CN110181172A - A kind of device and method of Laser Processing Ceramics special-shaped slot - Google Patents
A kind of device and method of Laser Processing Ceramics special-shaped slot Download PDFInfo
- Publication number
- CN110181172A CN110181172A CN201910489824.2A CN201910489824A CN110181172A CN 110181172 A CN110181172 A CN 110181172A CN 201910489824 A CN201910489824 A CN 201910489824A CN 110181172 A CN110181172 A CN 110181172A
- Authority
- CN
- China
- Prior art keywords
- laser
- processed
- sample
- shaped slot
- control device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims description 37
- 238000005096 rolling process Methods 0.000 claims abstract description 54
- 230000033001 locomotion Effects 0.000 claims description 47
- 238000009434 installation Methods 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000005086 pumping Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
- 238000003754 machining Methods 0.000 description 7
- 238000007664 blowing Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000007306 turnover Effects 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004814 ceramic processing Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The present invention discloses a kind of device of Laser Processing Ceramics special-shaped slot, including control device, laser aid and telecontrol equipment, control device is electrically connected with laser aid and telecontrol equipment respectively, telecontrol equipment is set at the laser irradiation of laser aid transmitting, telecontrol equipment includes rolling clamp and three-dimensional platform, supporting frame is fixed on three-dimensional platform, several rolling clamps are mounted on the upper surface of supporting frame, the bottom of rolling clamp connects rotating electric machine, is fixedly connected with sample to be processed at the top of rolling clamp;Rotating electric machine and control device are electrically connected, and the sample to be processed clamped on rolling clamp is made to turn to position to be processed;Three-dimensional platform and control device are electrically connected, and make to be moved to position to be processed by the sample to be processed that rolling clamp clamps on three-dimensional platform.The present invention can using common configuration the excessive problem of taper after the processing of effective solution ceramic inner walls Special-shaped slot, improve processing efficiency.
Description
Technical field
The present invention relates to ceramic processing technique field, it is related to the device and process with Laser Processing Ceramics inner wall, tool
Body is a kind of device and method of Laser Processing Ceramics special-shaped slot.
Background technique
Engineering ceramic material have excellent physical property and stable chemical property, be widely used to machinery, electronics,
Difficulty is brought for retrofit in the industries such as space flight and precision instruments, but the characteristics of its brittleness is big, poor toughness, especially for
Ceramic manufacturing special impression, tradition machinery machining accuracy is insufficient, and the chamfering between side wall and slot bottom is excessive, leads to subsequent assembly essence
It is poor to spend, and the ceramics after being machined can generally existing residual stress, edge chipping it is serious and other issues, therefore industrially get over
Laser beam is focused come more uses to carry out Ceramic manufacturing.
However there is also some problems for laser processing, can there is a problem of that taper is larger when such as processing larger depth, especially
It is that the big problem of existing taper is processed for the ceramic inner walls of annular, the problem need to usually increase the more dress for changing optical path at present
It sets to solve, manufacturing cycle and the cost of ceramic member will be increased.As disclosed in the Chinese patent of publication number CN106825944B
A kind of ultrafast femtosecond laser cutting machine disposably cuts through cutting or aperture by multiple-point focusing mirror, and utilizes inner cavity
The strong adsorption function of absorption platform ensure that the smooth zero draft cutting of notch;In addition, in publication number CN106425122A
A kind of device and method of laser rotary-cut processing disclosed in state's patent, by deflecting the focused light passages of eyeglass, root using spiral
According to the focal position and motion profile for needing to adjust focal beam spot, accurate control focal beam spot phase with the increase of depth of cut
It should decline, so that focal beam spot be made to be always positioned at the surface of material to be processed, taper present in tradition cutting can be overcome big
Problem.A kind of laser processing device and method as disclosed in the Chinese patent of publication number CN109014569A, by flat in three-dimensional
Rolling clamp is set on the side wall of platform, to process to for example rodlike, bowl-shape or spherical article to be processed, but it is only capable of
The outer surface for treating processing article is processed, and the inner wall that cannot treat processing article is processed, and being mainly cannot be right
Groove carries out mould taper control, so generated taper problems of too when processing ring-shaped pottery inner wall special-shaped slot can not be solved.
Summary of the invention
In response to the problems existing in the prior art, the purpose of the present invention is to provide a kind of devices of Laser Processing Ceramics special-shaped slot
And method, it can taper be excessive after the processing of effective solution ceramic inner walls Special-shaped slot using common configuration
Problem improves processing efficiency.
