CN110202281B - IC large board laser cutting process - Google Patents
IC large board laser cutting process Download PDFInfo
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- CN110202281B CN110202281B CN201910474326.0A CN201910474326A CN110202281B CN 110202281 B CN110202281 B CN 110202281B CN 201910474326 A CN201910474326 A CN 201910474326A CN 110202281 B CN110202281 B CN 110202281B
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- laser cutting
- groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a laser cutting method of an IC large board, which is realized by a laser cutting jig of the IC large board, wherein the laser cutting jig of the IC large board comprises a bottom plate and a plurality of hollow support columns, a first groove is arranged on the front surface of the bottom plate, a limit step is arranged at the opening of the first groove, a plurality of bottom plate through holes are arranged at the bottom of the first groove, the support columns are placed at the bottom of the first groove, the through holes of the support columns are communicated with the through holes of the bottom plate, and the step surfaces of the support columns and the limit step are used for supporting the IC large board accommodated in the first groove. The laser cutting process method of the large IC board is matched with the laser cutting jig of the large IC board, and the position of the supporting column can be accurately adjusted according to the IC carrier board on the large IC board, so that the laser cutting jig of the large IC board is universal for all large IC boards with the same size and is not influenced by the size, the shape and the number of the IC carrier boards on the large IC board.
Description
Technical Field
The invention relates to the technical field of laser cutting, in particular to a laser cutting jig for an IC large board and a process method.
Background
The IC carrier plate is a substrate used for packaging an IC bare chip, a plurality of IC carrier plates are integrated on a single IC large plate, the IC large plate needs to be fixed on a jig, and laser cutting equipment is adopted to cut the IC large plate so as to separate single-grain IC carrier plates. Because the sizes and the shapes of different IC carrier plates are different, the positions and the number of the IC carrier plates after typesetting on the IC large plates with the same size are different, if the current integrated jig is adopted, a set of laser cutting and separating jig special for each type of IC carrier plate is needed, so that the unit price of the product is improved, and the market competitiveness is reduced.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the laser cutting jig for the large IC boards is universal for all large IC boards with the same size, is not influenced by the size, shape and number of IC carrier boards on the large IC boards, and reduces the spreading cost of a single-grain IC carrier board on the laser cutting separation jig.
The technical scheme adopted by the invention is as follows: the utility model provides a big board laser cutting tool of IC, includes bottom plate and the hollow support column of a plurality of, the front of bottom plate is provided with first recess, the opening part of first recess is provided with spacing step, the tank bottom of first recess is provided with a plurality of bottom plate through-hole, the support column place the tank bottom of first recess, the through-hole of support column with the bottom plate through-hole be linked together, the step face of support column and spacing step be used for supporting the big board of IC of holding in first recess.
Compared with the prior art, the technical scheme of the invention has the following advantages:
in the laser cutting jig for the large IC board, the support columns and the jig bottom plate are not integrated, and the positions of the support columns can be accurately adjusted according to the IC carrier boards on the large IC board, so that the laser cutting jig for the large IC board can be universal for all large IC boards with the same size, and is not influenced by the size, shape and number of the IC carrier boards on the large IC board. In addition, the IC large board laser cutting jig is provided with a limiting step for supporting the IC large board accommodated in the first groove, so that the laser cutting machine can conveniently position the IC large board.
As an improvement, an open slot is arranged on the lower end face of the supporting column and is intersected with the through hole. By adopting the structure, no matter how the support column is placed at the bottom of the first groove, the through hole of the support column can be communicated with the through hole of the bottom plate.
As an improvement, a second groove is arranged on the back surface of the bottom plate and communicated with the through hole of the bottom plate. The second groove is used for limiting a vacuum chuck of the laser cutting machine, and the vacuum chuck is ensured to be communicated with the through hole of the bottom plate by adopting the structure.
As an improvement, a gasket is further placed at the bottom of the first groove, the supporting column is placed on the gasket, a plurality of gasket through holes are formed in the gasket, and the through holes of the supporting column, the gasket through holes and the bottom plate through holes form an air passage together. By adopting the structure, as long as the flatness of the surface of the gasket is ensured, the processing precision of the bottom of the first groove can be reduced, and the processing difficulty of the whole laser cutting jig for the IC large board is reduced.
