CN110172611B - 一种纳米石墨-纳米MoS2复合Cu基滑动电接触材料 - Google Patents
一种纳米石墨-纳米MoS2复合Cu基滑动电接触材料 Download PDFInfo
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- 239000000843 powder Substances 0.000 claims abstract description 38
- 229910052961 molybdenite Inorganic materials 0.000 claims abstract description 29
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims abstract description 29
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000002131 composite material Substances 0.000 claims abstract description 20
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 17
- 239000010439 graphite Substances 0.000 claims abstract description 17
- 239000002245 particle Substances 0.000 claims abstract description 16
- 239000000203 mixture Substances 0.000 claims abstract description 13
- 239000002994 raw material Substances 0.000 claims abstract description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 10
- 239000010453 quartz Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 238000007731 hot pressing Methods 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 5
- 238000000498 ball milling Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 5
- 239000011812 mixed powder Substances 0.000 claims description 5
- 239000012046 mixed solvent Substances 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 5
- 238000001291 vacuum drying Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000005303 weighing Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 2
- 238000005299 abrasion Methods 0.000 abstract description 3
- 230000001050 lubricating effect Effects 0.000 abstract description 2
- 238000010298 pulverizing process Methods 0.000 abstract description 2
- 239000010949 copper Substances 0.000 description 35
- 238000000034 method Methods 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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Abstract