To achieve the above object, the technical solution adopted by the present invention is that:
A kind of device of Laser Processing Ceramics special-shaped slot, including control device, laser aid and telecontrol equipment, the control
Device is electrically connected with the laser aid and the telecontrol equipment respectively, and the telecontrol equipment is set to the laser aid hair
At the laser irradiation penetrated, the telecontrol equipment includes rolling clamp and three-dimensional platform, is fixed with support frame on the three-dimensional platform
Body, several rolling clamps are mounted on the upper surface of support frame as described above body, and the bottom of the rolling clamp connects electric rotating
Machine is fixedly connected with sample to be processed at the top of the rolling clamp;The rotating electric machine and the control device are electrically connected, and are used
In the motion control signal for receiving the control device transmission and the rolling clamp is rotated according to the motion control signal, is made
The sample to be processed clamped on the rolling clamp turns to position to be processed;The three-dimensional platform and the control device are electrical
Connection, for receiving the motion control signal of the control device transmission and according to the mobile three-dimensional of the motion control signal
Platform makes to be moved to position to be processed by the sample to be processed that the rolling clamp clamps on the three-dimensional platform.
Preferably, the rolling clamp is 4.
Preferably, the control device sends laser control signal to the laser aid;The laser aid is for connecing
The laser control signal that the control device is sent is received, the switch of laser is controlled according to the laser control signal
Light, and control the direction of motion of laser in process.
Preferably, the laser aid includes: lasers and mirrors;The laser electrically connects with the control device
It connects, the reflecting mirror is set on the laser aid to the laser optical path of the telecontrol equipment;The laser is for receiving
The laser control signal that the control device is sent, and according to the laser control signal by Laser emission to the reflection
Mirror;The reflecting mirror is used for the laser reflection for emitting the laser, and the laser is for processing the sample to be processed.
Further, the reflecting mirror and level are in 45 ° of angles, so that laser direction is changed to vertically by level.
Preferably, the laser aid further includes galvanometer and lens;The galvanometer and the control device are electrically connected, institute
It states lens to be fixedly connected with the galvanometer, the side of the lens is provided with the galvanometer, and the lens are far from the galvanometer
Side is provided with reflecting mirror, and the galvanometer is provided with the laser far from the side of the lens;The galvanometer is for receiving
The laser control signal that the control device is sent, and the laser level direction of motion, institute are changed according to the laser control signal
Lens are stated for the laser to be focused to a point.
Further, the galvanometer is connect with the control device, for changing the movement side of laser beam in process
To 90 ° of turnovers can occur in the horizontal direction after galvanometer for the laser beam.
Preferably, the laser aid further includes beam expanding lens;The side of the beam expanding lens is provided with the galvanometer, the expansion
Shu Jing is provided with the laser far from the side of the galvanometer, the laser, the beam expanding lens, the galvanometer, described
The center line of mirror and the reflecting mirror is on laser optical path;The beam expanding lens is used to reduce the angle of departure of the laser.
Preferably, the device of the Laser Processing Ceramics special-shaped slot further includes positioning device;The positioning device is for clapping
The physical location of sample to be processed is taken the photograph, and co-ordinate position information will be obtained after physical location processing, by the coordinate position
Information is sent to the control device.
Preferably, the device of the Laser Processing Ceramics special-shaped slot further include: blowning installation and pumping dirt device;The air blowing
Device is set to the side of the sample to be processed, and the pumping dirt device is set to the sample to be processed and fills far from the air blowing
The side set, the blowning installation are flexibly connected with the three-dimensional platform.
A kind of method of Laser Processing Ceramics special-shaped slot is realized using the device, which comprises
S1 calculates the distance that rolling clamp deviates lens centre position according to taper value needed for sample to be processed;
S2, control device control rolling clamp are moved to designated position;
S3, the data for the sample to be processed that control device is sent according to positioning device calculate adding for the sample to be processed
Work figure layer, the data include the depth, taper size of special-shaped slot and rotation angle in the sample to be processed;
S4 adds according to the depth of special-shaped slot in the sample to be processed and pre-stored every layer of the control device
Work depth calculates the figure layer number of plies;
The working depth is converted to laser control signal and is sent to laser aid, the laser control signal packet by S5
Include transmitting laser duration and the laser level direction of motion;
S6 calculates angle of rotation needed for completing the sample to be processed according to the figure layer number of plies and the rotation angle
Degree and motion track;
The rotational angle and the motion track are converted to motion control signal and are sent to telecontrol equipment by S7, described
Motion control signal includes rotation and/or mobile sample to be processed, and the telecontrol equipment is by rotation and/or movement wait be loaded
Product complete the processing of entire sample.
