CN110190521B - Encapsulating method and structure of negative ion generator - Google Patents
Encapsulating method and structure of negative ion generator Download PDFInfo
- Publication number
- CN110190521B CN110190521B CN201910579180.6A CN201910579180A CN110190521B CN 110190521 B CN110190521 B CN 110190521B CN 201910579180 A CN201910579180 A CN 201910579180A CN 110190521 B CN110190521 B CN 110190521B
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- China
- Prior art keywords
- negative ion
- temperature
- ion generator
- mixture solution
- epoxy resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
- H01T23/00—Apparatus for generating ions to be introduced into non-enclosed gases, e.g. into the atmosphere
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses a method for encapsulating a negative ion generator, which comprises the following steps: the negative ion generator is arranged in the insulation box after being assembled; uniformly stirring a first mixture solution obtained by mixing epoxy resin and a high-temperature curing agent, and carrying out vacuum defoaming treatment; injecting the first mixture solution into the insulation box, performing high-temperature solidification treatment, and naturally cooling to normal temperature to form a primary pouring seal; placing the primary pouring sealant into an anion module isolation box; uniformly stirring a second mixture solution obtained by mixing epoxy resin and a normal-temperature curing agent; and injecting the second mixture solution into the negative ion module isolation box, and performing normal-temperature curing treatment to form a secondary pouring sealing piece. The invention can protect the high-voltage circuit, realize negative ion isolation, prevent low-frequency sound from diffusing and effectively absorb high-frequency sound.
Description
Technical Field
The invention belongs to the technical field of air purification, and particularly relates to a method and a structure for encapsulating a negative ion generator.
Background
The negative oxygen ions in the air are praised as vitamins in the air, and can degrade and neutralize harmful gases in the air. Regulating physiological function, relieving fatigue, improving sleep, preventing respiratory diseases, improving cardiovascular and cerebrovascular diseases, lowering blood pressure, stimulating appetite, and improving skin elasticity. Combining air purification with negative oxygen ions has become an important development of air purification devices over the years. In the conventional air purifying device, an opening is provided in a ceiling, and an air blowing device and a negative ion emitting device are provided in an upper portion of the opening to realize negative ion air blowing. This device can significantly affect the indoor silence due to the presence of the air outlet. Because the existing anion generating device can generate certain ultrahigh frequency sound wave harmonic sounds caused by an oscillating circuit in principle, human body discomfort can be caused, and particularly for high-frequency sensitive people, the high-frequency sound wave harmonic sounds caused by the fact can be very uncomfortable, and the rest of the people is not facilitated.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention provides a method and a structure for encapsulating an anion generator, which can protect a high-voltage circuit, realize anion isolation, stop low-frequency sound diffusion and effectively absorb high-frequency sound.
In one aspect of the invention, a method for potting a negative ion generator comprises the steps of:
the negative ion generator is arranged in the insulation box after being assembled;
uniformly stirring a first mixture solution obtained by mixing epoxy resin and a high-temperature curing agent, and carrying out vacuum defoaming treatment;
injecting the first mixture solution into the insulation box, performing high-temperature solidification treatment, and naturally cooling to normal temperature to form a primary pouring seal;
placing the primary pouring sealant into an anion module isolation box;
uniformly stirring a second mixture solution obtained by mixing epoxy resin and a normal-temperature curing agent;
and injecting the second mixture solution into the negative ion module isolation box, and performing normal-temperature curing treatment to form a secondary pouring sealing piece.
Further, the curing temperature of the high-temperature curing treatment is controlled to be about 80 ℃.
In another aspect of the invention, the encapsulating structure of the negative ion generator comprises a negative ion generator circuit board, an insulating box and a negative ion module isolation box, wherein the negative ion generator circuit board is encapsulated in the insulating box by high-temperature curing epoxy resin without micro bubbles, and the insulating box is encapsulated in the negative ion module isolation box by normal-temperature curing epoxy resin with micro bubbles.
Compared with the prior art, the invention has the following beneficial effects:
the primary encapsulating piece encapsulated by the epoxy resin with a tight microbubble-free structure is formed by adopting high-temperature curing and vacuumizing during the primary encapsulating, so that the diffusion of low-frequency sound can be effectively stopped while a high-voltage circuit is protected; and the secondary pouring sealant filled with the epoxy resin filled with the microbubbles is formed by adopting normal-temperature solidification and no vacuumizing during the secondary pouring sealant, so that negative ion isolation can be realized and high-frequency sound can be effectively absorbed.
