and the groove that is fanned out to are that be filled up completely groove or the fan-in groove interconnected and the groove that is fanned out to be part
Fill groove.
Further, the groove is in the same plane or in Different Plane.
Further, the cross sectional shape of the groove includes one of V-arrangement, U-shaped, semicircle, rectangular or a variety of.
Further, the conductive materials are one of graphene, carbon nanotube, copper, gold, titanium or a variety of.
Further, the processing method of the chip slot and the groove is electrostatic spinning, laser ablation, in machining
It is one or more.
Further, the groove is partially filled with groove to be described.
A kind of cooling scheme of heat sinking type chip fan-out structure, including passive cooling scheme or active cooling scheme.
Further, the cooling medium of the passive cooling scheme is air.
Further, the cooling medium of active cold-zone scheme is liquid, is also needed using the active cooling scheme
The liquid is pumped into and described is partially filled with groove by the setting pump housing.
Conductive materials are partially filled in the groove of heat sinking type chip fan-out structure of the invention, in the trench on conductive materials
Side reserves the space of cooling medium flowing, is come out the heat transfer of chip interior component using circuitry trenches self structure,
To increase radiating efficiency, chip heating problem is solved.Groove only needs applied chemistry or physical method progress fluid channel to scribe, so
Spray printing conductive materials afterwards, the processing is simple, processing performance is controllable, can be used for the extensive high chip production system for calculating power in the future
It makes.
Detailed description of the invention
Illustrate the embodiment of the present invention or technical solution in the prior art in order to clearer, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it is clear that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the top view of heat sinking type chip fan-out structure in embodiment 1；
Fig. 2 is the main view of heat sinking type chip fan-out structure in embodiment 1；
Fig. 3 is to be filled up completely ditch in embodiment 1 and be partially filled with the sectional view of groove；
Fig. 4 is the top view of heat sinking type chip fan-out structure in embodiment 2；
Fig. 5 is the top view of heat sinking type chip fan-out structure in embodiment 3.
In figure: 1 chip lower substrate, 2 chip bodies, 3 chip upper substrates, 4 chip slots, 5 grooves, 51 are filled up completely groove
51,52 groove, 6 back-shaped grooves are partially filled with.
Specific embodiment
Below in conjunction with specific embodiment, clear, complete description is carried out to technical solution of the present invention, it is clear that retouched
The embodiment stated is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, originally
Field those skilled in the art all other embodiment obtained without making creative work belongs to this
The protection scope of invention.
A kind of heat sinking type chip fan-out structure, including chip lower substrate, chip body, chip upper substrate, under the chip
The surface of substrate offers chip slot and groove, and the fixed chip body inside the chip slot, the groove includes complete
It fills groove and/or is partially filled with groove, at least one described groove is that described be partially filled with is filled up completely groove described in groove
Conductive materials are filled in interior whole space, and the conductive materials are filled in the trench interiors point space that is partially filled with；In the groove
The filling of conductive materials for circuit fan-in and be fanned out to, and it is described be partially filled in groove there are gap, allow cooling be situated between
Matter flows in and out, by the heat derives of chip interior.
The groove includes fan-in groove and is fanned out to groove, and the fan-in groove connects and is fanned out to groove described at least one,
The fan-in groove interconnected and it is described be fanned out to groove be filled up completely groove or the fan-in groove interconnected and
The groove that is fanned out to is to be partially filled with groove.The fan-in groove interconnected and described it is fanned out to filling out for conductive materials in groove
It fills situation and answers identical, the groove is interconnected " rat hole structure ", i.e. any one entrance can find at least one
Outlet, this discrete topological structure are conducive to the easier realization of the stacked structure between subsequent progress chip.
Further, the groove can be more favorable for chip in the same plane or not in the same plane
It stacks and radiates.
Further, the cross sectional shape of the groove includes one of V-arrangement, U-shaped, semicircle, rectangular or a variety of, preferably
For V-arrangement, the V-arrangement is up-side down triangle.The shapes and sizes of groove can be determined according to the actual situation, the ditch of different purposes
The shapes and sizes of slot can be in any combination.
Further, the conductive materials are one of graphene, carbon nanotube, copper, gold, titanium or a variety of.Guaranteeing
On the basis of cooling mechanism, conductive materials can be the higher metal of the conductivities such as copper, gold, titanium, be also possible to graphene, carbon is received
The emerging conductive material such as mitron.