Compared with prior art, the beneficial effects of the present invention are:
(1) supporting frame is fixedly installed in the present invention on three-dimensional platform, several rolling clamps are mounted on the branch
The upper surface of support body, the bottom of the rolling clamp connect rotating electric machine, are fixedly connected at the top of the rolling clamp to be added
Work sample;The rotating electric machine and the control device are electrically connected, the motion control sent for receiving the control device
Signal simultaneously rotates the rolling clamp according to the motion control signal, turns the sample to be processed clamped on the rolling clamp
Move position to be processed;The three-dimensional platform and the control device are electrically connected, for receiving the control device transmission
Motion control signal simultaneously moves the three-dimensional platform according to the motion control signal, makes on the three-dimensional platform by the rotation
The sample to be processed of fixture clamping is moved to position to be processed;The present invention passes through three-dimensional platform, rotating electric machine and rolling clamp
Cooperation, changes the rotational angle and motion track of sample to be processed, makes sample to be processed in a manner of rotating or move by laser
It effectively processes, makes the whole circle special-shaped slot of ceramic inner walls that can complete to process according to set sequence, to be effectively reduced to be added
The taper of special-shaped slot in work sample, while also improving processing efficiency;The prior art can be efficiently solved in this way
In the problem larger to taper existing for processing ceramic inner wall special-shaped slot.
(2) present invention solves ceramics only by the common configuration at telecontrol equipment end without increasing the device for changing optical path
Taper excessive problem when inner wall special-shaped slot is processed, controls manufacturing cycle and the cost of ceramic member, simultaneously as rolling clamp
It can be set multiple, more samples of different shapes can be processed simultaneously, and then improve processing efficiency.
Detailed description of the invention
Illustrate the embodiment of the present invention or technical solution in the prior art in order to clearer, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 shows the first viewing angle constructions of device signal of Laser Processing Ceramics special-shaped slot provided by the embodiments of the present application
Figure;
Fig. 2 shows the signals of the second viewing angle constructions of device of Laser Processing Ceramics special-shaped slot provided by the embodiments of the present application
Figure;
Fig. 3 shows the device third viewing angle constructions signal of Laser Processing Ceramics special-shaped slot provided by the embodiments of the present application
Figure;
Fig. 4 shows galvanometer lens group schematic diagram provided by the embodiments of the present application;
Fig. 5 shows telecontrol equipment structural schematic diagram provided by the embodiments of the present application;
Fig. 6 shows the method flow schematic diagram of Laser Processing Ceramics special-shaped slot provided by the embodiments of the present application;
Fig. 7 shows the another embodiment stream of the method for Laser Processing Ceramics special-shaped slot provided by the embodiments of the present application
Journey schematic diagram.
Icon: the device of 101- Laser Processing Ceramics special-shaped slot;100- control device;200- laser aid;210- laser
Device;220- galvanometer lens group;221- galvanometer;222- lens;230- reflecting mirror;240- beam expanding lens;300- positioning device;400- is waited for
Processed sample;500- telecontrol equipment;510- rolling clamp;520- rotating electric machine;530- three-dimensional platform;540- supporting frame;
600- blowning installation;700- takes out dirt device.
Specific embodiment
Below in conjunction with the attached drawing in the present invention, technical solution of the present invention is clearly and completely described, it is clear that
Described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the implementation in the present invention
Example, those of ordinary skill in the art's all other embodiment obtained under the conditions of not making creative work belong to
The scope of protection of the invention.
Unless otherwise defined, all technologies used herein and scientific words and the skill for belonging to technical field of the invention
The normally understood meaning of art personnel is identical, and it is specific that term as used herein in the specification of the present invention is intended merely to description
Embodiment purpose, it is not intended that in limitation the present invention.
First embodiment
Referring to Figure 1, Fig. 1 shows the first visual angle of device of Laser Processing Ceramics special-shaped slot provided by the embodiments of the present application
Structural schematic diagram.This application provides a kind of device 101 of Laser Processing Ceramics special-shaped slot, the dresses of Laser Processing Ceramics special-shaped slot
Setting 101 includes: control device 100, laser aid 200 and telecontrol equipment 500;Control device 100 respectively with laser aid 200 and
Telecontrol equipment 500 is electrically connected, and telecontrol equipment 500 is set at the laser irradiation of the transmitting of laser aid 200.
Control device 100 is for simultaneously or separately sending a control signal to laser aid 200 and telecontrol equipment 500.It is described
Controlling signal includes the laser control signal for being sent to laser aid 200 and the motion control signal for being sent to telecontrol equipment 500.
Laser aid 200 is used for the laser control signal that receiving control device 100 is sent, and is controlled according to laser control signal
The switch light of laser processed, and control the laser direction of motion in process.The laser control signal includes transmitting laser
Duration and the laser level direction of motion.