Drawings
FIG. 1 is a schematic diagram of a potting process flow of the present invention;
fig. 2 is a schematic diagram of the potting structure of the present invention.
Wherein, 1 anion generator circuit board, 2 insulating box, 3 high temperature curing epoxy, 4 anion module isolation box, 5 normal atmospheric temperature curing epoxy.
Detailed Description
The invention is further described with reference to the following detailed drawings in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the implementation of the invention easy to understand.
Method embodiment:
the encapsulating method of the negative ion generator, as shown in fig. 1, comprises the following steps:
and (3) primary filling and sealing:
the negative ion generator is arranged in the insulation box after being assembled;
uniformly stirring a first mixture solution obtained by mixing epoxy resin and a high-temperature curing agent, and carrying out vacuum defoaming treatment;
injecting the first mixture solution into the insulation box, performing high-temperature solidification treatment, and naturally cooling to normal temperature to form a primary pouring seal;
and (3) secondary filling and sealing:
placing the primary pouring sealant into an anion module isolation box;
uniformly stirring a second mixture solution obtained by mixing epoxy resin and a normal-temperature curing agent;
and injecting the second mixture solution into the negative ion module isolation box, and performing normal-temperature curing treatment to form a secondary pouring sealing piece.
In the research of the encapsulation mode of the anion generator, the inventor discovers that the epoxy resin not only has better insulating property, but also can realize better isolation effect on low-frequency harmonic sound and better absorption effect on high-frequency harmonic sound by adopting different encapsulation modes, and can obviously reduce the penetrability of part of harmonic sound.
According to the method for encapsulating the negative ion generator, high-temperature curing and vacuumizing are adopted in the first encapsulating process, so that a primary encapsulating piece encapsulated by epoxy resin without a micro-bubble structure is formed, and low-frequency sound diffusion can be effectively stopped while a high-voltage circuit is protected; the secondary encapsulating member is cured at normal temperature without vacuumizing during the secondary encapsulating process, and is encapsulated by the epoxy resin filled with micro bubbles, so that negative ions can be isolated, high-frequency sound can be effectively absorbed, particularly high-frequency sound higher than 15KHz can be absorbed very well, and at least 90% of high-frequency harmonic sound can be obviously reduced. Therefore, the influence of low-frequency sound and high-frequency sound generated by the negative ion generator on people can be obviously reduced, and if the negative ion generator is used in the environment of a health care system, a good health care environment can be provided for health care people (particularly certain high-frequency sensitive people). With respect to the manner of potting, both the mechanized production mode and the manual process mode may be used. The high temperature curing treatment may be performed in a high temperature oven. The epoxy resin and the high-temperature and normal-temperature curing agent can be common products in the market, and the vacuum defoaming treatment, the high-temperature curing treatment and the normal-temperature curing treatment are all the prior art, so long as the high-temperature curing epoxy resin without micro bubbles and the normal-temperature curing epoxy resin with micro bubbles can be generated. In addition, as can be seen from fig. 1, there is no strict sequence between the two steps of "putting into a box" and "stirring the mixture solution uniformly" in the two potting.
As an optimized scheme, the curing temperature of the high-temperature curing treatment is controlled between 75 ℃ and 85 ℃, and is preferably 80 ℃.
In order to prevent the electronic device from being damaged by the high temperature during curing, it is conceivable to control the curing temperature to about 80 ℃. Thus, the high-temperature curing is not affected, and the electronic devices in the negative ion generator circuit are not affected.
Structural example:
the encapsulating structure of the negative ion generator comprises a negative ion generator circuit board 1, an insulating box 2 and a negative ion module isolation box 4, wherein the negative ion generator circuit board 1 is encapsulated in the insulating box 2 by high-temperature curing epoxy resin 3 without micro bubbles, and the insulating box 2 is encapsulated in the negative ion module isolation box 4 by normal-temperature curing epoxy resin 5 with micro bubbles.
