CN110190521A - Anion generator encapsulating method and structure - Google Patents
Anion generator encapsulating method and structure Download PDFInfo
- Publication number
- CN110190521A CN110190521A CN201910579180.6A CN201910579180A CN110190521A CN 110190521 A CN110190521 A CN 110190521A CN 201910579180 A CN201910579180 A CN 201910579180A CN 110190521 A CN110190521 A CN 110190521A
- Authority
- CN
- China
- Prior art keywords
- anion
- anion generator
- mixture solution
- epoxy resin
- insulation booth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
- H01T23/00—Apparatus for generating ions to be introduced into non-enclosed gases, e.g. into the atmosphere
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses anion generator encapsulating method, include the following steps: to be placed in insulation booth after assembling anion generator；The first mixture solution that epoxy resin and high-temperature curing agent are mixed to get stirs evenly and carries out vacuum defoamation processing；First mixture solution is injected into the insulation booth and carries out hot setting processing, room temperature is naturally cooled to later, forms an embedding part；Embedding part is placed in anion module barrier box；The second mixture solution that epoxy resin and normal temperature cure agent are mixed to get is stirred evenly；Second mixture solution is injected into the anion module barrier box and carries out normal temperature cure processing, forms secondary embedding part.The present invention can protect high-tension circuit, it can be achieved that anion isolation, can prevent bass diffusion, can effectively absorb to high frequency audio.
Description
Technical field
The invention belongs to technical field of air purification, and in particular to a kind of anion generator encapsulating method and structure.
Background technique
Air negative oxgyen ion is known as the vitamin in air, and can degrade the pernicious gas neutralized in air.Adjust human body
Physiological function eliminates fatigue, improves sleep, prevention respiratory disease, improves cardiovascular and cerebrovascular disease, blood pressure lowering, the food for promoting people
It is intended to, enhancing skin elasticity.Air cleaning has been combined with negative oxygen ion to a weight in these years air cleaning unit
Want developing direction.In existing air cleaning unit, have using setting opening on the ceiling, and is sent in upper opening portion setting
Wind apparatus and negative ion emitter are to realize that anion is blown.This device is due to just at air outlet, significant ground shadow
Ring indoor quiet degree.Certain caused by oscillating circuit since existing negative ion generating device will necessarily generate in principle
Hyperfrequency sound wave harmonic wave sound, may cause human body discomfort, especially for high frequency sensitive group, thus caused by high-frequency harmonic
Sound can allow people to feel bad very much, be unfavorable for the recuperation of people.
Summary of the invention
For the deficiency in the presence of the prior art, the present invention provides one kind can protect high-tension circuit, can be achieved to bear
Ion isolation, the anion generator encapsulating method that bass diffusion can be prevented, effectively high frequency audio can be absorbed
And structure.
One aspect of the present invention, anion generator encapsulating method, includes the following steps:
It is placed in insulation booth after anion generator is assembled；
The first mixture solution that epoxy resin and high-temperature curing agent are mixed to get stirs evenly and carries out vacuum defoamation
Processing；
First mixture solution is injected into the insulation booth and carries out hot setting processing, is naturally cooled to later often
Temperature forms an embedding part；
Embedding part is placed in anion module barrier box；
The second mixture solution that epoxy resin and normal temperature cure agent are mixed to get is stirred evenly；
Second mixture solution is injected into the anion module barrier box and carries out normal temperature cure processing, forms two
Secondary embedding part.
Further, the solidification temperature of the hot setting processing is controlled at 80 DEG C or so.
Another aspect of the present invention, anion generator encapsulating structure, including anion generator circuit board, insulation booth
And anion module barrier box, the anion generator circuit board are potted in by the High Temperature Curing Epoxy Resin System of no microbubble
In the insulation booth, the insulation booth is had the normal-temperature curing epoxy resin of microbubble to be potted in the anion module barrier box
It is interior.
Compared with the prior art, the invention has the following beneficial effects:
By using hot setting in first time encapsulating and vacuumizing, formed by the hard-packed asphalt mixtures modified by epoxy resin of no microbubble
Embedding part of rouge encapsulating can effectively prevent the diffusion of bass while protecting high-tension circuit；In second of encapsulating
It Shi Caiyong normal temperature cure and does not vacuumize, forms the secondary embedding part of the epoxy resin encapsulated by there is microbubble to fill, Ke Yi
Realize the effective absorption accomplished while anion isolation to high frequency audio.