Telecontrol equipment 500 is used for the motion control signal that receiving control device 100 is sent, and the telecontrol equipment is for receiving
The motion control signal that the control device is sent, so that the sample to be processed 400 is moved to position to be processed, and according to finger
Provisioning request is in time rotated, and entire laser processing procedure is completed.The motion control signal include it is mobile and/or rotate to
Processed sample.
The telecontrol equipment 500 includes rolling clamp 510 and three-dimensional platform 530, is fixed with branch on the three-dimensional platform 530
Support body 540, several rolling clamps 510 are mounted on the upper surface of support frame as described above body 540, the rolling clamp 510
Bottom connect rotating electric machine 520, the top of the rolling clamp 510 is fixedly connected with sample to be processed;The rotating electric machine 520
It is electrically connected with the control device 100, for receiving the motion control signal of the transmission of control device 100 and according to described
Motion control signal rotates the rolling clamp 510, turns to the sample to be processed clamped on the rolling clamp 510 to be added
Station is set;The three-dimensional platform 530 is electrically connected with the control device 100, for receiving the transmission of control device 100
Motion control signal simultaneously moves the three-dimensional platform 530 according to the motion control signal, makes on the three-dimensional platform 530 by institute
The sample to be processed for stating the clamping of rolling clamp 510 is moved to position to be processed.It the use of telecontrol equipment 500 include three-dimensional platform 530,
The horizontally or vertically direction of motion that processed sample can be treated carries out more accurate control, to effectively improve to be added
The machining accuracy of work sample.
Wherein, it should be noted that, according to different taper demands, is arrived thoroughly by the way that sample center 400 to be processed is calculated
222 focal plane of mirror processes the distance at breadth center, and the distance decides the taper of special-shaped slot, and the taper to meet different is wanted
Ask, 510 position of the rolling clamp distance that can remain unchanged freely is set in the processing breadth of lens 222, in addition to improve plus
Work efficiency rate can place multiple rolling clamps 510 (being not limited to 4 shown in fig. 5) on the circle using the distance as radius, rotation
Fixture 510 is driven by rotating electric machine 520, and rotation angle every time can be set according to specific requirement;Made using rolling clamp 510
The article to be processed 400 of more Multiple Shape can be processed by obtaining, to effectively improve the processing for treating processed sample 400
Precision.
Fig. 2 is referred to, Fig. 2 shows the second visual angles of device of Laser Processing Ceramics special-shaped slot provided by the embodiments of the present application
Structural schematic diagram.Optionally, in the embodiment of the present application, the device 101 of Laser Processing Ceramics special-shaped slot further includes positioning device
300;Positioning device 300 is used to shoot the physical location of sample 400 to be processed, and obtains coordinate position after physical location is handled
Co-ordinate position information is sent to control device 100 by information.
Wherein, it should be noted that, positioning device 300 can be with control device 100 be wirelessly connected, be also possible to
100 wired connection of control device, specific connection type here should not be construed as the limitation to the application.Pass through control device
100 and positioning device 300 be used cooperatively so that for the processing of sample 400 to be processed more accurate, to greatly be promoted
The machining accuracy of sample 400 to be processed.
Fig. 3 is referred to, Fig. 3 shows the device third visual angle of Laser Processing Ceramics special-shaped slot provided by the embodiments of the present application
Structural schematic diagram.Optionally, in the embodiment of the present application, laser aid 200 includes: laser 210,220 and of galvanometer lens group
Reflecting mirror 230;Laser 210 and galvanometer lens group 220 and control device 100 are electrically connected, galvanometer lens group 220 and reflecting mirror
230 are set in turn on laser aid 200 to the laser optical path of telecontrol equipment 500 along optical path direction of advance.
Laser 210 is used for the laser control signal that receiving control device 100 is sent, and will be swashed according to laser control signal
Light emitting is to reflecting mirror 230.The laser that reflecting mirror 230 is used to emit in laser 210 carries out 90 ° of reflections, so that laser beam hangs down
Directly process sample 400 to be processed.Reflecting mirror 230 is used more easily to use the camera lens in positioning device 300 to be added
Position in the process of work sample is shot, to effectively improve the machining accuracy for treating processed sample.
Wherein, it should be noted that, galvanometer lens group 220 includes galvanometer 221 and lens 222, refers to Fig. 4;Galvanometer 221
It is electrically connected with control device 100, for changing the direction of motion of laser beam in process, the laser beam passes through galvanometer
90 ° of turnovers can occur after 221 in the horizontal direction, lens 222 are fixedly connected with galvanometer 221, by the laser beam after turnover saturating
A point is focused on 222 focal plane of mirror.Use galvanometer 221 make control device for laser horizontal movement more accurately
Control, to effectively improve the machining accuracy for treating processed sample.
