CN110218903A - A kind of ESP continuous cast mold narrow copper plate base material and its processing method, ESP continuous cast mold narrow copper plate - Google Patents
A kind of ESP continuous cast mold narrow copper plate base material and its processing method, ESP continuous cast mold narrow copper plate Download PDFInfo
- Publication number
- CN110218903A CN110218903A CN201910592083.0A CN201910592083A CN110218903A CN 110218903 A CN110218903 A CN 110218903A CN 201910592083 A CN201910592083 A CN 201910592083A CN 110218903 A CN110218903 A CN 110218903A
- Authority
- CN
- China
- Prior art keywords
- base material
- copper plate
- continuous cast
- cast mold
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/04—Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds
- B22D11/059—Mould materials or platings
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Abstract
The present invention provides a kind of ESP continuous cast mold narrow copper plate base material and its processing methods, ESP continuous cast mold narrow copper plate, belong to copper alloy technical field.The base material includes following chemical component: the Mg of the Be and 0.02-0.05wt% of Zr, 0.2-0.4wt% of Ni, 0.12-0.3wt% of Cu, 1.0-2.2wt% of 97.05-98.66wt%.Above-mentioned base material has good electrical and thermal conductivity performance.Its processing method includes: the corresponding alloy material of mixing, then successively carries out vacuum melting, vacuum-casting, hot forging, solid solution, flow harden and ageing treatment.Above-mentioned processing method is simple, keeps the strength of materials produced suitable with beryllium ambrose alloy, but electrical and thermal conductivity performance with higher.In continuous casting, hot-face temperature has and reduces by a relatively large margin the copper sheet as made from above-mentioned base material, has higher intensity, higher hardness at a lower temperature, wearability is stronger.
Description
Technical field
The present invention relates to copper alloy technical field, in particular to a kind of ESP continuous cast mold narrow copper plate base material and
Its processing method, ESP continuous cast mold narrow copper plate.
Background technique
With the development of continuous casting technology, the requirement to Cu alloy material performance is higher and higher, due to electric conductivity and material
Intensity is difficult to take into account, and the intensity and hardness of beryllium ambrose alloy are relatively high at normal temperature, and electric conductivity and thermal conductivity are somewhat relatively low, so that beryllium
For the copper plate of crystallizer of ambrose alloy in continuously casting, hot-face temperature is relatively high, usual material with temperature environment raising, in high temperature
Under state, intensity and hardness relative drop are more, wearability also relative drop, so that beryllium ambrose alloy can not be most newly developed super
Application is obtained in high pulling rate ESP continuous casting technology.
Summary of the invention
The first object of the present invention includes providing a kind of ESP continuous cast mold narrow copper plate base material, which has good
Electrical and thermal conductivity performance, can ensure that required heating conduction satisfies the use demand under superelevation pulling rate, while ensuring to use
It is not in the reduction of service life caused by lower mouth serious wear in journey.
The second object of the present invention includes providing a kind of processing method of above-mentioned ESP continuous cast mold narrow copper plate base material,
The processing method is simple, keeps the strength of materials produced suitable with beryllium ambrose alloy, but electrical and thermal conductivity performance with higher.
The third object of the present invention includes providing a kind of ESP continuous cast mold narrow copper plate as made from above-mentioned base material, should
In continuous casting, hot-face temperature has and reduces by a relatively large margin copper plate of crystallizer, to make copper plate of crystallizer at a lower temperature and have and is higher
Intensity, higher hardness, wearability is stronger, to meet the production requirement of ESP continuous cast mold superelevation pulling rate.
The present invention solves its technical problem and adopts the following technical solutions to realize:
The present invention proposes a kind of ESP continuous cast mold narrow copper plate base material, the chemical component including following mass content:
The Be and 0.02- of Zr, 0.2-0.4wt% of Ni, 0.12-0.3wt% of Cu, 1.0-2.2wt% of 97.05-98.66wt%
The Mg of 0.05wt%.
In some preferred embodiments, ESP continuous cast mold narrow copper plate base material includes the change of following mass content
Study point: the Be of Zr, 0.2-0.4wt% of Ni, 0.15-0.2wt% of Cu, 1.5-2.0wt% of 97.35-98.12wt% with
And the Mg of 0.03-0.05wt%.
