CN110218903B - ESP continuous casting crystallizer narrow-surface copper plate base metal and machining method thereof, and ESP continuous casting crystallizer narrow-surface copper plate - Google Patents
ESP continuous casting crystallizer narrow-surface copper plate base metal and machining method thereof, and ESP continuous casting crystallizer narrow-surface copper plate Download PDFInfo
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- CN110218903B CN110218903B CN201910592083.0A CN201910592083A CN110218903B CN 110218903 B CN110218903 B CN 110218903B CN 201910592083 A CN201910592083 A CN 201910592083A CN 110218903 B CN110218903 B CN 110218903B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/04—Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds
- B22D11/059—Mould materials or platings
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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Abstract
The invention provides an ESP continuous casting crystallizer narrow-face copper plate parent metal, a processing method thereof and an ESP continuous casting crystallizer narrow-face copper plate, and belongs to the technical field of copper alloys. The parent material comprises the following chemical components: 97.05-98.66 wt% of Cu, 1.0-2.2 wt% of Ni, 0.12-0.3 wt% of Zr, 0.2-0.4 wt% of Be and 0.02-0.05 wt% of Mg. The base material has good electric conduction and heat conduction performance. The processing method comprises the following steps: mixing the corresponding alloy materials, and then sequentially carrying out vacuum melting, vacuum ingot casting, hot forging, solid solution, cold hardening and aging treatment. The processing method is simple, so that the strength of the produced material is equivalent to that of beryllium-nickel-copper, but the material has higher electric and heat conducting properties. When the copper plate made of the base material is continuously cast, the hot surface temperature is greatly reduced, and the copper plate has higher strength, higher hardness and stronger wear resistance at lower temperature.
Description
Technical Field
The invention relates to the technical field of copper alloy, in particular to an ESP continuous casting crystallizer narrow-surface copper plate parent metal and a processing method thereof, and an ESP continuous casting crystallizer narrow-surface copper plate.
Background
With the development of continuous casting technology, the requirements on the performance of copper alloy materials are higher and higher, and because the conductivity and the material strength are difficult to be considered at the same time, the strength and the hardness of beryllium nickel copper are higher at normal temperature, and the conductivity and the thermal conductivity are slightly lower, so that the temperature of a hot surface of a crystallizer copper plate of beryllium nickel copper is relatively higher during continuous casting, the strength and the hardness of the crystallizer copper plate are relatively reduced and the wear resistance is relatively reduced along with the increase of a temperature environment of the material, and the beryllium nickel copper cannot be applied to the newly developed ultrahigh-drawing-speed ESP continuous casting technology.
Disclosure of Invention
The invention provides an ESP continuous casting crystallizer narrow-face copper plate parent metal which has good electric conduction and heat conduction performance, can ensure the required heat conduction performance to meet the use requirement at ultrahigh drawing speed, and simultaneously ensures that the service life reduction caused by serious lower port abrasion does not occur in the use process.
The second purpose of the invention comprises providing a processing method of the ESP continuous casting crystallizer narrow-face copper plate parent metal, wherein the processing method is simple, and the strength of the produced material is equivalent to that of beryllium nickel copper, but the produced material has high electric conduction and heat conduction performance.
The invention also provides an ESP continuous casting crystallizer narrow-face copper plate prepared from the parent metal, wherein the hot face temperature of the crystallizer copper plate is greatly reduced during continuous casting, so that the crystallizer copper plate has higher strength, higher hardness and stronger wear resistance at lower temperature, and the production requirement of the ESP continuous casting crystallizer on ultrahigh casting speed is met.
The technical problem to be solved by the invention is realized by adopting the following technical scheme:
the invention provides an ESP continuous casting crystallizer narrow-face copper plate parent metal, which comprises the following chemical components in percentage by mass: 97.05-98.66 wt% of Cu, 1.0-2.2 wt% of Ni, 0.12-0.3 wt% of Zr, 0.2-0.4 wt% of Be and 0.02-0.05 wt% of Mg.
In some preferred embodiments, the ESP continuous casting crystallizer narrow-face copper plate parent metal comprises the following chemical components by mass: 97.35-98.12 wt% Cu, 1.5-2.0 wt% Ni, 0.15-0.2 wt% Zr, 0.2-0.4 wt% Be and 0.03-0.05 wt% Mg.
In some embodiments, the electrical conductivity of the ESP continuous casting mold narrow-face copper plate parent material is 40-45S/m, the IACS is 72-76%, and the thermal conductivity is 320-.
In some preferred embodiments, the ESP continuous casting crystallizer narrow-face copper plate parent metal has the electric conductivity of 42S/m, the IACS of 74% and the thermal conductivity of 325W/(m.k).
In addition, the invention also provides a processing method of the ESP continuous casting crystallizer narrow-face copper plate parent metal, which comprises the following steps:
alloy materials of Cu, Ni, Be, Zr and Mg are provided by mixing, and then vacuum melting, vacuum ingot casting, hot forging, solid solution, cold hardening and aging treatment are carried out in sequence.
Wherein the aging treatment is carried out for 3-5h under the conditions of 500-530 ℃.
In addition, the invention also provides an ESP continuous casting crystallizer narrow-surface copper plate which is prepared from the ESP continuous casting crystallizer narrow-surface copper plate parent metal.
The application provides ESP continuous casting crystallizer narrow-face copper plate parent metal and processing method thereof, ESP continuous casting crystallizer narrow-face copper plate's beneficial effect includes:
the application provides an ESP continuous casting crystallizer leptoprosopy copper mother metal has good electrically conductive heat conductivility, can ensure that required heat conductivility satisfies the user demand under the super high speed of drawing, ensures simultaneously that the life that the end opening wearing and tearing seriously led to reduces can not appear in the use. The processing method is simple, so that the strength of the produced material is equivalent to that of beryllium-nickel-copper, but the material has higher electric and heat conducting properties. When the narrow-face copper plate of the ESP continuous casting crystallizer prepared from the parent metal is continuously cast, the hot face temperature is greatly reduced, so that the copper plate of the crystallizer has higher strength and hardness and stronger wear resistance at lower temperature, and the production requirement of the ESP continuous casting crystallizer on ultrahigh drawing speed is met.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
The ESP continuous casting mold narrow-face copper plate parent metal, the processing method thereof, and the ESP continuous casting mold narrow-face copper plate provided in the embodiments of the present application will be specifically described below.
The ESP continuous casting crystallizer narrow-face copper plate parent metal comprises the following chemical components in mass content: 97.05-98.66 wt% of Cu, 1.0-2.2 wt% of Ni, 0.12-0.3 wt% of Zr, 0.2-0.4 wt% of Be and 0.02-0.05 wt% of Mg.
Alternatively, the mass content of Cu may be 97.05 wt%, 97.5 wt%, 98 wt%, 98.5 wt%, 98.66 wt%, or the like, and may be any mass content within a range of 97.05 to 98.66 wt%.
The Ni content may be 1 wt%, 1.2 wt%, 1.5 wt%, 1.8 wt%, 2 wt%, 2.2 wt%, or the like, and may be any content within a range of 1 to 2.2 wt%.
The Zr content may be 0.12 wt%, 0.15 wt%, 0.18 wt%, 0.2 wt%, 0.25 wt%, 0.3 wt%, or the like, and may be any one of the mass contents within a range of 1.0 to 2.2 wt%.
The content of Be may Be 0.2 wt%, 0.25 wt%, 0.3 wt%, 0.35 wt%, 0.4 wt%, or the like, or may Be any content within the range of 0.2 to 0.4 wt%.
The Mg content may be 0.02 wt%, 0.025 wt%, 0.03 wt%, 0.035 wt%, 0.04 wt%, 0.045 wt%, 0.05 wt%, or the like, or may be any content within a range of 0.02 to 0.05 wt%.
In some preferred embodiments, the ESP continuous casting crystallizer narrow-face copper plate parent metal comprises the following chemical components by mass: 97.35-98.12 wt% Cu, 1.5-2.0 wt% Ni, 0.15-0.2 wt% Zr, 0.2-0.4 wt% Be and 0.03-0.05 wt% Mg.
For reference, in a specific embodiment, the ESP continuous casting crystallizer narrow-face copper plate parent metal comprises the following chemical compositions by mass: 97.88 wt% Cu, 1.6 wt% Ni, 0.18 wt% Zr, 0.3 wt% Be and 0.04 wt% Mg.
At present, the contradiction between high strength and high conductivity always exists in the field of copper alloy, and in the application, the solid solubility of nickel in copper is high, the nickel can be infinitely dissolved with the copper, the nickel and the copper can form a continuous solid solution, a wide single-phase area is provided, the mechanical property and the corrosion resistance of the copper can be obviously improved, and the conductivity and the heat conductivity of the copper are reduced.
In the existing CuNiBe material, Be is added on the basis of Cu and Ni, and although the strength and the hardness of the material are further improved, the electric conduction and heat conduction performance of the material still cannot meet the production requirement of an ESP continuous casting crystallizer at ultrahigh pulling speed.
The inventors of the present invention have found, through long-term studies on a copper plate base material, that Zr and Be can exert a synergistic effect in improving the electrical and thermal conductivity of a copper plate by blending an appropriate amount of Zr, Cu, Ni, Be, and Mg, which are limited in solid solubility in copper. The reason for this is probably that the solid solubility of Zr and Be changes drastically with the temperature change, that is, the solid solubility in copper at high and low temperatures is greatly different, and when the temperature starts to decrease after the alloy crystallization is completed, the solid solubility in copper also starts to decrease, and they precipitate from the solid phase in the form of metal compound or simple substance, and when they are dissolved in copper, the strength can Be significantly improved, which has a solid solution strengthening effect, and when they are subjected to the specific aging treatment in this application, they precipitate from the solid phase, which also produces a dispersion strengthening effect, thereby contributing to the improvement of the electric and thermal conductivities of the copper plate. Magnesium is limited in solid solubility in copper, can be used as a copper deoxidizer, and has the effects of deoxidizing liquid metal, slagging and refining grains.
In the method, Cu, Ni, Zr, Be and Mg are mixed according to the proportion, so that the electrical conductivity and the thermal conductivity of the copper plate can Be greatly improved on the premise of not reducing the strength and the hardness compared with the CuNiBe material.
Compared with beryllium nickel copper, the aging temperature of the beryllium nickel copper is 470 ℃, and the aging temperature of the parent metal of the narrow-face copper plate of the ESP continuous casting crystallizer provided by the application is 500-530 ℃, so that the strength of the produced material is equivalent to that of the beryllium nickel copper, but the electrical conductivity and the thermal conductivity of the parent metal of the narrow-face copper plate of the ESP continuous casting crystallizer provided by the application are obviously improved compared with those of the beryllium nickel copper.
In some embodiments, the ESP continuous casting crystallizer narrow-face copper plate parent material has the electrical conductivity of 40-45S/m (20 ℃) and the IACS of 72-76% (20 ℃), and the thermal conductivity of 320-330W/(m.k) (20 ℃). Meanwhile, under the condition of 20 ℃, the yield strength is 480-520MPa, the hardness is HB160-200, the softening temperature is 580-600 ℃, and the recrystallization temperature is 680-720 ℃.
In some preferred embodiments, the ESP continuous casting mold narrow-face copper plate parent material has an electrical conductivity of 43S/m (20 ℃) and an IACS of 74(20 ℃) and a thermal conductivity of 325W/(m.k) (20 ℃). In contrast, CuNiBe has an electrical conductivity of only 38S/m (20 ℃ C.), an IACS of only 66% (20 ℃ C.), and a thermal conductivity of only 290W/(m.k) (20 ℃ C.). Meanwhile, under the condition of 20 ℃, the yield strength is 480-520MPa, the hardness is HB160-200, the softening temperature is 580-600 ℃, and the recrystallization temperature is 680-720 ℃.
Therefore, the ESP continuous casting crystallizer narrow-face copper plate parent metal provided by the application has better electric conduction and heat conduction performance than the existing CuNiBe material, therefore, the hot-face temperature of the ESP continuous casting crystallizer narrow-face copper plate is lower than that of the crystallizer narrow-face copper plate taking CuNiBe as the parent metal, in a set of comparison tests, the hot-face temperature of the crystallizer narrow-face copper plate taking CuNiBe as the parent metal is 332 ℃, while the hot-face temperature of the ESP continuous casting crystallizer narrow-face copper plate is 305 ℃, the reduction of the hot-face temperature ensures that the strength and the hardness are increased inevitably, and the wear resistance is also increased inevitably.
The application also provides a method for processing the narrow-face copper plate parent metal of the ESP continuous casting crystallizer, which comprises the following steps: alloy materials of Cu, Ni, Be, Zr and Mg are provided by mixing, and then vacuum melting, vacuum ingot casting, hot forging, solid solution, cold hardening and aging treatment are carried out in sequence.
Wherein the aging treatment is carried out for 3-5h under the conditions of 500-530 ℃. Alternatively, the temperature of the aging treatment may be, for example, 500 ℃, 510 ℃, 520 ℃, 530 ℃, 505 ℃, 515 ℃, 525 ℃ or the like, or may be any temperature value within the range of 500 ℃ and 530 ℃. The time for the aging treatment may be, for example, 3 hours, 3.5 hours, 4 hours, 4.5 hours, or 5 hours.
In the application, the temperature of the aging treatment is set to be 500-530 ℃, and the time of the aging treatment is set to be 3-5h, so that the copper plate base material is ensured to have better electric conduction and heat conduction performance, and also have better strength and hardness.
In this application, the temperature of the vacuum melting may be set to 1350-. The degree of vacuum in the vacuum melting may be, for example, 60Pa or less.
The temperature of the vacuum ingot casting can be set to 1250-. The degree of vacuum of the vacuum ingot may be, for example, 60Pa or less.
The alloy base metal with compact structure, stable performance and excellent wear resistance can be obtained by the vacuum melting and the vacuum ingot casting.
The initial forging temperature of the hot forging can be set to 900-920 ℃, such as 900 ℃, 910 ℃ or 920 ℃ and the like; the finish forging temperature can be set at 600-650 deg.C, such as 600 deg.C, 610 deg.C, 620 deg.C, 630 deg.C, 640 deg.C or 650 deg.C; the heating time for hot forging may be set to 2.5-3h, such as 2.5h, 2.8h, or 3 h.
In the hot forging, it is preferable to perform forging in the order of the longitudinal direction first and the thickness direction later. The deformation amount of the hot forging can be controlled, for example, within a range of 25 to 30 mm.
The hot forging treatment under the above conditions is favorable for obtaining the copper plate base metal with uniform structure performance.
The solution temperature is set to 870-. The solid solution time can be 1-2h, such as 1h, 1.5h or 2 h.
In some preferred embodiments, the temperature of the cooling water is not more than 30 ℃ before the copper plate is cooled down by the launching water during solid solution, and the time from tapping to launching of the copper plate is controlled within 60s (inclusive).
Through the solid solution treatment under the conditions, Zr and Be in the application can form a supersaturated solid solution, so that the subsequent aging treatment is facilitated.
The cold deformation rate in the cold hardening process is 15-35%, such as 15%, 20%, 25%, 30% or 35%.
Preferably, the rolling amount of a single time in the cold hardening process can be controlled to be 1-2mm, for example.
The cold-work hardening process under the above conditions is favorable for making the copper plate base material have higher hardness.
In view of the above, the ESP continuous casting mold narrow-face copper plate parent metal processed by the above processing method according to the chemical composition provided by the present application has high electrical conductivity and thermal conductivity in addition to high hardness and strength.
The application also provides an ESP continuous casting crystallizer narrow-face copper plate which is made of the ESP continuous casting crystallizer narrow-face copper plate parent metal. The reason why the hot surface temperature of the narrow-surface copper plate of the ESP continuous casting crystallizer does not exceed 310 ℃, and is usually about 305 ℃, is that the working surface temperature is reduced because the used copper plate base material has high electrical conductivity and thermal conductivity and heat is rapidly transferred to the outside.
By comparison, under the same condition, the hot surface temperature of the CuNiBeZr crystallizer copper plate reaches 332 ℃, but the hot surface temperature of the CuNiBeZr crystallizer copper plate is only about 305 ℃, and the hardness of the copper plate at 305 ℃ is higher than that of the copper plate at 332 ℃, so that the CuNiBeZr crystallizer copper plate is more wear-resistant and has longer service life than the CuNiBe crystallizer copper plate.
The features and properties of the present invention are described in further detail below with reference to examples.
Example 1
The chemical composition of the ESP continuous casting mold narrow-face copper plate parent material in this example contains 97.05 wt% of Cu, 2.2 wt% of Ni, 0.3 wt% of Zr, 0.4 wt% of Be, and 0.05 wt% of Mg.
The processing method comprises the following steps:
proportionally mixing to provide an alloy material of Cu, Ni, Be, Zr and Mg, carrying out vacuum melting at 1380 ℃ and under the condition that the vacuum degree is 60Pa, and then carrying out vacuum ingot casting at 1265 ℃ and under the condition that the vacuum degree is 60 Pa.
The hot forging was carried out at a start forging temperature of 910 ℃ and a finish forging temperature of 625 ℃ for a heating time of 3 hours. In the hot forging process, forging is performed in the order of the longitudinal direction first and the thickness direction later, and the deformation amount of the hot forging is 30 mm.
Solid solution is carried out for 1.5h under the condition of 880 ℃, and then cold hardening is carried out. In the solid solution process, the temperature of cooling water before the steel plate is cooled to be launched is 30 ℃, and the time between the tapping of the copper plate and the launching is 60 s. The cold-work hardening deformation rate is 25%, and the single rolling amount is 1.5 mm.
Followed by aging at 530 ℃ for 4 h.
Example 2
This example differs from example 1 only in that: the chemical composition of the ESP continuous casting crystallizer narrow-face copper plate parent metal comprises 98.66 wt% of Cu, 1 wt% of Ni, 0.12 wt% of Zr, 0.2 wt% of Be and 0.02 wt% of Mg.
Example 3
This example differs from example 1 only in that: the chemical composition of the ESP continuous casting crystallizer narrow-face copper plate parent metal comprises 97.35 wt% of Cu, 2 wt% of Ni, 0.2 wt% of Zr, 0.4 wt% of Be and 0.05 wt% of Mg.
Example 4
This example differs from example 1 only in that: the chemical composition of the ESP continuous casting crystallizer narrow-face copper plate parent metal comprises 98.12 wt% of Cu, 1.5 wt% of Ni, 0.15 wt% of Zr, 0.2 wt% of Be and 0.03 wt% of Mg.
Example 5
This example differs from example 1 only in that: the chemical composition of the ESP continuous casting crystallizer narrow-face copper plate parent metal comprises 97.88 wt% of Cu, 1.6 wt% of Ni, 0.18 wt% of Zr, 0.3 wt% of Be and 0.04 wt% of Mg.
Example 6
The present example differs from example 1 only in the processing method:
the alloy materials of Cu, Ni, Be, Zr and Mg are provided by mixing according to the proportion, vacuum melting is carried out at 1350 ℃ and the vacuum degree of 55Pa, and then vacuum ingot casting is carried out at 1250 ℃ and the vacuum degree of 55 Pa.
The hot forging was carried out at a start forging temperature of 900 ℃ and a finish forging temperature of 600 ℃ for a heating time of 2.8 hours. In the hot forging process, forging is carried out in the sequence of the length direction first and the thickness direction later, and the deformation amount of the hot forging is 25 mm.
Solid solution is carried out for 2h under the condition of 880 ℃, and then cold hardening is carried out. In the solid solution, the temperature of the cooling water was 28 ℃ before the steel sheet was cooled down to the water, and the time from tapping to the water discharging of the copper sheet was 55 seconds. The cold-work hardening deformation rate is 15%, and the single rolling amount is 2 mm.
Followed by aging at 500 ℃ for 4 h.
Example 7
The present example differs from example 1 only in the processing method:
the alloy materials of Cu, Ni, Be, Zr and Mg are provided by mixing according to the proportion, vacuum melting is carried out at 1410 ℃ and the vacuum degree is 50Pa, and then vacuum ingot casting is carried out at 1280 ℃ and the vacuum degree is 50 Pa.
The hot forging was carried out at a start forging temperature of 920 ℃ and a finish forging temperature of 650 ℃ for a heating time of 2.5 hours. In the hot forging process, forging was performed in the order of the longitudinal direction first and the thickness direction second, and the deformation amount of hot forging was 28 mm.
Solid solution is carried out for 1.5h under the condition of 880 ℃, and then cold hardening is carried out. In the solid solution process, the temperature of cooling water is 25 ℃ before the steel plate is cooled and launched, and the time between the tapping of the copper plate and the launching of the copper plate is 50 s. The cold-work hardening deformation rate is 35%, and the single rolling amount is 1 mm.
Followed by aging at 530 ℃ for 5 h.
Test examples
Setting comparison groups 1-3:
control 1 differs from example 1 in that: the parent metal contains 97.05 wt% of Cu, 2.2 wt% of Ni, 0.4 wt% of Be and 0.05 wt% of Mg, and the aging treatment temperature is 470 ℃ for heat preservation for 4 hours;
control 2 differs from example 1 in that: the parent metal contains 97.25 wt% of Cu, 2.2 wt% of Ni, 0.2 wt% of Be and 0.05 wt% of Mg, and the aging treatment temperature is 470 ℃ and the temperature is kept for 4 hours;
the control 3 differs from example 2 in that: the parent material contains 97.25 wt% of Cu, 2.2 wt% of Ni, 0.2 wt% of Be and 0.05 wt% of Mg, and the aging treatment temperature is 470 ℃ for 5 hours.
The ESP continuous casting mold base materials on the narrow side obtained in examples 1 to 7 and comparative examples 1 to 3 were subjected to performance tests using methods described in "method for measuring resistivity of GB/T351 metallic material", "method for measuring high temperature thermal conductivity of GB/T3651 metal", "method for tensile testing of metallic material at room temperature" GB/T228.1-2010 and "brinell hardness of metallic material" GB/T231.1-2009, and the results are shown in table 1.
Table 1 results of performance testing
As can be seen from Table 1, by adding 0.12-0.3% of Zr into the CuNiBe alloy and increasing the aging temperature of the CuNiBeZr, the electric conductivity and the thermal conductivity of the parent metal can be greatly improved under the condition that the hardness and the yield strength are equivalent to those of the CuNiBe parent metal, and by using the CuNiBeZr as the ESP continuous casting crystallizer narrow-face copper plate parent metal, the wear resistance is obviously improved, and the excessive steel amount is correspondingly improved.
In conclusion, the ESP continuous casting crystallizer narrow-face copper plate parent metal has good electric conduction and heat conduction performance, can ensure that the required heat conduction performance meets the use requirement at ultrahigh drawing speed, and simultaneously ensures that the service life reduction caused by serious lower port abrasion cannot occur in the use process. The processing method is simple, so that the strength of the produced material is equivalent to that of beryllium-nickel-copper, but the material has higher electric and heat conducting properties. When the narrow-face copper plate of the ESP continuous casting crystallizer prepared from the parent metal is continuously cast, the hot face temperature is greatly reduced, so that the copper plate of the crystallizer has higher strength and hardness and stronger wear resistance at lower temperature, and the production requirement of the ESP continuous casting crystallizer on ultrahigh drawing speed is met.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes may be made to the present invention by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (13)
1. The ESP continuous casting crystallizer narrow-face copper plate parent metal is characterized by comprising the following chemical components in percentage by mass: 97.05-98.66 wt% of Cu, 1.0-2.2 wt% of Ni, 0.12-0.3 wt% of Zr, 0.2-0.4 wt% of Be and 0.02-0.05 wt% of Mg;
the ESP continuous casting crystallizer narrow-face copper plate parent metal is obtained through the following steps: mixing alloy materials of Cu, Ni, Be, Zr and Mg, and then sequentially carrying out vacuum melting, vacuum ingot casting, hot forging, solid solution, cold hardening and aging treatment;
the temperature of vacuum melting is 1350-; the vacuum degree of vacuum melting is less than or equal to 60 Pa; the forging starting temperature of hot forging is 900-920 ℃, the forging finishing temperature is 600-650 ℃, and the heating time of hot forging is 2.5-3 h.
2. The ESP continuous casting crystallizer narrow-face copper plate parent material of claim 1, comprising the following chemical components by mass: 97.35-98.12 wt% Cu, 1.5-2.0 wt% Ni, 0.15-0.2 wt% Zr, 0.2-0.4 wt% Be and 0.03-0.05 wt% Mg.
3. The ESP continuous casting mold narrow-face copper plate parent material as claimed in claim 1 or 2, wherein the ESP continuous casting mold narrow-face copper plate parent material has an electrical conductivity of 40-45S/m, an IACS of 72-76%, and a thermal conductivity of 320-;
the yield strength is 480-520MPa, the hardness is HB160-200, the softening temperature is 580-600 ℃, and the recrystallization temperature is 680-720 ℃.
4. The ESP continuous casting mold narrow-face copper plate parent material of claim 3, wherein the ESP continuous casting mold narrow-face copper plate parent material has an electrical conductivity of 43S/m, IACS of 74%, and thermal conductivity of 325W/(m-k);
the yield strength is 500MPa, the hardness is HB180, the softening temperature is 590 ℃, and the recrystallization temperature is 700 ℃.
5. The method for processing the narrow-face copper plate parent material of the ESP continuous casting crystallizer as claimed in any one of claims 1 to 4, wherein the aging treatment is carried out at 530 ℃ for 3-5h under 500-.
6. The process of claim 5, wherein the temperature of the vacuum ingot is 1250-1280 ℃; the vacuum degree of the vacuum cast ingot is less than or equal to 60 Pa.
7. The working method according to claim 5, wherein the hot forging is performed in the order of the longitudinal direction first and the thickness direction second.
8. The working method according to claim 7, wherein the deformation amount of the hot forging is 25 to 30 mm.
9. The process according to claim 5, wherein the solution temperature is 870-.
10. The process according to claim 9, wherein the temperature of the cooling water before the copper plate is cooled down to the lower water in the solution treatment is not more than 30 ℃ and the time from tapping to the lower water in the copper plate is not more than 60 seconds.
11. The process of claim 5, wherein the cold deformation rate during cold hardening is 15 to 35%.
12. The process of claim 11, wherein the amount of single pass rolling during cold work hardening is 1-2 mm.
13. An ESP continuous casting crystallizer narrow-face copper plate, characterized in that the ESP continuous casting crystallizer narrow-face copper plate is made of the ESP continuous casting crystallizer narrow-face copper plate parent material according to any one of claims 1 to 4.
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