CN110210337A - Living things feature recognition mould group, preparation method and electronic equipment - Google Patents
Living things feature recognition mould group, preparation method and electronic equipment Download PDFInfo
- Publication number
- CN110210337A CN110210337A CN201910411708.9A CN201910411708A CN110210337A CN 110210337 A CN110210337 A CN 110210337A CN 201910411708 A CN201910411708 A CN 201910411708A CN 110210337 A CN110210337 A CN 110210337A
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- living things
- feature recognition
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- 238000002360 preparation method Methods 0.000 title claims abstract description 49
- 239000000178 monomer Substances 0.000 claims abstract description 77
- 230000035807 sensation Effects 0.000 claims abstract description 75
- 238000005538 encapsulation Methods 0.000 claims abstract description 65
- 239000000463 material Substances 0.000 claims abstract description 42
- 238000012856 packing Methods 0.000 claims abstract description 37
- 230000006698 induction Effects 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 121
- 239000011159 matrix material Substances 0.000 claims description 22
- 239000011241 protective layer Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 12
- 239000002313 adhesive film Substances 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 10
- 230000001939 inductive effect Effects 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 238000004382 potting Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000010276 construction Methods 0.000 description 9
- 230000005284 excitation Effects 0.000 description 8
- 239000000243 solution Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000003486 chemical etching Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000003466 anti-cipated effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000003825 pressing Methods 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention provides a kind of living things feature recognition mould group, preparation method and electronic equipment, living things feature recognition mould group includes base unit and encapsulation monomer；Base unit has the groove and the multiple collimating apertures being connected to groove that Open Side Down；Encapsulation monomer includes the light sensation chip that upper surface has induction region；It encapsulates monomer setting in a groove, and encapsulates and be provided with packing material between the outer wall of monomer and the inner wall of groove, collimating aperture corresponds to the induction region.Living things feature recognition mould group of the embodiment of the present invention has the advantages that intensity is higher, thinner thickness.
Description
Technical field
The present invention relates to shield lower optical technical field more particularly to a kind of biological characteristic knowledge suitable for shielding lower optical finger print
Other mould group, preparation method and electronic equipment.
Background technique
The description of this part, which is only provided, discloses relevant background information to the present invention, without constituting the prior art.
Shield lower optical fingerprint identification technology to obtain due to being not take up the space surface of electronic equipment (such as smart phone)
Fast-developing and application.
In order to improve image quality, the prior art generally carries out collimation processing to light.Current relatively broad light collimation side
Formula is that optical fiber collimator is arranged on fingerprint chip.However, employing mode, optical fiber collimator is more fragile, is easily broken off.
In view of this, the encapsulating structure of the fingerprint recognition chip of Publication No. CN108022904A provides a kind of new standard
Histogram formula.As shown in FIG. 1A and 1B, the encapsulating structure of the fingerprint recognition chip includes fingerprint recognition chip 11 and semiconductor cap
Plate 12.The induction region a of the first surface 111 of fingerprint recognition chip 11 is arranged multiple for acquiring the pixel of finger print information
13.Semiconductor cover board 12 covers the first surface 111 of fingerprint recognition chip 11, and semiconductor cover board 12 has multiple and pixel
13 corresponding through-holes 14, multiple through-holes 14 can reach the purpose of light collimation.
However, in above-mentioned encapsulating structure, fingerprint recognition chip 11 and semiconductor cover board 12 are stepped construction, the two it is opposite
Surface can be fixed by the modes such as being bonded or welded.To which encapsulating structure has that structural strength is weaker.
Further, as shown in Figure 1B, some embodiments of above-mentioned encapsulating structure further include backboard 22, pass through glue-line 23
It is adhesively fixed with fingerprint recognition chip 11.As a result, in this embodiment, due to the presence of backboard 22, and stepped construction is increased,
To exacerbate the weakening strength of encapsulating structure.
In addition, being based on the lighter and thinner development trend of current electronic device (such as smart phone), it is desirable that encapsulating structure
Thinner thickness.However, the thickness that will lead to above-mentioned encapsulating structure is thicker, it is difficult to meet electronics due to the presence of stepped construction
The more lightening demand of equipment.
It should be noted that the above description of the technical background be intended merely to it is convenient to technical solution of the present invention carry out it is clear,
Complete explanation, and facilitate the understanding of those skilled in the art and illustrate.Cannot merely because these schemes of the invention
Background technology part is expounded and thinks that above-mentioned technical proposal is known to those skilled in the art.
Summary of the invention
Based on prior art defect above-mentioned, the embodiment of the invention provides a kind of living things feature recognition mould groups, preparation side
Method and electronic equipment, the living things feature recognition mould group have the advantages that intensity is higher, thinner thickness.
To achieve the goals above, the present invention provides the following technical solutions.
A kind of living things feature recognition mould group, comprising: base unit and encapsulation monomer；Wherein,
Described matrix unit has the groove and the multiple collimating apertures being connected to the groove that Open Side Down；
The encapsulation monomer includes: light sensation chip, and upper surface has induction region；
The encapsulation monomer is arranged in the groove, and between the outer wall of the encapsulation monomer and the inner wall of the groove
It is provided with packing material, the collimating aperture corresponds to the induction region.
Preferably, photoresist is filled in the collimating aperture.
Preferably, filter layer is provided with above the light sensation chip；Described matrix unit is arranged in the filter layer
Upper surface and the top for being located at multiple collimating apertures；Alternatively, the upper surface of light sensation chip is arranged in the filter layer.
Preferably, the filter layer with a thickness of 1~20 μm, the depth of the collimating aperture is 50~450 μm, the light sensation
Chip with a thickness of 10~200 μm.
Preferably, the encapsulation monomer further include: the transparent adhered layer of the light sensation chip upper surface is set；The light
Sense chip, which glues cementation by the inner wall of the transparent adhered layer and the groove, to be determined.
Preferably, the transparent adhered layer with a thickness of 5~40 μm.
Preferably, the encapsulation monomer further include: the protective layer of the packing material bottom is set；The protective layer packet
Include the insulating layer positioned at the first conductive wiring layer of inside and positioned at outside；
The upper surface of the light sensation chip has non-inductive region, is provided with and the induction zone on the non-inductive region
The weld pad of pixel connection on domain；First conductive wiring layer is connect by conducting element with the weld pad, and described first
Conductive wiring layer is provided with the pin for connecting with external circuit.
Preferably, the encapsulation monomer further include: the supporting layer in the groove is set；The supporting layer is filled out by described
Material is filled to be coated；
The conducting element is conductive column of the potting in the supporting layer, and the upper end of the conductive column is conductive by second
Wiring layer is connect with the weld pad.
Preferably, the conducting element is to be formed in the third conductive wiring layer on the light sensation chip by TSV technique,
The upper end of the third conductive wiring layer connects the weld pad, and lower end is connect with first conductive wiring layer.
Preferably, the protective layer with a thickness of 10~100 μm.
Preferably, the upper surface of the light sensation chip has non-inductive region, is provided on the non-inductive region and institute
State the conductive bump of the pixel connection on induction region；
The conductive bump is connect with flexible circuit board, and the flexible circuit board passes through the side wall of described matrix unit and prolongs
The outside of the groove is extended to, so that the conductive bump is by the flexible circuit board for connecting with external circuit.
Preferably, be provided with conductive adhesive film on the conductive bump, the flexible circuit board by the conductive adhesive film with
The conductive bump is conductively connected.
Preferably, the side wall of described matrix unit is provided with the perforation being connected to the groove, the flexible circuit board warp
It is described to extend through to outside the groove.
A kind of preparation method of the living things feature recognition mould group as described in any of the above-described, comprising: the preparation of base unit walks
Suddenly, the preparation step and assembling steps of monomer are encapsulated；Wherein,
The preparation step of described matrix unit includes:
Acquisition includes the substrate of multiple base units；
Groove and multiple collimating apertures are etched in described matrix unit；
It is described encapsulation monomer preparation step include:
Acquisition includes the wafer of multiple light sensation chips；
The wafer is cut along Cutting Road, obtains the encapsulation monomer；
The assembling steps include:
The encapsulation monomer that cutting obtains is placed in the groove of described matrix unit；
Inject packing material in the groove, make the packing material full of it is described encapsulation monomer lateral wall with it is described
Between the inner wall of groove；
After packing material solidification, the Cutting Road along the substrate is cut, and obtains the living things feature recognition mould group.
Preferably, the preparation step of the encapsulation monomer further include:
Coating operation is executed to the wafer for including multiple light sensation chips, in the upper surface shape of the light sensation chip
At transparent adhered layer；
The assembling steps further include:
It, will be described by the transparent adhered layer after in the groove that the encapsulation monomer is placed in described matrix unit
Encapsulation monomer glues cementation and is scheduled on the inner wall of the groove.
Preferably, the preparation step of the encapsulation monomer further include:
Protective layer is formed, the protective layer includes the insulating layer positioned at the first conductive wiring layer of inside and positioned at outside,
Pin for connecting with external circuit is set on first conductive wiring layer, connects described first by conducting element and leads
The weld pad of electrical wiring layer and the light sensation chip.
Preferably, the preparation step of the encapsulation monomer further include:
The second conductive wiring layer being connected with the weld pad is formed using RDL technique；
The supporting layer that potting has conductive column is prepared, the conductive column connects second conductive fabric as the conducting element
Line layer and first conductive wiring layer.
Preferably, the preparation step of the encapsulation monomer further include:
Using third conductive wiring layer of the TSV technique on the light sensation chip, the upper end of the third conductive wiring layer
The weld pad is connected, lower end connects first conductive wiring layer.
Preferably, the preparation step of described matrix unit further include:
The perforation being connected to the groove is formed on the side wall of described matrix unit；
The preparation step of the encapsulation monomer further include:
Conductive pillar is formed on the non-photo-sensing region of the upper surface of the light sensation chip；
The assembling steps further include:
After the injection for completing the packing material, the position of the conductive pillar is reserved, reveals the conductive pillar
Out；
The conductive pillar is connected by flexible circuit board, extends to the flexible circuit board by the perforation described
Outside groove.
Preferably, the preparation step of the encapsulation monomer further include:
It polishes the lower surface of the light sensation chip, the thickness of the light sensation chip is thinned.
Preferably, the assembling steps further include:
Conductive adhesive film is coated in the upper end of the conductive pillar；Make the flexible circuit board and institute by the conductive adhesive film
It states conductive bump and realizes conductive connection.
Preferably, the packing material is underfill glue；
After the injection for completing packing material, pressurizes to the packing material, make the packing material deaeration.
A kind of electronic equipment, comprising:
Display screen；
Living things feature recognition mould group as described in any of the above-described, the living things feature recognition mould group are set to the display screen
Lower section.
By on base unit be arranged for accommodate encapsulation monomer groove, and by packing material to encapsulate monomer into
Row is fixed, to avoid stepped construction occur because needing fixed encapsulation monomer, is reducing living things feature recognition mould group thickness
Meanwhile greatly improving structural strength.
The embodiment of the present invention is fixed encapsulation monomer by base unit, and can cancel the fixed encapsulating structure of the prior art needs to use
Cover board or diaphragm structure.Further, due to having abandoned traditional scheme for making collimator using optical fiber on fingerprint chip,
Therefore, collimating aperture need to be set on base unit to realize the purpose of light collimation.To which the embodiment of the present invention can be first in matrix list
Groove is formed in member, then forms collimating aperture on the basis of groove, and the processing of base unit is relatively easy.
Referring to following description and accompanying drawings, the particular embodiment of the present invention is disclosed in detail, specifies the principle of the present invention
It can be in a manner of adopted.It should be understood that the embodiment of the present invention is not so limited in range.
The feature for describing and/or showing for a kind of embodiment can be in a manner of same or similar one or more
It uses in other embodiments, is combined with the feature in other embodiments, or the feature in substitution other embodiments.
It should be emphasized that term "comprises/comprising" refers to the presence of feature, one integral piece, step or component when using herein, but simultaneously
It is not excluded for the presence or additional of one or more other features, one integral piece, step or component.
Detailed description of the invention
Attached drawing described here is only used for task of explanation, and is not intended to limit model disclosed by the invention in any way
It encloses.In addition, shape and proportional sizes of each component in figure etc. are only schematical, it is used to help the understanding of the present invention, and
It is not the specific shape and proportional sizes for limiting each component of the present invention.Those skilled in the art under the teachings of the present invention, can
Implement the present invention to select various possible shapes and proportional sizes as the case may be.In the accompanying drawings:
Figure 1A is the structural schematic diagram of the encapsulating structure of the fingerprint recognition chip of the first known embodiments in the prior art；
Figure 1B is the structural schematic diagram of the encapsulating structure of the fingerprint recognition chip of the second known embodiments in the prior art；
Fig. 2 is that the living things feature recognition mould group of the first preferred embodiment of the invention and display screen cooperatively form electronic equipment
Structural schematic diagram；
Fig. 3 is that the living things feature recognition mould group of the second preferred embodiment of the invention and display screen cooperatively form electronic equipment
Structural schematic diagram；
Fig. 4 is that the living things feature recognition mould group of third preferred embodiment of the present invention and display screen cooperatively form electronic equipment
Structural schematic diagram；
Fig. 5 is the living things feature recognition mould group schematic top plan view of third preferred embodiment shown in Fig. 4.
Specific embodiment
Technical solution in order to enable those skilled in the art to better understand the present invention, below in conjunction with of the invention real
The attached drawing in example is applied, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work, all should belong to guarantor of the present invention
The range of shield.
It should be noted that it can directly on the other element when element is referred to as " being set to " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not offered as being unique embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein "and/or" includes one or more phases
Any and all combinations of the listed item of pass.
In the present specification, by the living things feature recognition mould group of the embodiment of the present invention under normal operating condition, be directed toward or
In face of user direction definition be "upper", will in contrast, or back to user direction definition be "lower".
More specifically, the upwardly direction of meaning shown in Fig. 2 to Fig. 4 is defined as "upper", will anticipated shown in Fig. 2 to Fig. 4
Downwardly direction be defined as "lower".
It is worth noting that, all directions are defined in this specification, simply to illustrate that the side of technical solution of the present invention
Just, the living things feature recognition mould group of the embodiment of the present invention is not limited in including but not limited to use, test, transport and manufacture
Etc. other may cause living things feature recognition mould group orientation direction in the scene that reverse or position converts occur.
Living things feature recognition mould group provided in an embodiment of the present invention can operate with and including but not limited to shield lower fingerprint solution
In the scenes such as lock, subscriber authentication, authority acquiring.
Specifically, when the living things feature recognition mould group of the embodiment of the present invention is configured in electronic equipment, electronic equipment
A fingerprint feature information that user can be obtained based on the living things feature recognition mould group, to be carried out with the finger print information of storage
Match, to realize the authentication to active user, to confirm whether it has corresponding permission to execute correlation to electronic equipment
Operation.
It should be noted that the finger print information of above-mentioned acquisition, is only a kind of common embodiment in user biological feature.?
In the scope that can be envisioned, those skilled in the art, which can extend the technical solution of the embodiment of the present invention, applies to any appropriate life
In the verifying scene of object feature.Such as the scene that iris this biological information by obtaining user is verified, this hair
Bright embodiment is not construed as limiting this.
It is hereafter to state scene to obtain user fingerprints information as main and illustrate.But based on above description it is found that this hair
Therefore the protection scope of bright embodiment is not limited.
The living things feature recognition mould group for shielding lower optical finger print of the embodiment of the present invention can be used in including but not
It is limited to intelligent movable mobile phone, Flat electronic equipment, computer, GPS navigator, personal digital assistant, intelligent wearable device etc.
In electronic equipment.
In order to realize the basic function of electronic equipment, the electronic equipment in the embodiment of the present invention can also include that other are required
Module or component.It can also include communication module, battery etc. by taking intelligent movable mobile phone as an example.
It should be noted that other required modules or component included by electronic equipment, can select any appropriate
Existing construction.To be clearly briefly described technical solution provided by the present invention, no longer above-mentioned part will be repeated herein,
Figure of description has also carried out corresponding simplification.It is to be understood that therefore the present invention is not restricted in range.
As shown in Figures 2 to 5, which can be configured with display screen 300.The display screen 300 can be for using certainly
Self light emitting display panel of the luminescence unit as display pixel, such as can be OLED display screen or LED display.To show
Display screen 300 can be used as excitation light source, 1. to target organism (such as finger of user) transmitting excitation light.
Certainly, display screen 300 is also possible to LCD display or other passive light emitting displays, the embodiment of the present invention pair
This is not construed as limiting.When display screen 300 is passive light emitting display, electronic equipment can be configured with positioned at 300 lower section of display screen
Additional light source, by the additional light source as excitation light source, to target organism transmitting excitation light 1..
When the pressing of the finger of user, contact or close display screen 300,1. excitation light can be sent out in the finger surface of user
2. raw reflection, formation carry the echo signal light of finger print information.
The lower section of display screen 300 is arranged in the living things feature recognition mould group of the embodiment of the present invention.Specifically, in electronic equipment
Center can be set, living things feature recognition mould group is installed in the lower section of display screen 300 by the center, and realizes fixation.
Also, opposite between living things feature recognition mould group and display screen 300 and interval setting.
It is explained and illustrated below in conjunction with living things feature recognition mould group of the Fig. 2 to Fig. 5 to the embodiment of the present invention.It needs
Illustrate, for ease of description, in an embodiment of the present invention, identical appended drawing reference indicates identical component.And in order to
Succinctly, in various embodiments, detailed description to same parts is omitted, and the explanation of same parts reference and can draw mutually
With.
The living things feature recognition mould group of the embodiment of the present invention includes base unit 100 and encapsulation monomer 200.
Any appropriate existing construction can be used in base unit 100, and the embodiment of the present invention is not construed as limiting this.Show at one
In the embodiment of meaning property, base unit 100 can be silicon crystal.
Base unit 100 has the groove 101 and the multiple collimating apertures 102 being connected to groove 101 that Open Side Down.Groove
101 and multiple collimating apertures 102 can be formed by way of chemical etching or photoengraving, thus groove 101 and multiple collimating apertures
102 be a part of the structure of base unit 100 itself, alternatively, groove 101 and multiple collimating apertures 102 are with base unit 100
Monoblock type or one-piece construction.
It encapsulates and is provided with packing material 400 between the outer wall of monomer 200 and the inner wall of groove 101, for encapsulation monomer
200 are fixed, and can play the role of encapsulation to a certain extent.
Packing material 400 can be underfill glue (underfill), in the outer wall for being injected into encapsulation monomer 200
After between the inner wall of groove 101, it can be solidified by way of heating, thus fixed encapsulation monomer 200.After solidification
Packing material 400 in there are bubble influence fixing intensity, after the injection for completing packing material 400, pressurize to it,
Make 400 deaeration of packing material, to remove the bubble in packing material 400.
When the prior art contains the encapsulating structure of fingerprint chip using stepped construction come fixed packet, it need to be bonded using viscose glue
Each layer of structure, the intensity of such stepped construction are weaker.
And the embodiment of the present invention is used to accommodate the groove 101 for encapsulating monomer 200 by being arranged on base unit 100, and
It is fixed by 400 pairs of encapsulation monomers 200 of packing material, to avoid being laminated because needing fixed encapsulation monomer 200
Structure greatly improves structural strength while reducing living things feature recognition mould group thickness.
The embodiment of the present invention is fixed encapsulation monomer 200 by base unit 100, can cancel the fixed encapsulating structure of the prior art
The cover board or diaphragm structure that need to be used.Further, collimator is made using optical fiber on fingerprint chip due to having abandoned traditional
Scheme, therefore, collimating aperture 102 need to be set on base unit 100 come realize light collimation purpose.To which the present invention is implemented
Example can first form groove 101 on base unit 100, then collimating aperture 102, base unit 100 are formed on the basis of groove 101
Processing it is relatively easy.
It encapsulates monomer 200 and includes at least light sensation chip 201, receive after multiple collimating apertures 102 carry out collimation processing
Propagate the echo signal light come 2..And it is possible to 2. the echo signal light after collimation is converted to electric signal, to generate fingerprint image
Picture.The fingerprint image may further be sent to the image processor of signal connection therewith, image processor by light sensation chip 201
It carries out image procossing and obtains fingerprint signal, and fingerprint recognition is carried out to fingerprint signal by algorithm.
In the present embodiment, light sensation chip 201 with a thickness of 10~200 μm, further preferably can be 30~150 μm,
It further can be 40~100 μm.
The upper surface of light sensation chip 201 has induction region and non-inductive region, settable for acquiring on induction region
The conductive part connecting with pixel can be set on the non-inductive region, the conduction in the pixel (not shown) of finger print information
Portion with external circuit for connecting.
In the embodiment anticipated as shown in Figures 2 and 3, which can also be weld pad 201a.As schematically shown in Figure 4
In embodiment, which can also be conductive bump 201b.Conductive bump 201b is specifically as follows metal bump or metal is convex
Point.
2. multiple collimating apertures 102 carry out collimation processing to echo signal light for 2. passing through for echo signal light.It is multiple
Collimating aperture 102 corresponds to induction region, and the projection for being specifically as follows multiple collimating apertures 102 towards 201 upper surface of light sensation chip is fallen in
In the range of induction region.Multiple collimating apertures 102 are generally perpendicular with induction region, and multiple collimating apertures 102 can be with induction
Pixel on region corresponds.Photoresist is filled in collimating aperture 102, (not shown) is to prevent introduced contaminants or particle
(Particle) enter.
In the present embodiment, the depth of collimating aperture 102 is 50~450 μm, further preferably can be 100~350 μm, more
It may further be 150~250 μm.
Filter layer 500, propagation side of the filter layer 500 along echo signal light 2. has can be set in the top of light sensation chip 201
To the upstream for being located at light sensation chip 201, at least partly filter out echo signal light 2. in the noise light that is mingled with, to improve
Induction of the light sensation chip 201 to the light received promotes image quality.
Filter layer 500 can be set the upper surface in base unit 100 and be located at the top of multiple collimating apertures 102；Alternatively,
Filter layer 500 also can be set in the upper surface of light sensation chip 201, with light sensation chip 201.
In the present embodiment, filter layer 500 with a thickness of 1~20 μm, further preferably can be 8~15 μm, more into one
Step can be 10~12 μm.
When motivating light source difference, noise light changes accordingly, then filter layer 500 is also different.Specifically, in some scenes
In, when display screen 300 is self light emitting display panel, then display screen 300 is to motivate light source.The excitation that the display screen 300 issues
Light is generally visible light, then 2. echo signal light is also visible light.So, in this scene, noise light can be environment light
In black light, such as infrared light, near infrared light etc..Then at this point, filter layer 500 is infrared absorption filter photosphere.
And in other scenes, when excitation light source is that the invisible light source that is additionally provided under display screen 300 is for example red
Outer light source, 2. the excitation light and echo signal light which issues are black light.So, in this scene,
Noise light is then the visible light in environment light, such as white light.Then at this point, filter layer 500 is visible light filter layer 500.
Further, encapsulation monomer 200 can also include the transparent adhered layer 202 that 201 upper surface of light sensation chip is arranged in,
It is fixed that light sensation chip 201 can glue cementation by the inner wall of transparent adhered layer 202 and groove 101.Since transparent adhered layer 202 is pasted onto
The upper surface of light sensation chip 201, to avoid it from stopping echo signal light 2., transparent adhered layer 202 should have translucency.In this reality
It applies in example, DAF (Die Attach Film) glue or film can be used in transparent adhered layer 202 or other are viscous with light transmitting property
Paste material.
Transparent adhered layer 202 can be pasted onto 201 upper surface of light sensation chip in advance, be placed in groove that will encapsulate monomer 200
After in 101, before injecting packing material 400, encapsulation monomer 200 can be pasted onto the inner wall of groove 101 by transparent adhered layer 202
On, encapsulation monomer 200 is pre-fixed, is prepared for the injection of subsequent packing material 400.
In the present embodiment, transparent adhered layer 202 with a thickness of 5~40 μm, further preferably can be 10~35 μm, more
It may further be 15~25 μm.
Encapsulation monomer 200 can also include the protective layer 203 that 400 bottom of packing material is arranged in.The protective layer 203 includes
Positioned at the first conductive wiring layer 203a of inside and positioned at the insulating layer 203b in outside, wherein the first conductive wiring layer 203a is logical
It crosses conducting element to connect with the weld pad 201a of light sensation chip 201, the first conductive wiring layer 203a, which is provided with, to be used for and external circuit
The pin 203c of connection.
The the first conductive wiring layer 203a and insulating layer 203b that protective layer 203 is included are stacked mutually, the first conducting wiring
Layer 203a is pressed between insulating layer 203b and the bottom of packing material 400.It include the first conductive wiring layer by setting
The protective layer 203 of 203a, may be implemented the connection of light sensation chip 201 Yu external circuit.Also, protective layer 203 is included exhausted
Edge layer 203b can protect the first conductive wiring layer 203a.
In the present embodiment, protective layer 203 with a thickness of 10~100 μm, further preferably can be 30~70 μm, more into
One step can be 40~60 μm.
As shown in Fig. 2, in one embodiment, in order to realize the weldering of the first conductive wiring layer 203a and light sensation chip 201
The connection of 201a is padded, encapsulation monomer 200 further includes the supporting layer 205 being arranged in groove 101, and supporting layer 205 is filled material
400 are coated and fixed.Conducting element is conductive column 204 of the potting in supporting layer 205, and the upper end of conductive column 204 passes through second
Conductive wiring layer 206 is connect with the weld pad 201a of light sensation chip 201.
Take this, the first conductive wiring layer 203a and light sensation are realized by the second conductive wiring layer 206 and conductive column 204 indirectly
The connection of the weld pad 201a of chip 201.
In the present embodiment, conductive column 204 can be metal column, and supporting layer 205 can be any suitable current material system
At.For example, supporting layer 205 can be with PCB, then the second conductive wiring layer 206 can be formed in supporting layer by rerouting technique (RDL)
205 surface or inside.Alternatively, supporting layer 205 or EMC (Epoxy Molding Compound, epoxy-plastic packaging
Material), so as to coat the side of light sensation chip 201 by packaging technology.
As shown in figure 3, realizing another reality that the first conductive wiring layer 203a is connect with the weld pad 201a of light sensation chip 201
Applying example can be, conducting element is to be formed in light sensation core by TSV (Through Silicon Vias, through silicon via technology) technique
Third conductive wiring layer 207 on piece 201, the weld pad 201a of the upper end connection light sensation chip 201 of third conductive wiring layer 207,
Lower end is connect with the first conductive wiring layer 203a.Take this, the first conductive wiring layer can be realized by third conductive wiring layer 207
203a is directly connected to the weld pad 201a's of light sensation chip 201.
As shown in Figure 4 and Figure 5, in another embodiment, light sensation chip 201 can pass through flexible circuit board 600
(FPC, Flexible Printed Circuit) is connect with external circuit.Specifically, the conductive bump 201b of light sensation chip 201
It is connect with flexible circuit board 600, flexible circuit board 600 extends to the outside of groove 101, thus the conductive stud of light sensation chip 201
Block 201b is connect by flexible circuit board 600 with external circuit.
Perforation 103 has can be set in the side wall of base unit 100, for wearing for flexible circuit board 600.Conductive bump
The upper end of 201b may be provided with conductive adhesive film (ACF, Anisotropic Conductive Film) 201c, flexible circuit board 600
It is connect by conductive adhesive film 201c with the weld pad 201a of light sensation chip 201.
The preparation method of the living things feature recognition mould group of the embodiment of the present invention is described below, which includes matrix list
The preparation step S100 of member 100, the preparation step S200 and assembling steps S300 for encapsulating monomer 200.Wherein,
The preparation step S100 of base unit 100 may include:
Step S101: acquisition includes the substrate of multiple base units 100.Base unit 100 is in the array of multiple rows of multiple row
Form arrangement, to form Cutting Road between the base unit 100 of adjacent two rows of or adjacent two column；Same above description, substrate
It can be silicon wafer；
Step S102: groove 101 and multiple is formed by way of chemical etching or photoengraving in base unit 100
Collimating aperture 102.
Encapsulation monomer 200 preparation step S200 may include:
Step S201: acquisition includes the wafer of multiple light sensation chips 201.Likewise, light sensation chip 201 is in multiple rows of multiple row
Array format arrangement, to form Cutting Road between the light sensation chip 201 of adjacent two rows of or adjacent two column；
Step S202: along Cutting Road cutting crystal wafer, encapsulation monomer 200 is obtained.
Assembling steps S300 may include:
Step S301: the encapsulation monomer 200 that cutting obtains is placed in the groove 101 of base unit 100；
Step S302: injecting packing material 400 in groove 101, makes packing material 400 full of the outer of encapsulation monomer 200
Between side wall and the inner wall of groove 101；
Step S303: after material 400 to be filled solidifies, the Cutting Road along substrate is cut, and obtains living things feature recognition mould group.
Further, the preparation step S200 of encapsulation monomer 200 can also include:
Step S203: coating operation is executed to the wafer for including multiple light sensation chips 201, in light sensation chip 201
Upper surface forms transparent adhered layer 202.
Step S203 is implemented before step S202.
Then accordingly, assembling steps S300 further include:
Step S304: after in the groove 101 that encapsulation monomer 200 is placed in base unit 100, pass through transparent adhered layer
202 are scheduled on encapsulation 200 cementation of monomer on the inner wall of groove 101.
Step S304 is implemented between step S301 and step S302.
In addition, the connection in order to realize light sensation chip 201 Yu external circuit, encapsulates the preparation step S200 of monomer 200 also
It may include the operation for being used to form conductive path, specific as follows:
Step S205: protective layer 203 is formed using SMF technique, protective layer 203 includes the first conducting wiring positioned inside
The layer 203a and insulating layer 203b positioned at outside, is arranged on the first conductive wiring layer 203a and draws for what is connect with external circuit
Foot 203c connects the weld pad 201a of the first conductive wiring layer 203a and light sensation chip 201 by conducting element.
Step S205 is implemented before step S203.
In order to form the structure of living things feature recognition mould group as shown in Figure 2, the preparation step S200 of monomer 200 is encapsulated also
May include:
Step S206: the second conductive wiring layer being connected with the weld pad 201a of light sensation chip 201 is formed using RDL technique
206；
Step S207: preparing the supporting layer 205 that potting has conductive column, and conductive column connects the second conductive fabric as conducting element
Line layer 206 and the first conductive wiring layer 203a.
Step S206 is implemented before step S203.
In order to form the structure of living things feature recognition mould group as shown in Figure 3, the preparation step S200 of monomer 200 is encapsulated also
May include:
Step S208: using third conductive wiring layer 207 of the TSV technique on light sensation chip 201, third conductive wiring layer
The weld pad 201a of 207 upper end connection light sensation chip 201, lower end is connect with the first conductive wiring layer 203a.
Step S208 is implemented before step S203.
In order to form the structure of living things feature recognition mould group as shown in Figure 4, the preparation step S100 of base unit 100 is also
May include:
Step S103: the perforation 103 being connected to groove 101 is formed on the side wall of base unit 100.Perforation 103 is same
It is formed also by the method for chemical etching or photoengraving.
Step S103 can be implemented together with step S102, or two steps are successively implemented.
Correspondingly, the preparation step S200 of encapsulation monomer 200 includes:
Step S209: conductive pillar 201b is formed on the non-photo-sensing region of the upper surface of light sensation chip 201.
Step S209 is implemented before step S202.
Assembling steps S300 includes:
Step S305: after the injection for completing packing material 400, the position of conductive pillar 201b is reserved, conductive stud is made
Column 201b exposes；
Step S306: connecting conductive pillar 201b by flexible circuit board 600, and flexible circuit board 600 is made to pass through perforation 103
It extends to outside groove 101.
Specifically, can coat conductive adhesive film 201c in the upper end of conductive pillar 201b, Iron Guanyin passes through conductive adhesive film
201b makes flexible circuit board 600 and conductive bump 201b realize conductive connection.
Further, the preparation step of encapsulation monomer 200 can also include:
Step S210: the thickness of light sensation chip 201 is thinned in the lower surface of polishing light sensation chip 201.
Step S209 can be implemented together with step S202.
It should be noted that in the description of the present invention, term " first ", " second " etc. are used for description purposes only and distinguish
Similar object between the two and is not present sequencing, can not be interpreted as indication or suggestion relative importance.In addition,
In description of the invention, unless otherwise indicated, the meaning of " plurality " is two or more.
Herein cited any digital value all include between lower limit value to upper limit value with the lower value of an incremented and
The all values of upper value, there are the intervals of at least two units between any lower value and any much higher value.For example, such as
Fruit elaborates that the quantity an of component or the value of process variable (such as temperature, pressure, time etc.) are from 1 to 90, preferably from 21
To 80, more preferably from 30 to 70, then purpose is arrived in order to illustrate also clearly listing such as 15 to 85,22 in the specification
68,43 to 51,30 to 32 is equivalent.For the value less than 1, suitably think that a unit is 0.0001,0.001,0.01,0.1.
These are only intended to the example clearly expressed, it is believed that all possibility for the numerical value enumerated between minimum and peak
Combination is all expressly set forth in the specification in a similar manner.
Unless otherwise indicated, all ranges all include all numbers between endpoint and endpoint.It is used together with range
" about " or " approximation " be suitable for two endpoints of the range.Thus, " about 20 to 30 " are intended to cover that " about 20 to about
30 ", including at least the endpoint indicated.
The foregoing is merely several embodiments of the present invention, those skilled in the art is according to interior disclosed in application documents
Hold, various changes or modifications can be carried out without departing from the spirit and scope of the present invention to the embodiment of the present invention.
Claims (23)
1. a kind of living things feature recognition mould group characterized by comprising base unit and encapsulation monomer；Wherein,
Described matrix unit has the groove and the multiple collimating apertures being connected to the groove that Open Side Down；
The encapsulation monomer includes: light sensation chip, and upper surface has induction region；
The encapsulation monomer is arranged in the groove, and is arranged between the outer wall of the encapsulation monomer and the inner wall of the groove
There is packing material, the collimating aperture corresponds to the induction region.
2. living things feature recognition mould group as described in claim 1, which is characterized in that be filled with photoresist in the collimating aperture.
3. living things feature recognition mould group as described in claim 1, which is characterized in that be provided with filter above the light sensation chip
Photosphere；The filter layer is arranged in the upper surface of described matrix unit and is located at the top of multiple collimating apertures；Alternatively, described
The upper surface of light sensation chip is arranged in filter layer.
4. living things feature recognition mould group as claimed in claim 3, which is characterized in that the filter layer with a thickness of 1~20 μm,
The depth of the collimating aperture be 50~450 μm, the light sensation chip with a thickness of 10~200 μm.
5. living things feature recognition mould group as described in claim 1, which is characterized in that the encapsulation monomer further include: setting exists
The transparent adhered layer of the light sensation chip upper surface；The light sensation chip passes through the inner wall of the transparent adhered layer and the groove
Viscous cementation is fixed.
6. living things feature recognition mould group as claimed in claim 5, which is characterized in that the transparent adhered layer with a thickness of 5~
40μm。
7. living things feature recognition mould group as described in claim 1, which is characterized in that the encapsulation monomer further include: setting exists
The protective layer of the packing material bottom；The protective layer includes positioned at the first conductive wiring layer of inside and positioned at the exhausted of outside
Edge layer；
The upper surface of the light sensation chip has non-inductive region, be provided on the non-inductive region on the induction region
Pixel connection weld pad；First conductive wiring layer is connect by conducting element with the weld pad, and described first is conductive
Wiring layer is provided with the pin for connecting with external circuit.
8. living things feature recognition mould group as claimed in claim 7, which is characterized in that the encapsulation monomer further include: setting exists
Supporting layer in the groove；The supporting layer is coated by the packing material；
The conducting element is conductive column of the potting in the supporting layer, and the upper end of the conductive column passes through the second conducting wiring
Layer is connect with the weld pad.
9. living things feature recognition mould group as claimed in claim 7, which is characterized in that the conducting element is to pass through TSV technique
The upper end of the third conductive wiring layer being formed on the light sensation chip, the third conductive wiring layer connects the weld pad, under
End is connect with first conductive wiring layer.
10. living things feature recognition mould group as claimed in claim 7, which is characterized in that the protective layer with a thickness of 10~100
μm。
11. living things feature recognition mould group as described in claim 1, which is characterized in that the upper surface of the light sensation chip has
Non-inductive region is provided with the conductive bump connecting with the pixel on the induction region on the non-inductive region；
The conductive bump is connect with flexible circuit board, and the flexible circuit board passes through the side wall of described matrix unit and extends to
The outside of the groove, so that the conductive bump is by the flexible circuit board for connecting with external circuit.
12. living things feature recognition mould group as claimed in claim 11, which is characterized in that be provided with conduction on the conductive bump
Glue film, the flexible circuit board are conductively connected by the conductive adhesive film and the conductive bump.
13. living things feature recognition mould group as claimed in claim 11, which is characterized in that the side wall of described matrix unit is provided with
The perforation being connected to the groove, the flexible circuit board are extended through through described to outside the groove.
14. a kind of preparation method of the living things feature recognition mould group as described in claim 1 to 13 any one, feature exist
In, comprising: the preparation step of base unit, the preparation step and assembling steps for encapsulating monomer；Wherein,
The preparation step of described matrix unit includes:
Acquisition includes the substrate of multiple base units；
Groove and multiple collimating apertures are etched in described matrix unit；
It is described encapsulation monomer preparation step include:
Acquisition includes the wafer of multiple light sensation chips；
The wafer is cut along Cutting Road, obtains the encapsulation monomer；
The assembling steps include:
The encapsulation monomer that cutting obtains is placed in the groove of described matrix unit；
Packing material is injected in the groove, makes the packing material full of the lateral wall and the groove of the encapsulation monomer
Inner wall between；
After packing material solidification, the Cutting Road along the substrate is cut, and obtains the living things feature recognition mould group.
15. preparation method as claimed in claim 14, which is characterized in that
The preparation step of the encapsulation monomer further include:
Coating operation is executed to the wafer for including multiple light sensation chips, is formed with the upper surface in the light sensation chip
Bright adhered layer；
The assembling steps further include:
After in the groove that the encapsulation monomer is placed in described matrix unit, by the transparent adhered layer by the encapsulation
Monomer glues cementation and is scheduled on the inner wall of the groove.
16. preparation method as claimed in claim 14, which is characterized in that
The preparation step of the encapsulation monomer further include:
Protective layer is formed, the protective layer includes the insulating layer positioned at the first conductive wiring layer of inside and positioned at outside, in institute
The pin being arranged on the first conductive wiring layer for connecting with external circuit is stated, first conductive fabric is connected by conducting element
The weld pad of line layer and the light sensation chip.
17. preparation method as claimed in claim 16, which is characterized in that
The preparation step of the encapsulation monomer further include:
The second conductive wiring layer being connected with the weld pad is formed using RDL technique；
The supporting layer that potting has conductive column is prepared, the conductive column connects second conductive wiring layer as the conducting element
With first conductive wiring layer.
18. preparation method as claimed in claim 16, which is characterized in that
The preparation step of the encapsulation monomer further include:
Using third conductive wiring layer of the TSV technique on the light sensation chip, the upper end of the third conductive wiring layer is connected
The weld pad, lower end connect first conductive wiring layer.
19. preparation method as claimed in claim 14, which is characterized in that
The preparation step of described matrix unit further include:
The perforation being connected to the groove is formed on the side wall of described matrix unit；
The preparation step of the encapsulation monomer further include:
Conductive pillar is formed on the non-photo-sensing region of the upper surface of the light sensation chip；
The assembling steps further include:
After the injection for completing the packing material, the position of the conductive pillar is reserved, exposes the conductive pillar；
The conductive pillar is connected by flexible circuit board, the flexible circuit board is made to extend to the groove by the perforation
Outside.
20. preparation method as claimed in claim 19, which is characterized in that
The preparation step of the encapsulation monomer further include:
It polishes the lower surface of the light sensation chip, the thickness of the light sensation chip is thinned.
21. preparation method as claimed in claim 19, which is characterized in that
The assembling steps further include:
Conductive adhesive film is coated in the upper end of the conductive pillar；The flexible circuit board is led with described by the conductive adhesive film
Electric convex block, which is realized, to be conductively connected.
22. preparation method as claimed in claim 14, which is characterized in that the packing material is underfill glue；
After the injection for completing packing material, pressurizes to the packing material, make the packing material deaeration.
23. a kind of electronic equipment characterized by comprising
Display screen；
Living things feature recognition mould group as described in claim 1 to 13 any one, the living things feature recognition mould group are set to
The lower section of the display screen.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910411708.9A CN110210337A (en) | 2019-05-17 | 2019-05-17 | Living things feature recognition mould group, preparation method and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910411708.9A CN110210337A (en) | 2019-05-17 | 2019-05-17 | Living things feature recognition mould group, preparation method and electronic equipment |
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| CN110210337A true CN110210337A (en) | 2019-09-06 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105097724A (en) * | 2015-08-13 | 2015-11-25 | 苏州晶方半导体科技股份有限公司 | Package structure and packaging method |
| CN108022904A (en) * | 2017-01-17 | 2018-05-11 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and method for packing of fingerprint recognition chip |
| CN108447842A (en) * | 2018-04-28 | 2018-08-24 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and packaging method of fingerprint chip |
| CN109643377A (en) * | 2018-11-19 | 2019-04-16 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| CN209746551U (en) * | 2019-05-17 | 2019-12-06 | 上海思立微电子科技有限公司 | biological characteristic identification module and electronic equipment |
-
2019
- 2019-05-17 CN CN201910411708.9A patent/CN110210337A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105097724A (en) * | 2015-08-13 | 2015-11-25 | 苏州晶方半导体科技股份有限公司 | Package structure and packaging method |
| CN108022904A (en) * | 2017-01-17 | 2018-05-11 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and method for packing of fingerprint recognition chip |
| CN108447842A (en) * | 2018-04-28 | 2018-08-24 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and packaging method of fingerprint chip |
| CN109643377A (en) * | 2018-11-19 | 2019-04-16 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| CN209746551U (en) * | 2019-05-17 | 2019-12-06 | 上海思立微电子科技有限公司 | biological characteristic identification module and electronic equipment |
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