Further, the processing method of the chip slot and the groove is electrostatic spinning, laser ablation, in machining
It is one or more.The processing method of groove can be independently selected according to the difference of required groove size and shape.
A kind of manufacturing method of heat sinking type chip fan-out structure includes the following steps: that (1) makes on the chip lower substrate
Make the chip slot and the groove；(2) not completely filled in the trench or be filled up completely conductive materials；(3) by the chip
Lower substrate and chip substrate bonding, and mark the groove of not completely filled conductive materials.
A kind of cooling scheme of heat sinking type chip fan-out structure, including passive cooling scheme or active cooling scheme.
Further, the cooling medium of the passive cooling scheme is air, and free air flow is in each groove, root
According to the law of thermodynamics and law of entropy growing, air will automatically swap out the heat of chip interior, reach cooling effect.
Further, the cooling medium of active cold-zone scheme is liquid, is also needed using the active cooling scheme
The liquid is pumped into and described is partially filled with groove by the setting pump housing.When using active cooling scheme, it is also necessary to which micro-injection is set
Device and small pump, using part of trench mouth as liquid inlet, part of trench mouth is as liquid outlet.Cooling medium goes out
Mouth and entrance do not have specific setting, and technical staff can be according to the entrance of actual chips design conditions flexible configuration cooling medium
The outlet and.
Embodiment 1
A kind of heat sinking type chip fan-out structure, as depicted in figs. 1 and 2, including chip lower substrate 1, chip body 2, chip
Upper substrate 3, the surface of the chip lower substrate 1 offer chip slot 4 and groove 5, fix the chip inside the chip slot 4
Ontology 2, the part groove 5 are connect with the chip slot 4, and the groove 5 includes being filled up completely groove 51 and being partially filled with ditch
Slot 52, the groove 5 are vee-cut, and the conductive materials of filling are graphene.It is filled up completely groove 51 and is partially filled with groove 52
Sectional view it is as shown in Figure 3.
Embodiment 2
Compared with Example 1, the present embodiment difference is only that: as shown in figure 4, all the groove 5 is to be partially filled with ditch
Slot 52.
All grooves can be passed through cooling medium in the heat sinking type chip fan-out structure of the present embodiment, and heat dissipation effect is better than
Embodiment 1.
Embodiment 3
Compared with Example 1, the present embodiment difference be only that: as shown in figure 5, the chip lower substrate 1 be additionally provided with it is back-shaped
Groove 6, the back-shaped groove 6 are not connect with the chip slot 4, the back-shaped 6 inner part filled graphite alkene of groove.
The back-shaped trench interiors can be used for the flowing of cooling medium, therefore the heat dissipation effect phase of the fan-out structure of the present embodiment
It is weaker for embodiment 1.
Embodiment 4
Compared with Example 1, the present embodiment difference is only that: being filled up completely graphene in the back-shaped groove.
Embodiment 5
Compared with Example 1, the present embodiment difference is only that: the lamination of groove 13 copper coating and titanium.
Embodiment 6
A kind of manufacturing method of heat sinking type chip fan-out structure, includes the following steps:
(1) special material is covered on the lower substrate made of thermoplastic material, is wherein decorated with channel patterns on special material,
Using laser etching techniques, pattern manufactures groove along groove on substrate；
(2) conductive layer, such as the lamination of layers of copper, layer gold or various metals, such as copper are plated in each groove using electroplating technology
With the lamination of titanium.
(3) upper substrate is bonded on lower substrate using particular adhesive, while mark does not plate the ditch notch of conductive materials.
Embodiment 7
Compared with Example 6, the present embodiment difference is only that: the manufacturing method of the groove uses method of electrostatic spinning, tool
Body is the punch-pin for getting required fan-out circuit using electrostatic spinning technique on the glass substrate, convex mould material be it is degradable or
Easily removal substance on the glass substrate by thermoplastic material reverse mould obtains having fluted chip lower substrate.
Embodiment 8
A kind of cooling scheme of heat sinking type chip fan-out structure, using active cooling scheme: in the base of the fan-out structure
On plinth setting setting microsyringe and small pump by cooling water be pumped into it is described be partially filled with groove, and from the institute being attached thereto
State the outlet outflow for being partially filled with groove.
Active cooling scheme can control entrance, outlet port and the flow of cooling water according to the heat condition of chip, cooling
Excellent result and controllable.