Detailed description of the invention
Fig. 1 is dosing technology flow diagram of the present invention；
Fig. 2 is encapsulating structural schematic diagram of the present invention.
Wherein, 1 anion generator circuit board, 2 insulation booths, 3 High Temperature Curing Epoxy Resin Systems, 4 anion module barrier boxes,
5 normal-temperature curing epoxy resins.
Specific embodiment
In order to which the technical means, creative features, achievable purpose and effectiveness for realizing invention are easy to understand, below with reference to
It is specifically illustrating, the present invention is further explained.
Embodiment of the method:
Anion generator encapsulating method, as shown in Figure 1, including the following steps:
First time encapsulating:
It is placed in insulation booth after anion generator is assembled；
The first mixture solution that epoxy resin and high-temperature curing agent are mixed to get stirs evenly and carries out vacuum defoamation
Processing；
First mixture solution is injected into the insulation booth and carries out hot setting processing, is naturally cooled to later often
Temperature forms an embedding part；
Second of encapsulating:
Embedding part is placed in anion module barrier box；
The second mixture solution that epoxy resin and normal temperature cure agent are mixed to get is stirred evenly；
Second mixture solution is injected into the anion module barrier box and carries out normal temperature cure processing, forms two
Secondary embedding part.
In the research of the encapsulating mode to anion generator, inventor, which has found epoxy resin not only, to be had preferably absolutely
Edge performance, moreover it is possible to preferable insulating effect be realized to low-frequency harmonics sound by using different encapsulating modes and to high-frequency harmonic
Sound realizes preferable absorption, and the penetrability of fractional harmonic sound can be significantly reduced.
Anion generator encapsulating method in this programme uses hot setting in first time encapsulating and vacuumizes, shape
Embedding part of the hard-packed epoxy resin encapsulated of Cheng Youwu microbubble can effectively shut out while protecting high-tension circuit
The diffusion of exhausted bass；Normal temperature cure is used in second of encapsulating and is not vacuumized, and the epoxy by there is microbubble to fill is formed
The secondary embedding part of resin encapsulating can realize the effective absorption accomplished while anion isolation to high frequency audio, especially
There is extraordinary assimilation effect to the high frequency audio higher than 15KHz, at least 90% harmonic high frequency Boeing can be substantially reduced.Such one
Come, just can significantly reduce the influence of the bass and high frequency audio of anion generator generation to people, if being used in the ring that health supports system
In border, personage (especially certain high frequency sensitive groups) can be supported to health, good recuperation environment is provided.About the mode of encapsulating, nothing
By with mechanization production mode or artisan craftsmanship mode.The hot setting processing can carry out in high temperature oven.
Product common on the market, the vacuum defoamation processing, high temperature can be used in the epoxy resin and high temperature, normal temperature cure agent
Curing process and normal temperature cure processing are the prior art, if can generate High Temperature Curing Epoxy Resin System without microbubble and
There is the normal-temperature curing epoxy resin of microbubble.In addition, from figure 1 it appears that twice in encapsulating " in merging box " and
There is no strict sequence between " stirring evenly mixture solution " this two step.
As the scheme of optimization, the solidification temperature of the hot setting processing is controlled between 75-85 DEG C, and preferably 80
℃。
High temperature on electronic device when solidifying in order to prevent damages, it is contemplated that controls solidification temperature on 80 DEG C of left sides
It is right.Hot setting will not only be impacted in this way, also will not influence the electronic device in anion generator circuit.
Constructive embodiment:
Anion generator encapsulating structure, as shown in Fig. 2, including anion generator circuit board 1, insulation booth 2 and bearing
Ion module barrier box 4, the anion generator circuit board 1 are potted in institute by the High Temperature Curing Epoxy Resin System 3 of no microbubble
It states in insulation booth 2, the insulation booth 2 is had the normal-temperature curing epoxy resin 5 of microbubble to be potted in the anion module isolation
In box 4.
In the present embodiment, the outer layer of anion generator encapsulating structure is anion module barrier box, and inside passes through room temperature
Cured epoxy resin encapsulating has insulation booth, passes through the High Temperature Curing Epoxy Resin System encapsulating by vacuum defoamation processing inside insulation booth
The circuit board of anion generator.High Temperature Curing Epoxy Resin System close structure on the inside of insulation booth can be effective without bubble
Prevent the diffusion of low frequency noise；There is a large amount of crafters inside the normal-temperature curing epoxy resin structure in outside, can largely absorb
The harmonic high frequency Boeing that anion generator generates thereby realizes while reducing the low frequency and high frequency of anion generator generation
Harmonic wave sound substantially increases the comfort level of human body under the environment, is conducive to the recuperation of personnel.