Fig. 3 is referred to, optionally, in the embodiment of the present application, laser aid 200 further includes beam expanding lens 240;Beam expanding lens
240 side is provided with galvanometer lens group 220, and beam expanding lens 240 is provided with laser 210 far from the side of galvanometer lens group 220,
Laser 210, beam expanding lens 240, galvanometer 221, lens 222 and reflecting mirror 230 center line on laser optical path;Beam expanding lens
240 for reducing the angle of departure of laser.Reduce the angle of divergence of laser using beam expanding lens 240, reduces focal beam spot diameter, thus
Effectively improve the machining accuracy for treating processed sample.
Fig. 3 is referred to, optionally, in the embodiment of the present application, the device 101 of Laser Processing Ceramics special-shaped slot further include:
Blowning installation 500 and pumping dirt device 600;Blowning installation 500 is set to the side of sample 700 to be processed, takes out dirt device 600 and is arranged
In side of the sample 700 far from blowning installation 500 to be processed, blowning installation 500 is flexibly connected with three-dimensional platform 320.By blowing
Device of air 600 is used cooperatively with pumping dirt device 700, so that dust or dust of the sample to be processed when being processed are reduced very
It is more, to effectively improve processing environment.
Implement in order to make it easy to understand, the another of the device of Laser Processing Ceramics special-shaped slot provided by the present application is described below
Mode, the another embodiment of the device of Laser Processing Ceramics special-shaped slot provided by the present application are described as follows:
The another embodiment of the device of Laser Processing Ceramics special-shaped slot provided by the present application, a kind of laser processing conelet
The device of ceramic special-shaped slot is spent, the device being related to includes laser, beam expanding lens, galvanometer, lens, 45 ° of reflecting mirrors, clamping ceramics
Rolling clamp, air blowing and dust-extraction unit, motion platform system positioning system and computer control system.
The another embodiment of the device of Laser Processing Ceramics special-shaped slot provided by the present application, a kind of laser processing conelet
The device of ceramic special-shaped slot is spent, the working principle of whole device is as follows:
Sample to be processed is placed on to the marginal position of lens processing breadth, laser emits laser beam, passes through along optical path
Beam expanding lens, to reduce the angle of divergence of laser beam, laser beam enters galvanometer and lens later, by 45 ° of certain angles of mirror deflection
It spends in the ceramic inner walls being radiated on rolling clamp, to guarantee to process groove, positioning system in ceramic inner walls designated position
The specific location for shooting ring-shaped pottery inner wall is converted to specific coordinate information feedback into the control system of computer, the system
Control laser beam is positioned map file is processed to designated position according to this coordinate information, specified until completing in order to successively process
Special-shaped groove shape persistently blows protection gas in process and take out dirt to guarantee special-shaped rooved face without Ceramic Dust.
The laser wavelength range for completing ceramic inner walls processing is 532~1064nm, including green light, infrared is swashed
Light device, the pulse duration range of the laser are < 10ps.
It include three-dimensional platform in the kinetic control system, for placing rolling clamp and in the horizontal or vertical directions
Mobile sample to be processed;The rolling clamp is connect with rotating electric machine, for rotating rolling clamp with specified angle, into
And sample to be processed clamped by rolling clamp is driven to turn to position to be processed.The device of the Laser Processing Ceramics special-shaped slot
It is equipped with and takes out dirt device, in order to remove the Ceramic Dust generated in laser processing procedure.
Second embodiment
Fig. 6 is referred to, Fig. 6 shows the method flow signal of Laser Processing Ceramics special-shaped slot provided by the embodiments of the present application
Figure.Present invention also provides a kind of method of Laser Processing Ceramics special-shaped slot, the laser processing includes:
Step S11: according to taper value needed for sample to be processed, the distance that rolling clamp deviates lens centre position is calculated;
Step S12: control device control rolling clamp is moved to designated position;
Step S13: control device draws the processing figure layer of the sample to be processed, institute according to the data of sample to be processed
State the depth that data include the sample special-shaped slot to be processed, taper size and rotation angle.
Step S14: every layer pre-stored according to the depth of the sample special-shaped slot to be processed and the control device
Working depth calculates the figure layer number of plies.
Step S15: the process data is converted into control signal and is sent to laser aid.
Step S16: it according to the figure layer number of plies and the rotation angle, calculates needed for completing the sample processing to be processed
Pass and motion track.
Step S17: the processing pass and the motion track are converted into telecontrol equipment rotation or rotate sample to be processed
The control signal of product, completes the processing of entire sample.