In this embodiment, the outer layer of the encapsulating structure of the negative ion generator is a negative ion module isolation box, the inside of which is encapsulated with an insulation box by normal temperature cured epoxy resin, and the inside of the insulation box is encapsulated with a circuit board of the negative ion generator by high temperature cured epoxy resin which is subjected to vacuum defoaming treatment. The high-temperature cured epoxy resin inside the insulating box has a compact structure and no bubbles, so that low-frequency noise can be effectively prevented from being diffused; the inside of the outside normal temperature curing epoxy resin structure is provided with a large number of bubble holes, and can absorb a large number of high-frequency harmonic sounds generated by the negative ion generator, so that the low-frequency and high-frequency harmonic sounds generated by the negative ion generator are reduced simultaneously, the comfort level of a human body in the environment is greatly improved, and the rest of personnel is facilitated.
The foregoing is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the foregoing embodiment, and all technical solutions belonging to the principles of the present invention are within the protection scope of the present invention. Modifications which would occur to those skilled in the art without departing from the principles of the invention are also intended to be included within the scope of the invention.
Claims (2)
1. The encapsulating method of the negative ion generator is characterized by comprising the following steps of:
the negative ion generator is arranged in the insulation box after being assembled;
uniformly stirring a first mixture solution obtained by mixing epoxy resin and a high-temperature curing agent, and carrying out vacuum defoaming treatment;
injecting the first mixture solution into the insulation box, performing high-temperature solidification treatment, and naturally cooling to normal temperature to form a primary pouring seal;
placing the primary pouring sealant into an anion module isolation box;
uniformly stirring a second mixture solution obtained by mixing epoxy resin and a normal-temperature curing agent;
injecting the second mixture solution into the negative ion module isolation box and curing at normal temperature to form a secondary pouring sealing piece;
the curing temperature of the high-temperature curing treatment is controlled at 75-85 ℃.
2. The negative ion generator potting structure obtained by the negative ion generator potting method according to claim 1, wherein: the negative ion module isolation box comprises a negative ion generator circuit board, an insulation box and a negative ion module isolation box, wherein the negative ion generator circuit board is encapsulated in the insulation box by high-temperature curing epoxy resin without micro bubbles, and the insulation box is encapsulated in the negative ion module isolation box by normal-temperature curing epoxy resin with micro bubbles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910579180.6A CN110190521B (en) | 2019-06-28 | 2019-06-28 | Encapsulating method and structure of negative ion generator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910579180.6A CN110190521B (en) | 2019-06-28 | 2019-06-28 | Encapsulating method and structure of negative ion generator |
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| Publication Number | Publication Date |
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| CN110190521A CN110190521A (en) | 2019-08-30 |
| CN110190521B true CN110190521B (en) | 2023-08-25 |
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| CN201910579180.6A Active CN110190521B (en) | 2019-06-28 | 2019-06-28 | Encapsulating method and structure of negative ion generator |
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| CN113286411B (en) * | 2021-04-01 | 2024-02-20 | 中科石金(安徽)中子技术有限公司 | Neutron generator and encapsulating method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2050566U (en) * | 1989-06-16 | 1990-01-03 | 许国才 | Static electricity-removing negative ion generator core |
| JP2006092876A (en) * | 2004-09-22 | 2006-04-06 | Sharp Corp | Ion generator |
| CN108141013A (en) * | 2015-09-02 | 2018-06-08 | 夏普株式会社 | ion generating device and manufacturing method |
| CN210007107U (en) * | 2019-06-28 | 2020-01-31 | 重庆市耕爵环保科技有限公司 | Negative ion generator encapsulating structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6888259B2 (en) * | 2001-06-07 | 2005-05-03 | Denso Corporation | Potted hybrid integrated circuit |
-
2019
- 2019-06-28 CN CN201910579180.6A patent/CN110190521B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2050566U (en) * | 1989-06-16 | 1990-01-03 | 许国才 | Static electricity-removing negative ion generator core |
| JP2006092876A (en) * | 2004-09-22 | 2006-04-06 | Sharp Corp | Ion generator |
| CN108141013A (en) * | 2015-09-02 | 2018-06-08 | 夏普株式会社 | ion generating device and manufacturing method |
| CN210007107U (en) * | 2019-06-28 | 2020-01-31 | 重庆市耕爵环保科技有限公司 | Negative ion generator encapsulating structure |
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| CN110190521A (en) | 2019-08-30 |
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