CN110140083A - Lens driver - Google Patents
Lens driver Download PDFInfo
- Publication number
- CN110140083A CN110140083A CN201780080946.5A CN201780080946A CN110140083A CN 110140083 A CN110140083 A CN 110140083A CN 201780080946 A CN201780080946 A CN 201780080946A CN 110140083 A CN110140083 A CN 110140083A
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- China
- Prior art keywords
- mentioned
- conductive pattern
- matrix part
- sheet metal
- coil
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
Abstract
The first sheet metal, the second sheet metal and third sheet metal are buried in matrix part by insert-molding method.Multiple conductive patterns are formed with slave first surface to second surface in matrix part, conductive pattern is connected with the conducting portion of the first sheet metal respectively.
Description
Technical field
The present invention relates to be powered to make from the external terminal portions formed by the sheet metal for being embedded in matrix part towards coil
The mobile lens driver of lens holder.
Background technique
Invention relevant to lens driver is recorded in patent document 1.
Lens driver documented by patent document 1 is fixed with 4 messenger wires in lower side body, will be automatic right using messenger wire
The bearing of coke actuator is can be mobile towards the direction that the optical axis with lens intersects.
In auto-focusing actuator, the lens holder of lenticular body is being kept to be wound with first coil.Lens are kept
The inside of the outside magnetic yoke with magnet is arranged in device, and lens holder is magnetic on the outside by upside leaf spring and the bearing of downside leaf spring
The inside of yoke is moved freely towards optical axis direction.
FPC (flexible printed board) is overlapped in lower side body, is fixed with magnetic detecting element in the lower surface of FPC.?
The second coil holding member is overlapped on FPC, and the second coil holding member is provided with printed coil i.e. the second coil.?
FPC is provided with extension, via the meander pattern of FPC towards the second coil and magnetic detecting element wiring.Also, from the circuitous of FPC
Pattern is returned also to be powered towards first coil via messenger wire and upside leaf spring.
About the lens driver, carries out following so-called hand shaking amendment: being detected using magnetic detecting element by hanging
The movement in the direction that the court of the auto-focusing actuator of line bearing intersects with optical axis, and the second coil is assigned for offsetting
State mobile electric current.Also, by the electric current assigned to first coil, lens holder is driven towards optical axis direction, is carried out pair
Coke amendment.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2014-85624 bulletin
Summary of the invention
Problems to be solved by the invention
About this lens driver, need to be arranged the wiring path towards the second coil, matching towards magnetic detecting element
A variety of wiring paths as thread path and wiring path towards first coil.In patent document 1, by downside shell
Body overlaps FPC, can constitute multiple wiring paths.
But FPC is expensive component, therefore is existed by the way that the increased project of FPC manufacturing cost is arranged.Especially exist
In patent document 1, the messenger wire become towards a part of the wiring path of first coil is brazed in FPC, therefore the material as FPC
Material is needed using the polyimide resin with heat resistance, and fee of material is further got higher.
Also, in assembling operation, it is also desirable to successively be overlapped the work of FPC and the second coil holding member in lower side body
Sequence, therefore working hour is more, thus also manufacturing cost is caused to get higher.
The present invention completes to solve above-mentioned existing project, its purpose is to provide one kind can utilize compared with
Few number of components realizes the lens driver of multiple wiring paths towards coil or magnetic detecting element etc..
Means for solving the problems
The present invention is a kind of lens driver, comprising: matrix part；Lens holder is able to maintain lenticular body；With
And driving mechanism, keep said lens holding member mobile, above-mentioned driving mechanism is configured to magnet and coil, said lens drive
Device is moved to be characterized in that,
Above-mentioned matrix part is formed by insulating materials, and the first sheet metal is embedded in above-mentioned matrix part, above-mentioned first
Sheet metal is formed with external terminal portions and conducting portion,
Said external portion of terminal is exposed towards the outside from above-mentioned matrix part,
It is formed with conductive pattern on the surface of above-mentioned matrix part, above-mentioned conductive pattern is connected with above-mentioned conducting portion, and
Above-mentioned coil is connected with above-mentioned conductive pattern.
Lens driver of the invention is preferably formed into, the surface of above-mentioned matrix part have first surface and be located at than
The second surface of the high position of first surface,
It is connect in the above-mentioned conducting portion of above-mentioned first surface, above-mentioned first sheet metal with above-mentioned conductive pattern, above-mentioned conduction
Pattern is formed from above-mentioned first surface to second surface.
Lens driver of the invention is preferably formed into, and is formed between first surface and above-mentioned second surface tiltedly
Face, above-mentioned conductive pattern are formed through above-mentioned inclined-plane to above-mentioned second surface from first surface.
In such a situation it is preferred that the standing angle that above-mentioned inclined-plane is erected from above-mentioned first surface is 45 degree or less.
About lens driver of the invention, the movable part of said lens holding member is carried via elastic supporting part
It is supported on above-mentioned matrix part, in above-mentioned movable part equipped with above-mentioned magnet, with the above-mentioned coil opposed with above-mentioned magnet
Insulating substrate is overlapped in above-mentioned matrix part,
Above-mentioned conductive pattern is engaged with the connection conductive part for being formed in above-mentioned insulating substrate, and above-mentioned conductive pattern is via above-mentioned
The Wiring pattern of insulating substrate is connected with above-mentioned coil.
Alternatively, the movable part for carrying said lens holding member is propped up via elasticity about lens driver of the invention
Bearing portion part is supported on above-mentioned matrix part, in above-mentioned movable part equipped with above-mentioned magnet, with opposed with above-mentioned magnet above-mentioned
The insulating substrate of coil and the magnetic detecting element opposed with above-mentioned magnet is overlapped in above-mentioned matrix part,
The above-mentioned conductive pattern for being formed in above-mentioned second surface is engaged with the connection conductive part for being formed in above-mentioned insulating substrate,
A part of above-mentioned conductive pattern is connected via the Wiring pattern of above-mentioned insulating substrate with above-mentioned coil, the above-mentioned conductive pattern of another part
Case is connected via the Wiring pattern of above-mentioned insulating substrate with above-mentioned magnetic detecting element.
It in lens driver of the invention, is preferably formed into, above-mentioned magnetic detecting element and above-mentioned matrix part
Above-mentioned first surface is opposed.
Lens driver of the invention can be configured to, and above-mentioned insulating substrate is the stacking that multi-disc insulating trip is laminated
Substrate constitutes above-mentioned coil using the coil-conductor for being formed in each above-mentioned insulating trip.
In addition, lens driver of the invention can also be formed as, above-mentioned insulating substrate be divided into it is multiple, via
The relaying conductive pattern of the above-mentioned surface setting of above-mentioned matrix part, is set to the relaying conductive part of each above-mentioned insulating substrate
Mutual conduction.
About lens driver of the invention, the movable part for carrying said lens holding member is supported on via messenger wire
Matrix part is stated, in above-mentioned movable part equipped with above-mentioned magnet, above-mentioned matrix part side is provided with above-mentioned coil,
Be embedded with the second sheet metal supported to above-mentioned messenger wire in above-mentioned matrix part, above-mentioned second sheet metal by with
The identical metal plate of above-mentioned first sheet metal is formed, and the above-mentioned conducting portion of above-mentioned second sheet metal and above-mentioned first sheet metal is located at
Mutually level face.
Invention effect
About lens driver of the invention, the sheet metal of the inside of matrix part is embedded in by combination and is formed in
The conductive pattern on the surface of matrix part constitutes wiring path.Therefore, multiple match can be effectively formed without using FPC etc.
Thread path.
Also, by keeping the first surface of matrix part low, conductive pattern is connect with sheet metal in first surface, and makes
It is formed at the conducting such as conductive pattern and insulating substrate of the second surface of high position, first from matrix part can be prevented
The conducting portion and insulating substrate etc. for the sheet metal that surface is exposed against.
Detailed description of the invention
Fig. 1 is the perspective view that the lens driver of embodiments of the present invention is shown from top.
Fig. 2 is to show the perspective view of lens driver shown in FIG. 1 with the state after unloading cover.
Fig. 3 is the exploded perspective that the lens driver unloaded after covering is decomposed and shown according to each component parts
Figure.
Fig. 4 is the exploded perspective of the matrix part for showing lens driver, messenger wire and the insulating substrate with coil
Figure.
Fig. 5 is to show leading for the first sheet metal for being embedded in matrix part and the second sheet metal and matrix part surface
The exploded perspective view of positional relationship between electrical pattern.
Fig. 6 is the cross-sectional view after cutting off the base station formations shown in Fig. 4 comprising matrix part at line VI -- VI.
Specific embodiment
Hereinafter, being described in detail using appended attached drawing to the embodiment of the present invention.
Lens driver 1 shown in FIG. 1 is equipped on pocket telephone or portable information together with photographing element
Terminal installation etc..It, can be in the lens holder of lens driver 1 although being omitted in the following embodiments
31 carry the lenticular body (lens drum) opposed with above-mentioned photographing element.Lens holder 31 is by the optical axis direction driving towards lenticular body
And adjust from oving foci, and lens holder 31 is driven towards the direction intersected with optical axis and carries out hand shaking amendment.Thoroughly
Mirror retainer 31 is lens holder.
In the various figures, the direction Z1 is the top of lens driver 1, and the direction Z2 is the lower section of lens driver 1.The side Z1
To be should with photographing element shoot object present in front, the direction Z2 is rear present in photographing element.
The overall construction of lens driver 1 is shown in Fig. 1, the lens driving of the state after cover 2 is unloaded is shown in Fig. 2
Device 1 shows the lens driver 1 after decomposing according to each major part in Fig. 3.In the various figures, lens driver 1 is shown
Center line O.If in lens driver 1 equipped with lenticular body, the optical axis one of above-mentioned center line O and lenticular body (lens)
It causes.Also, the direction Z1-Z2 is the direction along optical axis.
As shown in figure 3, lens driver 1 has base station formations 10.Base station formations 10 is provided with synthetic resin
The matrix part 11 of system.Fig. 4 to fig. 6 shows the detailed construction of matrix part 11.It is embedded in matrix part 11 by phosphor bronze sheet
First sheet metal 12,13, second sheet metal 14A, 14B and third sheet metal 19a for being formed etc. conductive metal plate,
19b.As shown in figure 5, the first sheet metal 12,13 is divided into multiple, second sheet metal 14A, 14B is divided into 2.Third gold
Belong to piece 19a, 19b to be also disposed at 2.
First 12,13, second sheet metal 14A, 14B of sheet metal and third sheet metal 19a, 19b are from 1 metal plate
Cut out, above-mentioned sheet metal 12,13,14A, 14B, 19a, 19b it is integrated with matrix part 11 by so-called insert-molding method.
The details of the construction of first 12,13, second sheet metal 14A, 14B of sheet metal and third sheet metal 19a, 19b will be rear
Face explanation.
As shown in figure 5, forming the flat part for being parallel to X-Y plane orthogonal with the optical axis in second sheet metal 14A, 14B
14a is formed with suspension fixed part 14b at total the 4 of the end of flat part 14a.As shown in figure 4, suspending fixed part 14b from four
Corner is exposed at the 4 of the matrix part 11 of square shape.In lens driver 1, elastic supporting part is provided with 4 messenger wires
8.The base end part (lower end) of each messenger wire 8 is fixed in suspension fixed part 14b by soldering.Utilize the upper end 8a of messenger wire 8
It is to move freely towards the direction (orthogonal direction) intersected with the Z axis along optical axis by the bearing of mobile unit (movable part) 30.
Messenger wire 8 is formed by conductive and elastic excellent metal material, such as is formed by copper alloy.8 section of messenger wire
It is in rounded shape and linearly extend along optical axis.
As shown in figure 3, mobile unit (movable part) 30 have can kinetoplast 32.Can kinetoplast 32 by synthetic resin material shape
At.
As shown in figure 3, can kinetoplast 32 overlook rectangular (substantially square shape), opposed side is solid in the X direction
Surely there are magnet 33x, 33x, opposed side is fixed with magnet 33y, 33y in the Y direction.Magnet 33x, 33x match in parallel to each other
It sets, magnet 33y, 33y are configured in parallel to each other.
The inner surface opposed with center line O of each magnet 33x, 33x, 33y, 33y are excited as identical magnetic pole.It is each
The outer surface of magnet 33x, 33x, 33y, 33y are excited as identical magnetic pole, and respective inner surface is phase with respective outer surface
Anti- magnetic pole.Such as inner surface is the pole N, outer surface portion is the pole S.
In mobile unit 30, said lens retainer 31 configure frame shape can kinetoplast 32 inside.Lens are protected
Holder 31 is synthetic resin system, is formed with the circular retaining hole 31a of (Z-direction) perforation along the vertical direction in central portion opening,
Be formed as tubular.The lens of camera shooting are kept by lens barrel, and the lens barrel (lenticular body) for maintaining lens can be assemblied in retaining hole
31a.Therefore, the retaining hole 31a of lens holder 31 is provided with the thread groove (not shown) for mounted lens body, but lens
The holding of body towards lens holder 31 can also be carried out based on bonding.In addition, lens and lens barrel are omitted in embodiments
Diagram.
The central axis of lens holder 31 is consistent with the optical axis for the lens (lenticular body) being maintained by it, and with above-mentioned center line
O is consistent.
As shown in Figures 2 and 3, can the upside of kinetoplast 32 be fixed with and be divided into 2 first leaf spring 34A, 34B.
First leaf spring 34A, 34B is formed by the elastic metal sheet of the electric conductivity such as copper alloy or phosphor bronze sheet.First leaf spring 34A, 34B's
It is each, it is integrally formed with outside fixed part 34a, inside fixed part 34b and by outside fixed part 34a and inside fixed part
The flexible deformation portion 34c of 34b connection.
The respective outside fixed part 34a of first leaf spring 34A, 34B is fixed on movable base by the methods of hot riveting or bonding
The upper surface of body 32.Plastic pressing component 35 is provided on first leaf spring 34A, 34B.Pressing component 35 is in four
The frame-shaped of square shape (rectangular-shaped) passes through the methods of hot riveting or bonding together with first leaf spring 34A, 34B and is fixed on movable base
The upper surface of body 32.I.e., the outside fixed part 34a of first leaf spring 34A, 34B be sandwiched in can kinetoplast 32 upper surface and pressing
It is fixed between component 35.
The inside fixed part 34b of first leaf spring 34A, 34B is fixed on lens holder by the methods of hot riveting or bonding
31 upper surface.
In addition, can kinetoplast 32 upper surface, be provided with the outside fixed part being inserted through in first leaf spring 34A, 34B
The fixed protrusion of mounting hole and the mounting hole formed in pressing component 35 that 34a is formed.Also, in lens holder 31
Upper surface, be provided with the fixed of mounting hole being inserted through in the inside fixed part 34b formation of first leaf spring 34A, 34B and dash forward
It rises.
As shown in figure 3, can the downside of kinetoplast 32 be provided with the second leaf spring 36.Second leaf spring 36 is by flexible gold
Belong to plate to be formed.In the second leaf spring 36, it is integrally formed with outside fixed part 36a, inside fixed part 36b and consolidates outside
Determine the flexible deformation portion 36c of portion 36a and inside fixed part 36b connection.
The outside fixed part 36a of second leaf spring 36 by bonding or hot riveting processing etc. be fixed on from it is above-mentioned can kinetoplast 32
4 at corner downward (towards the direction Z2) the prominent leg 32a formed lower end surface.The inside fixed part 36b of second leaf spring 36
The lower surface of lens holder 31 is fixed on by bonding agent etc..
Lens holder 31 configuration can kinetoplast 32 inside, can kinetoplast 32 upper surface and lens holder 31
Upper surface be fixed with first leaf spring 34A, 34B, can the lower part of kinetoplast 32 and the lower surface of lens holder 31 be fixed with
Second leaf spring 36.Therefore, by first leaf spring 34A, 34B and the second leaf spring 36, lens holder 31 is supported in movable base
The inside of body 32 is moved freely towards the direction Z1-Z2, i.e. optical axis direction.
As shown in figure 3, being provided with first coil 41 in the periphery of lens holder 31.First coil 41 passes through coating conducting wire
It is constituted using center line O as winding center wound on the periphery of lens holder 31.First coil 41 and magnet 33x, 33x,
The inner surface of 33y, 33y separate opposed with gap.Lens are protected using first coil 41 and magnet 33x, 33x, 33y, 33y composition
First driving mechanism mobile towards optical axis direction, that is, direction Z1-Z2 of holder 31.
As shown in figure 3, being integrally formed with a pair of of protrusion 31b, 31c on the top of lens holder 31, First Line is constituted
The terminal part 42a of one side of the coating conducting wire of circle 41 is wound in protrusion 31b, and the terminal part 42b of another party is wound in protrusion 31c.
It is removed in the coating of terminal part 42a, 42b, coating conducting wire, the terminal part 42a soldering of a side is led in the first leaf spring 34A with it
Logical, the terminal part 42b soldering of another party is connected in the first leaf spring 34B with it.
As shown in figure 3, being formed with fixation hole 34d in the corner of first leaf spring 34A, 34B.As shown in Fig. 2, messenger wire 8 is upper
End 8a is inserted in fixation hole 34d, and is fixed on first leaf spring 34A, 34B by soldering.
It is fixed on the upper end 8a of 2 messenger wires 8 of the suspension fixed part 14b of the second sheet metal 14A of a side shown in fig. 5
(referring to Fig. 4) be fixed in be fixed on can kinetoplast 32 upper surface the first leaf spring 34A (referring to Fig. 3), the first leaf spring 34A with
The terminal part 42a of one side of first coil 41 is connected.The suspension for being fixed on the second sheet metal 14B of another party shown in fig. 5 is solid
The upper end 8a (referring to Fig. 4) for determining 2 messenger wires 8 of portion 14b be fixed in be fixed on can kinetoplast 32 upper surface the first plate
Spring 34B (referring to Fig. 3), the first leaf spring 34B is connected with the terminal part 42b of another party of first coil 41.
As shown in figure 5, the second sheet metal 14A end external terminal portions 14c by bending downward, in the second sheet metal
The end external terminal portions 14c of 14B is by bending downward, and each external terminal portions 14c, 14c are from the pleurapophysis downward of matrix part 11
Out.It can be via a pair of outer portion of terminal 14c, 14c and second sheet metal 14A, 14B and messenger wire 8, and then through the first leaf spring
34A, 34B are powered to first coil 41.
As shown in Figure 3 and Figure 4, in base station formations 10, bearing is formed in many places of the upper surface of matrix part 11
Protrusion 11a, be divided into 2 insulating substrate 50A, 50B setting bearing protrusion 11a on, and matrix part 11 with
Insulating substrate 50A, 50B are fixed by bonding agent.Insulating substrate 50A, 50B are the stacking base that multi-disc insulating trip is laminated respectively
Plate.The gyrate coil-conductor around pattern is formed with using copper foil etc. in each insulating trip.Insulation with coil-conductor
Piece is laminated with multi-disc, by the way that upper and lower coil-conductor is connected, constitutes the second coil that coil-conductor spirally connects
51x、51x、51y、51y。
Second coil 51x, 51x, 51y, 51y is the plane convolute coil circular along X-Y plane.Second coil 51x,
51x is configured in parallel to each other in X-direction interval, second coil 51y, 51y in the Y direction interval and in parallel to each other
Configuration.
As shown in Fig. 2, second coil 51x, 51x be fixed on can the lower end surface of magnet 33x, 33x of kinetoplast 32 separate
Compartment of terrain is opposed, second coil 51y, 51y be fixed on can kinetoplast 32 magnet 33y, 33y lower end surface it is right at spaced intervals
It sets.It is constituted using second coil 51x, 51x, 51y, 51y and magnet 33x, 33x, 33y, 33y for making comprising lens holder 31
Second driving mechanism mobile towards X-direction and Y-direction of mobile unit 30.Second driving mechanism is to make 31 phase of lens holder
The driving mechanism mobile towards the direction intersected with optical axis for matrix part 11.In addition, movable part, that is, mobile unit 30 is configured to
With first coil 41, lens holder 31, can kinetoplast 32, magnet 33x, 33x, 33y, 33y, first leaf spring 34A, 34B,
Two leaf springs 36 and pressing component 35.
As shown in Figure 4 and Figure 5, base station formations 10 is provided with magnetic detecting element 45x, 45y.Magnetic detecting element
45x, 45y are equipped with Hall element and attached circuit block.As also showed that in Fig. 6, magnetic detecting element 45x passes through
Soldering is fixed on the lower surface of insulating substrate 50B, and magnetic detecting element 45y is fixed on the following table of insulating substrate 50A by soldering
Face.Under assembled state shown in Fig. 2, the magnetic field of the lower section of 1 magnet 33x is detected by magnetic detecting element 45x, 1 magnet
It is detected by magnetic detecting element 45y in the magnetic field of the lower section of 33y.In addition, magnetic detecting element 45x across insulating substrate 50B and with
Magnet 33x is opposed, and magnetic detecting element 45y is opposed with magnet 33y across insulating substrate 50A.
As shown in figure 4, the insulating substrate 50A of a side be formed with connection conductive part 21a, 21b at total 6,21c,
21d, 21e, 21f, the insulating substrate 50B of another party be also formed with connection conductive part 22a, 22b at total 6,22c, 22d,
22e、22f。
In the insulating substrate 50A of a side, relaying conductive part is formed in the opposed portion of the insulating substrate 50B with another party
23a, 24a are formed with relaying conductive part in the opposed portion of the insulating substrate 50A with a side in the insulating substrate 50B of another party
23b,24b.It relays conductive part 23a and relays conductive part 23b through the formation of the relaying conductive pattern on the surface of matrix part 11
Case 28a conducting, relaying conductive part 24a and relaying conductive part 24b are connected via relaying conductive pattern 28b.
Connection conductive part 21a, 21b, 21c, 21d, 21e, 21f for being formed at total the 12 of insulating substrate 50A, 50B and
2 connection conductive parts in connection conductive part 22a, 22b, 22c, 22d, 22e, 22f are via forming in insulating substrate 50A, 50B
Wiring pattern (not shown) and in opposed second coil 51x, 51x connection of X-direction.Second coil 51x, 51x is set to not
Same insulating substrate 50A, 50B, therefore, the Wiring pattern of the series connection by being formed in insulating substrate 50A, 50B (is not schemed
Show) via relaying conductive part 23a, 23b conducting, 2 second coils 51x, 51x are connected in series.
In addition 2 connection conductive parts via the Wiring pattern (not shown) formed in insulating substrate 50A, 50B and in Y
Opposed second coil 51y, 51y connection in direction.2 second coils 51y, 51y be also disposed on different insulating substrate 50A,
50B, therefore, the Wiring pattern (not shown) of the series connection by being formed in insulating substrate 50A, 50B are conductive via relaying
Portion 24a, 24b conducting, 2 second coils 51y, 51y are connected in series.
4 connections in conductive part 21a, 21b, 21c, 21d, 21e, 21f are connected at the 6 of insulating substrate 50A setting to lead
Distinguish via the Wiring pattern (not shown) formed in insulating substrate 50A with 4 portion of terminal of magnetic detecting element 45y in electric portion
Conducting.I.e., a part of 4 Wiring patterns is exposed in the lower surface of insulating substrate 50A, in part (brazed portion, weldering of the exposing
Pan portion) it is brazed the portion of terminal for having magnetic detecting element 45y respectively.Insulating substrate 50B setting 6 at connect conductive part 22a,
4 connection conductive parts in 22b, 22c, 22d, 22e, 22f via the Wiring pattern (not shown) formed in insulating substrate 50B and
It is respectively turned on 4 portion of terminal of magnetic detecting element 45x.I.e., a part of 4 Wiring patterns is at insulating substrate 50B
Surface is exposed, and is brazed the portion of terminal for having magnetic detecting element 45x respectively in the part (brazed portion, welding disk) of the exposing.
About the lens driver 1 of embodiment, by 2 insulating substrates 50A, 50B by flat shape being in L-shaped
It is applied in combination, the yield rate of material can be made good.
It is shown in Fig. 4 and is embedded with the matrix part 11 of the first sheet metal 12,13 and second sheet metal 14A, 14B in inside,
By the first sheet metal 12,13 and second sheet metal 14A, 14B to be shown from the isolated state of matrix part 11 in Fig. 5.In addition,
Matrix part 11 is also embedded with third sheet metal 19a, 19b.
As shown in figure 5, the top towards the side Z1 of matrix part 11 be formed with first surface 15A, 15B, 15C, 15D and
Second surface 16.First surface 15A, 15B, 15C, 15D are formed as lower than second surface 16.First surface 15A, 15B, 15C,
15D is formed in identical height and position on the thickness direction (optical axis direction) of matrix part 11.Second surface 16 is in addition to bearing
Same plane is formed at the top of the side Z1 of the external matrix part 11 of protrusion 11a.Supporting protrusion 11a is to work as insulating substrate
The part that insulating substrate 50A, 50B are supported when 50A, 50B are overlapped on matrix part 11.Bearing protrusion 11a's
Upper surface (surface) also is located at than first surface 15A, 15B, 15C, the position of 15D high, the i.e. side Z1 (side magnet 33x, 33y), because
This constitutes a part of second surface.
Inclined-plane 17A is formed in the boundary portion of first surface 15A and second surface 16.In first surface 15B and the second table
The boundary portion in face 16 is formed with inclined-plane 17B.Inclined-plane 17C is formed in the boundary portion of first surface 15C and second surface 16.Together
Sample is formed with inclined-plane 17D in the boundary portion of first surface 15D and second surface 16.In the cross-sectional view of Fig. 6, first is showed
Surface 15C and second surface 16 and inclined-plane 17C.It is preferred that the standing angle, θ that inclined-plane 17C is erected from first surface 15C is 45 degree
Below.More preferably 10 degree or more 40 degree or less.
As shown in fig. 6, the magnetic detecting element 45x for being fixed on the lower surface of insulating substrate 50B, which enters, is formed with the first table
It is opposed with first surface 15C in the recess portion of face 15C.Equally, it is fixed on the magnetic detecting element of the lower surface of insulating substrate 50A
45y, which is located at, to be formed in the recess portion of first surface 15E, and opposed with first surface 15E.First surface 15E be formed in it is above-mentioned
The level position of first surface 15A, 15B, 15C, 15D phase.By the way that magnetic detecting element 45x, 45y configuration are being formed with the
In the recess portion of one surface 15C, 15E, it can be configured to keep the height dimension of base station tectosome 10 small.
As shown in figure 5, the first sheet metal 12 be provided with the conducting portion 12a, 12b being separated from each other, 12c, 12d, 12e,
12f.Conducting portion 13a, 13b, 13c, 13d, 13e, the 13f being separated from each other are provided in the first sheet metal 13.Conducting portion 12a,
12b, 12c, 12d, 12e, 12f and conducting portion 13a, 13b, 13c, 13d, 13e, 13f are the flat surfaces parallel with X-Y plane.And
And conducting portion 12a, 12b, 12c, 12d, 12e, 12f and conducting portion 13a, 13b, 13c, 13d, 13e, 13f are in matrix part 11
Positioned at identical height and position, flat part 14a, 14a of these conducting portions and second sheet metal 14A, 14B are also in matrix part 11
In be located at identical height and position.I.e., conducting portion 12a, 12b, 12c, 12d, 12e, 12f and the first gold medal of the first sheet metal 12
Flat part 14a, 14a of conducting portion 13a, 13b, 13c, 13d, 13e, 13f and second sheet metal 14A, 14B for belonging to piece 13 are located at light
Mutually level face in axis direction.
Therefore, the conducting portion of conducting portion 12a, 12b of the first sheet metal 12,12c, 12d, 12e, 12f, the first sheet metal 13
13a, 13b, 13c, 13d, 13e, 13f, second sheet metal 14A, 14B flat part 14a, 14a from the identical of identical metal plate
Plate part is embedded in matrix part 11 from formation, and by insert-molding method.
As shown in figure 5, external terminal portions 12g, 12h, 12i, 12j, 12k, 12m from the conducting portion 12a of the first sheet metal 12,
12b, 12c, 12d, 12e, 12f are by bending downward, these external terminal portions protrude downward from matrix part 11, in matrix part
The external of part 11 exposes.External terminal portions 13g, 13h, 13i, 13j, 13k, 13m from the conducting portion 13a of the first sheet metal 13,
13b, 13c, 13d, 13e, 13f are by bending downward, these external terminal portions protrude downward from matrix part 11, in matrix part
The external of part 11 exposes.
As shown in figure 5, being provided with exposed division 18A at 4 in first surface 15A, the first sheet metal 12 of insert-molding is led
Logical portion 12a, 12b, 12c, 12d expose at exposed division 18A from first surface 15A.In addition, showing and exposing at 3 in Fig. 5
Portion 18A.First surface 15B is provided with exposed division 18B at 2, conducting portion 12e, 12f are at exposed division 18B from first surface 15B
Expose.
Equally, first surface 15C is provided with exposed division 18C at 4, the conducting portion of the first sheet metal 13 of insert-molding
13a, 13b, 13c, 13d expose at exposed division 18C from first surface 15C.First surface 15D is provided with exposed division at 2
18D, conducting portion 13e, 13f expose at exposed division 18D from first surface 15D.
As shown in Figure 4 and Figure 5, from first surface 15A through inclined-plane 17A up to second surface 16, be formed with conductive pattern
25a,25b,25c,25d.The conducting portion 12a exposed from first surface 15A is connect with conductive pattern 25a, conducting portion 12b and conduction
Pattern 25b connection.Conducting portion 12c, 12d and conductive pattern 25c, 25d are separately connected.From first surface 15B through inclined-plane 17B up to
Second surface 16 is formed with conductive pattern 25e, 25f.From first surface 15B expose conducting portion 12e, 12f respectively with conductive pattern
The connection of case 25e, 25f.
Conductive pattern 26a, 26b, 26c, 26d are formed with up to second surface 16 from first surface 15C through inclined-plane 17C.From
The conducting portion 13a that first surface 15C exposes is connect with conductive pattern 26a, and conducting portion 13b is connect with conductive pattern 26b.Conducting portion
13c, 13d and conductive pattern 26c, 26d are separately connected.It is formed with from first surface 15D through inclined-plane 17D up to second surface 16
Conductive pattern 26e, 26f.Conducting portion 13e, the 13f exposed from first surface 15D is connect with electrical pattern 26e, 26f respectively.
Fig. 6 is the cross-sectional view of the line VI -- VI of Fig. 4, in Fig. 6, constitutes base station formations 10 together with matrix part 11
Insulating substrate 50B and magnetic detecting element 45x are also shown with undecomposed state.In fig. 6, it is illustrated that the first sheet metal 13
Conducting portion 13d, external terminal portions 13j and conductive pattern 26d.Conductive pattern 26d is to implement plating on the surface of printing layer
Conductive layer, from first surface 15C through inclined-plane 17C up to second surface 16 is formed continuously.The mode of printing of printing layer is ink-jet
Mode uses coating method, hectographic printing mode of dispenser etc..Printing is also possible to other any ways.Alternatively, in addition to
Other than printing layer, copper foil layer etc. can also be formed in the upper surface of matrix part 11, and conductive pattern 26d is formed by etching.
The printing layer of conductive pattern 26d is by printing the silver paste containing silver and resinoid bond and firing (heating)
Silver-colored pattern afterwards is constituted.In the present embodiment, coating is set on the surface of printing layer.Coating is in the print being made of silver-colored pattern
The layer of copper coating, nickel coating, gold plate is sequentially formed on brush layer, the most surface (outer surface) of conductive pattern 26d is golden
Coating.Furthermore it is preferred that being made from the surface of the printing layer of conductive pattern 26d up to the surface of conducting portion 13d is arranged with copper and nickel
For the coating of the gold of basal layer.In addition, in the case where conductive pattern 26d is not by printing but being formed by etching, plating
The layer of the downside of layer is copper foil etc..
As previously described, if the angle, θ of inclined-plane 17c is set as 45 degree or less, is preferably the range for being set as 10~40 degree,
Then it is easy from first surface 15C through inclined-plane 17C up to conductive pattern 26d is formed continuously by second surface 16 un-interrupted.
In addition, the formation of all conductive patterns other than above-mentioned conductive pattern 26d and conductive pattern and conducting portion
It connects also identical as construction shown in fig. 6.I.e., about conductive pattern, a part overlaps the upper surface of conducting portion, in the overlapping
Part at, conductive pattern is electrically connected with conducting portion.
As shown in figure 5, the second surface 16 in matrix part 11 is formed with exposed division 18E, 18E at 2, as shown in figure 4,
Exposed division 18E, 18E exposing have third sheet metal 19a, 19b.Third sheet metal 19a, 19b from the first sheet metal 12,13 and
The identical metal plate of second sheet metal 14A, 14B is cut out.
Relaying conductive pattern 28a, 28b are formed in the second surface 16 of matrix part 11.Relaying conductive pattern 28a
It is overlapped by a part and is connect on third sheet metal 19a with third sheet metal 19a, relaying passes through one with conductive pattern 28b
It partially overlaps on third sheet metal 19b and is connect with third sheet metal 19b.Relaying with conductive pattern 28a, 28b by with it is upper
It states the identical process of conductive pattern and is formed with identical conductive material.By using third sheet metal 19a, 19b as electrode
It uses, the surface of printing layer of conductive pattern 28a, 28b can be used to implement using copper and nickel as the gold-plated of substrate in relaying.
In addition, the flat part 14a of the second sheet metal 14A, 14B shown in fig. 5 be formed in each conducting portion 12a, 12b ...
And each conducting portion 13a, 13b ... identical height and position, therefore flat part 14a is again formed as part of it from first surface
Any of 15A, 15B, 15C, 15D, 15E expose.
After loading insulating substrate 50A on matrix part 11 and fixing using bonding agent, it is presented on second surface 16
Conductive pattern 25a be brazed on the connection conductive part 21a of insulating substrate 50A.Also, conductive pattern 25b, 25c, 25d, 25e,
25f also with connect conductive part 21b, 21c, 21d, 21e, 21f and be brazed respectively.Equally, when the mounting insulation on matrix part 11
After substrate 50B and utilization bonding agent are fixed, the conductive pattern 26a for being presented on second surface 16 is brazed on insulating substrate 50B's
Connect conductive part 22a.Equally, conductive pattern 26b, 26c, 26d, 26e, 26f also with connect conductive part 22b, 22c, 22d, 22e,
22f is brazed respectively.
In addition, relaying conductive part 23a, 23b is brazed with the conductive pattern 28a of relaying below, relaying conductive part 23a,
23b mutual conduction.Also, it relays conductive part 24a, 24b to be brazed with the conductive pattern 28b of relaying below, relays conductive part
24a, 24b mutual conduction.In addition, before insulating substrate 50A, 50B are fixed on matrix part 11, magnetic detecting element 45y,
45x is mounted on the lower surface of insulating substrate 50A, 50B.
By above-mentioned construction, external terminal portions 12g, 12h, 12i, 12j, 12k, 12m for formed by the first sheet metal 12 and
External terminal portions 13g, 13h, 13i, 13j, 13k, the 13m formed by the first sheet metal 13 through conductive pattern 25a, 25b, 25c,
25d, 25e, 25f and conductive pattern 26a, 26b, 26c, 26d, 26e, 26f and with second coil 51x, 51x, 51y, 51y and magnetic
The portion of terminal of power detecting element 45x, 45y are respectively turned on.
Secondly, being illustrated to the movement of lens driver 1.
If from external terminal portions 14c, 14c shown in fig. 5 via messenger wire 8 and first leaf spring 34A, 34B to first coil 41
Driving current is assigned, then in the first driving mechanism, by the coil current flowed around center line O and comes from magnet
The magnetic field of the inner surface of 33x, 33x, 33y, 33y, lens holder 31 are driven towards the optical axis direction, that is, direction Z1-Z2, carry out by
The lens that lens holder 31 is kept are adjusted from oving foci.
If mobile unit 30 is detected using magnetic detecting element 45x across exhausted towards X-direction and Y-direction positional shift
The movement of edge substrate 50B opposed magnet 33x detects the magnetic opposed across insulating substrate 50A using magnetic detecting element 45y
The movement of iron 33y, detection signal by from external terminal portions 12g, 12h, 12i, 12j, 12k, 12m and external terminal portions 13g,
Either one or two of 13h, 13i, 13j, 13k, 13m detection.In control unit, generates the movement to the direction X-Y of mobile unit 30 and carry out
Modified driving current, and second coil 51x, 51x, 51y, 51y is given to from any one external terminal portions through conductive pattern.
In the second driving mechanism, in the lower part of magnet 33x, 33x, by by reaching outer surface from the inner surface of magnet
Magnetic flux and the electromagnetic force generated in second coil 51x, 51x along the electric current of Y-direction flowing, mobile unit 30 are driven towards X-direction
It is dynamic.Also, in the lower part of magnet 33y, 33y, by by reaching the magnetic flux of outer surface from the inner surface of magnet and in the second coil
The electromagnetic force that the electric current flowed in X direction in 51y, 51y generates, mobile unit 30 are driven towards Y-direction.Thus hand shaking is carried out
Amendment.
In said lens driving device 1, in base station formations 10, the first of matrix part 11 is embedded in by combination
Sheet metal 12,13 and be formed in matrix part 11 surface conductive pattern, be thus electrically connected with insulating substrate 50A, 50B, because
This can efficiently constitute multiple wiring paths.Also, since number of components can be cut down without using FPC.In addition,
Without the sheet metal for being embedded in matrix part 11 to be overlapped to up and down and carried out the complicated construction to insulate etc., can will own
Sheet metal cut out from the planar portions of same metal plate, and pass through insert-molding constitute matrix part 11.
It, will in first surface 15A, 15B, 15C, the 15D for being located at lower position in the lens driver 1 of embodiment
Conducting portion is connected with conductive pattern, is being located at the high-order second surface 16 set, by the company of conductive pattern and insulating substrate 50A, 50B
Connect conductive part soldering.Thus, the conducting portion formed by metal plate will not be with insulating substrate 50A, 50B against can prevent exhausted
The short circuit of Wiring pattern and conducting portion that edge substrate 50A, 50B are formed.
Also, it is located at the second surface of the position higher than first surface by being formed, 11 part of matrix part can be added
First sheet metal, the second sheet metal and third sheet metal can be embedded in securely matrix part by insert-molding method by thickness
In part.
In addition, in the above-described embodiment, second coil 51x, 51y is more by that will have the stacking of the insulating trip of coil-conductor
Multilayer board made of piece is constituted, but it's not limited to that for the second coil.For example, it is also possible to be formed as, the second coil pass through by
Wire-wound is constituted at scheduled shape, which is mounted on the surface of insulating substrate.In this case, the second coil
End and the Wiring pattern of insulating substrate connect, Wiring pattern is connected with the connection conductive part formed in insulating substrate.
Also, it in the above-described embodiment, illustrates that matrix part 11 has to load insulating substrate 50A, 50B
And the bearing protrusion 11a supported, but the present invention is not limited to this.I.e., bearing can also not formed in matrix part 11
Protrusion 11a, insulating substrate 50A, 50B are positioned on the second surface 16 of matrix part 11 and Chong Die with matrix part 11.
More than, based on embodiment, the present invention is described, but the present invention is not limited to above embodiment, energy
Various modifications are carried out in enough ranges recorded in technical solution.
This application claims enjoy the basis application 2016-254991 to file an application to Japanese Patent Office on December 28th, 2016
Number priority, and herein by referring to and quote entire contents.
Description of symbols
1 lens driver
8 messenger wires (elastic supporting part)
10 base station formations
11 matrix parts
12 first sheet metals
12a, 12b, 12c, 12d, 12e, 12f conducting portion
12g, 12h, 12i, 12j, 12k, 12m external terminal portions
13 first sheet metals
13a, 13b, 13c, 13d, 13e, 13f conducting portion
13g, 13h, 13i, 13j, 13k, 13m external terminal portions
The second sheet metal of 14A, 14B
The flat part 14a
14b suspends fixed part
14c external terminal portions
15A, 15B, 15C, 15D first surface
16 second surfaces
The inclined-plane 17A, 17B, 17C, 17D
19a, 19b third sheet metal
21a, 21b, 21c, 21d, 21e, 21f connect conductive part
22a, 22b, 22c, 22d, 22e, 22f connect conductive part
23a, 23b, 24a, 24b relay conductive part
25a, 25b, 25c, 25d, 25e, 25f conductive pattern
26a, 26b, 26c, 26d, 26e, 26f conductive pattern
28a, 28b relaying use conductive pattern
30 mobile units (movable part)
31 lens holders (lens holder)
32 can kinetoplast
33x, 33y magnet
The first leaf spring of 34A, 34B
36 second leaf springs
41 first coils
45x, 45y magnetic detecting element
50A, 50B insulating substrate
The second coil of 51x, 51y (coil)
Claims (10)
1. a kind of lens driver, comprising:
Matrix part；Lens holder is able to maintain lenticular body；And driving mechanism, keep said lens holding member mobile,
Above-mentioned driving mechanism is configured to magnet and coil,
Said lens driving device is characterized in that,
Above-mentioned matrix part is formed by insulating materials, and the first sheet metal is embedded in above-mentioned matrix part, in above-mentioned first metal
Piece is formed with external terminal portions and conducting portion,
Said external portion of terminal is exposed towards the outside from above-mentioned matrix part,
It is formed with conductive pattern on the surface of above-mentioned matrix part, above-mentioned conductive pattern is connected with above-mentioned conducting portion, and above-mentioned
Coil is connected with above-mentioned conductive pattern.
2. lens driver according to claim 1, wherein
The surface of above-mentioned matrix part has first surface and the second surface positioned at the position higher than first surface,
It is connect in the above-mentioned conducting portion of above-mentioned first surface, above-mentioned first sheet metal with above-mentioned conductive pattern, above-mentioned conductive pattern
It is formed from above-mentioned first surface to second surface.
3. lens driver according to claim 2, wherein
Inclined-plane is formed between above-mentioned first surface and above-mentioned second surface, above-mentioned conductive pattern is from first surface through above-mentioned oblique
Face is formed to above-mentioned second surface.
4. lens driver according to claim 3, wherein
The standing angle that above-mentioned inclined-plane is erected from above-mentioned first surface is 45 degree or less.
5. lens driver according to any one of claims 1 to 4, wherein
The movable part for carrying said lens holding member is supported on above-mentioned matrix part via elastic supporting part, above-mentioned movable
Equipped with above-mentioned magnet, the insulating substrate with the above-mentioned coil opposed with above-mentioned magnet is overlapped in above-mentioned matrix part in portion,
Above-mentioned conductive pattern is engaged with the connection conductive part for being formed in above-mentioned insulating substrate, and above-mentioned conductive pattern is via above-mentioned insulation
The Wiring pattern of substrate is connected with above-mentioned coil.
6. the lens driver according to any one of claim 2~4, wherein
The movable part for carrying said lens holding member is supported on above-mentioned matrix part via elastic supporting part, above-mentioned movable
Portion has the above-mentioned coil opposed with above-mentioned magnet and the magnetic detecting element opposed with above-mentioned magnet equipped with above-mentioned magnet
Insulating substrate be overlapped in above-mentioned matrix part,
The above-mentioned conductive pattern for being formed in above-mentioned second surface is engaged with the connection conductive part for being formed in above-mentioned insulating substrate, and one
Above-mentioned conductive pattern is divided to be connected via the Wiring pattern of above-mentioned insulating substrate with above-mentioned coil, the above-mentioned conductive pattern warp of another part
It is connected by the Wiring pattern of above-mentioned insulating substrate with above-mentioned magnetic detecting element.
7. lens driver according to claim 6, wherein
Above-mentioned magnetic detecting element is opposed with the above-mentioned first surface of above-mentioned matrix part.
8. the lens driver according to any one of claim 5~7, wherein
Above-mentioned insulating substrate is the multilayer board that multi-disc insulating trip is laminated, and the coil by being formed in each above-mentioned insulating trip is led
Body constitutes above-mentioned coil.
9. the lens driver according to any one of claim 5~8, wherein
Above-mentioned insulating substrate be divided into it is multiple, via the relaying conductive pattern being arranged on the above-mentioned surface of above-mentioned matrix part
Case is set to the relaying conductive part mutual conduction of each above-mentioned insulating substrate.
10. lens driver according to any one of claims 1 to 4, wherein
Carry said lens holding member movable part be supported on above-mentioned matrix part via messenger wire, above-mentioned movable part equipped with
Above-mentioned magnet is provided with above-mentioned coil in above-mentioned matrix part side,
Be embedded with the second sheet metal supported to above-mentioned messenger wire in above-mentioned matrix part, above-mentioned second sheet metal by with it is above-mentioned
The identical metal plate of first sheet metal is formed, and above-mentioned second sheet metal is located at identical with the above-mentioned conducting portion of above-mentioned first sheet metal
The face of height.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016254991 | 2016-12-28 | ||
| JP2016-254991 | 2016-12-28 | ||
| PCT/JP2017/045956 WO2018123815A1 (en) | 2016-12-28 | 2017-12-21 | Lens-driving apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110140083A true CN110140083A (en) | 2019-08-16 |
| CN110140083B CN110140083B (en) | 2021-06-15 |
Family
ID=62707562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780080946.5A Active CN110140083B (en) | 2016-12-28 | 2017-12-21 | Lens driving device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6678252B2 (en) |
| CN (1) | CN110140083B (en) |
| WO (1) | WO2018123815A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102614773B1 (en) * | 2018-09-05 | 2023-12-18 | 엘지이노텍 주식회사 | Lens driving device and camera device |
| CN114755793A (en) * | 2020-12-29 | 2022-07-15 | 新思考电机有限公司 | Lens driving device, camera device, and electronic apparatus |
| GB2607901B (en) * | 2021-06-14 | 2023-10-25 | Cambridge Mechatronics Ltd | Voice coil motor actuator assembly |
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Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2018123815A1 (en) | 2019-07-11 |
| JP6678252B2 (en) | 2020-04-08 |
| WO2018123815A1 (en) | 2018-07-05 |
| CN110140083B (en) | 2021-06-15 |
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