The foregoing is merely the preferred embodiment of the present invention, protection scope of the present invention is not limited in above-mentioned embodiment party
Formula, all technical solutions for belonging to the principle of the invention all belong to the scope of protection of the present invention.For those skilled in the art and
Speech, several improvement carried out without departing from the principles of the present invention, these improvement also should be regarded as protection model of the invention
It encloses.
Claims (3)
1. anion generator encapsulating method, which comprises the steps of:
It is placed in insulation booth after anion generator is assembled；
The first mixture solution that epoxy resin and high-temperature curing agent are mixed to get stirs evenly and carries out vacuum defoamation processing；
First mixture solution is injected into the insulation booth and carries out hot setting processing, naturally cools to room temperature later,
Form an embedding part；
Embedding part is placed in anion module barrier box；
The second mixture solution that epoxy resin and normal temperature cure agent are mixed to get is stirred evenly；
Second mixture solution is injected into the anion module barrier box and carries out normal temperature cure processing, forms secondary filling
Sealing.
2. anion generator encapsulating method according to claim 1, it is characterised in that:
The solidification temperature of the hot setting processing is controlled at 75-85 DEG C.
3. anion generator encapsulating structure, it is characterised in that: including anion generator circuit board, insulation booth and anion
Module barrier box, the anion generator circuit board are potted in the insulation booth by the High Temperature Curing Epoxy Resin System of no microbubble
Interior, the insulation booth is had the normal-temperature curing epoxy resin of microbubble to be potted in the anion module barrier box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910579180.6A CN110190521B (en) | 2019-06-28 | 2019-06-28 | Encapsulating method and structure of negative ion generator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910579180.6A CN110190521B (en) | 2019-06-28 | 2019-06-28 | Encapsulating method and structure of negative ion generator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110190521A true CN110190521A (en) | 2019-08-30 |
| CN110190521B CN110190521B (en) | 2023-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910579180.6A Active CN110190521B (en) | 2019-06-28 | 2019-06-28 | Encapsulating method and structure of negative ion generator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113286411A (en) * | 2021-04-01 | 2021-08-20 | 中科石金(安徽)中子技术有限公司 | Neutron generator and encapsulating method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2050566U (en) * | 1989-06-16 | 1990-01-03 | 许国才 | Static electricity-removing negative ion generator core |
| US20020185752A1 (en) * | 2001-06-07 | 2002-12-12 | Takeshi Ishikawa | Potted hybrid integrated circuit and method for manufacturing potted hybrid integrated circuit |
| JP2006092876A (en) * | 2004-09-22 | 2006-04-06 | Sharp Corp | Ion generator |
| CN108141013A (en) * | 2015-09-02 | 2018-06-08 | 夏普株式会社 | ion generating device and manufacturing method |
| CN210007107U (en) * | 2019-06-28 | 2020-01-31 | 重庆市耕爵环保科技有限公司 | Negative ion generator encapsulating structure |
-
2019
- 2019-06-28 CN CN201910579180.6A patent/CN110190521B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2050566U (en) * | 1989-06-16 | 1990-01-03 | 许国才 | Static electricity-removing negative ion generator core |
| US20020185752A1 (en) * | 2001-06-07 | 2002-12-12 | Takeshi Ishikawa | Potted hybrid integrated circuit and method for manufacturing potted hybrid integrated circuit |
| JP2006092876A (en) * | 2004-09-22 | 2006-04-06 | Sharp Corp | Ion generator |
| CN108141013A (en) * | 2015-09-02 | 2018-06-08 | 夏普株式会社 | ion generating device and manufacturing method |
| CN210007107U (en) * | 2019-06-28 | 2020-01-31 | 重庆市耕爵环保科技有限公司 | Negative ion generator encapsulating structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113286411A (en) * | 2021-04-01 | 2021-08-20 | 中科石金(安徽)中子技术有限公司 | Neutron generator and encapsulating method thereof |
| CN113286411B (en) * | 2021-04-01 | 2024-02-20 | 中科石金(安徽)中子技术有限公司 | Neutron generator and encapsulating method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110190521B (en) | 2023-08-25 |
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