For ease of understanding, the another embodiment of laser processing provided by the present application is described below, the application mentions
The another embodiment of the laser processing of confession is described as follows:
Fig. 7 is referred to, Fig. 7 shows the another kind of the method for Laser Processing Ceramics special-shaped slot provided by the embodiments of the present application
Embodiment flow diagram.The another embodiment of the method for Laser Processing Ceramics special-shaped slot provided by the present application, it is a kind of
The processing method for laser machining Small Taper ceramics special-shaped slot, the process steps are as follows:
Step S21: according to the depth and taper of required groove on ring-shaped pottery sample to be processed, by computer
It controls needed for software is established and processes figure layer.
Step S22: according to the required depth D of groove to be processed and every layer of depth d processed, the layer of figure layer needed for calculating
Number.
Step S23: opening the laser in processing unit (plant), parameter needed for being arranged.
Step S24: ring-shaped pottery sample to be processed is attached on rolling clamp, using kinetic control system be moved to
Working position, it is ensured that laser beam foucing is on the surface of ring-shaped pottery sample when processing.
Step S25: CCD positioning system in processing unit (plant) is opened, the positioning of the central point of sample is completed.
Step S26: opening and take out dirt device and blowning installation, according to positioning coordinate, scans institute from ceramics sample surface layer-by-layer
Figure layer track is needed, completes the processing of a special-shaped slot, then rolling clamp is turned an angle, to complete adding for whole circle sample
Work.
The range of the ring-shaped pottery abnormity groove depth D is 50~200um, the range of the depth d of every layer of processing is 10~
20um.In addition, the parameter of each figure layer is not quite identical, can finely tune according to different requirements by the way of multi-layer image etching
Parameter is to reach the special-shaped slot of different depth, different taper.
The application provides a kind of device and method of Laser Processing Ceramics special-shaped slot, the device of Laser Processing Ceramics special-shaped slot
It include: control device, laser aid and telecontrol equipment;The control device respectively with the laser aid and the telecontrol equipment
It is electrically connected, the telecontrol equipment is set at the laser irradiation of the laser aid transmitting.It is sent and is controlled by control device
Signal sends control signal to control laser aid transmitting laser and its horizontal movement direction, then by control device to control
Telecontrol equipment is effectively processed in a manner of rotating sample to be processed or is mobile by laser, so as under common configuration
It is effectively reduced the taper value of sample to be processed.It can efficiently solve in the prior art in processing ceramic in this way
The larger problem of the processing taper of wall special-shaped slot.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (9)
1. a kind of device of Laser Processing Ceramics special-shaped slot, including control device, laser aid and telecontrol equipment, the control dress
It sets and is electrically connected respectively with the laser aid and the telecontrol equipment, the telecontrol equipment is set to the laser aid transmitting
Laser irradiation at, the telecontrol equipment includes rolling clamp and three-dimensional platform, which is characterized in that fixed on the three-dimensional platform
There is supporting frame, several rolling clamps are mounted on the upper surface of support frame as described above body, and the bottom of the rolling clamp connects
Rotating electric machine is connect, sample to be processed is fixedly connected at the top of the rolling clamp;The rotating electric machine and control device electricity
Property connection, for receiving motion control signal that the control device is sent and rotating the rotation according to the motion control signal
Turn fixture, the sample to be processed clamped on the rolling clamp is made to turn to position to be processed;The three-dimensional platform and the control
Device processed is electrically connected, for receiving the motion control signal of the control device transmission and being moved according to the motion control signal
The three-dimensional platform is moved, makes to be moved to station to be added by the sample to be processed that the rolling clamp clamps on the three-dimensional platform
It sets.
2. the device of Laser Processing Ceramics special-shaped slot according to claim 1, which is characterized in that the rolling clamp is 4
It is a.
3. the device of Laser Processing Ceramics special-shaped slot according to claim 1, which is characterized in that the control device is sent
Laser control signal is to the laser aid;The laser aid is used to receive the laser controlling that the control device is sent
Signal, the switch light of laser is controlled according to the laser control signal, and controls the movement side of laser in process
To.
4. the device of Laser Processing Ceramics special-shaped slot according to claim 1, which is characterized in that the laser aid packet
It includes: lasers and mirrors;The laser and the control device are electrically connected, and the reflecting mirror is set to the laser dress
On the laser optical path for setting the telecontrol equipment;The laser is used to receive the laser controlling that the control device is sent
Signal, and according to the laser control signal by Laser emission to the reflecting mirror;The reflecting mirror is used for the laser
The laser reflection of transmitting, the laser is for processing the sample to be processed.