Embodiment 9
A kind of cooling scheme of heat sinking type chip fan-out structure, using passive cooling scheme, cooling medium is air, is not required to
The pump housing is wanted, chip heat sheds by the free-flowing of air.
Passive cooling effect is weaker compared to active cooling, but advantage is simple process, is not necessarily to extra cost.
Claims (10)
1. a kind of heat sinking type chip fan-out structure, which is characterized in that including chip lower substrate, chip body, chip upper substrate, institute
The surface for stating chip lower substrate offers chip slot and groove, the fixed chip body inside the chip slot, the groove
Including being filled up completely groove and/or being partially filled with groove, at least one described groove is partially filled with groove for described in, described complete
It fills whole spaces in groove and fills conductive materials, the conductive materials are filled in the trench interiors point space that is partially filled with；
The groove includes fan-in groove and is fanned out to groove, and the fan-in groove connects and is fanned out to groove described at least one, mutually
The fan-in groove of connection and the groove that is fanned out to are to be filled up completely groove or the fan-in groove interconnected and described
Being fanned out to groove is to be partially filled with groove.
2. fan-out structure according to claim 1, which is characterized in that the groove is in the same plane or Different Plane
It is interior.
3. fan-out structure according to claim 1, which is characterized in that the cross sectional shape of the groove includes V-arrangement, U-shaped, half
It is one of round, rectangular or a variety of.
4. fan-out structure according to claim 1, which is characterized in that the conductive materials be graphene, carbon nanotube,
One of copper, gold, titanium are a variety of.
5. fan-out structure according to claim 1, which is characterized in that the processing method of the chip slot and the groove is
One of electrostatic spinning, laser ablation, machining are a variety of.
6. fan-out structure according to claim 1, which is characterized in that the groove is partially filled with groove to be described.
7. fan-out structure according to claim 1, which is characterized in that the surface of the chip lower substrate is additionally provided with back-shaped ditch
Slot, the back-shaped groove are connect with the groove, and the conductive materials are filled or be filled up completely to the back-shaped trench interiors point.
8. a kind of cooling scheme of such as described in any item heat sinking type chip fan-out structures of claim 1-7, which is characterized in that packet
Include passive cooling scheme or active cooling scheme.
9. cooling scheme according to claim 8, which is characterized in that the cooling medium of the passive cooling scheme is sky
Gas.
10. cooling scheme according to claim 8, which is characterized in that the cooling medium of active cold-zone scheme is liquid
Body, also needs to be arranged the pump housing using the active cooling scheme and is pumped into the liquid and described be partially filled with groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910471245.5A CN110223964B (en) | 2019-05-31 | 2019-05-31 | Heat dissipation type chip fan-out structure and cooling scheme |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910471245.5A CN110223964B (en) | 2019-05-31 | 2019-05-31 | Heat dissipation type chip fan-out structure and cooling scheme |
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| Publication Number | Publication Date |
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| CN110223964A true CN110223964A (en) | 2019-09-10 |
| CN110223964B CN110223964B (en) | 2021-03-02 |
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| CN202736972U (en) * | 2012-07-16 | 2013-02-13 | 桂林电子科技大学 | Wafer-grade large power LED packaging structure based on silicon through hole technology |
| CN207149548U (en) * | 2017-07-19 | 2018-03-27 | 江西凯强实业有限公司 | A kind of radiator structure of package substrate |
| CN109585399A (en) * | 2018-11-22 | 2019-04-05 | 北京遥感设备研究所 | A kind of high-efficiency heat conduction chip substrate structure and preparation method |
| CN210073819U (en) * | 2019-05-31 | 2020-02-14 | 王晗 | Heat dissipation type chip fan-out structure |
-
2019
- 2019-05-31 CN CN201910471245.5A patent/CN110223964B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101853840A (en) * | 2009-04-01 | 2010-10-06 | 日月光半导体制造股份有限公司 | Structure of embedded line substrate and manufacturing method thereof |
| CN101866904A (en) * | 2009-04-16 | 2010-10-20 | 联发科技股份有限公司 | Semiconductor chip package |
| CN202736972U (en) * | 2012-07-16 | 2013-02-13 | 桂林电子科技大学 | Wafer-grade large power LED packaging structure based on silicon through hole technology |
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| CN210073819U (en) * | 2019-05-31 | 2020-02-14 | 王晗 | Heat dissipation type chip fan-out structure |
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