As an improvement, the gasket and the supporting column are both made of magnetic materials. By adopting the scheme, the support column is magnetically adsorbed on the gasket, and the support column is prevented from shifting on the gasket after the support column is placed.
The invention aims to solve another technical problem that: the invention provides a process method for laser cutting of large IC boards, which is applied to laser cutting of large IC boards of the invention, and the laser cutting of the large IC boards with the same size is carried out by adopting a universal method, so that the influence of the size, shape and number of IC carrier boards on the large IC boards is avoided, and the average cost of a single IC carrier board on a laser cutting and separating process is reduced.
The technical scheme adopted by the invention is as follows: the process method for laser cutting of the IC large plate comprises the following steps:
(1) the laser cutting jig for the large IC board is fixed on the table top of a laser cutting machine, so that a vacuum chuck of the laser cutting machine is attached to the back of the bottom plate and is communicated with the through hole of the bottom plate;
(2) printing a layout diagram of an IC carrier plate on an IC large plate to be cut on paper according to the proportion of 1: 1;
(3) flatly pasting the printing paper in the step (2) on the bottom of the first groove;
(4) stamping holes corresponding to the through holes of the base plate one by one on the printing paper in the step (3);
(5) placing the support columns on the printing paper in the step (4), wherein the support columns correspond to the positions of the IC carrier plates on the layout one by one;
(6) placing an IC large board on the step surface of the limiting step, and enabling the IC carrier boards on the IC large board to be in one-to-one corresponding contact with the upper end surfaces of the supporting columns;
(7) starting a vacuum pump of the laser cutting machine to enable the IC large plate to be adsorbed on the supporting column;
(8) and starting laser cutting to separate the single-grain IC carrier plate.
Compared with the prior art, the technical scheme of the invention has the following advantages:
before laser cutting, the layout of all IC carrier plates on the large IC plate to be cut is printed on paper according to the proportion of 1:1 and is flatly adhered to the gasket, so that the position of each IC carrier plate on the large IC plate is accurately mapped on the gasket, the placing positions of the supporting columns are ensured to be in one-to-one correspondence with the IC carrier plates on the large IC plate, the technical scheme of the invention is universal for laser cutting of all large IC plates with the same size, and the laser cutting is not influenced by the size, shape and number of the IC carrier plates on the large IC plate.
As an improvement, an open slot is arranged on the lower end face of the supporting column and is intersected with the through hole.
As an improvement, a second groove is formed in the back face of the base plate, the second groove is communicated with the base plate through hole, and a vacuum chuck of the laser cutting machine in the step (1) is attached to the second groove.
As an improvement, a gasket is further placed at the bottom of the first groove, the supporting column is placed on the gasket, a plurality of gasket through holes are formed in the gasket, the through holes of the supporting column, the gasket through holes and the bottom plate through holes jointly form an air passage, printing paper is flatly adhered to the gasket in the step (3), and holes corresponding to the gasket through holes one to one are poked in the printing paper in the step (4).
As an improvement, the gasket and the supporting column are both made of magnetic materials.
Drawings
Figure 1 is a top view of the assembled product of the present invention.
Fig. 2 is a cross-sectional view of the assembled product of the invention shown in fig. 1.
FIG. 3 is a top view of an embodiment of the present invention.
Fig. 4 is a cross-sectional view of one embodiment of the invention shown in fig. 2.
Fig. 5 is a top view of another embodiment of the present invention.
Fig. 6 is a cross-sectional view of another embodiment of the present invention shown in fig. 4.
Figure 7 is a bottom view of the support post of the present invention.
Figure 8 is a cross-sectional view taken along the line a-a of the support post of the present invention.
Shown in the figure: 1. the IC carrier plate comprises a base plate, 101, a base plate through hole, 2, a support column, 201, a through hole, 202, an open slot, 3, a first groove, 4, a limiting step, 5, a second groove, 6, a gasket, 601, a gasket through hole, 7, an IC large plate, 701 and an IC carrier plate.
Detailed Description
The invention is further described with reference to the following figures and detailed description.
In the description of the present invention, it should be noted that the terms "top", "bottom", "upper and lower", "horizontal", "upper end", "lower end", "bottom", "step surface", "upper wall", "lower wall", "side wall", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "coupled" are to be interpreted broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The invention discloses a laser cutting jig for an IC large board, and fig. 1 and 2 are a top view and a cross section respectively after the product of the invention is assembled, as shown in fig. 1 and 2, an IC large board 7 is placed on the step surface of a limiting step 4 at the opening of a first groove 3, a second groove 5 is arranged on the back surface of a bottom plate 1, and the second groove 5 is used for limiting a vacuum chuck of a laser cutting machine.
Fig. 3 and 4 are a top view and a cross-sectional view of an embodiment of the present invention, as shown in fig. 3 and 4, the IC large board laser cutting jig of the present embodiment includes a bottom plate 1 with a thickness of 15mm and a plurality of cylindrical hollow supporting pillars 2; the front surface of the bottom plate 1 is provided with a first groove 3 with the depth of 9mm, the periphery of an opening of the first groove 3 is provided with a limiting step 4, the step width of the limiting step 4 and the height difference between the step surface and the front surface of the bottom plate are both 1mm, and the bottom of the first groove 3 is uniformly provided with a plurality of bottom plate through holes 101 with the diameter of 1 mm; the height of support column 2 is 8mm, and the diameter of the through-hole 201 of support column is 1mm, places support column 2 at the tank bottom of first recess 3, and the up end of support column 2 and the step face of spacing step 4 are located same horizontal plane and support the big board of IC of holding in first recess jointly, and the through-hole 201 of support column is linked together with bottom plate through-hole 101, has constituted vacuum chuck and has inhaled vacuous gas circuit route, makes the big board of IC adsorb on the up end of support column 2. The back of bottom plate 1 is provided with the second recess 5 that the degree of depth is 2mm, and the second recess is linked together with bottom plate through-hole 101 for spacing vacuum chuck guarantees that all bottom plate through-holes are all in vacuum chuck's vacuum gas circuit, makes the adsorption affinity maximize and the distribution that is used in on the big board of IC even. Bottom plate and support column in this embodiment are made by magnetic material, make support column magnetic adsorption on the bottom plate, after the position of placing the support column, avoid the support column to take place to shift at the tank bottom of first recess.
Fig. 5 and 6 are a top view and a cross-sectional view respectively showing another embodiment of the present invention, and as shown in fig. 5 and 6, the IC large board laser cutting jig of the present embodiment includes a bottom plate 1 with a thickness of 15mm, a sizing block with a thickness of 1mm, and a plurality of cylindrical hollow supporting pillars 2; the front surface of the bottom plate 1 is provided with a first groove 3 with the depth of 9mm, the periphery of an opening of the first groove 3 is provided with a limiting step 4, the step width of the limiting step 4 and the height difference between the step surface and the front surface of the bottom plate are both 1mm, and the bottom of the first groove 3 is uniformly provided with a plurality of bottom plate through holes 101 with the diameter of 1 mm; the height of support column 2 is 8mm, and the diameter of the through-hole 201 of support column is 1mm, places gasket 6 the tank bottom of first recess 3 is placed support column 2 on gasket 6, and the up end of support column 2 and the step face of spacing step 4 are located same horizontal plane and support the big board of IC of holding in first recess jointly, and the through-hole 201 of support column, gasket through-hole 601, bottom plate through-hole 101 are linked together, have constituted vacuum chuck and have inhaled vacuous gas circuit route, make the big board of IC adsorb on the up end of support column 2. The back of bottom plate 1 is provided with the second recess 5 that the degree of depth is 2mm, and the second recess is linked together with bottom plate through-hole 101 for spacing vacuum chuck guarantees that all bottom plate through-holes are all in vacuum chuck's vacuum gas circuit, makes the adsorption affinity maximize and the distribution that is used in on the big board of IC even. The gasket and the supporting column in the embodiment are made of magnetic materials, so that the supporting column is magnetically adsorbed on the gasket, and the supporting column is prevented from shifting on the gasket after the supporting column is placed. The bottom plate material is made of bakelite, so that the processing is convenient and the cost is low.
Fig. 7 and 8 are a bottom view and a sectional view in the direction a-a of the support column of the present invention, as shown in fig. 7 and 8, a through hole 201 with a diameter of 1mm in the support column 2 penetrates through the upper and lower end surfaces of the support column, an open groove 202 is provided on the lower end surface of the support column 2, and the width of the open groove 202 is greater than 1mm and intersects with the through hole 201.
The following describes a process method for laser cutting of an IC large board according to the present invention, which includes the following steps:
(1) the laser cutting jig for the large IC board is fixed on the table top of a laser cutting machine, so that a vacuum chuck of the laser cutting machine is adsorbed on the back of a bottom plate and is communicated with the through hole of the bottom plate;
(2) printing a layout diagram of an IC carrier plate on an IC large plate to be cut on paper according to the proportion of 1: 1;
(3) flatly pasting the printing paper obtained in the step (2) on the bottom of the first groove;
(4) punching holes corresponding to the through holes of the base plate one by one on the printing paper obtained in the step (3);
(5) placing the support columns on the printing paper in the step (4), wherein the support columns correspond to the positions of the IC carrier plates on the layout one by one;
(6) placing an IC large board on the step surface of the limiting step, and enabling the IC carrier boards on the IC large board to be in one-to-one corresponding contact with the upper end surfaces of the supporting columns;
(7) starting a vacuum pump of the laser cutting machine to enable the IC large plate to be adsorbed on the supporting column;
(8) and starting laser cutting to separate the single-grain IC carrier plate.
Before laser cutting, the layout of all IC carrier plates on the large IC plate to be cut is printed on paper according to the proportion of 1:1 and is flatly adhered to the bottom of the first groove, so that the position of each IC carrier plate on the large IC plate is accurately mapped to the bottom of the first groove, and the placement positions of the support columns are ensured to correspond to the IC carrier plates on the large IC plate one by one, so that the technical scheme of the invention is universal for laser cutting of all large IC plates with the same size and is not influenced by the size, shape and number of the IC carrier plates on the large IC plate.
Holes which correspond to the through holes of the base plate on the gasket one by one are punched on the printing paper, so that a vacuum air path channel formed by the vacuum sucker, the through holes in the support columns and the through holes of the base plate is ensured to be smooth, and the IC large plate laser cutting jig disclosed by the invention is ensured to stably adsorb and fix the IC large plate.
After laser cutting, the single-grain IC carrier plate separated from the large IC plate can be continuously adsorbed on the corresponding support column, and dust debris generated by cutting the large IC plate can enter the vacuum chuck through the gasket through hole and the bottom plate through hole, so that heat dissipation is facilitated and the surface of the single-grain IC carrier plate is kept clean.
If the back of the bottom plate is provided with a second groove, and the second groove is communicated with the through holes of the bottom plate, the vacuum chuck of the laser cutting machine in the step (1) is limited in the second groove, all the through holes of the bottom plate are ensured to be in the vacuum gas path of the vacuum chuck, and the adsorption force acting on the IC large plate is maximized and is uniformly distributed.
If a gasket is further placed at the bottom of the first groove, the support column is placed on the gasket, a plurality of gasket through holes are formed in the gasket, the through holes of the support column, the gasket through holes and the bottom plate through holes jointly form a gas path channel, printing paper is flatly adhered to the gasket in the step (3), and holes corresponding to the gasket through holes in a one-to-one mode are poked in the printing paper in the step (4).
The foregoing has described preferred embodiments of the present invention and is not to be construed as limiting the claims. The present invention is not limited to the above embodiments, and the specific structure thereof is allowed to vary, and various changes made within the scope of the independent claims of the present invention are within the scope of the present invention.
Claims (5)
1. A process method for laser cutting of an IC large board is realized by an IC large board laser cutting jig which comprises a bottom plate and a plurality of hollow support columns, wherein a first groove is formed in the front surface of the bottom plate, a limiting step is arranged at the opening of the first groove, a plurality of bottom plate through holes are formed in the bottom of the first groove, the support columns are placed at the bottom of the first groove, the through holes of the support columns are communicated with the bottom plate through holes, the step surfaces of the support columns and the limiting step are used for supporting the IC large board accommodated in the first groove, an open groove is formed in the lower end surface of each support column and is intersected with the through holes of the support columns, a second groove is formed in the back surface of the bottom plate and is communicated with the bottom plate through holes, and a gasket is also placed at the bottom of the first groove, the support column place the gasket on, the gasket on be provided with a plurality of gasket through-hole, the through-hole of support column, gasket through-hole, bottom plate through-hole constitute the gas circuit passageway jointly, gasket and support column make its characterized in that by magnetic material: the process method for laser cutting of the IC large plate comprises the following steps:
(1) fixing the laser cutting jig for the large IC board on the table top of a laser cutting machine, and enabling a vacuum chuck of the laser cutting machine to be attached to the back of the bottom plate and communicated with the through hole of the bottom plate;
(2) printing a layout diagram of an IC carrier plate on an IC large plate to be cut on paper according to the proportion of 1: 1;
(3) flatly pasting the printing paper in the step (2) on the bottom of the first groove;
(4) stamping holes corresponding to the through holes of the base plate one by one on the printing paper in the step (3);
(5) placing the support columns on the printing paper in the step (4), wherein the support columns correspond to the positions of the IC carrier plates on the layout one by one;
(6) placing an IC large board on the step surface of the limiting step, and enabling the IC carrier boards on the IC large board to be in one-to-one corresponding contact with the upper end surfaces of the supporting columns;
(7) starting a vacuum pump of the laser cutting machine to enable the IC large plate to be adsorbed on the supporting column;
(8) and starting laser cutting to separate the single-grain IC carrier plate.
2. The process of laser cutting of large IC boards as claimed in claim 1 wherein the lower end faces of the supporting posts are provided with open slots, and the open slots intersect the through holes.
3. The process of laser cutting of large IC boards as claimed in claim 2, wherein the back surface of the base plate is provided with a second groove, the second groove is communicated with the base plate through hole, and the vacuum chuck of the laser cutting machine in step (1) is attached to the second groove.
4. The process method for laser cutting of the large IC board according to any one of claims 1 to 3, wherein a gasket is further placed at the bottom of the first groove, the supporting pillar is placed on the gasket, a plurality of gasket through holes are formed in the gasket, the through holes of the supporting pillar, the gasket through holes and the bottom plate through holes jointly form a gas passage, the printing paper is flatly adhered to the gasket in the step (3), and holes corresponding to the gasket through holes in a one-to-one mode are punched in the printing paper in the step (4).
5. The process of laser dicing an IC large panel according to claim 4, wherein the spacers and the supporting posts are made of magnetic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910474326.0A CN110202281B (en) | 2019-06-03 | 2019-06-03 | IC large board laser cutting process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910474326.0A CN110202281B (en) | 2019-06-03 | 2019-06-03 | IC large board laser cutting process |
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| CN110202281A CN110202281A (en) | 2019-09-06 |
| CN110202281B true CN110202281B (en) | 2021-09-03 |
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| CN201910474326.0A Active CN110202281B (en) | 2019-06-03 | 2019-06-03 | IC large board laser cutting process |
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| CN113369722B (en) * | 2021-04-30 | 2023-03-10 | 武汉华工激光工程有限责任公司 | Clap clamp plate structure, feeding mechanism and IC support plate processing equipment |
| CN116765649A (en) * | 2023-07-31 | 2023-09-19 | 深圳市海目芯微电子装备科技有限公司 | Adsorption jig and laser cutting equipment |
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| CN108638644A (en) * | 2018-05-16 | 2018-10-12 | 郑州云海信息技术有限公司 | A kind of attached seat of vacuum branch |
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| JP2001347433A (en) * | 2000-06-07 | 2001-12-18 | Hitachi Ltd | Sucking system |
| KR100546043B1 (en) * | 2003-12-29 | 2006-01-24 | 세크론 주식회사 | Biz table manufacturing chuck table and sawing method using the same |
| CN206474808U (en) * | 2017-01-10 | 2017-09-08 | 深圳顺络电子股份有限公司 | One kind laser cutting tool |
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| CN110202281A (en) | 2019-09-06 |
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