5. the device of Laser Processing Ceramics special-shaped slot according to claim 4, which is characterized in that the laser aid also wraps
Include galvanometer and lens;The galvanometer and the control device are electrically connected, and the lens are fixedly connected with the galvanometer, described
The side of mirror is provided with the galvanometer, and the lens are provided with reflecting mirror far from the side of the galvanometer, and the galvanometer is far from institute
The side for stating lens is provided with the laser;The galvanometer is used to receive the laser control signal that the control device is sent,
And the laser level direction of motion is changed according to the laser control signal, the lens are used to the laser being focused to one
Point.
6. the device of Laser Processing Ceramics special-shaped slot according to claim 5, which is characterized in that the laser aid also wraps
Include beam expanding lens;The side of the beam expanding lens is provided with the galvanometer, and side setting of the beam expanding lens far from the galvanometer is
State laser, the laser, the beam expanding lens, the galvanometer, the lens and the reflecting mirror center line in laser
In optical path;The beam expanding lens is used to reduce the angle of departure of the laser.
7. the device of Laser Processing Ceramics special-shaped slot according to claim 1, which is characterized in that the Laser Processing Ceramics
The device of special-shaped slot further includes positioning device;The positioning device is used to shoot the physical location of sample to be processed, and will be described
Co-ordinate position information is obtained after physical location processing, the co-ordinate position information is sent to the control device.
8. the device of Laser Processing Ceramics special-shaped slot according to claim 1, which is characterized in that the Laser Processing Ceramics
The device of special-shaped slot further include: blowning installation and pumping dirt device;The blowning installation is set to the side of the sample to be processed,
The pumping dirt device is set to the side of the sample to be processed far from the blowning installation, the blowning installation and the three-dimensional
Platform activity connection.
9. a kind of method of Laser Processing Ceramics special-shaped slot is realized using device such as described in any item of the claim 1 to 8,
It is characterized in that, which comprises
S1 calculates the distance that rolling clamp deviates lens centre position according to taper value needed for sample to be processed;
S2, control device control rolling clamp are moved to designated position;
S3, the data for the sample to be processed that control device is sent according to positioning device calculate the manuscript of the sample to be processed
Layer, the data include the depth, taper size of special-shaped slot and rotation angle in the sample to be processed;
S4 is deep according to the depth of special-shaped slot in the sample to be processed and the pre-stored every layer of processing of the control device
Degree calculates the figure layer number of plies;
The working depth is converted to laser control signal and is sent to laser aid by S5, and the laser control signal includes hair
Penetrate laser duration and the laser level direction of motion;
S6, according to the figure layer number of plies and the rotation angle, calculate rotational angle needed for completing the sample to be processed and
Motion track;
The rotational angle and the motion track are converted to motion control signal and are sent to telecontrol equipment, the movement by S7
Controlling signal includes rotation and/or mobile sample to be processed, and the telecontrol equipment is complete by rotation and/or mobile sample to be added
At the processing of entire sample.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910489824.2A CN110181172A (en) | 2019-06-06 | 2019-06-06 | A kind of device and method of Laser Processing Ceramics special-shaped slot |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910489824.2A CN110181172A (en) | 2019-06-06 | 2019-06-06 | A kind of device and method of Laser Processing Ceramics special-shaped slot |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110181172A true CN110181172A (en) | 2019-08-30 |
Family
ID=67720662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910489824.2A Pending CN110181172A (en) | 2019-06-06 | 2019-06-06 | A kind of device and method of Laser Processing Ceramics special-shaped slot |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110181172A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110977205A (en) * | 2019-12-20 | 2020-04-10 | 武汉华工激光工程有限责任公司 | Blind hole machining rotary cutting system and blind hole machining method |
CN114939733A (en) * | 2022-04-24 | 2022-08-26 | 武汉华工激光工程有限责任公司 | Laser processing method and device for improving quality of through hole of green ceramic chip |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19745280A1 (en) * | 1997-10-15 | 1999-04-22 | Daimler Chrysler Ag | Method for fine or micro-machining of workpieces using laser beams |
JP2014091168A (en) * | 2012-10-31 | 2014-05-19 | Mitsubishi Materials Corp | End mill and manufacturing method for the same |
CA2917563A1 (en) * | 2015-01-19 | 2016-07-19 | General Electric Company | Laser machining systems and methods |
CN106077947A (en) * | 2016-07-05 | 2016-11-09 | 温州大学 | A kind of constant speed elliptical orbit laser precision machining method of oblique cone round platform |
CN107024837A (en) * | 2017-05-19 | 2017-08-08 | 深圳市斯普莱特激光科技有限公司 | A kind of high-precision three-dimensional laser explosure curing process |
CN108890138A (en) * | 2018-07-17 | 2018-11-27 | 西安交通大学 | A kind of ultrafast laser polishing processing method for ceramic matric composite |
CN109014569A (en) * | 2018-09-04 | 2018-12-18 | 武汉华工激光工程有限责任公司 | A kind of laser processing device and method |
CN109434288A (en) * | 2018-12-04 | 2019-03-08 | 上海交通大学 | Ultrafast laser taper hole perforating device and drilling technology |
CN210451382U (en) * | 2019-06-06 | 2020-05-05 | 武汉华工激光工程有限责任公司 | Device for laser processing ceramic special-shaped groove |
-
2019
- 2019-06-06 CN CN201910489824.2A patent/CN110181172A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19745280A1 (en) * | 1997-10-15 | 1999-04-22 | Daimler Chrysler Ag | Method for fine or micro-machining of workpieces using laser beams |
JP2014091168A (en) * | 2012-10-31 | 2014-05-19 | Mitsubishi Materials Corp | End mill and manufacturing method for the same |
CA2917563A1 (en) * | 2015-01-19 | 2016-07-19 | General Electric Company | Laser machining systems and methods |
CN106077947A (en) * | 2016-07-05 | 2016-11-09 | 温州大学 | A kind of constant speed elliptical orbit laser precision machining method of oblique cone round platform |
CN107024837A (en) * | 2017-05-19 | 2017-08-08 | 深圳市斯普莱特激光科技有限公司 | A kind of high-precision three-dimensional laser explosure curing process |
CN108890138A (en) * | 2018-07-17 | 2018-11-27 | 西安交通大学 | A kind of ultrafast laser polishing processing method for ceramic matric composite |
CN109014569A (en) * | 2018-09-04 | 2018-12-18 | 武汉华工激光工程有限责任公司 | A kind of laser processing device and method |
CN109434288A (en) * | 2018-12-04 | 2019-03-08 | 上海交通大学 | Ultrafast laser taper hole perforating device and drilling technology |
CN210451382U (en) * | 2019-06-06 | 2020-05-05 | 武汉华工激光工程有限责任公司 | Device for laser processing ceramic special-shaped groove |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110977205A (en) * | 2019-12-20 | 2020-04-10 | 武汉华工激光工程有限责任公司 | Blind hole machining rotary cutting system and blind hole machining method |
CN110977205B (en) * | 2019-12-20 | 2022-03-15 | 武汉华工激光工程有限责任公司 | Blind hole machining rotary cutting system and blind hole machining method |
CN114939733A (en) * | 2022-04-24 | 2022-08-26 | 武汉华工激光工程有限责任公司 | Laser processing method and device for improving quality of through hole of green ceramic chip |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108555464B (en) | Large complex curved surface dynamic focusing laser processing method and system | |
CN104190927B (en) | A kind of synchronous powder feeding system space laser processing and three-dimensional method and device | |
US10751936B2 (en) | Laser operating machine for additive manufacturing by laser sintering and corresponding method | |
JP2019162669A (en) | Laser processing systems capable of dithering | |
CN110181172A (en) | A kind of device and method of Laser Processing Ceramics special-shaped slot | |
CN105081586A (en) | Laser processing method and device | |
CN105163897A (en) | Coordination of beam angle and workpiece movement for taper control | |
JP2002301585A (en) | System and method for remote laser welding | |
US10357848B2 (en) | Laser machining systems and methods | |
KR101607226B1 (en) | system and method for cutting using laser | |
CN111496396A (en) | Picosecond laser drilling device and method for ceramic substrate | |
CN113579517A (en) | Four-galvanometer group hole machining method | |
CN201693290U (en) | Laser processing device | |
CN112264722A (en) | Laser micropore machining equipment and machining method suitable for thin-wall parts | |
CN109014569A (en) | A kind of laser processing device and method | |
EP0585463A1 (en) | Method of adjusting optical axis for laser robot | |
CN210451382U (en) | Device for laser processing ceramic special-shaped groove | |
CN103436882B (en) | The making method of wiring board laser filling perforation machine and wiring board | |
CN215393264U (en) | Five-axis four-linkage punching device | |
CN208743917U (en) | A kind of laser processing device | |
EP1671739B1 (en) | Laser beam machine | |
JP2024502156A (en) | Method and device for compensating ultrashort pulse laser rotation direction error, and machine tool | |
TW201630679A (en) | A laser machining method | |
CN113579518A (en) | Six-galvanometer group hole machining device and machining method | |
CN112775543A (en) | Polygon scanning galvanometer device for ultrahigh-speed laser processing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |