CN110202865A - Ultra-thin resist collapse soldering aluminium alloy compound fin material and preparation method thereof - Google Patents
Ultra-thin resist collapse soldering aluminium alloy compound fin material and preparation method thereof Download PDFInfo
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- CN110202865A CN110202865A CN201910435724.1A CN201910435724A CN110202865A CN 110202865 A CN110202865 A CN 110202865A CN 201910435724 A CN201910435724 A CN 201910435724A CN 110202865 A CN110202865 A CN 110202865A
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- aluminium alloy
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B37/00—Control devices or methods specially adapted for metal-rolling mills or the work produced thereby
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B37/00—Control devices or methods specially adapted for metal-rolling mills or the work produced thereby
- B21B37/74—Temperature control, e.g. by cooling or heating the rolls or the product
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/016—Layered products comprising a layer of metal all layers being exclusively metallic all layers being formed of aluminium or aluminium alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0076—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised in that the layers are not bonded on the totality of their surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0036—Heat treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/08—Interconnection of layers by mechanical means
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0036—Heat treatment
- B32B2038/0048—Annealing, relaxing
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention discloses a kind of ultra-thin resist collapse soldering aluminium alloy compound fin materials and preparation method thereof, including core layer, the upper surface and/or lower surface of the core layer to be coated with coating layer；The thickness of the aluminium alloy compound fin material is less than or equal to 0.07mm；Preparation method improves the crystallite dimension of interface, reduces interface attack by improving preparation method；The preparation method include the following steps: ingot casting, core layer and clad soldering, compound hot rolling, roughing, rewinding trimming, in roll, intermediate annealing, finish rolling and finished products.The improvement that the present invention passes through preparation method, the design and control of especially compound hot-rolled temperature, intermediate anneal temperature and finished product annealing process, effectively increase the crystallite dimension of interface, to effectively reduce diffusion rate of the low melting point element to core material, make aluminium alloy compound fin material of the prepared thickness less than or equal to 0.07mm that there is good sink-resistance performance, erosion-resisting characteristics and mechanical performance.
Description
Technical field
The present invention relates to aluminium foil and its preparation technical fields, multiple more particularly to a kind of ultra-thin resist collapse pricker welding aluminum alloy
Close fin material and preparation method thereof.
Background technique
Aluminium alloy compound fin is made of, quilt core material and duplex/simplex low melting point clad (nearly eutectic Al-Si alloy)
It is widely used in the brazing material of car heat exchanger, air cooling island of power plant heat exchanger, water tank etc..
Usually aluminium alloy composite strip is resisted in brazing process the sag resistance that the ability that gravity naturally droops calls material
Performance (SAG), the distance naturally drooped are known as sagging value (unit: mm).The sink-resistance performance of material is to measure composite strip
The important indicator of comprehensive performance.Once sink-resistance performance is bad, after 600 DEG C or so of high temperature brazing, Soldering foil is easy
Sagging and corrode phenomenon occurs, causes fin and conduit that high-temperature softening deformation occurs, directly affects the heat dissipation effect and property of water tank
Energy.
The thickness of existing aluminium alloy compound fin is mostly 0.10-0.08mm, in order to further save cost and improve weldering
Quality is stitched, more stringent requirements are proposed to the thickness of aluminium alloy compound fin.Since thickness is further thinning, various aspects of performance
It will be greatly reduced, especially its sagging resistance, and become the problem of technological improvement.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of ultra-thin resist collapse soldering aluminium alloy compound fin materials
And preparation method thereof, it can effectively solve the problem that in the case where thickness progress one reduces, resist existing for aluminium alloy compound fin material
The problem of sagging performance declines.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: a kind of ultra-thin resist collapse soldering is provided
With aluminium alloy compound fin material, including core layer, the upper surface and/or lower surface of the core layer are coated with coating layer；Institute
The thickness for stating aluminium alloy compound fin material is less than or equal to 0.07mm.
In order to solve the above technical problems, another technical solution used in the present invention is: providing a kind of by improving preparation
Method improves the crystallite dimension of interface, reduces interface attack；The preparation method include the following steps: ingot casting, core layer with
Clad soldering, compound hot rolling, roughing, rewinding trimming, in roll, intermediate annealing, finish rolling and finished products.
In a preferred embodiment of the present invention, the process conditions of the compound hot rolling are as follows: 500 ± 10 DEG C of heating temperature,
2~16h of heating and thermal insulation time, 470~500 DEG C of start rolling temperature at roller-way.
In a preferred embodiment of the present invention, the process conditions of the intermediate annealing are as follows: annealing position 0.154mm,
Annealing temperature is 360~380 DEG C, annealing time 7h.
In a preferred embodiment of the present invention, the process conditions of the finished products are as follows: annealing position 0.07mm, annealing
160 DEG C of temperature, annealing time 7h.
In a preferred embodiment of the present invention, the crystallite dimension of the interface is more than or equal to 817 μm.
The beneficial effects of the present invention are: a kind of ultra-thin resist collapse soldering aluminium alloy compound fin material of the present invention, passes through
The improvement of preparation method, the design and control of especially compound hot-rolled temperature, intermediate anneal temperature and finished product annealing process, has
The crystallite dimension that effect improves interface makes prepared to effectively reduce diffusion rate of the low melting point element to core material
Aluminium alloy compound fin material of the thickness less than or equal to 0.07mm has good sink-resistance performance, erosion-resisting characteristics and mechanicalness
Can, excellent combination property.
Detailed description of the invention
Fig. 1 is corrode mechanism schematic diagram；
Fig. 2 is a kind of structure signal of interface of ultra-thin resist collapse soldering aluminium alloy compound fin material of the present invention
Figure amplifies 200 times；
Fig. 3 is the corrode schematic diagram of existing product, amplifies 600 times；
Fig. 4 is a kind of corrode schematic diagram of ultra-thin resist collapse soldering aluminium alloy compound fin material of the present invention, amplifies 200 times.
Specific embodiment
The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawing, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
Fig. 1-4 is please referred to, the embodiment of the present invention includes:
In brazing process, due to leading to solder containing a large amount of elements (the most commonly used is Si elements) for reducing fusing point in solder
Fusing point is more much lower than the fusing point of core material.The reason is that being caused due to the very big concentration gradient of silicon concentration presence in solder and core material
Si is spread from solder to core material.Melt when the silicon concentration in places certain in core material oversteps the extreme limit solid solubility, here it is
The generation of corrode.Corrode reduces the mechanical property of core material, is the main reason for causing SAG poor.
Generally there are three types of mechanism for corrode: crystal boundary infiltration, dissolution and these three mobile corrode forms of liquid film.Their generation area
As shown in Fig. 1.By attached drawing 1 as it can be seen that the corrode occurred is mainly crystal boundary infiltration.And crystal boundary is that Si is formed to core material scattering and permeating
The high-speed channel of corrode, crystal grain is smaller, and crystal boundary is more, then crystal boundary infiltration is more serious.Therefore, in order to mitigate corrode, Yao Jinliang makes
The coarse grains of microstructure.
Present invention discloses a kind of ultra-thin resist collapse soldering aluminium alloy compound fin material, including core layer, the cores
The upper surface and/or lower surface of material layer are coated with coating layer；The thickness of the aluminium alloy compound fin material is less than or equal to
0.07mm, for most thin soldering aluminium alloy compound fin material in the world at present.The present invention is improved by improving preparation method
The crystallite dimension of interface reduces interface attack, to improve the sink-resistance performance of aluminium alloy compound fin material.Specifically,
Shown preparation method include the following steps: ingot casting, core layer and clad soldering, compound hot rolling, roughing, rewinding trimming, in roll,
Intermediate annealing, finish rolling and finished products.
Wherein, the process conditions of the compound hot rolling are as follows: 490~510 DEG C of heating temperature, 2~16h of heating and thermal insulation time,
470~500 DEG C of start rolling temperature at roller-way.
The process conditions of the intermediate annealing are as follows: annealing position 0.154mm, annealing temperature are 360~380 DEG C, annealing
Time is 7h.
The process conditions of the finished products are as follows: annealing position 0.07mm, 160 DEG C of annealing temperature, annealing time 7h.
The aluminium alloy compound fin material of above method preparation is tested for the property, as a result as follows:
(1) crystallite dimension is tested at section: it is more than or equal to 817 μm using the crystallite dimension that metallographic microscope tests its interface,
Interface crystallite dimension than existing aluminium alloy compound fin material improves 10% or more, as shown in Fig. 2.
(2) measuring mechanical property: carrying out measuring mechanical property to aluminium alloy compound fin material after molding, as a result as follows
Shown in table:
(3) sink-resistance performance (SAG): test result is SAG thickness 31mm, is less than 35mm, composite demand, and SAG performance obviously mentions
It is high.
(4) corrode is tested: by metallography microscope sem observation, before preparation method improves, core surfaces corrode is serious, sees Fig. 3
It is shown；The worth material of improved preparation method through the invention, core surfaces do not have corrode, as shown in Figure 4.
A kind of ultra-thin resist collapse soldering aluminium alloy compound fin material of the present invention, by the improvement of preparation method, especially
It is the design and control of compound hot-rolled temperature, intermediate anneal temperature and finished product annealing process, effectively increases the crystalline substance of interface
Particle size makes prepared thickness be less than or equal to 0.07mm to effectively reduce diffusion rate of the low melting point element to core material
Aluminium alloy compound fin material have good sink-resistance performance, erosion-resisting characteristics and mechanical performance, excellent combination property, institute
Aluminium alloy compound fin material is most thin soldering aluminium alloy compound fin material in the world at present.
In the description of the present invention, it should be noted that the instruction such as term " on ", "lower", "left", "right", "inner", "outside"
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings or the invention product using when usually put
Orientation or positional relationship, be merely for convenience of description of the present invention and simplification of the description, rather than the device of indication or suggestion meaning
Or element must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, and comes for those skilled in the art
It says, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any modification, equivalent
Replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (6)
1. a kind of soldering of ultra-thin resist collapse aluminium alloy compound fin material, including core layer, the upper surface of the core layer and/
Or lower surface is coated with coating layer；It is characterized in that, the thickness of the aluminium alloy compound fin material is less than or equal to 0.07mm.
2. the preparation method that aluminium alloy compound fin material is used in a kind of ultra-thin resist collapse soldering, which is characterized in that made by improving
Preparation Method improves the crystallite dimension of interface, reduces interface attack；The preparation method includes the following steps: ingot casting, core layer
With clad soldering, compound hot rolling, roughing, rewinding trimming, in roll, intermediate annealing, finish rolling and finished products.
3. the ultra-thin resist collapse soldering according to claim 2 preparation method of aluminium alloy compound fin material, feature
It is, the process conditions of the compound hot rolling are as follows: 490~510 DEG C of heating temperature, 2~16h of heating and thermal insulation time, at roller-way
470~500 DEG C of start rolling temperature.
4. the ultra-thin resist collapse soldering according to claim 2 preparation method of aluminium alloy compound fin material, feature
It is, the process conditions of the intermediate annealing are as follows: annealing position 0.154mm, annealing temperature are 360~380 DEG C, annealing time
For 7h.
5. the ultra-thin resist collapse soldering according to claim 2 preparation method of aluminium alloy compound fin material, feature
It is, the process conditions of the finished products are as follows: annealing position 0.07mm, 160 DEG C of annealing temperature, annealing time 7h.
6. the ultra-thin resist collapse soldering according to claim 2 preparation method of aluminium alloy compound fin material, feature
It is, the crystallite dimension of the interface is more than or equal to 817 μm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910435724.1A CN110202865A (en) | 2019-05-23 | 2019-05-23 | Ultra-thin resist collapse soldering aluminium alloy compound fin material and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910435724.1A CN110202865A (en) | 2019-05-23 | 2019-05-23 | Ultra-thin resist collapse soldering aluminium alloy compound fin material and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114000070A (en) * | 2021-11-02 | 2022-02-01 | 上海电机学院 | Aluminum alloy hollow section, heat treatment method for inhibiting abnormal growth of longitudinal weld grains of aluminum alloy hollow section and application of aluminum alloy hollow section |
| CN114290006A (en) * | 2021-12-09 | 2022-04-08 | 银邦金属复合材料股份有限公司 | Anti-collapse aluminum alloy composite fin material for electric vehicle heat management and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101433910A (en) * | 2008-11-19 | 2009-05-20 | 苏州有色金属研究院有限公司 | Method for improving sink-resistance performance of aluminium alloy composite insulating foil for brazing |
| CN103818051A (en) * | 2014-03-19 | 2014-05-28 | 南通恒秀铝热传输材料有限公司 | Aluminium alloy composite foil and preparation method thereof |
-
2019
- 2019-05-23 CN CN201910435724.1A patent/CN110202865A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101433910A (en) * | 2008-11-19 | 2009-05-20 | 苏州有色金属研究院有限公司 | Method for improving sink-resistance performance of aluminium alloy composite insulating foil for brazing |
| CN103818051A (en) * | 2014-03-19 | 2014-05-28 | 南通恒秀铝热传输材料有限公司 | Aluminium alloy composite foil and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114000070A (en) * | 2021-11-02 | 2022-02-01 | 上海电机学院 | Aluminum alloy hollow section, heat treatment method for inhibiting abnormal growth of longitudinal weld grains of aluminum alloy hollow section and application of aluminum alloy hollow section |
| CN114290006A (en) * | 2021-12-09 | 2022-04-08 | 银邦金属复合材料股份有限公司 | Anti-collapse aluminum alloy composite fin material for electric vehicle heat management and preparation method thereof |
| CN114290006B (en) * | 2021-12-09 | 2023-09-26 | 银邦金属复合材料股份有限公司 | Anti-collapse aluminum alloy composite fin material for electric automobile thermal management and preparation method thereof |
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Application publication date: 20190906 |