本发明涉及Cu基滑动电接触材料技术领域,且公开了一种纳米石墨‑纳米MoS2复合Cu基滑动电接触材料,包括以下重量份数配比的原料:60~80份的球形微米Cu粉、5~10份平均粒径≤400nm的球形纳米石墨粉、5~10份的球形纳米MoS2粉。本发明解决了现有铜‑石墨‑MoS2滑动电接触材料,由于润滑组分中,MoS2的电阻率高、导电性能差,石墨在真空环境中摩擦磨损严重,导致其在性能上难以满足使用要求的技术问题。
Description
技术领域
本发明涉及Cu基滑动电接触材料技术领域,具体为一种纳米石墨-纳米 MoS2复合Cu基滑动电接触材料。
背景技术
铜基自润滑复合材料是金属基自润滑复合材料的重要组成部分,其中,铜-石墨-MoS2是典型的滑动电接触材料,广泛用于电机的固定部件和旋转部件 (换向器或集电环)之间传导电流。对于滑动电接触材料,要求其具有低接触电阻,以减少电功率损耗;同时又希望其具有低的摩擦磨损。铜-石墨-MoS2主要依靠Cu改善材料的导电导热能力,依靠石墨和MoS2的减摩和自润滑来改善材料的摩擦学特性。
但是铜-石墨-MoS2存在如下问题:MoS2的电阻率高,导电性能差;石墨虽然导电性能好,但在真空环境中摩擦磨损严重。随各类电机仪表朝小型化、大电流、高速度方向发展,要求电接触材料的允许线速度大、接触电压低、摩擦系数小、磨损率低、载流能力大,而铜-石墨-MoS2电接触材料在性能上难以满足这些要求。
发明内容
(一)解决的技术问题
针对现有技术的不足,本发明提供了一种纳米石墨-纳米MoS2复合Cu基滑动电接触材料,解决了现有铜-石墨-MoS2滑动电接触材料,由于润滑组分中, MoS2的电阻率高、导电性能差,石墨在真空环境中摩擦磨损严重,导致其在性能上难以满足使用要求的技术问题。
(二)技术方案
为实现上述目的,本发明提供如下技术方案:
一种纳米石墨-纳米MoS2复合Cu基滑动电接触材料,包括以下重量份数配比的原料:60~80份的球形微米Cu粉、5~10份平均粒径≤400nm的球形纳米石墨粉、5~10份的球形纳米MoS2粉。
优选的,所述球形微米Cu粉的平均粒径为74um。
优选的,所述球形纳米石墨粉的平均粒径≤400nm,所述球形纳米MoS2粉的平均粒径≤400nm。
优选的,所述Cu基滑动电接触材料的制备方法包括以下步骤:
(1)称取60~80份的球形微米Cu粉、5~10份的球形纳米石墨粉、5~ 10份的球形纳米MoS2粉置于100mL由去离子水和无水乙醇等体积组成的混合溶剂中,先超声分散1~3h,再置于高速混合器中,在转速800~1000rpm下搅拌1~3h;
(2)之后,转移到置于球磨机中,按照球料比1:11将不锈钢球放入球磨机中,在氮气保护下进行球磨12~15h,转速为200~300rpm,将球磨好的材料取出,放在石英舟中,在100~105℃的真空干燥箱中烘干,得到均匀负载在球形微米Cu表面的纳米石墨-纳米MoS2混合粉料;
(3)将上述制备的均匀负载在球形微米Cu表面的纳米石墨-纳米MoS2混合粉料放入到直径为50mm的石墨模具中,模具内部涂有氮化硼防渗层,氩气保护,在压力40~50MPa、温度700~750℃热压烧结2~5h,制备得到纳米石墨-纳米MoS2复合Cu基滑动电接触材料。
(三)有益的技术效果
与现有技术相比,本发明具备以下有益的技术效果:
本发明先将平均粒径≤400nm的球形纳米石墨粉、平均粒径≤400nm的球形纳米MoS2粉,均匀地负载在平均粒径为74um的球形微米Cu粉的表面上,再经过热压烧结处理,制备得到纳米石墨-纳米MoS2复合Cu基滑动电接触材料,且制备出的纳米石墨-纳米MoS2复合Cu基滑动电接触材料的电阻率为2.4 ×10-5Ω·cm-1~2.6×10-5Ω·cm-1、摩擦系数为0.17~0.21,从而解决了MoS2的电阻率高、导电性能差,石墨在真空环境中摩擦磨损严重,导致其在性能上难以满足使用要求的技术问题。
具体实施方式
以下实施例中使用的原料如下:
上海三联粉末冶金厂生产的663Cu粉(呈青色球形粉末,其中Sn6%、Zn6%、Pb4%、Cu余量,平均粒径为74um);
平均粒径≤400nm的球形纳米石墨粉,纯度99.9%,麦克林试剂;
平均粒径≤400nm的球形纳米MoS2粉,纯度99.9%,广州宏武材料科技有限公司。
实施例一:
(1)称取60g平均粒径为74um的球形微米Cu粉、5g平均粒径≤400nm 的球形纳米石墨粉、5g平均粒径≤400nm的球形纳米MoS2粉置于100mL由去离子水和无水乙醇等体积组成的混合溶剂中,先超声分散1h,再置于高速混合器中,在转速800rpm下搅拌1h;
(2)之后,转移到置于球磨机中,按照球料比1:11将不锈钢球放入球磨机中,在氮气保护下进行球磨12h,转速为200rpm,将球磨好的材料取出,放在石英舟中,在100℃的真空干燥箱中烘干,得到均匀负载在球形微米Cu 表面的纳米石墨-纳米MoS2混合粉料;
(3)将上述制备的均匀负载在球形微米Cu表面的纳米石墨-纳米MoS2混合粉料放入到直径为50mm的石墨模具中,模具内部涂有氮化硼防渗层,氩气保护,在压力40MPa、温度700℃热压烧结2h,制备得到纳米石墨-纳米MoS2复合Cu基滑动电接触材料;
(4)对上述制备的纳米石墨-纳米MoS2复合Cu基滑动电接触材料进行性能测试,其电阻率为2.6×10-5Ω·cm-1、摩擦系数为0.21。
实施例二:
(1)称取80g平均粒径为74um的球形微米Cu粉、10g平均粒径≤400nm 的球形纳米石墨粉、10g平均粒径≤400nm的球形纳米MoS2粉置于100mL由去离子水和无水乙醇等体积组成的混合溶剂中,先超声分散3h,再置于高速混合器中,在转速1000rpm下搅拌3h;
(2)之后,转移到置于球磨机中,按照球料比1:11将不锈钢球放入球磨机中,在氮气保护下进行球磨15h,转速为300rpm,将球磨好的材料取出,放在石英舟中,在105℃的真空干燥箱中烘干,得到均匀负载在球形微米Cu 表面的纳米石墨-纳米MoS2混合粉料;
(3)将上述制备的均匀负载在球形微米Cu表面的纳米石墨-纳米MoS2混合粉料放入到直径为50mm的石墨模具中,模具内部涂有氮化硼防渗层,氩气保护,在压力50MPa、温度750℃热压烧结5h,制备得到纳米石墨-纳米MoS2复合Cu基滑动电接触材料;
(4)对上述制备的纳米石墨-纳米MoS2复合Cu基滑动电接触材料进行性能测试,其电阻率为2.4×10-5Ω·cm-1、摩擦系数为0.19。
实施例三:
(1)称取70g平均粒径为74um的球形微米Cu粉、8g平均粒径≤400nm 的球形纳米石墨粉、8g平均粒径≤400nm的球形纳米MoS2粉置于100mL由去离子水和无水乙醇等体积组成的混合溶剂中,先超声分散2h,再置于高速混合器中,在转速900rpm下搅拌2h;
(2)之后,转移到置于球磨机中,按照球料比1:11将不锈钢球放入球磨机中,在氮气保护下进行球磨13h,转速为280rpm,将球磨好的材料取出,放在石英舟中,在105℃的真空干燥箱中烘干,得到均匀负载在球形微米Cu 表面的纳米石墨-纳米MoS2混合粉料;
(3)将上述制备的均匀负载在球形微米Cu表面的纳米石墨-纳米MoS2混合粉料放入到直径为50mm的石墨模具中,模具内部涂有氮化硼防渗层,氩气保护,在压力45MPa、温度700℃热压烧结4h,制备得到纳米石墨-纳米MoS2复合Cu基滑动电接触材料;
(4)对上述制备的纳米石墨-纳米MoS2复合Cu基滑动电接触材料进行性能测试,其电阻率为2.4×10-5Ω·cm-1、摩擦系数为0.17。
Claims (1)
1.一种纳米石墨-纳米MoS2复合Cu基滑动电接触材料,其特征在于,包括以下重量份数配比的原料:60~80份的球形微米Cu粉、5~10份平均粒径≤400nm的球形纳米石墨粉、5~10份的球形纳米MoS2粉,所述球形微米Cu粉的平均粒径为74um,所述球形纳米MoS2粉的平均粒径≤400nm;所述Cu基滑动电接触材料的制备方法包括以下步骤:(1)称取60~80份的球形微米Cu粉、5~10份的球形纳米石墨粉、5~10份的球形纳米MoS2粉置于100mL由去离子水和无水乙醇等体积组成的混合溶剂中,先超声分散1~3h,再置于高速混合器中,在转速800~1000rpm下搅拌1~3h;
(2)之后,转移到置于球磨机中,按照球料比1:11将不锈钢球放入球磨机中,在氮气保护下进行球磨12~15h,转速为200~300rpm,将球磨好的材料取出,放在石英舟中,在100~105℃的真空干燥箱中烘干,得到均匀负载在球形微米Cu表面的纳米石墨-纳米MoS2混合粉料;
(3)将上述制备的均匀负载在球形微米Cu表面的纳米石墨-纳米MoS2混合粉料放入到直径为50mm的石墨模具中,模具内部涂有氮化硼防渗层,氩气保护,在压力40~50MPa、温度700~750℃热压烧结2~5h,制备得到纳米石墨-纳米MoS2复合Cu基滑动电接触材料。
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