In some embodiments, the conductivity of ESP continuous cast mold narrow copper plate base material is 40-45S/m, and IACS is
72-76%, thermal conductivity are 320-330W/ (mk).
In some preferred embodiments, the conductivity of ESP continuous cast mold narrow copper plate base material is 42S/m, IACS
It is 74%, thermal conductivity is 325W/ (mk).
In addition, the invention also provides a kind of processing methods of above-mentioned ESP continuous cast mold narrow copper plate base material, including with
Lower step:
Mixing provides the alloy material of Cu, Ni, Be, Zr and Mg, then successively carries out vacuum melting, vacuum-casting, heat
Forging, solid solution, flow harden and ageing treatment.
Wherein, ageing treatment is that 3-5h is handled under conditions of 500-530 DEG C.
In addition, the invention also provides a kind of ESP continuous cast mold narrow copper plate, the ESP continuous cast mold narrow copper plate
It is made by above-mentioned ESP continuous cast mold narrow copper plate base material.
ESP continuous cast mold narrow copper plate base material provided by the present application and its processing method, ESP continuous cast mold leptoprosopy copper
The beneficial effect of plate includes:
ESP continuous cast mold narrow copper plate base material provided by the present application has good electrical and thermal conductivity performance, draws in superelevation
Speed is lower can to ensure that required heating conduction satisfies the use demand, while ensuring to be not in lower mouth serious wear in use process
Caused service life reduces.Its processing method is simple, keeps the strength of materials produced suitable with beryllium ambrose alloy but with higher
Electrical and thermal conductivity performance.In continuous casting, hot-face temperature has by a relatively large margin the ESP continuous cast mold narrow copper plate as made from above-mentioned base material
It reduces, so that making copper plate of crystallizer at a lower temperature has higher intensity, higher hardness, wearability is stronger, to meet
The production requirement of ESP continuous cast mold superelevation pulling rate.
Specific embodiment
It in order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below will be in the embodiment of the present invention
Technical solution be clearly and completely described.The person that is not specified actual conditions in embodiment, according to normal conditions or manufacturer builds
The condition of view carries out.Reagents or instruments used without specified manufacturer is the conventional production that can be obtained by commercially available purchase
Product.
Below to ESP continuous cast mold narrow copper plate base material provided by the embodiments of the present application and its processing method, ESP continuous casting
Narrow face copper plate of crystallizer is specifically described.
ESP continuous cast mold narrow copper plate base material provided by the present application includes the chemical component of following mass content:
The Be and 0.02- of Zr, 0.2-0.4wt% of Ni, 0.12-0.3wt% of Cu, 1.0-2.2wt% of 97.05-98.66wt%
The Mg of 0.05wt%.
Optionally, the mass content of Cu can for 97.05wt%, 97.5wt%, 98wt%, 98.5wt% or
98.66wt% etc., or any mass content within the scope of 97.05-98.66wt%.
The mass content of Ni can be for 1wt%, 1.2wt%, 1.5wt%, 1.8wt%, 2wt% or 2.2wt% etc., can also
Think any mass content within the scope of 1-2.2wt%.
The mass content of Zr can for 0.12wt%, 0.15wt%, 0.18wt%, 0.2wt%, 0.25wt% or
0.3wt% etc., or any mass content within the scope of 1.0-2.2wt%.
The mass content of Be can be for 0.2wt%, 0.25wt%, 0.3wt%, 0.35wt% or 0.4wt% etc., can also be with
For any mass content within the scope of 0.2-0.4wt%.
The mass content of Mg can for 0.02wt%, 0.025wt%, 0.03wt%, 0.035wt%, 0.04wt%,
0.045wt% or 0.05wt% etc., or any mass content within the scope of 0.02-0.05wt%.
In some preferred embodiments, ESP continuous cast mold narrow copper plate base material includes the change of following mass content
Study point: the Be of Zr, 0.2-0.4wt% of Ni, 0.15-0.2wt% of Cu, 1.5-2.0wt% of 97.35-98.12wt% with
And the Mg of 0.03-0.05wt%.
As reference, in a specific embodiment, ESP continuous cast mold narrow copper plate base material includes following quality
The chemical component of content: the Be and 0.04wt% of Zr, 0.3wt% of Ni, 0.18wt% of Cu, 1.6wt% of 97.88wt%
Mg.
Currently, copper alloy field, always there is the contradiction between high-intensitive and high conductivity, nickel is in copper in the application
Solid solubility is big, can be capable of forming continuous solid solution with copper with copper infinitely dissolve, has broad monophase field, can be obvious
The mechanical performance and corrosion resisting property of copper are improved, but the conduction of copper and heating conduction is caused to reduce simultaneously.
And Be is added on the basis of Cu and Ni in existing CuNiBe material, though such material further improves material
Intensity and hardness, but its electrical and thermal conductivity performance is not able to satisfy production requirement of the ESP continuous cast mold under superelevation pulling rate still.
Inventor through the discovery that studies for a long period of time to copper sheet base material, by suitable limited solid solution in copper Zr and Cu, Ni, Be with
And Mg cooperation, Zr and Be can be made to play synergistic effect on the electrical and thermal conductivity for improving copper sheet.Its reason may is that, Zr and
The solid solubility of Be varies with temperature and the solid solubility difference under fierce variation namely high temperature and low temperature in copper is larger, works as temperature
When beginning to decline after completing from alloy crystallization, their solid solubility in copper also start to reduce, with metallic compound or simple substance
Form be precipitated from solid phase, when they are solid-solution in copper, its intensity can be significantly improved, there is solid solution strengthening effect, when it
After ageing treatment specific in the application, be precipitated from solid phase, and produce dispersion-strengthened effect, thus be conducive to improve copper
The conduction and thermal conductivity of plate.Magnesium limited solid solution can be used as the deoxidier of copper in copper, to liquid metal play deoxidation, slag making and
Refine the effect of crystal grain.
It holds, by mixing Cu, Ni, Zr, Be and Mg by said ratio, compared with CuNiBe material, is not reducing
Under the premise of intensity and hardness, copper sheet electric conductivity can be made to improve a lot with thermal conductivity.
Compared with beryllium ambrose alloy, the aging temp that beryllium ambrose alloy uses is 470 DEG C, and ESP continuous casting crystallining provided by the present application
The aging temp of device narrow copper plate base material beryllium nickel zirconium copper is 500-530 DEG C, keeps the strength of materials produced suitable with beryllium ambrose alloy, but
ESP continuous cast mold narrow copper plate base material beryllium nickel zirconium copper conductivity and thermal conductivity compared with beryllium ambrose alloy provided by the present application have obviously
It improves.
In some embodiments, the conductivity of above-mentioned ESP continuous cast mold narrow copper plate base material is 40-45S/m (20
DEG C), IACS is 72-76% (20 DEG C), and thermal conductivity is 320-330W/ (mk) (20 DEG C).Meanwhile under conditions of 20 DEG C, bend
Taking intensity is 480-520MPa, and hardness HB160-200, softening temperature is 580-600 DEG C, and recrystallization temperature is 680-720 DEG C.
In some preferred embodiments, the conductivity of above-mentioned ESP continuous cast mold narrow copper plate base material is 43S/m
(20 DEG C), IACS are 74 (20 DEG C), and thermal conductivity is 325W/ (mk) (20 DEG C).In contrast, the conductivity of CuNiBe is only
38S/m (20 DEG C), IACS are only 66% (20 DEG C), and thermal conductivity is only 290W/ (mk) (20 DEG C).Meanwhile in 20 DEG C of condition
Under, yield strength 480-520MPa, hardness HB160-200, softening temperature are 580-600 DEG C, recrystallization temperature 680-
720℃。
It can thus be seen that ESP continuous cast mold narrow copper plate base material provided by the present application is really than existing CuNiBe
Material have more preferably electrical and thermal conductivity performance be therefore with CuNiBe with the hot-face temperature ratio of ESP continuous cast mold narrow copper plate
The hot-face temperature of the narrow face copper plate of crystallizer of base material wants low, and in one group of contrast test, CuNiBe is the crystallizer leptoprosopy of base material
The hot-face temperature of copper sheet is 332 DEG C, and the ESP continuous cast mold narrow copper plate hot-face temperature of the application is 305 DEG C, hot-face temperature
Reduction improve intensity and hardness necessarily, wearability also just necessarily improves.
Present invention also provides a kind of processing methods of above-mentioned ESP continuous cast mold narrow copper plate base material, such as can wrap
Include following steps: mixing provides the alloy material of Cu, Ni, Be, Zr and Mg, then successively carry out vacuum melting, vacuum-casting,
Hot forging, solid solution, flow harden and ageing treatment.
Wherein, ageing treatment is that 3-5h is handled under conditions of 500-530 DEG C.Optionally, the temperature of ageing treatment
It such as can be 500 DEG C, 510 DEG C, 520 DEG C, 530 DEG C, or 505 DEG C, 515 DEG C or 525 DEG C etc., can also be 500-
Any temperature value within the scope of 530 DEG C.The time of ageing treatment can be for example 3h, 3.5h, 4h, 4.5h or 5h etc..
In the application by the temperature setting of ageing treatment be 500-530 DEG C, the time of ageing treatment is set as 3-5h, with true
Protecting copper sheet base material had both had preferable electrical and thermal conductivity performance, while also having preferable intensity and hardness.
Can refer to ground, the temperature of vacuum melting can be set to 1350-1410 DEG C in the application, such as 1350 DEG C, 1360 DEG C,
1370 DEG C, 1380 DEG C, 1390 DEG C, 1400 DEG C or 1410 DEG C etc..The vacuum degree of vacuum melting can for example be less than or equal to 60Pa.
The temperature of vacuum-casting can be set to 1250-1280 DEG C, such as 1250 DEG C, 1255 DEG C, 1260 DEG C, 1265 DEG C,
1270 DEG C, 1275 DEG C or 1280 DEG C etc..The vacuum degree of vacuum-casting can for example be less than or equal to 60Pa.
Be conducive to obtain dense structure, performance stabilization and high abrasion resistance by above-mentioned vacuum melting and vacuum-casting
Alloy base metal.
The initial forging temperature of hot forging can be set to 900-920 DEG C, such as 900 DEG C, 910 DEG C or 920 DEG C；Final forging temperature can be with
It is set as 600-650 DEG C, such as 600 DEG C, 610 DEG C, 620 DEG C, 630 DEG C, 640 DEG C or 650 DEG C；The heating time of hot forging can set
It is set to 2.5-3h, such as 2.5h, 2.8h or 3h.
In hot forging process preferably according to elder generation along long to the sequence of rear through-thickness is forged.The deflection example of hot forging
Such as it can be controlled within the scope of 25-30mm.
It is handled by the hot forging of above-mentioned condition, help to obtain the uniform copper sheet base material of structure property.
Solid solubility temperature is set as 870-890 DEG C, preferably 880 DEG C.Solution time can be 1-2h, such as 1h, 1.5h or 2h.
Be preferably carried out in mode some, when solid solution, copper sheet is cooling be lauched before, cooling water temperature is no more than 30 DEG C, copper
Time control of the plate from coming out of the stove to being lauched is in 60s (containing).
By the solution treatment of above-mentioned condition, Zr and Be in the application can be made to form supersaturated solid solution, to be conducive to
Subsequent ageing treatment.
Cold deformation rate is 15-35% during flow harden, such as 15%, 20%, 25%, 30% or 35%.
Preferably, the amount of rolling for example can be controlled in 1-2mm under single during flow harden.
By the flow harden process of above-mentioned condition, be conducive to make copper sheet base material hardness with higher.
It holds, by chemical component provided by the present application with ESP continuous cast mold leptoprosopy obtained by the processing of above-mentioned processing method
Copper sheet base material is with higher hardness and intensity on the basis of conductivity and thermal conductivity also with higher.
Present invention also provides a kind of ESP continuous cast mold narrow copper plates, by above-mentioned ESP continuous cast mold narrow copper plate
Base material is made.The hot-face temperature of the ESP continuous cast mold narrow copper plate is no more than 310 DEG C, usually at 305 DEG C or so, reason
It is that conductivity and the thermal conductivity of copper sheet base material used are high, it is very fast transmits heat outward, to makes the reduction of working face temperature.
By comparing, under equal conditions, the hot-face temperature of CuNiBe copper plate of crystallizer is up to 332 DEG C, and in the application
The hot-face temperature of CuNiBeZr copper plate of crystallizer only has 305 DEG C or so, since the copper sheet hardness at 305 DEG C is higher than 332 DEG C of copper
Plate hardness, therefore, CuNiBeZr copper plate of crystallizer is more wear resistant compared with CuNiBe copper plate of crystallizer, and the service life is longer.
Feature and performance of the invention are described in further detail with reference to embodiments.
Embodiment 1
The chemical component of ESP continuous cast mold narrow copper plate base material in the present embodiment contain 97.05wt% Cu,
The Mg of the Be and 0.05wt% of Zr, 0.4wt% of Ni, 0.3wt% of 2.2wt%.
Its processing method includes:
Mixing provides the alloy material of Cu, Ni, Be, Zr and Mg according to the ratio, in 1380 DEG C and vacuum degree be 60Pa's
Under the conditions of carry out vacuum melting, then carry out vacuum-casting under conditions of 1265 DEG C and vacuum degree are 60Pa.
It is hot-forged under conditions of initial forging temperature is 910 DEG C, final forging temperature is 625 DEG C, the heating time of hot forging is 3h.
In hot forging process, according to elder generation along long to the sequence of rear through-thickness is forged, and the deflection of hot forging is 30mm.
It is dissolved 1.5h under conditions of 880 DEG C, then carries out flow harden.When solid solution, before steel plate cooling is lauched, cooling water
Temperature be 30 DEG C, copper sheet from coming out of the stove to being lauched time be 60s.The deformation rate of flow harden is 25%, the amount of rolling under single
For 1.5mm.
The then ageing treatment 4h under conditions of 530 DEG C.
Embodiment 2
The present embodiment and the difference of embodiment 1 are only that: the chemical component of ESP continuous cast mold narrow copper plate base material contains
The Mg of the Be and 0.02wt% of Zr, 0.2wt% of Ni, 0.12wt% of Cu, 1wt% of 98.66wt%.
Embodiment 3
The present embodiment and the difference of embodiment 1 are only that: the chemical component of ESP continuous cast mold narrow copper plate base material contains
The Mg of the Be and 0.05wt% of Zr, 0.4wt% of Ni, 0.2wt% of Cu, 2wt% of 97.35wt%.
Embodiment 4
The present embodiment and the difference of embodiment 1 are only that: the chemical component of ESP continuous cast mold narrow copper plate base material contains
The Mg of the Be and 0.03wt% of Zr, 0.2wt% of Ni, 0.15wt% of Cu, 1.5wt% of 98.12wt%.
Embodiment 5
The present embodiment and the difference of embodiment 1 are only that: the chemical component of ESP continuous cast mold narrow copper plate base material contains
The Mg of the Be and 0.04wt% of Zr, 0.3wt% of Ni, 0.18wt% of Cu, 1.6wt% of 97.88wt%.
Embodiment 6
The present embodiment is only that processing method is different from the difference of embodiment 1:
Mixing provides the alloy material of Cu, Ni, Be, Zr and Mg according to the ratio, in 1350 DEG C and vacuum degree be 55Pa's
Under the conditions of carry out vacuum melting, then carry out vacuum-casting under conditions of 1250 DEG C and vacuum degree are 55Pa.
It is hot-forged under conditions of initial forging temperature is 900 DEG C, final forging temperature is 600 DEG C, the heating time of hot forging is
2.8h.In hot forging process, according to elder generation along long to the sequence of rear through-thickness is forged, and the deflection of hot forging is 25mm.
It is dissolved 2h under conditions of 880 DEG C, then carries out flow harden.When solid solution, before steel plate cooling is lauched, coolant water temperature
Degree be 28 DEG C, copper sheet from coming out of the stove to being lauched time be 55s.The deformation rate of flow harden is 15%, and the amount of rolling is under single
2mm。
The then ageing treatment 4h under conditions of 500 DEG C.
Embodiment 7
The present embodiment is only that processing method is different from the difference of embodiment 1:
Mixing provides the alloy material of Cu, Ni, Be, Zr and Mg according to the ratio, in 1410 DEG C and vacuum degree be 50Pa's
Under the conditions of carry out vacuum melting, then carry out vacuum-casting under conditions of 1280 DEG C and vacuum degree are 50Pa.
It is hot-forged under conditions of initial forging temperature is 920 DEG C, final forging temperature is 650 DEG C, the heating time of hot forging is
2.5h.In hot forging process, according to elder generation along long to the sequence of rear through-thickness is forged, and the deflection of hot forging is 28mm.
It is dissolved 1.5h under conditions of 880 DEG C, then carries out flow harden.When solid solution, before steel plate cooling is lauched, cooling water
Temperature be 25 DEG C, copper sheet from coming out of the stove to being lauched time be 50s.The deformation rate of flow harden is 35%, the amount of rolling under single
For 1mm.
The then ageing treatment 5h under conditions of 530 DEG C.
Test example
Control group 1-3 is set:
Control group 1 the difference from embodiment 1 is that: the Ni of Cu, 2.2wt% in base material containing 97.05wt%,
The Mg of the Be and 0.05wt% of 0.4wt%, aging temperature are 470 DEG C and keep the temperature 4 hours；
Control group 2 the difference from embodiment 1 is that: the Ni of Cu, 2.2wt% in base material containing 97.25wt%,
The Mg of the Be and 0.05wt% of 0.2wt%, aging temperature are 470 DEG C and keep the temperature 4 hours；
Control group 3 the difference from example 2 is that: the Ni of Cu, 2.2wt% in base material containing 97.25wt%,
The Mg of the Be and 0.05wt% of 0.2wt%, aging temperature are 470 DEG C and keep the temperature 5 hours.
According to " GB/T351 metal material resistivity measurement method ", " GB/T3651 metallic high temperature thermal conductivity measurement side
Method ", " GB/T228.1-2010 metal material tensile testing at ambient temperature ", " GB/T231.1-2009 metal material Brinell hardness "
Method the resulting ESP continuous cast mold narrow copper plate base material of embodiment 1-7 and control group 1-3 is tested for the property,
The results are shown in Table 1.
1 the performance test results of table
As can be seen from Table 1, by adding the Zr of 0.12-0.3% inside CuNiBe alloy, by improving CuNiBeZr
Aging temp can greatly improve the conductivity of base material under the conditions of hardness, yield strength and comparable CuNiBe base material and lead
Heating rate, with CuNiBeZr for ESP continuous cast mold narrow copper plate base material, wearability can be significantly improved, and steel transportation amount correspondinglys increase.
To sum up, ESP continuous cast mold narrow copper plate base material provided by the present application has good electrical and thermal conductivity performance, super
It can ensure that required heating conduction satisfies the use demand under high pulling rate, while ensure to be not in lower mouth abrasion in use process
Service life caused by serious reduces.Its processing method is simple, keeps the strength of materials produced suitable with beryllium ambrose alloy, but have compared with
High electrical and thermal conductivity performance.In continuous casting, hot-face temperature has larger the ESP continuous cast mold narrow copper plate as made from above-mentioned base material
Amplitude reduction, so that making copper plate of crystallizer at a lower temperature has higher intensity, higher hardness, wearability is stronger, thus
Meet the production requirement of ESP continuous cast mold superelevation pulling rate.
The above is only the preferred embodiment of the present invention, are not intended to restrict the invention, for the technology of this field
For personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of ESP continuous cast mold narrow copper plate base material, which is characterized in that the chemical component including following mass content:
The Be and 0.02- of Zr, 0.2-0.4wt% of Ni, 0.12-0.3wt% of Cu, 1.0-2.2wt% of 97.05-98.66wt%
The Mg of 0.05wt%；
Preferably, the chemical component including following mass content: the Ni of Cu, 1.5-2.0wt% of 97.35-98.12wt%,
The Mg of the Be and 0.03-0.05wt% of Zr, 0.2-0.4wt% of 0.15-0.2wt%.
2. ESP continuous cast mold narrow copper plate base material according to claim 1, which is characterized in that ESP continuous cast mold is narrow
The conductivity of face copper sheet base material is 40-45S/m, and IACS 72-76%, thermal conductivity is 320-330W/ (mk)；
Yield strength is 480-520MPa, and hardness HB160-200, softening temperature is 580-600 DEG C, recrystallization temperature 680-
720℃；
Preferably, the conductivity of ESP continuous cast mold narrow copper plate base material is 43S/m, IACS 74%, thermal conductivity 325W/
(m·k)；
Yield strength is 500MPa, and hardness HB180, softening temperature is 590 DEG C, and recrystallization temperature is 700 DEG C.
3. the processing method of ESP continuous cast mold narrow copper plate base material according to claim 1 or 2, which is characterized in that packet
Include following steps:
Mixing provides the alloy material of Cu, Ni, Be, Zr and Mg, then successively carries out vacuum melting, vacuum-casting, hot forging, consolidates
Molten, flow harden and ageing treatment.
4. processing method according to claim 3, which is characterized in that ageing treatment is under conditions of 500-530 DEG C
Manage 3-5h.
5. processing method according to claim 3, which is characterized in that the temperature of vacuum melting is 1350-1410 DEG C；Vacuum
The vacuum degree of melting is less than or equal to 60Pa.
6. processing method according to claim 3, which is characterized in that the temperature of vacuum-casting is 1250-1280 DEG C；Vacuum
The vacuum degree of ingot casting is less than or equal to 60Pa.
7. processing method according to claim 3, which is characterized in that the initial forging temperature of hot forging is 900-920 DEG C, finish-forging temperature
Degree is 600-650 DEG C, and the heating time of hot forging is 2.5-3h；
Preferably, it is hot-forged according to elder generation along long to the sequence of rear through-thickness is forged；
Preferably, the deflection of hot forging is 25-30mm.
8. processing method according to claim 3, which is characterized in that solid solubility temperature is 870-890 DEG C, solution time 1-
2h；
Preferably, when solid solution, copper sheet is cooling be lauched before, cooling water temperature is no more than 30 DEG C, copper sheet from coming out of the stove to being lauched
Time is no more than 60s.
9. processing method according to claim 3, which is characterized in that cold deformation rate is 15- during flow harden
35%；
Preferably, the amount of rolling is 1-2mm under single during flow harden.
10. a kind of ESP continuous cast mold narrow copper plate, which is characterized in that ESP continuous cast mold narrow copper plate is by such as claim
ESP continuous cast mold narrow copper plate base material described in 1 or 2 is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910592083.0A CN110218903B (en) | 2019-07-02 | 2019-07-02 | ESP continuous casting crystallizer narrow-surface copper plate base metal and machining method thereof, and ESP continuous casting crystallizer narrow-surface copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910592083.0A CN110218903B (en) | 2019-07-02 | 2019-07-02 | ESP continuous casting crystallizer narrow-surface copper plate base metal and machining method thereof, and ESP continuous casting crystallizer narrow-surface copper plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110218903A true CN110218903A (en) | 2019-09-10 |
| CN110218903B CN110218903B (en) | 2020-07-14 |
Family
ID=67815755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910592083.0A Active CN110218903B (en) | 2019-07-02 | 2019-07-02 | ESP continuous casting crystallizer narrow-surface copper plate base metal and machining method thereof, and ESP continuous casting crystallizer narrow-surface copper plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110218903B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113333696A (en) * | 2021-06-01 | 2021-09-03 | 西峡龙成特种材料有限公司 | CuAlFeNi crystallizer copper plate back plate, parent metal and machining method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2137281A (en) * | 1937-09-15 | 1938-11-22 | Mallory & Co Inc P R | Copper alloys |
| EP1181997A1 (en) * | 2000-08-26 | 2002-02-27 | SMS Demag AG | Process and device for continuous casting of steel strip from molten steel |
| DE10155117A1 (en) * | 2001-11-09 | 2003-05-22 | Sms Demag Ag | Continuous casting mold used for casting metals comprises independently moving mold parts which separate in the casting direction |
| CN1423707A (en) * | 2000-04-14 | 2003-06-11 | Sms迪马格股份公司 | Use of a hardenable copper alloy for molds |
| CN102925746A (en) * | 2012-11-29 | 2013-02-13 | 宁波兴业鑫泰新型电子材料有限公司 | High-performance Cu-Ni-Si system copper alloy, and preparation method and processing method thereof |
| CN104046841A (en) * | 2013-03-13 | 2014-09-17 | 南京金基合金材料有限公司 | Crystallizer block alloy material |
| US20150251270A1 (en) * | 2012-10-05 | 2015-09-10 | Kme Germany Gmbh & Co. Kg | Electrode for electrode holder |
-
2019
