CN110152942A - A kind of automatic double surface gluer and its glue spreading method - Google Patents
A kind of automatic double surface gluer and its glue spreading method Download PDFInfo
- Publication number
- CN110152942A CN110152942A CN201910491905.6A CN201910491905A CN110152942A CN 110152942 A CN110152942 A CN 110152942A CN 201910491905 A CN201910491905 A CN 201910491905A CN 110152942 A CN110152942 A CN 110152942A
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- Prior art keywords
- glue
- gluing
- negative pressure
- automatic double
- double surface
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
- B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
Abstract
The present invention relates to electronic product gluing technical field more particularly to a kind of automatic double surface gluers and its glue spreading method, comprising: defoaming device, for being stirred simultaneously deaeration to glue；Glue stations, for completing gluing movement to electronic component；And negative pressure device, it is used to form the vacuum cavity that gluing movement is completed for the glue stations.Goal of the invention of the invention is to provide a kind of automatic double surface gluer and its glue spreading method, it is solved using technical solution provided by the invention there are bondline thickness unevenness after traditional automatic double surface gluer gluing, generating in air bubble and glue in high component bottom there is technical issues that bubble causes gluing process glue occur.
Description
Technical field
The present invention relates to electronic product gluing technical field more particularly to a kind of automatic double surface gluers and its glue spreading method.
Background technique
For improve automobile electronics antidetonation, it is moisture-proof, dust-proof, in terms of performance, in circuit board element
Surface will increase highly viscous glue and be protected.
In the feeder process of glue, since high-viscosity glue water viscosity is larger, the frictional resistance of glue and holding vessel pipeline
It is different with the difference of glue storage, under the conditions of identical pressure and application rate, with the use of glue, holding vessel glue
The frictional resistance of the decline of amount, glue reduces, and under the conditions of homogeneous pressure and application rate, gel quantity is increasing, influences
The uniformity of glue；Secondly, high-viscosity glue will form packet in high component bottom during carrying out glue gluing under normal pressure
It wraps up in, form bubble space due to the thermal expansion of air, will puncture glue-line, causes the breakage of glue-line when glue is heating and curing,
Lose moisture-proof role；On the other hand, highly viscous glue needs to be stirred before use, since glue is in whipping process,
Bubble is easy to be sandwiched inside glue, the glue of the suitable low viscosity of the mode of conventionally employed vacuum defoamation while stirring, and nothing
Taking off inside highly viscous glue, the bubble being wrapped in glue compression power effect during gluing can be broken method suddenly
It splits, causes the splashing of glue, polluted product.
In addition, difficulty of doing over again is big there is also bad after glue curing, it be easy to cause scrapping for product；Too small bubble
The technical issues of in being wrapped in, appearance can not be detected, and the formation of air layer will affect product heat dissipation.
Summary of the invention
Goal of the invention of the invention is to provide a kind of automatic double surface gluer and its glue spreading method, using technology provided by the invention
Scheme solves after traditional automatic double surface gluer gluing that there are bondline thickness unevenness, generates air bubble and glue in high component bottom
There is technical issues that bubble causes gluing process glue occur in water.
In order to solve the above-mentioned technical problem, one aspect of the present invention provides a kind of automatic double surface gluer, comprising: defoaming device is used for
Simultaneously deaeration is stirred to glue；Glue stations, for completing gluing movement to electronic component；And negative pressure device, it is used for shape
At the vacuum cavity for completing gluing movement for the glue stations.
Preferably, the flow sensor of gel quantity feedback loop is formed including connecting with the glue stations.
It preferably, further include auxiliary detection components；The auxiliary detection components are included in setting at the glue stations
Product sensors in place and glue-line thickness measurement sensor and in the pressure sensor being arranged in the negative pressure device.
Preferably, the defoaming device is agitator.
Based on above-mentioned automatic double surface gluer, another aspect of the present invention also provides a kind of glue spreading method, comprising the following steps:
S100, glue is placed in the defoaming device and completes stirring and deaeration；
S200, it will be placed in gluing product in the negative pressure device, and start the negative pressure device, the negative pressure is enabled to fill
Set interior generation vacuum cavity；
S300, the glue stations treat gluing product according to default gluing path in the vacuum cavity and carry out gluing
Operation；
S400, the flow sensor detect plastic emitting flow value of glue stations during gluing；
S500, the glue stations are adjusted according to the plastic emitting flow value applies flow adhesive.
In step s 200, start the negative pressure device, enable and generate vacuum cavity in the negative pressure device；Preferably, institute
It states pressure sensor and obtains vacuum degree intracavitary in the negative pressure device in real time, the negative pressure device starting is until the vacuum degree
Reach setting value.
In step S300, the glue stations is treating the progress gluing operation of gluing product；Preferably, described in the completion
After the operation of the gluing of gluing product, the thickness of the glue-line thickness measurement sensor detection glue-line.
In step S400, the flow sensor detects plastic emitting flow value of glue stations during gluing；
Preferably, the flow sensor obtains the glue amount that gluing flows through the valve of the glue stations in the process, and the glue amount is institute
State plastic emitting flow value.
In step S500, the glue stations adjusts according to the plastic emitting flow value and applies flow adhesive；Preferably, the painting
Adhesive dispenser adjusts application rate or gluing pressure according to the plastic emitting flow value.
From the foregoing, it will be observed that using provided by the invention available following the utility model has the advantages that
One, glue-spread is monitored using flow sensor on hardware, control system is passed back to according to flow sensor
The signal come adjusts plastic emitting pressure and application rate in time, plays at the uniform velocity plastic emitting effect, phase by the algorithm of pressure and speed
Than in traditional automatic double surface gluer, automatic double surface gluer of the invention is controlled with more accurately plastic emitting, bondline thickness after guarantee gluing
Uniformly；
Two, using sealed negative-pressure mechanism, guarantee the operation under vacuum conditions of gluing process, high element foot bottom is without air bubble
Formation, will not cause glue-line rupture or bubble package influence heat dissipation；
Three, using the evacuation and centrifugal degassing device of rotation and revolution, guarantee that simultaneously deaeration is sufficiently stirred in glue before use, be transported to
The glue bubble-free of gluing valve, gluing process are not in that glue splashes.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, the present invention will be implemented below
Attached drawing needed in the description of example or the prior art is briefly described.It should be evident that the accompanying drawings in the following description
Only a part of the embodiments of the present invention, for those of ordinary skill in the art, in not making the creative labor property
Under the premise of, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is automatic double surface gluer of embodiment of the present invention system block diagram；
Fig. 2 is automatic double surface gluer of embodiment of the present invention operational flowchart；
Fig. 3 is automatic double surface gluer of embodiment of the present invention structural schematic diagram.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description.Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In traditional automatic double surface gluer, after gluing there are bondline thickness unevenness, high component bottom generate air bubble with
And there is technical issues that bubble causes gluing process glue occur in glue.
The present embodiment provides a kind of automatic double surface gluers to utilize on the present embodiment hardware to realize the uniformity of bondline thickness
Flow sensor is monitored the glue-spread of glue stations, the signal that control system is passed back according to flow sensor, leads to
The algorithm of excess pressure and speed adjusts plastic emitting pressure and application rate in time, at the uniform velocity plastic emitting effect is played, so that glue-line is thick
Degree is consistent；In order to avoid element foot bottom generates bubble, the present embodiment negative pressure device changes the gluing environment of glue stations
Become, guarantees the operation under vacuum conditions of gluing process, high formation of the element foot bottom without air bubble；In order to avoid there are gas for glue
The problem of bubble, the present embodiment use the evacuation and centrifugal degassing device of rotation and revolution, guarantee that simultaneously deaeration is sufficiently stirred in glue before use.
For this purpose, automatic double surface gluer provided in this embodiment, hardware includes the deaeration for being stirred simultaneously deaeration to glue
Device is used to form and completes the negative pressure device for the vacuum cavity that gluing acts for glue stations and for complete to electronic component
The glue stations acted at gluing.On this basis, it in order to realize that the course of work of automatic double surface gluer meets production requirement, refers to
Fig. 1-2, composition system include: signal input unit 10, control system 20 and hardware execution units 30.Wherein above-mentioned deaeration
Device 303, negative pressure device 302 and glue stations 304 then belong to hardware execution units 30, and hardware execution units 30 are also wrapped
Other component is included, is elaborated below to glue stations provided in this embodiment.
Signal input unit 10 includes flow sensor 101, glue amount sensor 102, pressure sensor 103, glue-line thickness measuring
Sensor 104, product sensors in place 105, touch screen 106 and operation button 107.
Wherein, flow sensor 101 obtain the glue amount for flowing through the valve of glue stations 304 during gluing, for control
System provides gel quantity input signal；
Glue amount sensor 102 monitors the minimum value of glue amount in feeding system, guarantees the minimum glue amount demand of product gluing；
Wherein feeding system is located on the station before defoaming device 303, for storing glue and providing glue for defoaming device 303；
It is intracorporal true to obtain 302 inner chamber of negative pressure device in 302 vacuum of negative pressure device for pressure sensor 103
Reciprocal of duty cycle provides vacuum degree input signal when vacuum degree reaches setting value for control system；
Product sensors in place 105, before glue stations 304 starts gluing movement, whether testing product is in place；
Glue-line thickness measurement sensor 104, glue stations 304 detect bondline thickness after the completion of gluing；
Touch screen 106, for transferring for program, simulation input/output signal；
Operation button 107 provides external operation.
Control system 20 includes data acquisition unit 201, control system host 202, control program 203, gluing control system
System 204, vacuum-control(led) system 206, robot control system 207, data uploading system 208 and is held deaeration control system 205
Row system 209.
Wherein, the collected external signal of signal input unit 10 is converted into control system 20 by data acquisition unit 201
Identifiable signal；
Control system host 202 handles input/output signal according to the operation program of setting, to whole service system into
Row control；
Control program 203, the processing method of the sequence control method of process, process exception；
Gluing control system 204 controls the unlatching of glue valve, the height of gluing, the speed of plastic emitting of glue stations 304；
Deaeration control system 205 controls glue of the defoaming device 303 after the revolving speed of de-aeration, the angle of deaeration, deaeration
Water output；
Vacuum-control(led) system 206 controls the disengaging of cavity, the sealing of chamber door, the unlatching of vacuum and the pass of negative pressure device 302
It closes；
Robot control system 207 controls the operation of robot；
Data uploading system 208, acquires the data of gluing, and uploads to database；
Execution system 209 is converted into the executable signal of hardware to the program instruction that control system host issues.
Hardware execution units 30 are also wrapped other than including above-mentioned negative pressure device 302, defoaming device 303 and glue stations 304
Include multi-axis robot 301, product tool fixing device 305 and signal lamp 307.
Wherein, the purposes of negative pressure device 302, defoaming device 303 and glue stations 304 is as described above, does not do herein tired
It states.
Multi-axis robot 301, for providing assembly movement to operating mechanism；
Product tool fixing device 305 prevents solidification process from not completing, artificially takes out product for fixing product；
Signal lamp 307, the instruction of process status.
Based on above-mentioned automatic double surface gluer, on the other hand the embodiment of the present invention also provides a kind of glue spreading method, the glue spreading method packet
Include the operating procedure of operator and the automatic operation step of automatic double surface gluer.
Wherein the operating procedure of operator includes: after system normally starts, operator glue be put into defoaming device into
Row stirring and deaeration；After the completion of deaeration, operator presses start button being put into product tool fixing device 305 to gluing product,
Equipment completes gluing movement according to the set procedure.
Refer to Fig. 2, the automatic operation step of automatic double surface gluer then the following steps are included:
S10, the power-on operations such as equipment power supply, gas source, equipment are opened；
Emergent stopping when S20, exception, starts emergency stop protection function, cuts off all dangerous input/output；
S30, equipment starting voluntarily diagnose, and carry out self-test to system, including whether just each operation button, packet switch living
Often, whether equipment is in mechanical origin；
S40, according to production product, scan product ID, transfer corresponding program；
S50, according to corresponding program, the setting origin for the operating position that robot is reset to, reduce the stroke of operation away from
From；
S60, the glue for being put into storage glue tank is stirred, and deaeration is carried out by centrifugal deaeration machine, be glue stations
Uniformly mixed, bubble-free glue is provided；
S70, stationary fixture will be placed on to gluing product, stationary fixture judges whether product is put into position；Glue feeder sleeve
After road detects glue in place, into operating status, standby indicating lamp is bright；
S80, start button is pressed, fixed fixture clamps product, and the lower chamber of negative pressure device runs to glue sites, epicoele
Body decline, chamber door are closed, and confined space is formed；
S90, the glue sites according to program setting detect current flow adhesive out, provide for control system before gluing
Data on flows；Vacuum plant is opened simultaneously, forms vacuum in closed chamber vivo environment；
S100, after vacuum reaches, glue stations in vacuum cavity according to default gluing path treat gluing product into
The operation of row gluing；
S110, according to the real-time traffic signal of flow sensor feed back, gluing control system adjust in real time application rate or
Gluing pressure；
After the completion of S120, gluing, thickness measurement sensor carries out reconnaissance measurement to the glue-line of gluing thickness, to judge that glue thickness is
It is no to meet the requirements；The glue of storage sebific duct is detected simultaneously, to determine whether to meet next product glue-spread；
After the completion of S130, gluing, the key parameter of gluing process is collected, and upload to MES system；
S140, cavity pressure release, are returned to normal pressure；Upper cavity up return, lower chamber, which returns to, to be put plate position and unclamps jig.
In conclusion automatic double surface gluer provided in this embodiment and its glue spreading method can reach following effect:
One, glue-spread is monitored using flow sensor on hardware, control system is passed back to according to flow sensor
The signal come adjusts plastic emitting pressure and application rate in time, plays at the uniform velocity plastic emitting effect, phase by the algorithm of pressure and speed
Than in traditional automatic double surface gluer, automatic double surface gluer of the invention is controlled with more accurately plastic emitting, bondline thickness after guarantee gluing
Uniformly；
Two, using sealed negative-pressure mechanism, guarantee the operation under vacuum conditions of gluing process, high element foot bottom is without air bubble
Formation, will not cause glue-line rupture or bubble package influence heat dissipation；
Three, using the evacuation and centrifugal degassing device of rotation and revolution, guarantee that simultaneously deaeration is sufficiently stirred in glue before use, be transported to
The glue bubble-free of gluing valve, gluing process are not in that glue splashes.
Embodiments described above does not constitute the restriction to the technical solution protection scope.It is any in above-mentioned implementation
Made modifications, equivalent substitutions and improvements etc., should be included in the protection model of the technical solution within the spirit and principle of mode
Within enclosing.
Claims (9)
1. a kind of automatic double surface gluer, it is characterised in that: include:
Defoaming device, for being stirred simultaneously deaeration to glue；
Glue stations, for completing gluing movement to electronic component；And
Negative pressure device is used to form the vacuum cavity that gluing movement is completed for the glue stations.
2. automatic double surface gluer according to claim 1, it is characterised in that: including connecting composition gel quantity with the glue stations
The flow sensor of feedback loop.
3. automatic double surface gluer according to claim 2, it is characterised in that: further include auxiliary detection components；The auxiliary detection
Component is included in the product sensors in place being arranged at the glue stations and glue-line thickness measurement sensor and fills in the negative pressure
Set the pressure sensor of interior setting.
4. automatic double surface gluer according to claim 2, it is characterised in that: the defoaming device is agitator.
5. a kind of glue spreading method based on automatic double surface gluer as claimed in claim 3, it is characterised in that: the following steps are included:
S100, glue is placed in the defoaming device and completes stirring and deaeration；
S200, it will be placed in gluing product in the negative pressure device, and start the negative pressure device, enabled in the negative pressure device
Generate vacuum cavity；
S300, the glue stations treat gluing product according to default gluing path in the vacuum cavity and carry out gluing behaviour
Make；
S400, the flow sensor detect plastic emitting flow value of glue stations during gluing；
S500, the glue stations are adjusted according to the plastic emitting flow value applies flow adhesive.
6. glue spreading method according to claim 5 starts the negative pressure device in step s 200, the negative pressure is enabled to fill
Set interior generation vacuum cavity；It is characterized by: the pressure sensor obtains vacuum degree intracavitary in the negative pressure device in real time,
The negative pressure device starting is until the vacuum degree reaches setting value.
7. glue spreading method according to claim 6, in step S300, the glue stations is treating the progress of gluing product
Gluing operation；It is characterized by: completing described after the operation of the gluing of gluing product, the glue-line thickness measurement sensor detection glue
The thickness of layer.
8. glue spreading method according to claim 7, in step S400, the flow sensor detects the glue stations
Plastic emitting flow value during gluing；It is characterized by: the flow sensor flows through the gluing during obtaining gluing
The glue amount of the valve of device, the glue amount are the plastic emitting flow value.
9. glue spreading method according to claim 8, in step S500, the glue stations is according to the plastic emitting flow value
Adjustment applies flow adhesive；It is characterized by: the glue stations adjusts application rate or gluing pressure according to the plastic emitting flow value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910491905.6A CN110152942A (en) | 2019-06-06 | 2019-06-06 | A kind of automatic double surface gluer and its glue spreading method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910491905.6A CN110152942A (en) | 2019-06-06 | 2019-06-06 | A kind of automatic double surface gluer and its glue spreading method |
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| Publication Number | Publication Date |
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| CN110152942A true CN110152942A (en) | 2019-08-23 |
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ID=67628159
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112427243A (en) * | 2020-11-24 | 2021-03-02 | 东风本田汽车有限公司 | Multi-layer repeated gluing device and gluing method |
| CN115178438A (en) * | 2022-09-14 | 2022-10-14 | 深圳市鑫路远电子设备有限公司 | Steady state performance evaluation method and system for vacuum glue filling valve |
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