- 2019-07-02 CN CN201910592083.0A patent/CN110218903B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2137281A (en) * | 1937-09-15 | 1938-11-22 | Mallory & Co Inc P R | Copper alloys |
| CN1423707A (en) * | 2000-04-14 | 2003-06-11 | Sms迪马格股份公司 | Use of a hardenable copper alloy for molds |
| EP1181997A1 (en) * | 2000-08-26 | 2002-02-27 | SMS Demag AG | Process and device for continuous casting of steel strip from molten steel |
| DE10155117A1 (en) * | 2001-11-09 | 2003-05-22 | Sms Demag Ag | Continuous casting mold used for casting metals comprises independently moving mold parts which separate in the casting direction |
| US20150251270A1 (en) * | 2012-10-05 | 2015-09-10 | Kme Germany Gmbh & Co. Kg | Electrode for electrode holder |
| CN102925746A (en) * | 2012-11-29 | 2013-02-13 | 宁波兴业鑫泰新型电子材料有限公司 | High-performance Cu-Ni-Si system copper alloy, and preparation method and processing method thereof |
| CN104046841A (en) * | 2013-03-13 | 2014-09-17 | 南京金基合金材料有限公司 | Crystallizer block alloy material |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113333696A (en) * | 2021-06-01 | 2021-09-03 | 西峡龙成特种材料有限公司 | CuAlFeNi crystallizer copper plate back plate, parent metal and machining method thereof |
| CN113333696B (en) * | 2021-06-01 | 2023-02-17 | 西峡龙成特种材料有限公司 | CuAlFeNi crystallizer copper plate back plate, parent metal and machining method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110218903B (en) | 2020-07-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104745903B (en) | A kind of 480MPa grades of aluminium alloy oil pipe aluminium alloy and its tubing manufacture method | |
| CN101974709B (en) | Super-soft aluminum alloy conductor and preparation method thereof | |
| CN101403080B (en) | Thermal treatment process for erbium-containing aluminum-magnesium-manganese wrought aluminium alloy | |
| CN105950931B (en) | The high-strength high hard magnesium alloy of controllable reaction and its manufacturing method of component occurs with water | |
| JP6247225B2 (en) | Aluminum fin alloy and manufacturing method thereof | |
| CN102943193A (en) | Grain refinement machining process of hard aluminium alloy cast ingot | |
| CN111485146B (en) | High-thermal-conductivity high-strength low-Si cast aluminum alloy and preparation method thereof | |
| JP2007056365A (en) | Copper-zinc-tin alloy and manufacturing method therefor | |
| WO2015192279A1 (en) | High-strength creep-resistant low-copper alloy material and application thereof | |
| CN109706354A (en) | A kind of material and preparation method thereof with good plasticity | |
| CN105568019B (en) | Refining method for CuAlMn shape memory alloy grains | |
| US20160298217A1 (en) | Aluminum Alloy Refiner Material and Preparation Method Thereof | |
| JP4642119B2 (en) | Copper alloy and method for producing the same | |
| WO2021129802A1 (en) | High-strength and high-toughness copper-zinc-aluminum shape memory alloy and preparation method therefor | |
| CN110218903A (en) | A kind of ESP continuous cast mold narrow copper plate base material and its processing method, ESP continuous cast mold narrow copper plate | |
| CN105861935A (en) | Fe-36Ni Invar alloy material good in thermoplasticity and preparation method thereof | |
| CN112981212A (en) | Preparation method of non-equiatomic ratio high-entropy alloy semi-solid thixotropic blank | |
| JP2000119784A (en) | Aluminum alloy material excellent in high temperature creep characteristic and its production | |
| CN109161738B (en) | A kind of highly conductive corrosion resistant aluminum alloy and preparation method thereof | |
| CN110656263A (en) | High-performance Al-Si series welding wire alloy containing trace La element and preparation method thereof | |
| CN103361526B (en) | A kind of aldural and production method thereof | |
| WO2023015608A1 (en) | High strength, high conductivity, intergranular corrosion-resistant aluminum alloy and preparation method therefor | |
| CN107586980B (en) | A kind of multielement rare earth alloying high-conductivity copper alloy and preparation method thereof | |
| JP3692006B2 (en) | High corrosion resistance zirconium alloy, structural material for reactor core, and method for producing the same | |
| JP4158337B2 (en) | Method for producing chromium-zirconium-based copper alloy for continuous casting mold |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |